TW239219B - - Google Patents
Info
- Publication number
- TW239219B TW239219B TW082106729A TW82106729A TW239219B TW 239219 B TW239219 B TW 239219B TW 082106729 A TW082106729 A TW 082106729A TW 82106729 A TW82106729 A TW 82106729A TW 239219 B TW239219 B TW 239219B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- H10W70/05—
-
- H10W70/66—
-
- H10W72/075—
-
- H10W72/50—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H10W72/5363—
-
- H10W72/5522—
-
- H10W72/5524—
-
- H10W72/59—
-
- H10W72/884—
-
- H10W90/734—
-
- H10W90/754—
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Wire Bonding (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4221824A JPH06216184A (ja) | 1992-08-20 | 1992-08-20 | 配線基板上の配線の表面処理方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW239219B true TW239219B (enExample) | 1995-01-21 |
Family
ID=16772767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW082106729A TW239219B (enExample) | 1992-08-20 | 1993-08-20 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0588093A1 (enExample) |
| JP (1) | JPH06216184A (enExample) |
| KR (1) | KR0127277B1 (enExample) |
| TW (1) | TW239219B (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3435484B2 (ja) * | 1995-06-08 | 2003-08-11 | 日本特殊陶業株式会社 | セラミック基板及びその製造方法 |
| JPH1050751A (ja) * | 1996-07-30 | 1998-02-20 | Kyocera Corp | ワイヤボンディング細線の接合方法 |
| JP2005057132A (ja) * | 2003-08-06 | 2005-03-03 | Fcm Kk | 回路基板およびそれを含むことを特徴とする製品 |
| JP4984473B2 (ja) * | 2005-09-30 | 2012-07-25 | 富士電機株式会社 | 電子部品および電子部品の製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4077854A (en) * | 1972-10-02 | 1978-03-07 | The Bendix Corporation | Method of manufacture of solderable thin film microcircuit with stabilized resistive films |
| DE3380413D1 (en) * | 1982-04-27 | 1989-09-21 | Richardson Chemical Co | Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate and products produced thereby |
| JPH0634442B2 (ja) * | 1986-11-25 | 1994-05-02 | 株式会社日立製作所 | ムライト配線基板の製造方法 |
| JPH01169996A (ja) * | 1987-12-25 | 1989-07-05 | Hitachi Ltd | 湿式多層セラミック回路板のメタライズ方法 |
-
1992
- 1992-08-20 JP JP4221824A patent/JPH06216184A/ja active Pending
-
1993
- 1993-08-17 KR KR1019930015341A patent/KR0127277B1/ko not_active Expired - Fee Related
- 1993-08-19 EP EP93113276A patent/EP0588093A1/en not_active Withdrawn
- 1993-08-20 TW TW082106729A patent/TW239219B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| KR940005200A (ko) | 1994-03-16 |
| EP0588093A1 (en) | 1994-03-23 |
| KR0127277B1 (ko) | 1998-04-06 |
| JPH06216184A (ja) | 1994-08-05 |