TW202527408A - 光模組及光收發器 - Google Patents

光模組及光收發器 Download PDF

Info

Publication number
TW202527408A
TW202527408A TW113144624A TW113144624A TW202527408A TW 202527408 A TW202527408 A TW 202527408A TW 113144624 A TW113144624 A TW 113144624A TW 113144624 A TW113144624 A TW 113144624A TW 202527408 A TW202527408 A TW 202527408A
Authority
TW
Taiwan
Prior art keywords
optical
base
main surface
integrated circuit
module
Prior art date
Application number
TW113144624A
Other languages
English (en)
Chinese (zh)
Inventor
中野誠二
Original Assignee
日商三菱電機股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三菱電機股份有限公司 filed Critical 日商三菱電機股份有限公司
Publication of TW202527408A publication Critical patent/TW202527408A/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/02208Mountings; Housings characterised by the shape of the housings
    • H01S5/02212Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/024Arrangements for thermal management
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/026Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/04Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042Electrical excitation ; Circuits therefor

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
TW113144624A 2023-12-20 2024-11-20 光模組及光收發器 TW202527408A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2023/045748 WO2025134277A1 (ja) 2023-12-20 2023-12-20 光モジュールおよび光トランシーバ
WOPCT/JP2023/045748 2023-12-20

Publications (1)

Publication Number Publication Date
TW202527408A true TW202527408A (zh) 2025-07-01

Family

ID=92588297

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113144624A TW202527408A (zh) 2023-12-20 2024-11-20 光模組及光收發器

Country Status (3)

Country Link
JP (1) JP7544304B1 (https=)
TW (1) TW202527408A (https=)
WO (1) WO2025134277A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117178445A (zh) * 2021-04-27 2023-12-05 三菱电机株式会社 半导体激光光源装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003307603A (ja) * 2002-02-15 2003-10-31 Omron Corp 光学素子及び当該素子を用いた光学部品
US8855160B2 (en) * 2009-11-30 2014-10-07 Hitachi, Ltd. Horizontal-cavity surface-emitting laser
JP6794140B2 (ja) * 2016-05-23 2020-12-02 オプト エレクトロニクス ソリューションズ 光送信機及びこれを含む光モジュール
JP6408661B2 (ja) * 2017-07-21 2018-10-17 京セラ株式会社 To−can型パッケージ用ヘッダーおよび半導体装置
WO2021014568A1 (ja) * 2019-07-23 2021-01-28 三菱電機株式会社 To-can型光送信モジュール
WO2022123719A1 (ja) * 2020-12-10 2022-06-16 日本電信電話株式会社 波長可変光送信機
JP7502983B2 (ja) * 2020-12-23 2024-06-19 CIG Photonics Japan株式会社 光モジュール
JP2022143754A (ja) * 2021-03-18 2022-10-03 CIG Photonics Japan株式会社 光モジュール

Also Published As

Publication number Publication date
WO2025134277A1 (ja) 2025-06-26
JP7544304B1 (ja) 2024-09-03
JPWO2025134277A1 (https=) 2025-06-26

Similar Documents

Publication Publication Date Title
US7317742B2 (en) Optical sub-assembly having a thermo-electric cooler and an optical transceiver using the optical sub-assembly
CN102422193B (zh) 具有陶瓷封装的光学装置的光学组件
TWI859936B (zh) 半導體雷射光源裝置
CN116577885B (zh) 一种光模块封装结构
CN112993055A (zh) 光模块
TW202527408A (zh) 光模組及光收發器
JP7545349B2 (ja) 光モジュール
JP7020590B1 (ja) レーザ光源装置
JP7466773B1 (ja) 光モジュール
US12206218B2 (en) Optical module
US6465858B2 (en) Semiconductor device package for optical communication device
JPH11186668A (ja) 光半導体モジュール
TWI863260B (zh) 半導體雷射光源裝置
JP2004335584A (ja) 半導体パッケージ
US20230359024A1 (en) Optical device, subassembly of optical device, and method of manufacturing optical device
US6023481A (en) Module having Peltier element
JP4951691B2 (ja) 光伝送モジュールおよびこれを用いた光通信装置
GB2260225A (en) High-frequency semiconductor hybrid integrated circuit device
JP7542466B2 (ja) 光モジュール
US20050259706A1 (en) High speed optoelectronic subassembly and package for optical devices
WO2021006344A1 (ja) アレイアンテナ装置
JP7513228B1 (ja) Can型光モジュールおよび光トランシーバ
US12210231B2 (en) Optical module and manufacturing method of optical module for optical communication
JP2004259880A (ja) 光半導体装置
JP7246590B1 (ja) 半導体レーザ光源装置