TW202514873A - 基板收納容器 - Google Patents

基板收納容器 Download PDF

Info

Publication number
TW202514873A
TW202514873A TW113118966A TW113118966A TW202514873A TW 202514873 A TW202514873 A TW 202514873A TW 113118966 A TW113118966 A TW 113118966A TW 113118966 A TW113118966 A TW 113118966A TW 202514873 A TW202514873 A TW 202514873A
Authority
TW
Taiwan
Prior art keywords
rib
wall
substrate storage
opening
container body
Prior art date
Application number
TW113118966A
Other languages
English (en)
Chinese (zh)
Inventor
福田隆二
Original Assignee
日商未來兒股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商未來兒股份有限公司 filed Critical 日商未來兒股份有限公司
Publication of TW202514873A publication Critical patent/TW202514873A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1916—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1918—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier

Landscapes

  • Packaging Frangible Articles (AREA)
TW113118966A 2023-05-25 2024-05-22 基板收納容器 TW202514873A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2023/019438 WO2024241560A1 (ja) 2023-05-25 2023-05-25 基板収納容器
WOPCT/JP2023/019438 2023-05-25

Publications (1)

Publication Number Publication Date
TW202514873A true TW202514873A (zh) 2025-04-01

Family

ID=93589226

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113118966A TW202514873A (zh) 2023-05-25 2024-05-22 基板收納容器

Country Status (5)

Country Link
JP (1) JPWO2024241560A1 (https=)
KR (1) KR20260018811A (https=)
CN (1) CN121039800A (https=)
TW (1) TW202514873A (https=)
WO (1) WO2024241560A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3916342B2 (ja) * 1999-04-20 2007-05-16 信越ポリマー株式会社 基板収納容器
JP4204284B2 (ja) * 2002-09-11 2009-01-07 信越ポリマー株式会社 基板収納容器
JP2011077166A (ja) * 2009-09-29 2011-04-14 Shin Etsu Polymer Co Ltd 基板収納容器
TWI515160B (zh) * 2010-10-19 2016-01-01 安堤格里斯公司 具自動凸緣之前開式晶圓容器
JP2015521377A (ja) * 2012-05-04 2015-07-27 インテグリス・インコーポレーテッド ドア接点シールを有するウェハ容器
JP6000075B2 (ja) * 2012-11-08 2016-09-28 ミライアル株式会社 基板収納容器
US11309200B2 (en) * 2017-02-27 2022-04-19 Miraial Co., Ltd. Substrate storage container

Also Published As

Publication number Publication date
KR20260018811A (ko) 2026-02-09
CN121039800A (zh) 2025-11-28
WO2024241560A1 (ja) 2024-11-28
JPWO2024241560A1 (https=) 2024-11-28

Similar Documents

Publication Publication Date Title
CN102017118B (zh) 保持器及包括保持器的基板收纳容器
TWI878536B (zh) 基板收納容器
CN110574152B (zh) 基板收纳容器
US9698033B2 (en) Substrate storing container
JP2013546176A (ja) ロボットフランジを有する前面開口ウェーハ容器
TW201502044A (zh) 基板收納容器
TWI697066B (zh) 基板收納容器
US20100025287A1 (en) Wafer Container with Constraints
US12424472B2 (en) Substrate storing container
US9865487B2 (en) Substrate storage container
US20260082855A1 (en) Substrate housing container and rear retainer
TWI715873B (zh) 裝載埠裝置以及裝載埠裝置的驅動方法
TW202514873A (zh) 基板收納容器
JP2004304122A (ja) 精密基板収納容器
TW202310702A (zh) 基板收納容器及其製造方法以及蓋體側基板支承部
KR102942671B1 (ko) 기판수납용기 및 그 뚜껑
TW202449953A (zh) 基板收納容器
TW202348529A (zh) 基板收納容器以及蓋體側基板支承部
JP6000075B2 (ja) 基板収納容器
TW202448781A (zh) 基板收納容器
WO2026083709A1 (ja) 基板収納容器
JP2011031964A (ja) 基板支持枠及び基板収納容器
TW202448779A (zh) 基板收納容器
TW202516660A (zh) 基板收納容器
TW202545794A (zh) 基板收納容器