TW202442033A - 電漿處理裝置、電源系統及頻率控制方法 - Google Patents

電漿處理裝置、電源系統及頻率控制方法 Download PDF

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Publication number
TW202442033A
TW202442033A TW112144230A TW112144230A TW202442033A TW 202442033 A TW202442033 A TW 202442033A TW 112144230 A TW112144230 A TW 112144230A TW 112144230 A TW112144230 A TW 112144230A TW 202442033 A TW202442033 A TW 202442033A
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TW
Taiwan
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source
frequency
time
frequency power
variation pattern
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TW112144230A
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English (en)
Chinese (zh)
Inventor
輿水地塩
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日商東京威力科創股份有限公司
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Publication of TW202442033A publication Critical patent/TW202442033A/zh

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/46Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • H05H1/4645Radiofrequency discharges
    • H05H1/466Radiofrequency discharges using capacitive coupling means, e.g. electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/32174Circuits specially adapted for controlling the RF discharge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/32091Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/32128Radio frequency generated discharge using particular waveforms, e.g. polarised waves
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/32137Radio frequency generated discharge controlling of the discharge by modulation of energy
    • H01J37/32146Amplitude modulation, includes pulsing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/32137Radio frequency generated discharge controlling of the discharge by modulation of energy
    • H01J37/32155Frequency modulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/32137Radio frequency generated discharge controlling of the discharge by modulation of energy
    • H01J37/32155Frequency modulation
    • H01J37/32165Plural frequencies
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/32174Circuits specially adapted for controlling the RF discharge
    • H01J37/32183Matching circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H2242/00Auxiliary systems
    • H05H2242/20Power circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H2245/00Applications of plasma devices
    • H05H2245/40Surface treatments

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electromagnetism (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
TW112144230A 2022-11-30 2023-11-16 電漿處理裝置、電源系統及頻率控制方法 TW202442033A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022191299 2022-11-30
JP2022-191299 2022-11-30

Publications (1)

Publication Number Publication Date
TW202442033A true TW202442033A (zh) 2024-10-16

Family

ID=91323724

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112144230A TW202442033A (zh) 2022-11-30 2023-11-16 電漿處理裝置、電源系統及頻率控制方法

Country Status (6)

Country Link
US (1) US20250285837A1 (https=)
EP (1) EP4622397A1 (https=)
JP (2) JP7727860B2 (https=)
CN (2) CN121547930A (https=)
TW (1) TW202442033A (https=)
WO (1) WO2024116938A1 (https=)

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5319150B2 (ja) 2008-03-31 2013-10-16 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法及びコンピュータ読み取り可能な記憶媒体
US9947514B2 (en) * 2015-09-01 2018-04-17 Mks Instruments, Inc. Plasma RF bias cancellation system
JP6643212B2 (ja) * 2016-09-16 2020-02-12 株式会社日立ハイテクノロジーズ プラズマ処理装置及びプラズマ処理方法
US10424467B2 (en) * 2017-03-13 2019-09-24 Applied Materials, Inc. Smart RF pulsing tuning using variable frequency generators
CN109994360B (zh) * 2017-12-29 2021-06-01 中微半导体设备(上海)股份有限公司 一种等离子体射频调节方法及等离子处理装置
JP7175239B2 (ja) * 2018-06-22 2022-11-18 東京エレクトロン株式会社 制御方法、プラズマ処理装置、プログラム及び記憶媒体
WO2020068107A1 (en) * 2018-09-28 2020-04-02 Lam Research Corporation Systems and methods for optimizing power delivery to an electrode of a plasma chamber
CN110299279B (zh) * 2019-08-22 2019-11-12 中微半导体设备(上海)股份有限公司 一种射频电源系统、等离子体处理器及其调频匹配方法
CN110310878B (zh) * 2019-08-28 2019-11-12 中微半导体设备(上海)股份有限公司 一种等离子体处理器及其处理方法
JP7437142B2 (ja) * 2019-11-25 2024-02-22 株式会社ダイヘン 高周波電源システム
JP7511423B2 (ja) * 2019-12-17 2024-07-05 東京エレクトロン株式会社 プラズマ処理装置、プラズマ処理方法、及び電源システム
JP7474591B2 (ja) * 2019-12-27 2024-04-25 株式会社ダイヘン 高周波電源システム
KR102903079B1 (ko) * 2020-06-26 2025-12-19 램 리써치 코포레이션 기판에 걸친 플라즈마 프로세스 결과들의 균일도를 제어하기 위해 바이어스 무선 주파수 공급부에서 저 주파수 고조파의 사용을 위한 시스템들 및 방법들
KR20230034970A (ko) * 2020-07-08 2023-03-10 램 리써치 코포레이션 플라즈마 프로세싱 시스템의 무선 주파수 (radiofrequency) 공급 시스템으로부터 프로세스 제어 정보를 추출하기 위한 시스템들 및 방법들
JP7493428B2 (ja) * 2020-10-21 2024-05-31 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
JP7544594B2 (ja) * 2020-12-25 2024-09-03 株式会社ダイヘン 高周波電源システム
KR102786710B1 (ko) * 2021-01-29 2025-03-25 도쿄엘렉트론가부시키가이샤 플라즈마 처리 장치 및 소스 고주파 전력의 소스 주파수를 제어하는 방법
JP7692783B2 (ja) * 2021-05-06 2025-06-16 東京エレクトロン株式会社 プラズマ処理装置及び終点検出方法
TW202341227A (zh) * 2021-12-27 2023-10-16 日商東京威力科創股份有限公司 電漿處理裝置、電源系統、控制方法、程式及記憶媒體

Also Published As

Publication number Publication date
JPWO2024116938A1 (https=) 2024-06-06
WO2024116938A1 (ja) 2024-06-06
US20250285837A1 (en) 2025-09-11
JP2025159091A (ja) 2025-10-17
CN120345350B (zh) 2025-11-28
CN121547930A (zh) 2026-02-17
JP7727860B2 (ja) 2025-08-21
KR20250099261A (ko) 2025-07-01
CN120345350A (zh) 2025-07-18
EP4622397A1 (en) 2025-09-24

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