TW262591B - Process of flash EEPROM memory cell - Google Patents

Process of flash EEPROM memory cell

Info

Publication number
TW262591B
TW262591B TW83103620A TW83103620A TW262591B TW 262591 B TW262591 B TW 262591B TW 83103620 A TW83103620 A TW 83103620A TW 83103620 A TW83103620 A TW 83103620A TW 262591 B TW262591 B TW 262591B
Authority
TW
Taiwan
Prior art keywords
forming
gate oxide
substrate
gate
masking material
Prior art date
Application number
TW83103620A
Other languages
Chinese (zh)
Inventor
Yeun-Ding Horng
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to TW83103620A priority Critical patent/TW262591B/en
Application granted granted Critical
Publication of TW262591B publication Critical patent/TW262591B/en

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Abstract

A process of flash EEPROM memory cell, that is applicable fabricate flash EEPROM memory cell on substrate, includes the following steps: (1) doping dopant to the above substrate to form the first doped region; (2) forming trench on predetermined position of the above substrate to make the above first doped region form source and drain region separately; (3) forming gate oxide on the above trench and substrate; (4) forming masking material on gate oxide in the above trench to expose gate oxide located on the above source and drain region; (5) with the above masking material as mask removing gate oxide located on the above source and drain region; (6) with the above masking material as mask forming tunnel oxide on the above source and drain region, and the thickness of the above tunnel oxide is less than the above gate oxide's; (7) removing the above masking material; (8) forming floating gate on the above tunnel oxide and gate oxide; (9) forming dielectric layer and control gate between gates on the above floating gate in sequence.
TW83103620A 1994-04-23 1994-04-23 Process of flash EEPROM memory cell TW262591B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW83103620A TW262591B (en) 1994-04-23 1994-04-23 Process of flash EEPROM memory cell

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW83103620A TW262591B (en) 1994-04-23 1994-04-23 Process of flash EEPROM memory cell

Publications (1)

Publication Number Publication Date
TW262591B true TW262591B (en) 1995-11-11

Family

ID=51402252

Family Applications (1)

Application Number Title Priority Date Filing Date
TW83103620A TW262591B (en) 1994-04-23 1994-04-23 Process of flash EEPROM memory cell

Country Status (1)

Country Link
TW (1) TW262591B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7948008B2 (en) 2007-10-26 2011-05-24 Micron Technology, Inc. Floating body field-effect transistors, and methods of forming floating body field-effect transistors

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7948008B2 (en) 2007-10-26 2011-05-24 Micron Technology, Inc. Floating body field-effect transistors, and methods of forming floating body field-effect transistors
US8395214B2 (en) 2007-10-26 2013-03-12 Micron Technology, Inc. Floating body field-effect transistors, and methods of forming floating body field-effect transistors
US8716075B2 (en) 2007-10-26 2014-05-06 Micron Technology, Inc. Floating body field-effect transistors, and methods of forming floating body field-effect transistors

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