TW202444862A - 研磨用組成物 - Google Patents

研磨用組成物 Download PDF

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Publication number
TW202444862A
TW202444862A TW113109959A TW113109959A TW202444862A TW 202444862 A TW202444862 A TW 202444862A TW 113109959 A TW113109959 A TW 113109959A TW 113109959 A TW113109959 A TW 113109959A TW 202444862 A TW202444862 A TW 202444862A
Authority
TW
Taiwan
Prior art keywords
water
polishing
less
polymer
soluble polymer
Prior art date
Application number
TW113109959A
Other languages
English (en)
Chinese (zh)
Inventor
希
今井春雄
Original Assignee
日商福吉米股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商福吉米股份有限公司 filed Critical 日商福吉米股份有限公司
Publication of TW202444862A publication Critical patent/TW202444862A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW113109959A 2023-03-20 2024-03-18 研磨用組成物 TW202444862A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-044298 2023-03-20
JP2023044298 2023-03-20

Publications (1)

Publication Number Publication Date
TW202444862A true TW202444862A (zh) 2024-11-16

Family

ID=92842085

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113109959A TW202444862A (zh) 2023-03-20 2024-03-18 研磨用組成物

Country Status (3)

Country Link
JP (1) JPWO2024195575A1 (https=)
TW (1) TW202444862A (https=)
WO (1) WO2024195575A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026070724A1 (ja) * 2024-09-27 2026-04-02 株式会社フジミインコーポレーテッド 表面処理組成物、表面処理組成物の濃縮液および表面処理方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102239045B1 (ko) * 2013-06-07 2021-04-12 가부시키가이샤 후지미인코퍼레이티드 실리콘 웨이퍼 연마용 조성물
JP7440423B2 (ja) * 2018-11-12 2024-02-28 株式会社フジミインコーポレーテッド 研磨用組成物
JP2020203980A (ja) * 2019-06-17 2020-12-24 日本キャボット・マイクロエレクトロニクス株式会社 化学機械研磨組成物、リンス組成物、化学機械研磨方法及びリンス方法
JP7778727B2 (ja) * 2021-01-18 2025-12-02 株式会社フジミインコーポレーテッド 研磨用組成物

Also Published As

Publication number Publication date
JPWO2024195575A1 (https=) 2024-09-26
WO2024195575A1 (ja) 2024-09-26

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