JPWO2024241560A1 - - Google Patents
Info
- Publication number
- JPWO2024241560A1 JPWO2024241560A1 JP2025521750A JP2025521750A JPWO2024241560A1 JP WO2024241560 A1 JPWO2024241560 A1 JP WO2024241560A1 JP 2025521750 A JP2025521750 A JP 2025521750A JP 2025521750 A JP2025521750 A JP 2025521750A JP WO2024241560 A1 JPWO2024241560 A1 JP WO2024241560A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1916—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1918—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/019438 WO2024241560A1 (ja) | 2023-05-25 | 2023-05-25 | 基板収納容器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024241560A1 true JPWO2024241560A1 (https=) | 2024-11-28 |
| JPWO2024241560A5 JPWO2024241560A5 (https=) | 2026-03-25 |
Family
ID=93589226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025521750A Pending JPWO2024241560A1 (https=) | 2023-05-25 | 2023-05-25 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024241560A1 (https=) |
| KR (1) | KR20260018811A (https=) |
| CN (1) | CN121039800A (https=) |
| TW (1) | TW202514873A (https=) |
| WO (1) | WO2024241560A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3916342B2 (ja) * | 1999-04-20 | 2007-05-16 | 信越ポリマー株式会社 | 基板収納容器 |
| JP4204284B2 (ja) * | 2002-09-11 | 2009-01-07 | 信越ポリマー株式会社 | 基板収納容器 |
| JP2011077166A (ja) * | 2009-09-29 | 2011-04-14 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
| TWI515160B (zh) * | 2010-10-19 | 2016-01-01 | 安堤格里斯公司 | 具自動凸緣之前開式晶圓容器 |
| JP2015521377A (ja) * | 2012-05-04 | 2015-07-27 | インテグリス・インコーポレーテッド | ドア接点シールを有するウェハ容器 |
| JP6000075B2 (ja) * | 2012-11-08 | 2016-09-28 | ミライアル株式会社 | 基板収納容器 |
| US11309200B2 (en) * | 2017-02-27 | 2022-04-19 | Miraial Co., Ltd. | Substrate storage container |
-
2023
- 2023-05-25 KR KR1020257038593A patent/KR20260018811A/ko active Pending
- 2023-05-25 JP JP2025521750A patent/JPWO2024241560A1/ja active Pending
- 2023-05-25 CN CN202380097633.6A patent/CN121039800A/zh active Pending
- 2023-05-25 WO PCT/JP2023/019438 patent/WO2024241560A1/ja not_active Ceased
-
2024
- 2024-05-22 TW TW113118966A patent/TW202514873A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20260018811A (ko) | 2026-02-09 |
| CN121039800A (zh) | 2025-11-28 |
| WO2024241560A1 (ja) | 2024-11-28 |
| TW202514873A (zh) | 2025-04-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251119 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251202 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260410 |