JPWO2024195575A1 - - Google Patents
Info
- Publication number
- JPWO2024195575A1 JPWO2024195575A1 JP2025508312A JP2025508312A JPWO2024195575A1 JP WO2024195575 A1 JPWO2024195575 A1 JP WO2024195575A1 JP 2025508312 A JP2025508312 A JP 2025508312A JP 2025508312 A JP2025508312 A JP 2025508312A JP WO2024195575 A1 JPWO2024195575 A1 JP WO2024195575A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023044298 | 2023-03-20 | ||
| PCT/JP2024/008890 WO2024195575A1 (ja) | 2023-03-20 | 2024-03-07 | 研磨用組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024195575A1 true JPWO2024195575A1 (https=) | 2024-09-26 |
Family
ID=92842085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025508312A Pending JPWO2024195575A1 (https=) | 2023-03-20 | 2024-03-07 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2024195575A1 (https=) |
| TW (1) | TW202444862A (https=) |
| WO (1) | WO2024195575A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026070724A1 (ja) * | 2024-09-27 | 2026-04-02 | 株式会社フジミインコーポレーテッド | 表面処理組成物、表面処理組成物の濃縮液および表面処理方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102239045B1 (ko) * | 2013-06-07 | 2021-04-12 | 가부시키가이샤 후지미인코퍼레이티드 | 실리콘 웨이퍼 연마용 조성물 |
| JP7440423B2 (ja) * | 2018-11-12 | 2024-02-28 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP2020203980A (ja) * | 2019-06-17 | 2020-12-24 | 日本キャボット・マイクロエレクトロニクス株式会社 | 化学機械研磨組成物、リンス組成物、化学機械研磨方法及びリンス方法 |
| JP7778727B2 (ja) * | 2021-01-18 | 2025-12-02 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
-
2024
- 2024-03-07 WO PCT/JP2024/008890 patent/WO2024195575A1/ja not_active Ceased
- 2024-03-07 JP JP2025508312A patent/JPWO2024195575A1/ja active Pending
- 2024-03-18 TW TW113109959A patent/TW202444862A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202444862A (zh) | 2024-11-16 |
| WO2024195575A1 (ja) | 2024-09-26 |