TW202436398A - 工件加工用片及其使用方法 - Google Patents

工件加工用片及其使用方法 Download PDF

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Publication number
TW202436398A
TW202436398A TW112149449A TW112149449A TW202436398A TW 202436398 A TW202436398 A TW 202436398A TW 112149449 A TW112149449 A TW 112149449A TW 112149449 A TW112149449 A TW 112149449A TW 202436398 A TW202436398 A TW 202436398A
Authority
TW
Taiwan
Prior art keywords
sheet
workpiece processing
adhesive layer
acrylic polymer
mass
Prior art date
Application number
TW112149449A
Other languages
English (en)
Chinese (zh)
Inventor
田端直人
土山佐也香
朝稲翔平
鈴木伸哉
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW202436398A publication Critical patent/TW202436398A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
TW112149449A 2023-02-24 2023-12-19 工件加工用片及其使用方法 TW202436398A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-027647 2023-02-24
JP2023027647 2023-02-24

Publications (1)

Publication Number Publication Date
TW202436398A true TW202436398A (zh) 2024-09-16

Family

ID=92500974

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112149449A TW202436398A (zh) 2023-02-24 2023-12-19 工件加工用片及其使用方法

Country Status (3)

Country Link
JP (1) JPWO2024176580A1 (https=)
TW (1) TW202436398A (https=)
WO (1) WO2024176580A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2025005046A1 (https=) * 2023-06-30 2025-01-02

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7720688B2 (ja) * 2019-08-02 2025-08-08 日東電工株式会社 光架橋性粘着剤およびその利用
JP7600870B2 (ja) * 2021-05-28 2024-12-17 三菱ケミカル株式会社 活性エネルギー線硬化性粘着剤組成物および剥離型粘着シート
JP7696246B2 (ja) * 2021-07-26 2025-06-20 日東電工株式会社 光硬化性粘着シート

Also Published As

Publication number Publication date
JPWO2024176580A1 (https=) 2024-08-29
WO2024176580A1 (ja) 2024-08-29

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