TW226474B - A process of forming tungsten contact by using disposable spin-on-glass - Google Patents

A process of forming tungsten contact by using disposable spin-on-glass

Info

Publication number
TW226474B
TW226474B TW82103427A TW82103427A TW226474B TW 226474 B TW226474 B TW 226474B TW 82103427 A TW82103427 A TW 82103427A TW 82103427 A TW82103427 A TW 82103427A TW 226474 B TW226474 B TW 226474B
Authority
TW
Taiwan
Prior art keywords
layer
glass
spin
contact
precipitates
Prior art date
Application number
TW82103427A
Other languages
Chinese (zh)
Inventor
Shaw-Tzeng Shiah
guang-zhao Chen
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW82103427A priority Critical patent/TW226474B/en
Application granted granted Critical
Publication of TW226474B publication Critical patent/TW226474B/en

Links

Abstract

A process of forming tungsten contact by using disposable spin-on-glasswhich comprises providing a semiconductor structure on the semiconductorsubstrate and providing at least one layer of patterned conductor layerto contact the active element of the semiconductor; the surface of thepatterned conductor structure is irregular surface with horizontal andvertical elements; precipitating an insulation layer on the irregularsurface of the patterned conductor structure and undergoing refluxing; theprocess is characterized in the following steps: precipitates a spin-on-glass on the insulation layer and bakes thespin-on-glass; through the insulation layer and the spin-on-glass, defines a contact onthe element structure and the semiconductor substrate; precipitates a nucleation layer on the spin-on-glass and meanwhile in thecontact; precipitates a tungsten on the nucleation layer; back-etches the tungsten layer and the nucleation layer so as to let thetungsten layer stay only in the contact and meanwhile let part of thetungsten layer residue stay on the spin-on-glass; removes the spin-on-glass so as to remove the residual tungsten layer onthe spin-on-glass; and precipitates a metal layer to complete the contact on the elementstructure and the silicon substrate.
TW82103427A 1993-04-29 1993-04-29 A process of forming tungsten contact by using disposable spin-on-glass TW226474B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW82103427A TW226474B (en) 1993-04-29 1993-04-29 A process of forming tungsten contact by using disposable spin-on-glass

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW82103427A TW226474B (en) 1993-04-29 1993-04-29 A process of forming tungsten contact by using disposable spin-on-glass

Publications (1)

Publication Number Publication Date
TW226474B true TW226474B (en) 1994-07-11

Family

ID=51348384

Family Applications (1)

Application Number Title Priority Date Filing Date
TW82103427A TW226474B (en) 1993-04-29 1993-04-29 A process of forming tungsten contact by using disposable spin-on-glass

Country Status (1)

Country Link
TW (1) TW226474B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9583432B2 (en) 2013-01-29 2017-02-28 Hewlett-Packard Development Company, L.P. Interconnects through dielecric vias

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9583432B2 (en) 2013-01-29 2017-02-28 Hewlett-Packard Development Company, L.P. Interconnects through dielecric vias
US9780028B2 (en) 2013-01-29 2017-10-03 Hewlett-Packard Development Company, L.P. Interconnects through dielectric vias

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees