TW264535B - Thickness detecting system for plate constructor - Google Patents
Thickness detecting system for plate constructorInfo
- Publication number
- TW264535B TW264535B TW83104562A TW83104562A TW264535B TW 264535 B TW264535 B TW 264535B TW 83104562 A TW83104562 A TW 83104562A TW 83104562 A TW83104562 A TW 83104562A TW 264535 B TW264535 B TW 264535B
- Authority
- TW
- Taiwan
- Prior art keywords
- signal
- receiving
- ultrasonic
- response signal
- processing unit
- Prior art date
Links
Abstract
A ultrasonic system of measuring plate thickness comprises: one pushing car including wheels and supporting devices, in which there is encoder installed on the wheels and the encoder could transfer rotating signal of the wheels; signal receiver continuously generating ultrasonic signal and synchronous signal, and receiving response signal of ultrasonic signal, then amplifying the response signal and outputting it; multiple ultrasonic probe installed on the above supporting device, and detecting following the movement of pushing car, then receiving the ultrasonic echo wave, and generating response signal of the each wave; one multi-purpose scanner that switches the connection between the ultrasonic probe and signal receiver in sequence by one control signal; one filter receiving the response signal and synchronous signal from signal receiver, filtering response signal, getting the most front two each waves; signal processing unit receiving synchronous signal from signal receiver, receiving response signal of the most front two echo wave from filter, receiving encoding signal from encoder; the signal processing unit calculates plate thickness according to measured plate sonic speed and time difference of the most front two echo waves; calculating moving distance of pushing car according encoding signal; simultanesouly the signal processing unit sends out control signal to the multi-purpose scanner.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW83104562A TW264535B (en) | 1994-05-17 | 1994-05-17 | Thickness detecting system for plate constructor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW83104562A TW264535B (en) | 1994-05-17 | 1994-05-17 | Thickness detecting system for plate constructor |
Publications (1)
Publication Number | Publication Date |
---|---|
TW264535B true TW264535B (en) | 1995-12-01 |
Family
ID=51402079
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW83104562A TW264535B (en) | 1994-05-17 | 1994-05-17 | Thickness detecting system for plate constructor |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW264535B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7073383B2 (en) | 2001-06-07 | 2006-07-11 | Tokyo Electron Limited | Apparatus and method for determining clamping status of semiconductor wafer |
-
1994
- 1994-05-17 TW TW83104562A patent/TW264535B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7073383B2 (en) | 2001-06-07 | 2006-07-11 | Tokyo Electron Limited | Apparatus and method for determining clamping status of semiconductor wafer |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |