JPWO2024176580A1 - - Google Patents
Info
- Publication number
- JPWO2024176580A1 JPWO2024176580A1 JP2025502124A JP2025502124A JPWO2024176580A1 JP WO2024176580 A1 JPWO2024176580 A1 JP WO2024176580A1 JP 2025502124 A JP2025502124 A JP 2025502124A JP 2025502124 A JP2025502124 A JP 2025502124A JP WO2024176580 A1 JPWO2024176580 A1 JP WO2024176580A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023027647 | 2023-02-24 | ||
| PCT/JP2023/044797 WO2024176580A1 (ja) | 2023-02-24 | 2023-12-14 | ワーク加工用シートおよびその使用方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024176580A1 true JPWO2024176580A1 (https=) | 2024-08-29 |
Family
ID=92500974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025502124A Pending JPWO2024176580A1 (https=) | 2023-02-24 | 2023-12-14 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2024176580A1 (https=) |
| TW (1) | TW202436398A (https=) |
| WO (1) | WO2024176580A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2025005046A1 (https=) * | 2023-06-30 | 2025-01-02 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7720688B2 (ja) * | 2019-08-02 | 2025-08-08 | 日東電工株式会社 | 光架橋性粘着剤およびその利用 |
| JP7600870B2 (ja) * | 2021-05-28 | 2024-12-17 | 三菱ケミカル株式会社 | 活性エネルギー線硬化性粘着剤組成物および剥離型粘着シート |
| JP7696246B2 (ja) * | 2021-07-26 | 2025-06-20 | 日東電工株式会社 | 光硬化性粘着シート |
-
2023
- 2023-12-14 WO PCT/JP2023/044797 patent/WO2024176580A1/ja not_active Ceased
- 2023-12-14 JP JP2025502124A patent/JPWO2024176580A1/ja active Pending
- 2023-12-19 TW TW112149449A patent/TW202436398A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024176580A1 (ja) | 2024-08-29 |
| TW202436398A (zh) | 2024-09-16 |