CN120936678A - 树脂组合物、膜、膜组、光波导、光电复合基板和电子部件 - Google Patents

树脂组合物、膜、膜组、光波导、光电复合基板和电子部件

Info

Publication number
CN120936678A
CN120936678A CN202480020325.8A CN202480020325A CN120936678A CN 120936678 A CN120936678 A CN 120936678A CN 202480020325 A CN202480020325 A CN 202480020325A CN 120936678 A CN120936678 A CN 120936678A
Authority
CN
China
Prior art keywords
resin
resin composition
film
resin layer
sample
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480020325.8A
Other languages
English (en)
Chinese (zh)
Inventor
田中裕马
佐藤健太
松原由奈
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of CN120936678A publication Critical patent/CN120936678A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F32/00—Homopolymers and copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
    • C08F32/02—Homopolymers and copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having no condensed rings
    • C08F32/04—Homopolymers and copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having no condensed rings having one carbon-to-carbon double bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L45/00—Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L87/00—Compositions of unspecified macromolecular compounds, obtained otherwise than by polymerisation reactions only involving unsaturated carbon-to-carbon bonds
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Optical Integrated Circuits (AREA)
CN202480020325.8A 2023-03-31 2024-03-27 树脂组合物、膜、膜组、光波导、光电复合基板和电子部件 Pending CN120936678A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023-057397 2023-03-31
JP2023057397 2023-03-31
PCT/JP2024/012202 WO2024204317A1 (ja) 2023-03-31 2024-03-27 樹脂組成物、フィルム、フィルムセット、光導波路、光電気複合基板、および電子部品

Publications (1)

Publication Number Publication Date
CN120936678A true CN120936678A (zh) 2025-11-11

Family

ID=92907576

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480020325.8A Pending CN120936678A (zh) 2023-03-31 2024-03-27 树脂组合物、膜、膜组、光波导、光电复合基板和电子部件

Country Status (4)

Country Link
JP (1) JPWO2024204317A1 (https=)
CN (1) CN120936678A (https=)
TW (1) TW202501062A (https=)
WO (1) WO2024204317A1 (https=)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003302544A (ja) * 2002-04-10 2003-10-24 Mitsui Chemicals Inc 光路変換機能付高分子光導波路素子およびその製造方法
JP4498102B2 (ja) * 2004-11-10 2010-07-07 イビデン株式会社 光電気配線板、および、光通信用デバイス
JP2006119659A (ja) * 2005-12-05 2006-05-11 Hitachi Ltd ポリマー光導波路、及びその製造方法
EP2083293A4 (en) * 2006-11-16 2010-09-01 Sumitomo Bakelite Co GUIDE OF LIGHT AND STRUCTURE OF GUIDE OF LIGHT
JP2011221143A (ja) * 2010-04-06 2011-11-04 Sumitomo Bakelite Co Ltd 光導波路構造体および電子機器
JP2011221193A (ja) * 2010-04-07 2011-11-04 Sumitomo Bakelite Co Ltd 光導波路構造体および電子機器
JPWO2011138856A1 (ja) * 2010-05-06 2013-07-22 住友ベークライト株式会社 光学装置および光学装置の製造方法
JP6245569B2 (ja) * 2013-06-06 2017-12-13 日東電工株式会社 光電気混載基板
JP7643165B2 (ja) * 2021-05-07 2025-03-11 大日本印刷株式会社 ポリイミド樹脂、ポリイミド組成物、ポリイミド組成物の硬化膜及びその製造方法、絶縁膜、保護膜、並びに、電子部品
US12600101B2 (en) * 2021-10-26 2026-04-14 Sumitomo Bakelite Co., Ltd. Manufacturing method of optical waveguide
JP7414185B2 (ja) * 2021-10-28 2024-01-16 住友ベークライト株式会社 光導波路の製造方法
JP7311066B1 (ja) * 2021-12-27 2023-07-19 住友ベークライト株式会社 光導波路の製造方法
JP2024064435A (ja) * 2022-10-28 2024-05-14 大日本印刷株式会社 樹脂組成物、樹脂組成物の硬化膜及びその製造方法、絶縁膜、保護膜、並びに、電子部品

Also Published As

Publication number Publication date
TW202501062A (zh) 2025-01-01
WO2024204317A1 (ja) 2024-10-03
JPWO2024204317A1 (https=) 2024-10-03

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