TW239222B - - Google Patents

Info

Publication number
TW239222B
TW239222B TW083105646A TW83105646A TW239222B TW 239222 B TW239222 B TW 239222B TW 083105646 A TW083105646 A TW 083105646A TW 83105646 A TW83105646 A TW 83105646A TW 239222 B TW239222 B TW 239222B
Authority
TW
Taiwan
Application number
TW083105646A
Original Assignee
Hyundai Electronics Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyundai Electronics Ind filed Critical Hyundai Electronics Ind
Application granted granted Critical
Publication of TW239222B publication Critical patent/TW239222B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
TW083105646A 1993-06-25 1994-06-22 TW239222B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019930011746A KR960011461B1 (ko) 1993-06-25 1993-06-25 회절빛 제어 마스크

Publications (1)

Publication Number Publication Date
TW239222B true TW239222B (zh) 1995-01-21

Family

ID=19358076

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083105646A TW239222B (zh) 1993-06-25 1994-06-22

Country Status (5)

Country Link
US (2) US5571641A (zh)
JP (1) JPH081890B2 (zh)
KR (1) KR960011461B1 (zh)
DE (1) DE4422038C2 (zh)
TW (1) TW239222B (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0792647A (ja) * 1993-09-27 1995-04-07 Nec Corp ホトマスク
KR100253580B1 (ko) * 1996-10-02 2000-04-15 김영환 스티칭 노광 공정에 사용되는 마스크
US6040892A (en) 1997-08-19 2000-03-21 Micron Technology, Inc. Multiple image reticle for forming layers
US6379868B1 (en) * 1999-04-01 2002-04-30 Agere Systems Guardian Corp. Lithographic process for device fabrication using dark-field illumination
US20020180608A1 (en) * 2001-05-04 2002-12-05 Sphericon Ltd. Driver alertness monitoring system
US6857220B2 (en) * 2001-06-21 2005-02-22 Bobby D. King Flexible fishing lure tails and appendages
EP1599762A4 (en) * 2003-02-14 2006-08-09 Univ Leland Stanford Junior OPTICAL LITHOGRAPHY USING BOTH PHOTOMASK SURFACES
US6982135B2 (en) 2003-03-28 2006-01-03 Taiwan Semiconductor Manufacturing Co., Ltd. Pattern compensation for stitching
EP1664858A1 (en) * 2003-07-24 2006-06-07 Explay Ltd. Method for production of micro-optics structures
KR100598497B1 (ko) * 2003-12-31 2006-07-10 동부일렉트로닉스 주식회사 이중 노광 패턴 형성 방법
KR100790292B1 (ko) * 2006-06-28 2008-01-02 주식회사 하이닉스반도체 반도체 소자의 미세패턴 형성 방법
DE102015117556A1 (de) * 2015-10-15 2017-04-20 Universität Kassel Mikrostruktur und Verfahren zur Herstellung einer Mikrostruktur in einer Fotolithographietechnik
JP6645371B2 (ja) * 2016-07-15 2020-02-14 オムロン株式会社 光デバイス及び立体表示方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4223083A (en) * 1977-12-27 1980-09-16 Tektronix, Inc. Virtual mask exposure system for CRT screen manufacture
US4947413A (en) * 1988-07-26 1990-08-07 At&T Bell Laboratories Resolution doubling lithography technique
JPH02101423A (ja) * 1988-10-11 1990-04-13 Ricoh Co Ltd 光学的読取装置
EP0507487B1 (en) * 1991-04-05 1996-12-18 Nippon Telegraph And Telephone Corporation Optical projection exposure method and system using the same
JP2630694B2 (ja) * 1991-07-12 1997-07-16 日本電信電話株式会社 投影露光装置用マスク
JP3250563B2 (ja) * 1992-01-17 2002-01-28 株式会社ニコン フォトマスク、並びに露光方法及びその露光方法を用いた回路パターン素子製造方法、並びに露光装置
US5387484A (en) * 1992-07-07 1995-02-07 International Business Machines Corporation Two-sided mask for patterning of materials with electromagnetic radiation
JPH06161092A (ja) * 1992-11-17 1994-06-07 Nippon Steel Corp 露光用マスク

Also Published As

Publication number Publication date
KR960011461B1 (ko) 1996-08-22
JPH0722308A (ja) 1995-01-24
DE4422038C2 (de) 2002-11-14
KR950001919A (ko) 1995-01-04
DE4422038A1 (de) 1995-02-02
US5571641A (en) 1996-11-05
US5698350A (en) 1997-12-16
JPH081890B2 (ja) 1996-01-10

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees