TW202346500A - 研磨用組成物 - Google Patents

研磨用組成物 Download PDF

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Publication number
TW202346500A
TW202346500A TW112110351A TW112110351A TW202346500A TW 202346500 A TW202346500 A TW 202346500A TW 112110351 A TW112110351 A TW 112110351A TW 112110351 A TW112110351 A TW 112110351A TW 202346500 A TW202346500 A TW 202346500A
Authority
TW
Taiwan
Prior art keywords
weight
water
less
polishing
polymer
Prior art date
Application number
TW112110351A
Other languages
English (en)
Chinese (zh)
Inventor
後藤修
田中優己
Original Assignee
日商福吉米股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商福吉米股份有限公司 filed Critical 日商福吉米股份有限公司
Publication of TW202346500A publication Critical patent/TW202346500A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW112110351A 2022-03-23 2023-03-21 研磨用組成物 TW202346500A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022047444 2022-03-23
JP2022-047444 2022-03-23

Publications (1)

Publication Number Publication Date
TW202346500A true TW202346500A (zh) 2023-12-01

Family

ID=88101272

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112110351A TW202346500A (zh) 2022-03-23 2023-03-21 研磨用組成物

Country Status (3)

Country Link
JP (1) JPWO2023181929A1 (https=)
TW (1) TW202346500A (https=)
WO (1) WO2023181929A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026070724A1 (ja) * 2024-09-27 2026-04-02 株式会社フジミインコーポレーテッド 表面処理組成物、表面処理組成物の濃縮液および表面処理方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5860848A (en) * 1995-06-01 1999-01-19 Rodel, Inc. Polishing silicon wafers with improved polishing slurries
JP2004319759A (ja) * 2003-04-16 2004-11-11 Hitachi Chem Co Ltd 金属用研磨液及び研磨方法
CN103740281B (zh) * 2013-12-31 2015-11-25 深圳市力合材料有限公司 一种适用于大尺寸硅晶片抛光的抛光组合物及其制备方法
JP7353051B2 (ja) * 2019-03-26 2023-09-29 株式会社フジミインコーポレーテッド シリコンウェーハ研磨用組成物
JP7349309B2 (ja) * 2019-09-30 2023-09-22 株式会社フジミインコーポレーテッド シリコンウェーハ用研磨用組成物

Also Published As

Publication number Publication date
JPWO2023181929A1 (https=) 2023-09-28
WO2023181929A1 (ja) 2023-09-28

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