TW247967B - - Google Patents

Info

Publication number
TW247967B
TW247967B TW082103144A TW82103144A TW247967B TW 247967 B TW247967 B TW 247967B TW 082103144 A TW082103144 A TW 082103144A TW 82103144 A TW82103144 A TW 82103144A TW 247967 B TW247967 B TW 247967B
Authority
TW
Taiwan
Application number
TW082103144A
Other languages
Chinese (zh)
Original Assignee
Tokyo Electron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Co Ltd filed Critical Tokyo Electron Co Ltd
Application granted granted Critical
Publication of TW247967B publication Critical patent/TW247967B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Tests Of Electronic Circuits (AREA)
TW082103144A 1992-03-23 1993-04-23 TW247967B (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9590892 1992-03-23
JP29078792A JP3173676B2 (ja) 1992-03-23 1992-10-05 プローブ装置

Publications (1)

Publication Number Publication Date
TW247967B true TW247967B (ja) 1995-05-21

Family

ID=14150396

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082103144A TW247967B (ja) 1992-03-23 1993-04-23

Country Status (3)

Country Link
JP (1) JP3173676B2 (ja)
KR (1) KR930020629A (ja)
TW (1) TW247967B (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI456213B (zh) * 2013-01-18 2014-10-11 Hon Tech Inc 電子元件作業單元、作業方法及其應用之作業設備
US11262401B2 (en) 2020-04-22 2022-03-01 Mpi Corporation Wafer probe station
TWI789857B (zh) * 2020-08-03 2023-01-11 日商日本麥克隆尼股份有限公司 檢查用連接裝置及檢查用連接裝置的組裝方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4713763B2 (ja) * 2000-05-18 2011-06-29 株式会社アドバンテスト プローブの位置ずれ検出方法・プローブの位置決定方法・プローブの位置ずれ検出装置・プローブの位置決定装置
JP4885139B2 (ja) * 2005-09-15 2012-02-29 株式会社アドバンテスト Ｔｃｐハンドリング装置
JP4606319B2 (ja) * 2005-12-19 2011-01-05 日東電工株式会社 復旧支援装置
JP2011075450A (ja) * 2009-09-30 2011-04-14 Hitachi High-Tech Instruments Co Ltd 特性検査装置及びテーピング装置
JP6999321B2 (ja) * 2017-07-31 2022-01-18 東京エレクトロン株式会社 検査装置、検査方法及び記憶媒体
TWI674413B (zh) * 2018-10-31 2019-10-11 致茂電子股份有限公司 探針對準設備
JP7218909B2 (ja) * 2019-05-09 2023-02-07 株式会社昭和真空 プローブピン位置合せ装置及びプローブピン位置合せ装置を使用した電子デバイスの製造方法
US11821912B2 (en) * 2020-05-29 2023-11-21 Formfactor, Inc. Methods of producing augmented probe system images and associated probe systems
JP2023097019A (ja) * 2021-12-27 2023-07-07 東京エレクトロン株式会社 検査装置及び検査方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI456213B (zh) * 2013-01-18 2014-10-11 Hon Tech Inc 電子元件作業單元、作業方法及其應用之作業設備
US11262401B2 (en) 2020-04-22 2022-03-01 Mpi Corporation Wafer probe station
TWI765649B (zh) * 2020-04-22 2022-05-21 旺矽科技股份有限公司 晶圓探針台
TWI789857B (zh) * 2020-08-03 2023-01-11 日商日本麥克隆尼股份有限公司 檢查用連接裝置及檢查用連接裝置的組裝方法

Also Published As

Publication number Publication date
JP3173676B2 (ja) 2001-06-04
KR930020629A (ko) 1993-10-20
JPH05326675A (ja) 1993-12-10

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