TW253031B - - Google Patents
Info
- Publication number
- TW253031B TW253031B TW083109588A TW83109588A TW253031B TW 253031 B TW253031 B TW 253031B TW 083109588 A TW083109588 A TW 083109588A TW 83109588 A TW83109588 A TW 83109588A TW 253031 B TW253031 B TW 253031B
- Authority
- TW
- Taiwan
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
- G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
- G01R31/318558—Addressing or selecting of subparts of the device under test
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
- G01R31/318505—Test of Modular systems, e.g. Wafers, MCM's
- G01R31/318513—Test of Multi-Chip-Moduls
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
- G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
- G01R31/318536—Scan chain arrangements, e.g. connections, test bus, analog signals
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Test And Diagnosis Of Digital Computers (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17277893A | 1993-12-27 | 1993-12-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW253031B true TW253031B (zh) | 1995-08-01 |
Family
ID=22629198
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW083109588A TW253031B (zh) | 1993-12-27 | 1994-10-15 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5673276A (zh) |
EP (1) | EP0662616A3 (zh) |
JP (1) | JP3096597B2 (zh) |
KR (1) | KR100208306B1 (zh) |
TW (1) | TW253031B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8076863B2 (en) | 2008-04-11 | 2011-12-13 | Chunghwa Picture Tubes, Ltd. | Back light module |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5719879A (en) * | 1995-12-21 | 1998-02-17 | International Business Machines Corporation | Scan-bypass architecture without additional external latches |
US6324614B1 (en) * | 1997-08-26 | 2001-11-27 | Lee D. Whetsel | Tap with scannable control circuit for selecting first test data register in tap or second test data register in tap linking module for scanning data |
US6018815A (en) * | 1996-10-18 | 2000-01-25 | Samsung Electronics Co., Ltd. | Adaptable scan chains for debugging and manufacturing test purposes |
JP3287539B2 (ja) * | 1996-11-13 | 2002-06-04 | 富士通株式会社 | テスト機構を有する処理システム |
US5900753A (en) * | 1997-03-28 | 1999-05-04 | Logicvision, Inc. | Asynchronous interface |
US5943490A (en) * | 1997-05-30 | 1999-08-24 | Quickturn Design Systems, Inc. | Distributed logic analyzer for use in a hardware logic emulation system |
US5960191A (en) * | 1997-05-30 | 1999-09-28 | Quickturn Design Systems, Inc. | Emulation system with time-multiplexed interconnect |
US6658615B2 (en) * | 1998-06-30 | 2003-12-02 | Texas Instruments Incorporated | IC with IP core and user-added scan register |
JPH1183956A (ja) * | 1997-06-30 | 1999-03-26 | Texas Instr Inc <Ti> | 集積回路 |
KR19990047438A (ko) * | 1997-12-04 | 1999-07-05 | 윤종용 | 핀 공유를 이용한 바이패스 회로를 구비하는 반도체 장치 |
US6408413B1 (en) * | 1998-02-18 | 2002-06-18 | Texas Instruments Incorporated | Hierarchical access of test access ports in embedded core integrated circuits |
US6163864A (en) * | 1998-06-10 | 2000-12-19 | Compaq Computer Corporation | Method for cost-effective production testing of input voltage levels of the forwarded clock interface of high performance integrated circuits |
US7013415B1 (en) | 1999-05-26 | 2006-03-14 | Renesas Technology Corp. | IC with internal interface switch for testability |
JP2003014819A (ja) * | 2001-07-03 | 2003-01-15 | Matsushita Electric Ind Co Ltd | 半導体配線基板,半導体デバイス,半導体デバイスのテスト方法及びその実装方法 |
KR100896538B1 (ko) * | 2001-09-20 | 2009-05-07 | 엔엑스피 비 브이 | 전자 장치 |
US6825683B1 (en) * | 2002-04-18 | 2004-11-30 | Cypress Semiconductor Corporation | System and method for testing multiple integrated circuits that are in the same package |
US7246282B2 (en) | 2003-06-25 | 2007-07-17 | Hewlett-Packard Development Company, L.P. | Bypassing a device in a scan chain |
US7509533B1 (en) * | 2003-06-30 | 2009-03-24 | Sun Microsystems, Inc. | Methods and apparatus for testing functionality of processing devices by isolation and testing |
KR101118447B1 (ko) * | 2004-01-13 | 2012-03-06 | 엔엑스피 비 브이 | 멀티 칩 시스템 및 이 시스템을 테스트하는 방법 |
US20090307545A1 (en) * | 2004-12-20 | 2009-12-10 | Koninklijke Philips Electronics N.V. | Testable multiprocessor system and a method for testing a processor system |
US7519883B1 (en) * | 2005-04-05 | 2009-04-14 | Advanced Micro Devices, Inc. | Method of configuring a system and system therefor |
US7657807B1 (en) * | 2005-06-27 | 2010-02-02 | Sun Microsystems, Inc. | Integrated circuit with embedded test functionality |
TW200708750A (en) | 2005-07-22 | 2007-03-01 | Koninkl Philips Electronics Nv | Testable integrated circuit, system in package and test instruction set |
DE102005041614B4 (de) * | 2005-09-01 | 2014-11-06 | Infineon Technologies Ag | Halbleiter-Bauelement-Testsystem mit Test-Schnittstellen-Einrichtung |
US7906982B1 (en) | 2006-02-28 | 2011-03-15 | Cypress Semiconductor Corporation | Interface apparatus and methods of testing integrated circuits using the same |
JP4809439B2 (ja) * | 2006-09-29 | 2011-11-09 | 富士通株式会社 | 集積回路 |
US7661048B2 (en) * | 2007-06-29 | 2010-02-09 | Alcatel-Lucent Usa Inc. | Apparatus and method for embedded boundary scan testing |
US7904770B2 (en) * | 2008-09-09 | 2011-03-08 | Qualcomm Incorporated | Testing circuit split between tiers of through silicon stacking chips |
US10776233B2 (en) | 2011-10-28 | 2020-09-15 | Teradyne, Inc. | Programmable test instrument |
US9759772B2 (en) | 2011-10-28 | 2017-09-12 | Teradyne, Inc. | Programmable test instrument |
US9026872B2 (en) * | 2012-08-16 | 2015-05-05 | Xilinx, Inc. | Flexible sized die for use in multi-die integrated circuit |
US9547034B2 (en) | 2013-07-03 | 2017-01-17 | Xilinx, Inc. | Monolithic integrated circuit die having modular die regions stitched together |
US10311001B2 (en) * | 2017-10-09 | 2019-06-04 | Getac Technology Corporation | Electronic device and communication method thereof |
US11293979B2 (en) * | 2019-10-22 | 2022-04-05 | Peter Shun Shen Wang | Method of and an arrangement for analyzing manufacturing defects of multi-chip modules made without known good die |
US11249134B1 (en) * | 2020-10-06 | 2022-02-15 | Qualcomm Incorporated | Power-collapsible boundary scan |
CN114113990B (zh) * | 2021-08-31 | 2023-08-04 | 西南电子技术研究所(中国电子科技集团公司第十研究所) | 嵌入式边界扫描控制器 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4855669A (en) * | 1987-10-07 | 1989-08-08 | Xilinx, Inc. | System for scan testing of logic circuit networks |
US5084874A (en) * | 1988-09-07 | 1992-01-28 | Texas Instruments Incorporated | Enhanced test circuit |
US4996691A (en) * | 1988-09-21 | 1991-02-26 | Northern Telecom Limited | Integrated circuit testing method and apparatus and integrated circuit devices for use therewith |
JP2626920B2 (ja) * | 1990-01-23 | 1997-07-02 | 三菱電機株式会社 | スキャンテスト回路およびそれを用いた半導体集積回路装置 |
JP2627464B2 (ja) * | 1990-03-29 | 1997-07-09 | 三菱電機株式会社 | 集積回路装置 |
US5355369A (en) * | 1991-04-26 | 1994-10-11 | At&T Bell Laboratories | High-speed integrated circuit testing with JTAG |
US5412260A (en) * | 1991-05-03 | 1995-05-02 | Lattice Semiconductor Corporation | Multiplexed control pins for in-system programming and boundary scan state machines in a high density programmable logic device |
US5448576A (en) * | 1992-10-29 | 1995-09-05 | Bull Hn Information Systems Inc. | Boundary scan architecture extension |
US5404358A (en) * | 1993-02-04 | 1995-04-04 | Bull Hn Information Systems Inc. | Boundary scan architecture analog extension |
-
1994
- 1994-10-15 TW TW083109588A patent/TW253031B/zh not_active IP Right Cessation
- 1994-12-07 EP EP94309103A patent/EP0662616A3/en not_active Withdrawn
- 1994-12-27 KR KR1019940037123A patent/KR100208306B1/ko not_active IP Right Cessation
- 1994-12-27 JP JP06336988A patent/JP3096597B2/ja not_active Expired - Fee Related
-
1996
- 1996-02-05 US US08/716,559 patent/US5673276A/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8076863B2 (en) | 2008-04-11 | 2011-12-13 | Chunghwa Picture Tubes, Ltd. | Back light module |
Also Published As
Publication number | Publication date |
---|---|
KR950021604A (ko) | 1995-07-26 |
EP0662616A3 (en) | 1999-03-03 |
JPH07287053A (ja) | 1995-10-31 |
JP3096597B2 (ja) | 2000-10-10 |
KR100208306B1 (ko) | 1999-07-15 |
EP0662616A2 (en) | 1995-07-12 |
US5673276A (en) | 1997-09-30 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |