TW202509166A - 熱硬化型黏著片及印刷配線板 - Google Patents

熱硬化型黏著片及印刷配線板 Download PDF

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Publication number
TW202509166A
TW202509166A TW113120491A TW113120491A TW202509166A TW 202509166 A TW202509166 A TW 202509166A TW 113120491 A TW113120491 A TW 113120491A TW 113120491 A TW113120491 A TW 113120491A TW 202509166 A TW202509166 A TW 202509166A
Authority
TW
Taiwan
Prior art keywords
adhesive sheet
thermosetting adhesive
mass
resin
styrene
Prior art date
Application number
TW113120491A
Other languages
English (en)
Chinese (zh)
Inventor
伊原恵
大旗亮平
谷井翔太
Original Assignee
日商Ｄｉｃ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｄｉｃ股份有限公司 filed Critical 日商Ｄｉｃ股份有限公司
Publication of TW202509166A publication Critical patent/TW202509166A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/06—Copolymers with styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C09J125/04—Homopolymers or copolymers of styrene
    • C09J125/08—Copolymers of styrene
    • C09J125/10—Copolymers of styrene with conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Laminated Bodies (AREA)
TW113120491A 2023-08-10 2024-06-03 熱硬化型黏著片及印刷配線板 TW202509166A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-130948 2023-08-10
JP2023130948 2023-08-10

Publications (1)

Publication Number Publication Date
TW202509166A true TW202509166A (zh) 2025-03-01

Family

ID=94534216

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113120491A TW202509166A (zh) 2023-08-10 2024-06-03 熱硬化型黏著片及印刷配線板

Country Status (5)

Country Link
JP (1) JPWO2025032955A1 (https=)
KR (1) KR20260049119A (https=)
CN (1) CN121399222A (https=)
TW (1) TW202509166A (https=)
WO (1) WO2025032955A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005277135A (ja) * 2004-03-25 2005-10-06 Toray Ind Inc 半導体用接着剤組成物およびそれを用いた半導体用接着剤シート、半導体集積回路接続用基板、半導体装置
JP2013145840A (ja) * 2012-01-16 2013-07-25 Mitsubishi Chemicals Corp 三次元集積回路の層間充填層形成用塗布液、及び三次元集積回路の製造方法
JP7676761B2 (ja) * 2020-12-04 2025-05-15 ａｒｔｉｅｎｃｅ株式会社 絶縁性組成物、熱硬化性接着シート、熱伝導性接着層および複合部材
JPWO2022255078A1 (https=) * 2021-06-02 2022-12-08

Also Published As

Publication number Publication date
CN121399222A (zh) 2026-01-23
WO2025032955A1 (ja) 2025-02-13
JPWO2025032955A1 (https=) 2025-02-13
KR20260049119A (ko) 2026-04-13

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