TW202448216A - 電漿處理裝置及電漿處理方法 - Google Patents
電漿處理裝置及電漿處理方法 Download PDFInfo
- Publication number
- TW202448216A TW202448216A TW113101047A TW113101047A TW202448216A TW 202448216 A TW202448216 A TW 202448216A TW 113101047 A TW113101047 A TW 113101047A TW 113101047 A TW113101047 A TW 113101047A TW 202448216 A TW202448216 A TW 202448216A
- Authority
- TW
- Taiwan
- Prior art keywords
- plasma
- frequency component
- frequency
- power level
- period
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
- H01J37/32155—Frequency modulation
- H01J37/32165—Plural frequencies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
- H01J37/3211—Antennas, e.g. particular shapes of coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
- H01J37/32183—Matching circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/3299—Feedback systems
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023-005664 | 2023-01-18 | ||
| JP2023005664 | 2023-01-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202448216A true TW202448216A (zh) | 2024-12-01 |
Family
ID=91955902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW113101047A TW202448216A (zh) | 2023-01-18 | 2024-01-10 | 電漿處理裝置及電漿處理方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250343027A1 (https=) |
| JP (1) | JPWO2024154612A1 (https=) |
| KR (1) | KR20250135221A (https=) |
| CN (1) | CN120570068A (https=) |
| TW (1) | TW202448216A (https=) |
| WO (1) | WO2024154612A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3122618B2 (ja) * | 1996-08-23 | 2001-01-09 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| US20050069651A1 (en) * | 2003-09-30 | 2005-03-31 | Tokyo Electron Limited | Plasma processing system |
| US20140367043A1 (en) * | 2013-06-17 | 2014-12-18 | Applied Materials, Inc. | Method for fast and repeatable plasma ignition and tuning in plasma chambers |
| JP7334102B2 (ja) | 2019-10-11 | 2023-08-28 | 株式会社ダイヘン | 高周波電源装置 |
-
2024
- 2024-01-09 JP JP2024571709A patent/JPWO2024154612A1/ja active Pending
- 2024-01-09 WO PCT/JP2024/000187 patent/WO2024154612A1/ja not_active Ceased
- 2024-01-09 CN CN202480007046.8A patent/CN120570068A/zh active Pending
- 2024-01-09 KR KR1020257026073A patent/KR20250135221A/ko active Pending
- 2024-01-10 TW TW113101047A patent/TW202448216A/zh unknown
-
2025
- 2025-07-10 US US19/265,822 patent/US20250343027A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2024154612A1 (https=) | 2024-07-25 |
| CN120570068A (zh) | 2025-08-29 |
| WO2024154612A1 (ja) | 2024-07-25 |
| US20250343027A1 (en) | 2025-11-06 |
| KR20250135221A (ko) | 2025-09-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW202418342A (zh) | 電漿處理系統及電漿處理方法 | |
| JP7607539B2 (ja) | プラズマ処理装置及び処理方法 | |
| TW202422625A (zh) | 電漿處理裝置及電漿處理方法 | |
| TW202423188A (zh) | 電漿處理裝置及電漿處理方法 | |
| JP7675954B2 (ja) | プラズマ処理装置及びプラズマ処理方法 | |
| US20250191883A1 (en) | Plasma processing apparatus, rf system, and rf control method | |
| TW202448216A (zh) | 電漿處理裝置及電漿處理方法 | |
| TW202524960A (zh) | 電漿處理裝置及阻抗匹配方法 | |
| TW202507791A (zh) | 電漿處理裝置 | |
| US20250266248A1 (en) | Electric bias control in plasma processing | |
| US20250364234A1 (en) | Anomaly detection method and plasma processing device | |
| TW202533280A (zh) | 電漿處理裝置及控制方法 | |
| JP2024098586A (ja) | プラズマ処理装置及び制御方法 | |
| WO2025142138A1 (ja) | プラズマ処理装置 | |
| TW202431327A (zh) | 電漿處理裝置及電源系統 | |
| TW202606015A (zh) | 基板支持器、基板處理裝置、及基台 | |
| TW202442033A (zh) | 電漿處理裝置、電源系統及頻率控制方法 | |
| WO2025169740A1 (ja) | プラズマ処理装置、電源システム、制御方法、及びプログラム | |
| WO2026070514A1 (ja) | プラズマ処理装置及びエッチング方法 | |
| JP2024119243A (ja) | プラズマ処理装置、電源システム、及びプラズマ処理方法 | |
| TW202418335A (zh) | 電漿處理裝置及電源系統 | |
| JP2026004103A (ja) | プラズマ処理装置及びプラズマ処理方法 | |
| WO2024106257A1 (ja) | プラズマ処理装置及びプラズマ処理方法 | |
| TW202548842A (zh) | 電漿處理裝置及清潔方法 | |
| JP2026027648A (ja) | 基板支持器及びプラズマ処理装置 |