TW232744B - - Google Patents
Info
- Publication number
- TW232744B TW232744B TW081102553A TW81102553A TW232744B TW 232744 B TW232744 B TW 232744B TW 081102553 A TW081102553 A TW 081102553A TW 81102553 A TW81102553 A TW 81102553A TW 232744 B TW232744 B TW 232744B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0015—Orientation; Alignment; Positioning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/5442—Marks applied to semiconductor devices or parts comprising non digital, non alphanumeric information, e.g. symbols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/5448—Located on chip prior to dicing and remaining on chip after dicing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Semiconductor Lasers (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Lasers (AREA)
- Laser Beam Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019910005891A KR940000910B1 (ko) | 1991-04-12 | 1991-04-12 | 반도체 칩의 얼라인먼트 방법 및 레이저 리페이어용 타겟이 형성된 반도체 칩 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW232744B true TW232744B (en, 2012) | 1994-10-21 |
Family
ID=19313205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW081102553A TW232744B (en, 2012) | 1991-04-12 | 1992-04-02 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5414519A (en, 2012) |
| JP (1) | JP2802561B2 (en, 2012) |
| KR (1) | KR940000910B1 (en, 2012) |
| DE (1) | DE4210774B4 (en, 2012) |
| TW (1) | TW232744B (en, 2012) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5545593A (en) * | 1993-09-30 | 1996-08-13 | Texas Instruments Incorporated | Method of aligning layers in an integrated circuit device |
| JP3446287B2 (ja) * | 1994-03-15 | 2003-09-16 | 富士通株式会社 | 縮小投影露光装置と光軸ずれ補正方法 |
| US5696587A (en) * | 1994-12-14 | 1997-12-09 | United Microelectronics Corporation | Metal target for laser repair of dies |
| US5796414A (en) * | 1996-03-25 | 1998-08-18 | Hewlett-Packard Company | Systems and method for establishing positional accuracy in two dimensions based on a sensor scan in one dimension |
| KR100256815B1 (ko) * | 1996-06-24 | 2000-06-01 | 김영환 | 확대/축소 크기 측정용 마크 |
| JP2866831B2 (ja) * | 1996-08-30 | 1999-03-08 | 株式会社アドバンテスト | レーザ加工装置の位置決め方法 |
| CN1138463C (zh) | 1996-12-13 | 2004-02-11 | 松下电器产业株式会社 | 电子部件及其安装方法和装置 |
| US6938335B2 (en) | 1996-12-13 | 2005-09-06 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounting method |
| US6064750A (en) * | 1997-01-10 | 2000-05-16 | Hunter Engineering Company | Apparatus and method for determining vehicle wheel alignment measurements from three dimensional wheel positions and orientations |
| TW335527B (en) * | 1997-11-08 | 1998-07-01 | United Microelectronics Corp | The rework testing method of semiconductor device |
| US6077756A (en) * | 1998-04-24 | 2000-06-20 | Vanguard International Semiconductor | Overlay target pattern and algorithm for layer-to-layer overlay metrology for semiconductor processing |
| USD456404S1 (en) | 2000-11-09 | 2002-04-30 | Exabye Corporation | Cartridge library |
| US6462900B1 (en) | 2000-11-09 | 2002-10-08 | Exabyte Corporation | Cartridge picker robot with ribbon cable for cartridge library |
| US6473261B1 (en) | 2000-11-09 | 2002-10-29 | Exabyte Corporation | Cartridge overinsertion protection for cartridge library |
| US6466396B1 (en) | 2000-11-09 | 2002-10-15 | Exabyte Corporation | Cartridge library |
| USD464354S1 (en) | 2000-11-09 | 2002-10-15 | Exabye Corporation | Magazine for data cartridges |
| US6486956B2 (en) * | 2001-03-23 | 2002-11-26 | Micron Technology, Inc. | Reducing asymmetrically deposited film induced registration error |
| US7053495B2 (en) | 2001-09-17 | 2006-05-30 | Matsushita Electric Industrial Co., Ltd. | Semiconductor integrated circuit device and method for fabricating the same |
| US6612499B2 (en) | 2002-01-24 | 2003-09-02 | Exabyte Corporation | Calibration cartridge for automated cartridge library and method of using same |
| JP2005109145A (ja) | 2003-09-30 | 2005-04-21 | Toshiba Corp | 半導体装置 |
| USD554084S1 (en) * | 2005-10-31 | 2007-10-30 | Kabushiki Kaisha Toshiba | Portion of a semiconductor apparatus mounting-position accuracy measurement jig |
| US20080282281A1 (en) * | 2007-05-11 | 2008-11-13 | White Christopher M | Cartridge engagement apparatus and method for cartridge library |
| US7777985B2 (en) * | 2007-05-11 | 2010-08-17 | Tandberg Data Corporation | Transport method and apparatus for cartridge library utilizing cam slot and follower for moving a robot carriage |
| US20080278847A1 (en) * | 2007-05-11 | 2008-11-13 | Barkley John A | Method and apparatus for positioning drives in cartridge library |
| US7777986B2 (en) * | 2007-05-11 | 2010-08-17 | Tandberg Data Corporation | Multi-dimensional transport method and drive subsystems in a cartridge library apparatus |
| US20080282275A1 (en) * | 2007-05-11 | 2008-11-13 | Zaczek Thomas E | Entry/exit port method and apparatus for cartridge library |
| US9583401B2 (en) | 2014-02-12 | 2017-02-28 | International Business Machines Corporation | Nano deposition and ablation for the repair and fabrication of integrated circuits |
| JP6219227B2 (ja) * | 2014-05-12 | 2017-10-25 | 東京エレクトロン株式会社 | ヒータ給電機構及びステージの温度制御方法 |
| JP2017053999A (ja) * | 2015-09-09 | 2017-03-16 | 株式会社東芝 | 半導体装置および検査パターン配置方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3660157A (en) * | 1969-08-18 | 1972-05-02 | Computervision Corp | Enhanced contrast semiconductor wafer alignment target |
| JPS55162229A (en) * | 1979-06-04 | 1980-12-17 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Detection of electron beam exposure position |
| US4385838A (en) * | 1980-01-19 | 1983-05-31 | Nippon Kogaku K. K. | Alignment device |
| JPS57192028A (en) * | 1981-05-20 | 1982-11-26 | Matsushita Electric Ind Co Ltd | Mask set and positioning method for mask |
| JPS58108745A (ja) * | 1981-12-23 | 1983-06-28 | Canon Inc | 転写装置 |
| JPS58116541A (ja) * | 1981-12-29 | 1983-07-11 | Canon Inc | 整合方法 |
| JPS59200905A (ja) * | 1983-04-28 | 1984-11-14 | Mitsubishi Electric Corp | 位置検出装置 |
| JPS61258420A (ja) * | 1985-05-13 | 1986-11-15 | Canon Inc | 位置検出装置 |
| JPS62193124A (ja) * | 1986-02-19 | 1987-08-25 | Sanyo Electric Co Ltd | パタ−ン位置合わせ方法 |
| ES2023135B3 (es) * | 1986-04-18 | 1992-01-01 | Heidelberger Druckmasch Ag | Determinacion de errores de registro de impresion multicolor. |
| JPS63204722A (ja) * | 1987-02-20 | 1988-08-24 | Nec Corp | 半導体集積回路の製造方法 |
| JP2629709B2 (ja) * | 1987-05-28 | 1997-07-16 | 株式会社ニコン | 位置合わせ方法及び装置 |
| JPH01301030A (ja) * | 1988-05-26 | 1989-12-05 | Toshiba Corp | Ｘｙ方向送り装置 |
| FR2676129A1 (fr) * | 1991-04-30 | 1992-11-06 | Cer Ets | Procede destine a positionner un objet par rapport a un element a emplacement determine ou vice et versa et machine pour sa mise en óoeuvre. |
-
1991
- 1991-04-12 KR KR1019910005891A patent/KR940000910B1/ko not_active Expired - Fee Related
-
1992
- 1992-03-27 US US07/858,723 patent/US5414519A/en not_active Expired - Fee Related
- 1992-04-01 DE DE4210774A patent/DE4210774B4/de not_active Expired - Fee Related
- 1992-04-02 TW TW081102553A patent/TW232744B/zh active
- 1992-04-09 JP JP8879292A patent/JP2802561B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05109873A (ja) | 1993-04-30 |
| DE4210774A1 (de) | 1992-10-15 |
| JP2802561B2 (ja) | 1998-09-24 |
| US5414519A (en) | 1995-05-09 |
| KR920020700A (ko) | 1992-11-21 |
| KR940000910B1 (ko) | 1994-02-04 |
| DE4210774B4 (de) | 2007-06-28 |