TW202501062A - 樹脂組成物、薄膜、薄膜組、光波導、光電複合基板、及電子零件 - Google Patents

樹脂組成物、薄膜、薄膜組、光波導、光電複合基板、及電子零件 Download PDF

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TW202501062A
TW202501062A TW113112013A TW113112013A TW202501062A TW 202501062 A TW202501062 A TW 202501062A TW 113112013 A TW113112013 A TW 113112013A TW 113112013 A TW113112013 A TW 113112013A TW 202501062 A TW202501062 A TW 202501062A
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Taiwan
Prior art keywords
film
resin
resin composition
less
resin layer
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TW113112013A
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English (en)
Chinese (zh)
Inventor
田中裕馬
佐藤健太
松原由奈
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日商住友電木股份有限公司
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Application filed by 日商住友電木股份有限公司 filed Critical 日商住友電木股份有限公司
Publication of TW202501062A publication Critical patent/TW202501062A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F32/00—Homopolymers and copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
    • C08F32/02—Homopolymers and copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having no condensed rings
    • C08F32/04—Homopolymers and copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having no condensed rings having one carbon-to-carbon double bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L45/00—Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L87/00—Compositions of unspecified macromolecular compounds, obtained otherwise than by polymerisation reactions only involving unsaturated carbon-to-carbon bonds
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

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  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Optical Integrated Circuits (AREA)
TW113112013A 2023-03-31 2024-03-29 樹脂組成物、薄膜、薄膜組、光波導、光電複合基板、及電子零件 TW202501062A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-057397 2023-03-31
JP2023057397 2023-03-31

Publications (1)

Publication Number Publication Date
TW202501062A true TW202501062A (zh) 2025-01-01

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TW113112013A TW202501062A (zh) 2023-03-31 2024-03-29 樹脂組成物、薄膜、薄膜組、光波導、光電複合基板、及電子零件

Country Status (4)

Country Link
JP (1) JPWO2024204317A1 (https=)
CN (1) CN120936678A (https=)
TW (1) TW202501062A (https=)
WO (1) WO2024204317A1 (https=)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003302544A (ja) * 2002-04-10 2003-10-24 Mitsui Chemicals Inc 光路変換機能付高分子光導波路素子およびその製造方法
JP4498102B2 (ja) * 2004-11-10 2010-07-07 イビデン株式会社 光電気配線板、および、光通信用デバイス
JP2006119659A (ja) * 2005-12-05 2006-05-11 Hitachi Ltd ポリマー光導波路、及びその製造方法
EP2083293A4 (en) * 2006-11-16 2010-09-01 Sumitomo Bakelite Co GUIDE OF LIGHT AND STRUCTURE OF GUIDE OF LIGHT
JP2011221143A (ja) * 2010-04-06 2011-11-04 Sumitomo Bakelite Co Ltd 光導波路構造体および電子機器
JP2011221193A (ja) * 2010-04-07 2011-11-04 Sumitomo Bakelite Co Ltd 光導波路構造体および電子機器
JPWO2011138856A1 (ja) * 2010-05-06 2013-07-22 住友ベークライト株式会社 光学装置および光学装置の製造方法
JP6245569B2 (ja) * 2013-06-06 2017-12-13 日東電工株式会社 光電気混載基板
JP7643165B2 (ja) * 2021-05-07 2025-03-11 大日本印刷株式会社 ポリイミド樹脂、ポリイミド組成物、ポリイミド組成物の硬化膜及びその製造方法、絶縁膜、保護膜、並びに、電子部品
US12600101B2 (en) * 2021-10-26 2026-04-14 Sumitomo Bakelite Co., Ltd. Manufacturing method of optical waveguide
JP7414185B2 (ja) * 2021-10-28 2024-01-16 住友ベークライト株式会社 光導波路の製造方法
JP7311066B1 (ja) * 2021-12-27 2023-07-19 住友ベークライト株式会社 光導波路の製造方法
JP2024064435A (ja) * 2022-10-28 2024-05-14 大日本印刷株式会社 樹脂組成物、樹脂組成物の硬化膜及びその製造方法、絶縁膜、保護膜、並びに、電子部品

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Publication number Publication date
WO2024204317A1 (ja) 2024-10-03
JPWO2024204317A1 (https=) 2024-10-03
CN120936678A (zh) 2025-11-11

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