TW241380B - Fabrication method for tungsten plug metallization of IC - Google Patents
Fabrication method for tungsten plug metallization of ICInfo
- Publication number
- TW241380B TW241380B TW83103910A TW83103910A TW241380B TW 241380 B TW241380 B TW 241380B TW 83103910 A TW83103910 A TW 83103910A TW 83103910 A TW83103910 A TW 83103910A TW 241380 B TW241380 B TW 241380B
- Authority
- TW
- Taiwan
- Prior art keywords
- tungsten plug
- layer
- forming
- substrate
- contact window
- Prior art date
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
A fabrication method for tungsten plug metallization of IC includes the following steps: 1. supplying one substrate; 2. forming semiconducter component structrue on the substrate; 3. forming one isolating layer overlaying on the semiconductor component structure, and opening contact window from isolating layer to the substrate; 4. depositing one glue layer evenly on the isolating layer and in the contact window; 5. forming one tungsten plug in the contact window; 6. removing partial glue layer to leave the lower half part of glue layer located below the tungsten plug, and forming ditch on the upper half part of tungsten plug with removed glue layer; 7. forming one dielectric layer to fill the ditch; 8. forming one metal layer on the isolating layer and tungsten plug; 9. etching the metal layer for defining pattern to complete the metallization process.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW83103910A TW241380B (en) | 1994-04-30 | 1994-04-30 | Fabrication method for tungsten plug metallization of IC |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW83103910A TW241380B (en) | 1994-04-30 | 1994-04-30 | Fabrication method for tungsten plug metallization of IC |
Publications (1)
Publication Number | Publication Date |
---|---|
TW241380B true TW241380B (en) | 1995-02-21 |
Family
ID=51400920
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW83103910A TW241380B (en) | 1994-04-30 | 1994-04-30 | Fabrication method for tungsten plug metallization of IC |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW241380B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8196747B2 (en) | 2005-12-06 | 2012-06-12 | International Business Machines Corporation | End cap packaging material, packaging and method for protecting products against damage |
-
1994
- 1994-04-30 TW TW83103910A patent/TW241380B/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8196747B2 (en) | 2005-12-06 | 2012-06-12 | International Business Machines Corporation | End cap packaging material, packaging and method for protecting products against damage |
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