TW229263B - - Google Patents

Info

Publication number
TW229263B
TW229263B TW082102418A TW82102418A TW229263B TW 229263 B TW229263 B TW 229263B TW 082102418 A TW082102418 A TW 082102418A TW 82102418 A TW82102418 A TW 82102418A TW 229263 B TW229263 B TW 229263B
Authority
TW
Taiwan
Application number
TW082102418A
Original Assignee
Akeo N V
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akeo N V filed Critical Akeo N V
Application granted granted Critical
Publication of TW229263B publication Critical patent/TW229263B/zh

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/025Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/26Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
    • F28F9/262Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators for radiators
    • F28F9/268Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators for radiators by permanent joints, e.g. by welding
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12Elements constructed in the shape of a hollow panel, e.g. with channels
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02Header boxes; End plates
    • F28F9/026Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
    • F28F9/0265Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by using guiding means or impingement means inside the header box
    • F28F9/0268Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by using guiding means or impingement means inside the header box in the form of multiple deflectors for channeling the heat exchange medium
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02Header boxes; End plates
    • F28F9/04Arrangements for sealing elements into header boxes or end plates
    • F28F9/16Arrangements for sealing elements into header boxes or end plates by permanent joints, e.g. by rolling
    • F28F9/18Arrangements for sealing elements into header boxes or end plates by permanent joints, e.g. by rolling by welding
    • F28F9/182Arrangements for sealing elements into header boxes or end plates by permanent joints, e.g. by rolling by welding the heat-exchange conduits having ends with a particular shape, e.g. deformed; the heat-exchange conduits or end plates having supplementary joining means, e.g. abutments
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00Fins
    • F28F2215/10Secondary fins, e.g. projections or recesses on main fins
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00Fastening; Joining
    • F28F2275/06Fastening; Joining by welding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127Natural convection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
TW082102418A 1992-03-31 1993-04-01 TW229263B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL9200590 1992-03-31

Publications (1)

Publication Number Publication Date
TW229263B true TW229263B (zh) 1994-09-01

Family

ID=19860636

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082102418A TW229263B (zh) 1992-03-31 1993-04-01

Country Status (5)

Country Link
US (1) US5353867A (zh)
EP (1) EP0564027A1 (zh)
JP (1) JPH0618187A (zh)
KR (1) KR930020137A (zh)
TW (1) TW229263B (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5914856A (en) * 1997-07-23 1999-06-22 Litton Systems, Inc. Diaphragm pumped air cooled planar heat exchanger
DE19733045C1 (de) * 1997-07-31 1998-07-30 Fahrzeugklimaregelung Gmbh Elektrische Heizung für ein Kraftfahrzeug
DE19738318C5 (de) * 1997-09-02 2014-10-30 Behr Gmbh & Co. Kg Elektrische Heizeinrichtung für ein Kraftfahrzeug
SE514405C2 (sv) * 1999-06-21 2001-02-19 Nivell System Ab Anordning för avskärmning av ett ventilerat utrymme, samt golvkonstruktion
DE19963373A1 (de) * 1999-12-28 2001-07-12 Abb Alstom Power Ch Ag Vorrichtung zur Kühlung einer, einen Strömungskanal umgebenden Strömungskanalwand mit wenigstens einem Rippenzug
US6942944B2 (en) * 2000-02-29 2005-09-13 Illinois Institute Of Technology Battery system thermal management
US8273474B2 (en) * 2000-02-29 2012-09-25 Illinois Institute Of Technology Battery system thermal management
DE102005029074B3 (de) * 2005-06-23 2006-08-10 Wieland-Werke Ag Wärmeaustauscher für Kleinbauteile
WO2012169012A1 (ja) * 2011-06-07 2012-12-13 トヨタ自動車株式会社 冷却器
TWI517905B (zh) * 2012-09-08 2016-01-21 西凱渥資訊處理科技公司 於射頻模組製造期間關於漆霧收集之裝置及方法
US10156359B2 (en) 2012-12-28 2018-12-18 United Technologies Corporation Gas turbine engine component having vascular engineered lattice structure
US10018052B2 (en) 2012-12-28 2018-07-10 United Technologies Corporation Gas turbine engine component having engineered vascular structure
US10048019B2 (en) * 2014-12-22 2018-08-14 Hamilton Sundstrand Corporation Pins for heat exchangers
US10094287B2 (en) 2015-02-10 2018-10-09 United Technologies Corporation Gas turbine engine component with vascular cooling scheme
US10221694B2 (en) 2016-02-17 2019-03-05 United Technologies Corporation Gas turbine engine component having vascular engineered lattice structure
US10774653B2 (en) 2018-12-11 2020-09-15 Raytheon Technologies Corporation Composite gas turbine engine component with lattice structure
CN111479449B (zh) * 2020-05-09 2023-03-31 中国航空工业集团公司西安航空计算技术研究所 一种电子设备风冷机箱的冷却介质分配装置
DE102022107011A1 (de) 2022-03-24 2023-09-28 Regirt Metall Gmbh Bausatz für einen Wärmeaustauscher

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3361195A (en) * 1966-09-23 1968-01-02 Westinghouse Electric Corp Heat sink member for a semiconductor device
US4016928A (en) * 1973-12-26 1977-04-12 General Electric Company Heat exchanger core having expanded metal heat transfer surfaces
US4147210A (en) * 1976-08-03 1979-04-03 Pronko Vladimir G Screen heat exchanger
FR2401525A1 (fr) * 1977-06-10 1979-03-23 Alsthom Atlantique Dispositif thermoelectrique
US4359181A (en) * 1978-05-25 1982-11-16 John Chisholm Process for making a high heat transfer surface composed of perforated or expanded metal
FR2500610B1 (fr) * 1981-02-25 1986-05-02 Inst Francais Du Petrole Echangeur de chaleur a plaques perforees
US4730666A (en) * 1986-04-30 1988-03-15 International Business Machines Corporation Flexible finned heat exchanger
US4777560A (en) * 1987-09-02 1988-10-11 Microelectronics And Computer Technology Corporation Gas heat exchanger
EP0267772B1 (en) * 1986-11-10 1993-01-13 Microelectronics and Computer Technology Corporation Heat exchanger and method of making same
DE3703873A1 (de) * 1987-02-07 1988-08-18 Sueddeutsche Kuehler Behr Kuehlkoerper, insbesondere zum kuehlen elektronischer bauelemente
US4768581A (en) * 1987-04-06 1988-09-06 International Business Machines Corporation Cooling system for semiconductor modules
US4898234A (en) * 1988-08-19 1990-02-06 Mcdonnell Douglas Corporation Air heat exchanger
EP0376365B1 (en) * 1988-12-01 1995-08-09 Akzo Nobel N.V. Semiconductor module
US5212625A (en) * 1988-12-01 1993-05-18 Akzo Nv Semiconductor module having projecting cooling fin groups
SU1677477A1 (ru) * 1989-01-02 1991-09-15 Одесский Технологический Институт Холодильной Промышленности Способ изготовлени теплообменника
US5058665A (en) * 1989-03-28 1991-10-22 Aisin Seiki Kabushiki Kaisha Stacked-plate type heat exchanger
GB8910241D0 (en) * 1989-05-04 1989-06-21 Secretary Trade Ind Brit Heat exchangers
US5205353A (en) * 1989-11-30 1993-04-27 Akzo N.V. Heat exchanging member
EP0510734A1 (en) * 1991-02-20 1992-10-28 Akzo Nobel N.V. Heat exchanging member, more particularly for cooling a semiconductor module

Also Published As

Publication number Publication date
US5353867A (en) 1994-10-11
JPH0618187A (ja) 1994-01-25
KR930020137A (ko) 1993-10-19
EP0564027A1 (en) 1993-10-06

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