JPWO2023181929A1 - - Google Patents
Info
- Publication number
- JPWO2023181929A1 JPWO2023181929A1 JP2024509970A JP2024509970A JPWO2023181929A1 JP WO2023181929 A1 JPWO2023181929 A1 JP WO2023181929A1 JP 2024509970 A JP2024509970 A JP 2024509970A JP 2024509970 A JP2024509970 A JP 2024509970A JP WO2023181929 A1 JPWO2023181929 A1 JP WO2023181929A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022047444 | 2022-03-23 | ||
| PCT/JP2023/008723 WO2023181929A1 (ja) | 2022-03-23 | 2023-03-08 | 研磨用組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023181929A1 true JPWO2023181929A1 (https=) | 2023-09-28 |
| JPWO2023181929A5 JPWO2023181929A5 (https=) | 2024-11-29 |
Family
ID=88101272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024509970A Pending JPWO2023181929A1 (https=) | 2022-03-23 | 2023-03-08 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023181929A1 (https=) |
| TW (1) | TW202346500A (https=) |
| WO (1) | WO2023181929A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026070724A1 (ja) * | 2024-09-27 | 2026-04-02 | 株式会社フジミインコーポレーテッド | 表面処理組成物、表面処理組成物の濃縮液および表面処理方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5860848A (en) * | 1995-06-01 | 1999-01-19 | Rodel, Inc. | Polishing silicon wafers with improved polishing slurries |
| JP2004319759A (ja) * | 2003-04-16 | 2004-11-11 | Hitachi Chem Co Ltd | 金属用研磨液及び研磨方法 |
| CN103740281B (zh) * | 2013-12-31 | 2015-11-25 | 深圳市力合材料有限公司 | 一种适用于大尺寸硅晶片抛光的抛光组合物及其制备方法 |
| JP7353051B2 (ja) * | 2019-03-26 | 2023-09-29 | 株式会社フジミインコーポレーテッド | シリコンウェーハ研磨用組成物 |
| JP7349309B2 (ja) * | 2019-09-30 | 2023-09-22 | 株式会社フジミインコーポレーテッド | シリコンウェーハ用研磨用組成物 |
-
2023
- 2023-03-08 WO PCT/JP2023/008723 patent/WO2023181929A1/ja not_active Ceased
- 2023-03-08 JP JP2024509970A patent/JPWO2023181929A1/ja active Pending
- 2023-03-21 TW TW112110351A patent/TW202346500A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202346500A (zh) | 2023-12-01 |
| WO2023181929A1 (ja) | 2023-09-28 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240828 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250917 |