TW210421B - - Google Patents

Download PDF

Info

Publication number
TW210421B
TW210421B TW081104483A TW81104483A TW210421B TW 210421 B TW210421 B TW 210421B TW 081104483 A TW081104483 A TW 081104483A TW 81104483 A TW81104483 A TW 81104483A TW 210421 B TW210421 B TW 210421B
Authority
TW
Taiwan
Prior art keywords
copper
copper foil
protective film
bsrcf
foils
Prior art date
Application number
TW081104483A
Other languages
English (en)
Chinese (zh)
Original Assignee
Sumitomo Bakelite Co
Furukawa Circuit Foil Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co, Furukawa Circuit Foil Kk filed Critical Sumitomo Bakelite Co
Application granted granted Critical
Publication of TW210421B publication Critical patent/TW210421B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Insulated Conductors (AREA)
TW081104483A 1991-06-18 1992-06-09 TW210421B (US06373033-20020416-M00002.png)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3145704A JPH04369290A (ja) 1991-06-18 1991-06-18 保護フィルム付き両面粗化処理銅箔及びその製法

Publications (1)

Publication Number Publication Date
TW210421B true TW210421B (US06373033-20020416-M00002.png) 1993-08-01

Family

ID=15391189

Family Applications (1)

Application Number Title Priority Date Filing Date
TW081104483A TW210421B (US06373033-20020416-M00002.png) 1991-06-18 1992-06-09

Country Status (5)

Country Link
EP (1) EP0519631B1 (US06373033-20020416-M00002.png)
JP (1) JPH04369290A (US06373033-20020416-M00002.png)
KR (1) KR100324486B1 (US06373033-20020416-M00002.png)
DE (1) DE69225091T2 (US06373033-20020416-M00002.png)
TW (1) TW210421B (US06373033-20020416-M00002.png)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6770380B2 (en) 1998-08-11 2004-08-03 Nikko Materials Usa, Inc. Resin/copper/metal laminate and method of producing same
JP2005340382A (ja) * 2004-05-25 2005-12-08 Mitsui Mining & Smelting Co Ltd フレキシブルプリント配線板及びそのフレキシブルプリント配線板の製造方法
KR100839760B1 (ko) * 2006-02-06 2008-06-19 주식회사 엘지화학 칩 온 필름용 동장 적층판
JP5018181B2 (ja) * 2007-03-30 2012-09-05 味の素株式会社 多層プリント配線板の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1778825A1 (de) * 1968-06-10 1971-08-26 Licentia Gmbh Verfahren zur Herstellung von kupferkaschierten Schichtstoffen bzw.Schichtpressstoffen
EP0395871A3 (en) * 1989-05-05 1991-09-18 Gould Electronics Inc. Protected conductive foil and procedure for protecting an electrodeposited metallic foil during further processing
JPH0366195A (ja) * 1989-08-04 1991-03-20 Hitachi Chem Co Ltd 銅張り積層板

Also Published As

Publication number Publication date
DE69225091T2 (de) 1998-12-03
DE69225091D1 (de) 1998-05-20
KR930000257A (ko) 1993-01-15
KR100324486B1 (ko) 2002-06-20
EP0519631B1 (en) 1998-04-15
EP0519631A3 (US06373033-20020416-M00002.png) 1994-12-28
JPH04369290A (ja) 1992-12-22
EP0519631A2 (en) 1992-12-23

Similar Documents

Publication Publication Date Title
US5057372A (en) Multilayer film and laminate for use in producing printed circuit boards
JP4006618B2 (ja) キャリア付銅箔の製法及びキャリア付銅箔を使用したプリント基板
US9992874B2 (en) Metal foil with carrier
US5286330A (en) Method of producing copper-clad laminated board
TW210421B (US06373033-20020416-M00002.png)
US5413838A (en) Both-side roughened copper foil with protection film
KR20170080535A (ko) 캐리어 부착 구리박 및 그것을 이용한 프린트 배선판의 제조 방법
JPH02307296A (ja) 保護された伝導フオイル及び処理中の電着金属フオイルを保護するための処理方法
TW573079B (en) Composite copper foil with copper or copper alloy support body, and printed circuit board using the composite copper foil
CN113038718A (zh) 超薄pcb板压合工艺
TW201808624A (zh) 捲筒狀積層體、捲筒狀積層體的製造方法、積層體的製造方法、增層基板的製造方法、印刷配線板的製造方法、電子機器的製造方法
JP2008074408A (ja) プラスチックシート及びキャリアテープ
US20010006740A1 (en) Component of printed circuit boards
JP4461766B2 (ja) 金属層転写用熱可塑性樹脂シート
US6955740B2 (en) Production of laminates for printed wiring boards using protective carrier
JP4630120B2 (ja) 回路基板およびその製造方法
JP2005205731A (ja) フレキシブル積層板の製造方法、およびフレキシブル積層板
JP6085404B2 (ja) アルミニウム箔積層体
JPS58153390A (ja) プリント回路用基材及びその製造方法
JPH05329981A (ja) 保護フィルム付き片面粗化処理銅箔
JP2004103681A (ja) 銅又は銅合金の支持体を備えた複合銅箔及び該複合銅箔を使用したプリント基板
JPS6149111B2 (US06373033-20020416-M00002.png)
JPH06316042A (ja) 積層体
JP2019183272A (ja) キャリア材及びそれを用いた加熱プレス方法
JP2003198084A (ja) プリント配線基板用複合箔及びその製造方法