TW226474B - A process of forming tungsten contact by using disposable spin-on-glass - Google Patents
A process of forming tungsten contact by using disposable spin-on-glassInfo
- Publication number
- TW226474B TW226474B TW82103427A TW82103427A TW226474B TW 226474 B TW226474 B TW 226474B TW 82103427 A TW82103427 A TW 82103427A TW 82103427 A TW82103427 A TW 82103427A TW 226474 B TW226474 B TW 226474B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- glass
- spin
- contact
- precipitates
- Prior art date
Links
Abstract
A process of forming tungsten contact by using disposable spin-on-glasswhich comprises providing a semiconductor structure on the semiconductorsubstrate and providing at least one layer of patterned conductor layerto contact the active element of the semiconductor; the surface of thepatterned conductor structure is irregular surface with horizontal andvertical elements; precipitating an insulation layer on the irregularsurface of the patterned conductor structure and undergoing refluxing; theprocess is characterized in the following steps: precipitates a spin-on-glass on the insulation layer and bakes thespin-on-glass; through the insulation layer and the spin-on-glass, defines a contact onthe element structure and the semiconductor substrate; precipitates a nucleation layer on the spin-on-glass and meanwhile in thecontact; precipitates a tungsten on the nucleation layer; back-etches the tungsten layer and the nucleation layer so as to let thetungsten layer stay only in the contact and meanwhile let part of thetungsten layer residue stay on the spin-on-glass; removes the spin-on-glass so as to remove the residual tungsten layer onthe spin-on-glass; and precipitates a metal layer to complete the contact on the elementstructure and the silicon substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW82103427A TW226474B (en) | 1993-04-29 | 1993-04-29 | A process of forming tungsten contact by using disposable spin-on-glass |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW82103427A TW226474B (en) | 1993-04-29 | 1993-04-29 | A process of forming tungsten contact by using disposable spin-on-glass |
Publications (1)
Publication Number | Publication Date |
---|---|
TW226474B true TW226474B (en) | 1994-07-11 |
Family
ID=51348384
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW82103427A TW226474B (en) | 1993-04-29 | 1993-04-29 | A process of forming tungsten contact by using disposable spin-on-glass |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW226474B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9583432B2 (en) | 2013-01-29 | 2017-02-28 | Hewlett-Packard Development Company, L.P. | Interconnects through dielecric vias |
-
1993
- 1993-04-29 TW TW82103427A patent/TW226474B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9583432B2 (en) | 2013-01-29 | 2017-02-28 | Hewlett-Packard Development Company, L.P. | Interconnects through dielecric vias |
US9780028B2 (en) | 2013-01-29 | 2017-10-03 | Hewlett-Packard Development Company, L.P. | Interconnects through dielectric vias |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |