TW264535B - Thickness detecting system for plate constructor - Google Patents

Thickness detecting system for plate constructor

Info

Publication number
TW264535B
TW264535B TW83104562A TW83104562A TW264535B TW 264535 B TW264535 B TW 264535B TW 83104562 A TW83104562 A TW 83104562A TW 83104562 A TW83104562 A TW 83104562A TW 264535 B TW264535 B TW 264535B
Authority
TW
Taiwan
Prior art keywords
signal
receiving
ultrasonic
response signal
processing unit
Prior art date
Application number
TW83104562A
Other languages
Chinese (zh)
Inventor
Hae-Yang Hwang
Yeong-Haur Wu
Muh-Tsuen Perng
Original Assignee
Ind Tech Res Inst
Chinese Petroleum Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst, Chinese Petroleum Corp filed Critical Ind Tech Res Inst
Priority to TW83104562A priority Critical patent/TW264535B/en
Application granted granted Critical
Publication of TW264535B publication Critical patent/TW264535B/en

Links

Abstract

A ultrasonic system of measuring plate thickness comprises: one pushing car including wheels and supporting devices, in which there is encoder installed on the wheels and the encoder could transfer rotating signal of the wheels; signal receiver continuously generating ultrasonic signal and synchronous signal, and receiving response signal of ultrasonic signal, then amplifying the response signal and outputting it; multiple ultrasonic probe installed on the above supporting device, and detecting following the movement of pushing car, then receiving the ultrasonic echo wave, and generating response signal of the each wave; one multi-purpose scanner that switches the connection between the ultrasonic probe and signal receiver in sequence by one control signal; one filter receiving the response signal and synchronous signal from signal receiver, filtering response signal, getting the most front two each waves; signal processing unit receiving synchronous signal from signal receiver, receiving response signal of the most front two echo wave from filter, receiving encoding signal from encoder; the signal processing unit calculates plate thickness according to measured plate sonic speed and time difference of the most front two echo waves; calculating moving distance of pushing car according encoding signal; simultanesouly the signal processing unit sends out control signal to the multi-purpose scanner.
TW83104562A 1994-05-17 1994-05-17 Thickness detecting system for plate constructor TW264535B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW83104562A TW264535B (en) 1994-05-17 1994-05-17 Thickness detecting system for plate constructor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW83104562A TW264535B (en) 1994-05-17 1994-05-17 Thickness detecting system for plate constructor

Publications (1)

Publication Number Publication Date
TW264535B true TW264535B (en) 1995-12-01

Family

ID=51402079

Family Applications (1)

Application Number Title Priority Date Filing Date
TW83104562A TW264535B (en) 1994-05-17 1994-05-17 Thickness detecting system for plate constructor

Country Status (1)

Country Link
TW (1) TW264535B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7073383B2 (en) 2001-06-07 2006-07-11 Tokyo Electron Limited Apparatus and method for determining clamping status of semiconductor wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7073383B2 (en) 2001-06-07 2006-07-11 Tokyo Electron Limited Apparatus and method for determining clamping status of semiconductor wafer

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees