TW202430372A - Laminated Sheets - Google Patents

Laminated Sheets Download PDF

Info

Publication number
TW202430372A
TW202430372A TW112142193A TW112142193A TW202430372A TW 202430372 A TW202430372 A TW 202430372A TW 112142193 A TW112142193 A TW 112142193A TW 112142193 A TW112142193 A TW 112142193A TW 202430372 A TW202430372 A TW 202430372A
Authority
TW
Taiwan
Prior art keywords
resin substrate
protrusion
laminated sheet
length
laminated
Prior art date
Application number
TW112142193A
Other languages
Chinese (zh)
Inventor
高田晃右
Original Assignee
日商Agc股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Agc股份有限公司 filed Critical 日商Agc股份有限公司
Publication of TW202430372A publication Critical patent/TW202430372A/en

Links

Abstract

本發明係關於一種積層片材,其係依序積層有第1樹脂基板、中間層及第2樹脂基板者,且上述第1樹脂基板與上述中間層係形狀及大小相同且積層而構成積層部,上述第1樹脂基板之從上述第1樹脂基板之表面之法線方向觀察到之外形為四邊形,上述第2樹脂基板係面積大於上述第1樹脂基板及上述中間層,且於從上述第1樹脂基板之上述表面之上述法線方向觀察之情形時,在包含上述第1樹脂基板之第1邊與第2邊正交地相交之頂點的角部,具有從上述第1邊、上述頂點及上述第2邊之外緣突出之突出部,上述突出部在與上述第1邊正交之第1方向上從上述第1邊突出之長度為5 mm以上20 mm以下,與上述第1邊平行之方向上之上述突出部距上述突出部與上述第1邊之交點之長度為10 mm以上40 mm以下,上述突出部在與上述第2邊正交之第2方向上從上述第2邊突出之長度為5 mm以上20 mm以下,與上述第2邊平行之方向上之上述突出部距上述突出部與上述第2邊之交點之長度為10 mm以上40 mm以下。The present invention relates to a laminated sheet, which is laminated with a first resin substrate, an intermediate layer and a second resin substrate in sequence, and the first resin substrate and the intermediate layer are of the same shape and size and are laminated to form a laminated portion, the first resin substrate is a quadrilateral when observed from the normal direction of the surface of the first resin substrate, and the second resin substrate is larger in area than the first resin substrate. and the intermediate layer, and when observed from the normal direction of the surface of the first resin substrate, at a corner including the vertex where the first side and the second side of the first resin substrate intersect orthogonally, there is a protrusion protruding from the first side, the vertex and the outer edge of the second side, the length of the protrusion protruding from the first side in a first direction orthogonal to the first side is not less than 5 mm and not more than 20 mm, the length of the protrusion in a direction parallel to the first side from the intersection of the protrusion and the first side is not less than 10 mm and not more than 40 mm, the length of the protrusion in a second direction orthogonal to the second side from the second side is not less than 5 mm and not more than 20 mm, and the length of the protrusion in a direction parallel to the second side from the intersection of the protrusion and the second side is not less than 10 mm and not more than 40 mm.

Description

積層片材Laminated Sheets

本發明係關於一種積層片材。The present invention relates to a laminated sheet.

於製造太陽電池、液晶面板(LCD)、有機EL(Electroluminescence,電致發光)面板(OLED)、感知電磁波、X射線、紫外線、可見光線、紅外線等之接收感測器面板等電子裝置時,將聚醯亞胺樹脂層用作基板。聚醯亞胺樹脂層以設置於玻璃基板上之積層體之狀態使用,將積層體提供給電子裝置之製造。 具有聚醯亞胺樹脂層之積層體例如於玻璃基板上設置聚矽氧樹脂層等吸附層,於該吸附層上形成有聚醯亞胺樹脂層。 於形成具有聚醯亞胺樹脂層之積層體之情形時,於玻璃基板上之聚矽氧樹脂層等吸附層上設置有保護膜。 製造具有聚醯亞胺樹脂層之積層體例如使用離型膜、吸附層及保護膜之積層體。於該積層體中,切斷離型膜與吸附層後,除去無用部後,將保護膜剝離,將吸附層貼合於玻璃基板,將吸附層設置於玻璃基板上。以玻璃基板上有吸附層之狀態,如上所述地於吸附層上形成聚醯亞胺樹脂層。 When manufacturing electronic devices such as solar cells, liquid crystal panels (LCD), organic EL (Electroluminescence) panels (OLED), and receiving sensor panels that sense electromagnetic waves, X-rays, ultraviolet rays, visible rays, infrared rays, etc., a polyimide resin layer is used as a substrate. The polyimide resin layer is used in the form of a laminated body disposed on a glass substrate, and the laminated body is provided for the manufacture of electronic devices. The laminated body having a polyimide resin layer is provided with an adsorption layer such as a polysilicone resin layer on a glass substrate, and a polyimide resin layer is formed on the adsorption layer. When forming a laminate having a polyimide resin layer, a protective film is provided on an adsorption layer such as a silicone resin layer on a glass substrate. A laminate having a polyimide resin layer is manufactured by using, for example, a release film, an adsorption layer, and a protective film. In the laminate, after cutting the release film and the adsorption layer, after removing the useless part, the protective film is peeled off, the adsorption layer is attached to the glass substrate, and the adsorption layer is provided on the glass substrate. With the adsorption layer on the glass substrate, a polyimide resin layer is formed on the adsorption layer as described above.

關於上述積層體之保護膜之剝離有所提出(專利文獻1)。更具體而言,於專利文獻1中揭示有一種電子零件用兩面黏著片材,其具有:黏著劑層;第1剝離片材,其貼合於黏著劑層之一面,至少具有第1剝離劑層;以及第2剝離片材,其貼合於黏著劑層之另一面,至少具有第2剝離劑層;且第1剝離劑層主要包含烯烴系樹脂,第2剝離劑層主要包含二烯系高分子材料,於將第1剝離片材對於黏著劑層之剝離力設為X[mN/20 mm],將第2剝離片材對於黏著劑層之剝離力設為Y[mN/20 mm]時,滿足Y-X≧50之關係,黏著劑層、第1剝離劑層及第2剝離劑層實質上不包含聚矽氧化合物及鹵素化合物。於專利文獻1中,第1剝離片材、黏著劑層及第2剝離片材為相同大小。 [先前技術文獻] [專利文獻] Regarding the peeling of the protective film of the above-mentioned laminate, there has been proposed (Patent Document 1). More specifically, Patent Document 1 discloses a double-sided adhesive sheet for electronic components, which comprises: an adhesive layer; a first peeling sheet, which is attached to one side of the adhesive layer and has at least the first peeling layer; and a second peeling sheet, which is attached to the other side of the adhesive layer and has at least the second peeling layer; and the first peeling layer mainly comprises an olefin resin, and the second peeling layer mainly comprises a diene polymer material, and the peeling force of the first peeling sheet on the adhesive layer is set to X [mN/20 mm], when the peeling force of the second peeling sheet on the adhesive layer is set to Y [mN/20 mm], the relationship Y-X≧50 is satisfied, and the adhesive layer, the first peeling agent layer and the second peeling agent layer do not substantially contain polysilicone compounds and halogen compounds. In patent document 1, the first peeling sheet, the adhesive layer and the second peeling sheet are of the same size. [Prior art document] [Patent document]

[專利文獻1]國際公開第2009/047984號[Patent Document 1] International Publication No. 2009/047984

[發明所欲解決之問題][The problem the invention is trying to solve]

於專利文獻1中,將第1剝離片材剝離後,將黏著劑層之剝離了第1剝離片材之面黏著於被黏著體。其後,進而將第2剝離片材從黏著劑層剝離,將被黏著體黏著於其他被黏著體。如上所述,第1剝離片材、黏著劑層及第2剝離片材為相同大小。因此,於將第1剝離片材剝離時,在處於剝離終止部之黏著劑層中,容易產生凝集破壞等剝離疵點,需要進行其改善。又,於操作時亦希望不在各層之界面產生剝離等剝離缺陷。 本發明之目的在於提供一種能夠抑制剝離無用部時及操作時之剝離疵點之積層片材。 [解決問題之技術手段] In patent document 1, after the first peeling sheet is peeled off, the surface of the adhesive layer from which the first peeling sheet is peeled off is adhered to an adherend. Thereafter, the second peeling sheet is further peeled off from the adhesive layer, and the adherend is adhered to another adherend. As described above, the first peeling sheet, the adhesive layer, and the second peeling sheet are of the same size. Therefore, when the first peeling sheet is peeled off, peeling defects such as coagulation damage are easily generated in the adhesive layer at the end of the peeling, and it is necessary to improve it. Furthermore, it is also desirable to prevent peeling defects such as peeling from occurring at the interface of each layer during operation. The purpose of the present invention is to provide a laminated sheet material that can suppress peeling defects when peeling off useless parts and during operation. [Technical means to solve the problem]

本發明人等進行了銳意研究,結果發現,藉由以下構成,能夠解決上述問題。 (1)一種積層片材,其係依序積層有第1樹脂基板、中間層及第2樹脂基板者,且第1樹脂基板與中間層係形狀及大小相同且積層而構成積層部,第1樹脂基板之從第1樹脂基板之表面之法線方向觀察到之外形為四邊形,第2樹脂基板係面積大於第1樹脂基板及中間層,且於從第1樹脂基板之表面之法線方向觀察之情形時,在包含第1樹脂基板之第1邊與第2邊正交地相交之頂點的角部,具有從第1邊、頂點及第2邊之外緣突出之突出部,突出部在與第1邊正交之第1方向上從第1邊突出之長度為5 mm以上20 mm以下,與第1邊平行之方向上之突出部距突出部與第1邊之交點之長度為10 mm以上40 mm以下,突出部在與第2邊正交之第2方向上從第2邊突出之長度為5 mm以上20 mm以下,與第2邊平行之方向上之突出部距突出部與第2邊之交點之長度為10 mm以上40 mm以下。 (2)如(1)中記載之積層片材,其中於第2樹脂基板之突出部上,依序積層有與積層部分離地配置且與中間層不同之中間層及與第1樹脂基板不同之第1樹脂基板。 The inventors of the present invention have conducted intensive research and found that the above-mentioned problem can be solved by the following structure. (1) A laminated sheet, wherein a first resin substrate, an intermediate layer, and a second resin substrate are laminated in sequence, wherein the first resin substrate and the intermediate layer are of the same shape and size and are laminated to form a laminated portion, wherein the first resin substrate is a quadrilateral when viewed from the normal direction of the surface of the first resin substrate, and the second resin substrate is larger in area than the first resin substrate and the intermediate layer, and wherein, when viewed from the normal direction of the surface of the first resin substrate, a corner portion including a vertex where a first side and a second side of the first resin substrate intersect orthogonally has a protrusion protruding from the first side, the vertex, and the outer edge of the second side, and the length of the protrusion protruding from the first side in a first direction orthogonal to the first side is 5 mm to 20 mm, the length of the protrusion in the direction parallel to the first side from the intersection of the protrusion and the first side is 10 mm to 40 mm, the length of the protrusion from the second side in the second direction perpendicular to the second side is 5 mm to 20 mm, and the length of the protrusion in the direction parallel to the second side from the intersection of the protrusion and the second side is 10 mm to 40 mm. (2) The laminated sheet as described in (1), wherein an intermediate layer which is arranged off the ground from the laminated portion and different from the intermediate layer and a first resin substrate which is different from the first resin substrate are laminated in sequence on the protrusion of the second resin substrate.

(3)如(1)或(2)中記載之積層片材,其中突出部之從第1樹脂基板之表面之法線方向觀察到之外形的輪廓由直線及曲線中之至少一者構成。 (4)如(1)至(3)中任一項所記載之積層片材,其中突出部之從第1樹脂基板之表面之法線方向觀察到之外形為多邊形、扇形或橢圓扇形。 (5)如(1)至(4)中任一項所記載之積層片材,其中中間層為聚矽氧樹脂層。 (6)如(1)至(5)中任一項所記載之積層片材,其中第1樹脂基板及第2樹脂基板為聚對苯二甲酸乙二酯基板。 [發明之效果] (3) A laminated sheet as described in (1) or (2), wherein the outline of the shape of the protrusion observed from the normal direction of the surface of the first resin substrate is composed of at least one of a straight line and a curved line. (4) A laminated sheet as described in any one of (1) to (3), wherein the outline of the protrusion observed from the normal direction of the surface of the first resin substrate is a polygon, a sector or an elliptical sector. (5) A laminated sheet as described in any one of (1) to (4), wherein the intermediate layer is a polysilicone resin layer. (6) A laminated sheet as described in any one of (1) to (5), wherein the first resin substrate and the second resin substrate are polyethylene terephthalate substrates. [Effect of the invention]

根據本發明,可提供一種抑制了剝離無用部時及操作時之剝離疵點之積層片材。According to the present invention, a laminated sheet can be provided in which peeling defects are suppressed when peeling off unnecessary portions and during operation.

以下,參照圖式,對本發明之實施方式進行說明。其中,以下實施方式係用以說明本發明之例示性者,本發明並不受以下所示之實施方式所限制。再者,可於不脫離本發明之範圍之情況下對以下實施方式添加各種變化及置換。 以下,使用「~」表示之數值範圍意指包含「~」之前後所記載之數值作為下限值及上限值之範圍。 又,以下,「正交」及「平行」若無特別記載,則一般包含可容許之誤差範圍。 Hereinafter, the embodiments of the present invention will be described with reference to the drawings. The embodiments below are exemplary embodiments for illustrating the present invention, and the present invention is not limited to the embodiments shown below. Furthermore, various changes and substitutions may be added to the embodiments below without departing from the scope of the present invention. Hereinafter, the numerical range indicated by "~" means a range including the numerical values recorded before and after "~" as the lower limit and the upper limit. In addition, below, "orthogonal" and "parallel" generally include the allowable error range unless otherwise specified.

作為本發明之積層片材之特徵點,藉由如下一種積層片材,而有於將第2樹脂基板作為無用部而剝離時,能夠抑制剝離疵點之見解,上述積層片材係依序積層有第1樹脂基板、中間層及第2樹脂基板者,且第1樹脂基板與中間層係形狀及大小相同且積層而構成積層部,第1樹脂基板之從第1樹脂基板之表面之法線方向觀察到之外形為四邊形,第2樹脂基板係面積大於第1樹脂基板及中間層,且於從第1樹脂基板之表面之法線方向觀察之情形時,在包含第1樹脂基板之第1邊與第2邊正交地相交之頂點的角部,具有從第1邊、頂點及第2邊之外緣突出之突出部,突出部在與第1邊正交之第1方向上從第1邊突出之長度為5 mm以上20 mm以下,與第1邊平行之方向上之突出部距突出部與第1邊之交點之長度為10 mm以上40 mm以下,突出部在與第2邊正交之第2方向上從第2邊突出之長度為5 mm以上20 mm以下,與第2邊平行之方向上之突出部距突出部與第2邊之交點之長度為10 mm以上40 mm以下。藉此,可獲得所需之效果。As a characteristic point of the laminated sheet of the present invention, it is found that when the second resin substrate is peeled off as an unnecessary portion, peeling defects can be suppressed by the laminated sheet, wherein the laminated sheet is laminated with a first resin substrate, an intermediate layer, and a second resin substrate in sequence, and the first resin substrate and the intermediate layer are of the same shape and size and are laminated to form a laminated portion, and a normal line of the first resin substrate from the surface of the first resin substrate is The shape observed in the direction is a quadrilateral, the second resin substrate has an area larger than the first resin substrate and the intermediate layer, and when observed in the normal direction of the surface of the first resin substrate, at a corner including the vertex where the first side and the second side of the first resin substrate intersect orthogonally, there is a protrusion protruding from the first side, the vertex and the outer edge of the second side, the length of the protrusion protruding from the first side in a first direction orthogonal to the first side is 5 mm to 20 mm, the length of the protrusion in a direction parallel to the first side from the intersection of the protrusion and the first side is 10 mm to 40 mm, the length of the protrusion in a second direction orthogonal to the second side from the second side is 5 mm to 20 mm, and the length of the protrusion in a direction parallel to the second side from the intersection of the protrusion and the second side is 10 mm to 40 mm. In this way, the desired effect can be obtained.

<積層片材之第1例> 圖1係表示本發明之實施方式之積層片材之第1例的模式性俯視圖,圖2係表示本發明之實施方式之積層片材之第1例的模式性剖視圖。圖2係由圖1之A-A線所得之模式性剖視圖。圖1係從第1樹脂基板12之表面12a之法線方向觀察的模式性俯視圖。 圖1所示之第1例之積層片材10如圖2所示依序積層有第1樹脂基板12、中間層14及第2樹脂基板16。 積層片材10係於第2樹脂基板16之表面16a配置有中間層14,於中間層14之表面14a配置有第1樹脂基板12。 第1樹脂基板12與中間層14係形狀及大小相同且積層而構成積層部15。 <First Example of Laminated Sheet> FIG. 1 is a schematic top view of the first example of the laminated sheet of the embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view of the first example of the laminated sheet of the embodiment of the present invention. FIG. 2 is a schematic cross-sectional view taken along line A-A of FIG. 1 . FIG. 1 is a schematic top view observed from the normal direction of the surface 12a of the first resin substrate 12. The laminated sheet 10 of the first example shown in FIG. 1 is sequentially laminated with a first resin substrate 12, an intermediate layer 14, and a second resin substrate 16 as shown in FIG. 2 . The laminated sheet 10 has an intermediate layer 14 disposed on the surface 16a of the second resin substrate 16, and a first resin substrate 12 disposed on the surface 14a of the intermediate layer 14. The first resin substrate 12 and the intermediate layer 14 have the same shape and size and are laminated to form a laminated portion 15.

如圖1所示,第1樹脂基板12之從第1樹脂基板12之表面12a之法線方向觀察到之外形為四邊形。 第2樹脂基板16之面積大於第1樹脂基板12及中間層14。且第2樹脂基板16於從第1樹脂基板12之表面12a之法線方向觀察之情形時,在包含第1樹脂基板12之第1邊13a與第2邊13b正交地相交之頂點13e之角部12e具有從第1邊13a、頂點13e及第2邊13b之外緣突出之突出部18。即,第2樹脂基板16之面積大於積層部15。 As shown in FIG. 1 , the first resin substrate 12 has a quadrilateral shape when viewed from the normal direction of the surface 12a of the first resin substrate 12. The second resin substrate 16 has a larger area than the first resin substrate 12 and the intermediate layer 14. And when the second resin substrate 16 is viewed from the normal direction of the surface 12a of the first resin substrate 12, the corner 12e of the second resin substrate 16 including the vertex 13e where the first side 13a and the second side 13b of the first resin substrate 12 intersect orthogonally has a protrusion 18 protruding from the outer edge of the first side 13a, the vertex 13e and the second side 13b. That is, the second resin substrate 16 has a larger area than the laminated portion 15.

於積層片材10中,如圖1所示,第1樹脂基板12具有第1邊13a、第2邊13b、第3邊13c及第4邊13d。第1邊13a與第3邊13c為相同長度且平行。第2邊13b與第4邊13d為相同長度且平行。第1邊13a與第2邊13b正交。又,第3邊13c與第4邊13d正交。 於圖1所示之積層部15中,第1邊13a及第3邊13c之長度L 1較第2邊13b及第4邊13d之長度L 2短。 再者,於積層部15中,第1邊13a及第3邊13c之長度L 1亦可較第2邊13b及第4邊13d之長度L 2長,又,第1邊13a及第3邊13c之長度L 1與第2邊13b及第4邊13d之長度L 2還可相同。於第1邊13a及第3邊13c之長度L 1與第2邊13b及第4邊13d之長度L 2相同之情形時,從第1樹脂基板12之表面12a之法線方向觀察到之外形為正方形。 In the laminated sheet 10, as shown in FIG1, the first resin substrate 12 has a first side 13a, a second side 13b, a third side 13c and a fourth side 13d. The first side 13a and the third side 13c are of the same length and parallel. The second side 13b and the fourth side 13d are of the same length and parallel. The first side 13a and the second side 13b are orthogonal. Moreover, the third side 13c and the fourth side 13d are orthogonal. In the laminated portion 15 shown in FIG1, the length L1 of the first side 13a and the third side 13c is shorter than the length L2 of the second side 13b and the fourth side 13d. Furthermore, in the laminated portion 15, the length L1 of the first side 13a and the third side 13c may be longer than the length L2 of the second side 13b and the fourth side 13d, and the length L1 of the first side 13a and the third side 13c may be the same as the length L2 of the second side 13b and the fourth side 13d. When the length L1 of the first side 13a and the third side 13c is the same as the length L2 of the second side 13b and the fourth side 13d, the outer shape observed from the normal direction of the surface 12a of the first resin substrate 12 is a square.

如圖2所示,積層片材10係第2樹脂基板16之突出部18之表面18a上什麼都沒有之構成。 突出部18之從第1樹脂基板12之表面12a之法線方向觀察到之外形例如為如圖1所示地2個四邊形結合而成之形狀。突出部18之從第1樹脂基板12之表面12a之法線方向觀察到之外形如圖1所示地為L字形狀。將突出部18之與第1邊13a平行之邊和與第2邊13b平行之邊正交地相交之頂點設為18e。 As shown in FIG2 , the laminated sheet 10 is a structure in which nothing is formed on the surface 18a of the protrusion 18 of the second resin substrate 16. The shape of the protrusion 18 observed from the normal direction of the surface 12a of the first resin substrate 12 is, for example, a shape formed by combining two quadrilaterals as shown in FIG1 . The shape of the protrusion 18 observed from the normal direction of the surface 12a of the first resin substrate 12 is an L shape as shown in FIG1 . The vertex of the protrusion 18 where the side parallel to the first side 13a and the side parallel to the second side 13b intersect orthogonally is set as 18e.

突出部18在與第1邊13a正交之第1方向D 1上從第1邊13a突出之長度d 1為5 mm以上20 mm以下,與第1邊13a平行之方向上之突出部18距突出部18與第1邊13a之交點M 1之長度d 2為10 mm以上40 mm以下。突出部18在與第2邊13b正交之第2方向D 2上從第2邊13b突出之長度d 3為5 mm以上20 mm以下,與第2邊13b平行之方向上之突出部18距突出部18與第2邊13b之交點M 2之長度d 4為10 mm以上40 mm以下。 再者,與第1邊13a平行之方向為第2方向D 2,與第2邊13b平行之方向為第1方向D 1。 突出部18突出之長度d 1及突出部18突出之長度d 3較佳為5 mm~10 mm。 與第1邊13a平行之方向上之突出部18之長度d 2及與第2邊13b平行之方向上之突出部18之長度d 4較佳為20 mm~30 mm。 上述突出部18突出之長度d 1、與第1邊13a平行之方向上之突出部18之長度d 2、突出部18突出之長度d 3及與第2邊13b平行之方向上之突出部18之長度d 4分別為與突出部18突出之長度d 1、與第1邊13a平行之方向上之突出部18之長度d 2、突出部18突出之長度d 3及與第2邊13b平行之方向上之突出部18之長度d 4相當之距離之任意10處之距離之平均值。 The length d1 of the protrusion 18 protruding from the first side 13a in the first direction D1 orthogonal to the first side 13a is 5 mm to 20 mm, and the length d2 of the protrusion 18 from the intersection M1 of the protrusion 18 and the first side 13a in the direction parallel to the first side 13a is 10 mm to 40 mm. The length d3 of the protrusion 18 protruding from the second side 13b in the second direction D2 orthogonal to the second side 13b is 5 mm to 20 mm, and the length d4 of the protrusion 18 from the intersection M2 of the protrusion 18 and the second side 13b in the direction parallel to the second side 13b is 10 mm to 40 mm. Furthermore, the direction parallel to the first side 13a is the second direction D2 , and the direction parallel to the second side 13b is the first direction D1 . The protruding length d1 of the protruding portion 18 and the protruding length d3 of the protruding portion 18 are preferably 5 mm to 10 mm. The length d2 of the protruding portion 18 in a direction parallel to the first side 13a and the length d4 of the protruding portion 18 in a direction parallel to the second side 13b are preferably 20 mm to 30 mm. The protruding length d1 of the protrusion 18, the length d2 of the protrusion 18 in a direction parallel to the first side 13a, the protruding length d3 of the protrusion 18, and the length d4 of the protrusion 18 in a direction parallel to the second side 13b are respectively average values of distances at any 10 locations that are equivalent to the protruding length d1 of the protrusion 18, the length d2 of the protrusion 18 in a direction parallel to the first side 13a, the protruding length d3 of the protrusion 18, and the length d4 of the protrusion 18 in a direction parallel to the second side 13b.

於突出部18中,只要突出部18突出之長度d 1、與第1邊13a平行之方向上之突出部18之長度d 2、突出部18突出之長度d 3及與第2邊13b平行之方向上之突出部18之長度d 4處於上述範圍內,則其形狀並無特別限定,較佳為考慮容易加工之形狀等加工性。 突出部18之從第1樹脂基板12之表面12a之法線方向觀察到之外形之輪廓可由直線及曲線中之至少一者構成。再者,構成輪廓之直線及曲線之數量並無特別限定,可為1個,亦可為複數個。 又,突出部18之從第1樹脂基板12之表面12a之法線方向觀察到之外形例如為多邊形、扇形或橢圓扇形。 As long as the protruding length d1 of the protruding portion 18, the protruding length d2 of the protruding portion 18 in the direction parallel to the first side 13a, the protruding length d3 of the protruding portion 18, and the protruding length d4 of the protruding portion 18 in the direction parallel to the second side 13b are within the above range, the shape thereof is not particularly limited, and it is preferably a shape that takes into consideration the processability such as easy processing. The outline of the shape of the protruding portion 18 observed from the normal direction of the surface 12a of the first resin substrate 12 may be composed of at least one of a straight line and a curved line. Furthermore, the number of straight lines and curved lines constituting the outline is not particularly limited, and may be one or more. Moreover, the shape of the protruding portion 18 observed from the normal direction of the surface 12a of the first resin substrate 12 is, for example, a polygon, a sector, or an elliptical sector.

於突出部18中,藉由上述突出部18突出之長度d 1、與第1邊13a平行之方向上之突出部18之長度d 2、突出部18突出之長度d 3及與第2邊13b平行之方向上之突出部18之長度d 4分別滿足上述範圍,可抑制凝集破壞等剝離疵點之產生,且於搬送積層片材等操作時,可抑制積層片材之剝離。 再者,於上述突出部18突出之長度d 1、與第1邊13a平行之方向上之突出部18之長度d 2、突出部18突出之長度d 3及與第2邊13b平行之方向上之突出部18之長度d 4分別超過上限值之情形時,在積層片材之搬送等操作時積層片材會意外剝離,其結果為,產生凝集破壞等剝離疵點。 又,於上述突出部18突出之長度d 1、與第1邊13a平行之方向上之突出部18之長度d 2、突出部18突出之長度d 3及與第2邊13b平行之方向上之突出部18之長度d 4分別未達下限值之情形時,會產生凝集破壞等剝離疵點。 In the protrusion 18, by the protrusion length d1 of the protrusion 18, the protrusion length d2 of the protrusion 18 in the direction parallel to the first side 13a, the protrusion length d3 of the protrusion 18, and the protrusion length d4 of the protrusion 18 in the direction parallel to the second side 13b respectively satisfying the above ranges, the generation of peeling defects such as cohesion damage can be suppressed, and the peeling of the laminated sheet can be suppressed during the operation of conveying the laminated sheet. Furthermore, when the protruding length d1 of the protruding portion 18, the protruding length d2 of the protruding portion 18 in the direction parallel to the first side 13a, the protruding length d3 of the protruding portion 18, and the protruding length d4 of the protruding portion 18 in the direction parallel to the second side 13b exceed the upper limit values, the laminated sheet may be accidentally peeled off during the operation of conveying the laminated sheet, and as a result, peeling defects such as cohesion damage may occur. Moreover, when the protruding length d1 of the protruding portion 18, the protruding length d2 of the protruding portion 18 in the direction parallel to the first side 13a, the protruding length d3 of the protruding portion 18, and the protruding length d4 of the protruding portion 18 in the direction parallel to the second side 13b do not reach the lower limit values, peeling defects such as cohesion damage may occur.

於積層片材10中,藉由將上述突出部18設置於第2樹脂基板16,於將第2樹脂基板16例如從處於有突出部18之角部12e之對角之位置的角部12e在朝向有突出部18之角部12e之方向Dp上剝離之情形時,有突出部18之角部12e不成為剝離終止部。因此,可抑制凝集破壞等剝離疵點於有突出部18之角部12e產生。 由於凝集破壞,中間層14會脫落,而脫落之中間層14導致步驟內污染,但亦可抑制此種情況。即,亦可抑制步驟內污染。 In the laminated sheet 10, by providing the above-mentioned protrusion 18 on the second resin substrate 16, when the second resin substrate 16 is peeled off, for example, from the corner 12e at the diagonal position of the corner 12e with the protrusion 18 in the direction Dp toward the corner 12e with the protrusion 18, the corner 12e with the protrusion 18 does not become the peeling end portion. Therefore, it is possible to suppress the generation of peeling defects such as coagulation damage at the corner 12e with the protrusion 18. Due to coagulation damage, the intermediate layer 14 will fall off, and the fallen intermediate layer 14 will cause contamination in the step, but this situation can also be suppressed. That is, contamination in the step can also be suppressed.

<積層片材之第2例~第4例> 圖3係表示本發明之實施方式之積層片材之第2例的模式性俯視圖,圖4係表示本發明之實施方式之積層片材之第2例的模式性剖視圖。 圖5係表示本發明之實施方式之積層片材之第3例的模式性俯視圖。圖6係表示本發明之實施方式之積層片材之第4例的模式性俯視圖。 圖3、圖5及圖6係從第1樹脂基板12之表面12a之法線方向觀察的模式性俯視圖。圖4係由圖3之B-B線所得的模式性剖視圖。 再者,於圖3~圖6中,對與圖1及圖2所示之積層片材10相同之構成物標註相同之符號,省略其詳細之說明。 <Second to fourth examples of laminated sheets> Fig. 3 is a schematic top view of the second example of the laminated sheet of the embodiment of the present invention, and Fig. 4 is a schematic cross-sectional view of the second example of the laminated sheet of the embodiment of the present invention. Fig. 5 is a schematic top view of the third example of the laminated sheet of the embodiment of the present invention. Fig. 6 is a schematic top view of the fourth example of the laminated sheet of the embodiment of the present invention. Figs. 3, 5 and 6 are schematic top views observed from the normal direction of the surface 12a of the first resin substrate 12. Fig. 4 is a schematic cross-sectional view obtained from the B-B line of Fig. 3. Furthermore, in FIGS. 3 to 6 , the same symbols are used for the components that are the same as those of the laminated sheet 10 shown in FIGS. 1 and 2 , and their detailed descriptions are omitted.

與圖1及圖2所示之積層片材10相比,圖3所示之第2例之積層片材11在如圖4所示地於第2樹脂基板16之突出部18之表面18a上,依序積層有與積層部15分離地配置且與中間層14不同之中間層19a及與第1樹脂基板12不同之第1樹脂基板19b之方面有所不同,除此以外之構成係與圖1及圖2所示之積層片材10相同之構成。積層體19包含不同之中間層19a及不同之第1樹脂基板19b。Compared with the laminated sheet 10 shown in Figs. 1 and 2, the laminated sheet 11 of the second example shown in Fig. 3 is different in that an intermediate layer 19a which is arranged separately from the laminated portion 15 and different from the intermediate layer 14 and a first resin substrate 19b which is different from the first resin substrate 12 are sequentially laminated on the surface 18a of the protruding portion 18 of the second resin substrate 16 as shown in Fig. 4, but the other structures are the same as the laminated sheet 10 shown in Figs. 1 and 2. The laminated body 19 includes a different intermediate layer 19a and a different first resin substrate 19b.

於圖3所示之積層片材11中,積層部15與積層體19因切割線17而分離。即,不同之中間層19a及不同之第1樹脂基板19b藉由切割線17而與積層部15分離。 切割線17如圖4所示地貫通第1樹脂基板12及中間層14,且到達第2樹脂基板16之厚度方向之中途。切割線17對於第1樹脂基板12及中間層14為全切,對於第2樹脂基板16為半切。 不同之中間層19a係藉由切割線17而與上述中間層14分離,因此可與中間層14相同,但亦可為與上述中間層14不同者。又,不同之第1樹脂基板19b係藉由切割線17而與上述第1樹脂基板12分離,因此可與第1樹脂基板12相同,但亦可為與上述第1樹脂基板12不同者。 於積層片材11中,在將第2樹脂基板16剝離之情形時,於將第2樹脂基板16剝離前,將突出部18之表面18a上之積層體19剝離。若剝離積層體19,則成為圖1及圖2所示之積層片材10之狀態。於將積層體19剝離後,與圖1及圖2所示之積層片材10同樣地剝離第2樹脂基板16。 於積層片材11中,與圖1及圖2所示之積層片材10同樣,可抑制凝集破壞等剝離疵點產生,亦可抑制步驟內污染。 In the laminated sheet 11 shown in FIG. 3 , the laminated portion 15 and the laminated body 19 are separated by the cutting line 17. That is, the different intermediate layers 19a and the different first resin substrates 19b are separated from the laminated portion 15 by the cutting line 17. As shown in FIG. 4 , the cutting line 17 passes through the first resin substrate 12 and the intermediate layer 14 and reaches the middle of the thickness direction of the second resin substrate 16. The cutting line 17 fully cuts the first resin substrate 12 and the intermediate layer 14 and half cuts the second resin substrate 16. The different intermediate layer 19a is separated from the intermediate layer 14 by the cutting line 17, and thus may be the same as the intermediate layer 14, or may be different from the intermediate layer 14. Furthermore, the different first resin substrate 19b is separated from the first resin substrate 12 by the cutting line 17, and thus may be the same as the first resin substrate 12, or may be different from the first resin substrate 12. In the laminate sheet 11, when the second resin substrate 16 is peeled off, the laminate 19 on the surface 18a of the protrusion 18 is peeled off before the second resin substrate 16 is peeled off. If the laminated body 19 is peeled off, the laminated sheet 10 shown in FIG. 1 and FIG. 2 is obtained. After the laminated body 19 is peeled off, the second resin substrate 16 is peeled off in the same manner as the laminated sheet 10 shown in FIG. 1 and FIG. 2. In the laminated sheet 11, as in the laminated sheet 10 shown in FIG. 1 and FIG. 2, the generation of peeling defects such as cohesion damage can be suppressed, and contamination in the step can also be suppressed.

與圖1及圖2所示之積層片材10相比,圖5所示之第3例之積層片材11a在第2樹脂基板16之突出部18之從第1樹脂基板12之表面12a之法線方向觀察到之外形為扇形之方面有所不同,除此以外之構成係與圖1及圖2所示之積層片材10相同之構成。 突出部18之上述外形係以第1樹脂基板12之頂點13e為中心之半徑r之扇形。突出部18包圍包含第1邊13a與第2邊13b正交地相交之頂點13e之角部12e。通過扇形之中心之最大之長度d 5為半徑r之2倍。於積層片材11a中,最大之長度d 5為10 mm以上40 mm以下。 半徑r與上述突出部18在第1方向D 1上突出之長度d 1、及上述突出部18在第2方向D 2上突出之長度d 3相當。 突出部18之最大之長度d 5與上述與第1邊13a平行之方向上之突出部18之長度d 2、及上述與第2邊13b平行之方向上之突出部18之長度d 4相當。 再者,突出部18之最大之長度d 5為10 mm以上40 mm以下,因此半徑r成為5 mm以上20 mm以下。 於積層片材11a中,突出部18之外形為扇形,但亦可為橢圓扇形。 Compared with the laminated sheet 10 shown in FIGS. 1 and 2 , the laminated sheet 11a of the third example shown in FIG. 5 is different in that the protrusion 18 of the second resin substrate 16 has a sector shape when viewed from the normal direction of the surface 12a of the first resin substrate 12, but the other configurations are the same as the laminated sheet 10 shown in FIGS. 1 and 2 . The above-mentioned external shape of the protrusion 18 is a sector shape with a radius r centered at the vertex 13e of the first resin substrate 12. The protrusion 18 surrounds a corner 12e including the vertex 13e where the first side 13a and the second side 13b intersect orthogonally. The maximum length d5 passing through the center of the sector shape is twice the radius r. In the laminated sheet 11a, the maximum length d5 is not less than 10 mm and not more than 40 mm. The radius r is equal to the length d1 of the protrusion 18 in the first direction D1 and the length d3 of the protrusion 18 in the second direction D2 . The maximum length d5 of the protrusion 18 is equal to the length d2 of the protrusion 18 in the direction parallel to the first side 13a and the length d4 of the protrusion 18 in the direction parallel to the second side 13b. Furthermore, the maximum length d5 of the protrusion 18 is not less than 10 mm and not more than 40 mm, so the radius r is not less than 5 mm and not more than 20 mm. In the laminated sheet 11a, the protrusion 18 has a sector shape , but may also be an elliptical sector shape.

與圖1及圖2所示之積層片材10相比,圖6所示之第4例之積層片材11b在第2樹脂基板16之突出部18之從第1樹脂基板12之表面12a之法線方向觀察到之外形之方面有所不同,除此以外之構成係與圖1及圖2所示之積層片材10相同之構成。 積層片材11b之突出部18之外形係輪廓具有從第1邊13a延伸之圓弧狀曲線20a、連接於該曲線20a且與第1邊13a平行之直線20b、從第2邊13b延伸之圓弧狀曲線20c、及連接於該曲線20c且與第2邊13b平行之直線20d,且與第1邊13a平行之直線20b和與第1邊13a正交之直線20d連接而構成。圓弧狀曲線20a與圓弧狀曲線20c為相同長度。又,直線20b與直線20d為相同長度。 第1方向D 1上之第1邊13a與直線20b之距離為上述突出部18突出之長度d 1。從突出部18之曲線20a與第1邊13a之交點M 1至直線20b與直線20d之交點20e為止的在與第1邊13a平行之方向上之距離為上述突出部18之長度d 2。 第2方向D 2上之第2邊13b與直線20d之距離為上述突出部18突出之長度d 3。從曲線20c與第2邊13b之交點M 2至交點20e為止的在與第2邊13b平行之方向上之距離為上述突出部18之長度d 4Compared with the laminated sheet 10 shown in Figures 1 and 2, the laminated sheet 11b of the fourth example shown in Figure 6 is different in the shape of the protrusion 18 of the second resin substrate 16 observed from the normal direction of the surface 12a of the first resin substrate 12. Other than this, the structure is the same as the laminated sheet 10 shown in Figures 1 and 2. The outer shape of the protrusion 18 of the laminated sheet 11b is a profile having an arc-shaped curve 20a extending from the first side 13a, a straight line 20b connected to the curve 20a and parallel to the first side 13a, an arc-shaped curve 20c extending from the second side 13b, and a straight line 20d connected to the curve 20c and parallel to the second side 13b, and the straight line 20b parallel to the first side 13a and the straight line 20d perpendicular to the first side 13a are connected. The arc-shaped curve 20a and the arc-shaped curve 20c are the same length. Moreover, the straight line 20b and the straight line 20d are the same length. The distance between the first side 13a and the straight line 20b in the first direction D1 is the protruding length d1 of the protrusion 18. The distance from the intersection point M1 of the curve 20a of the protrusion 18 and the first side 13a to the intersection point 20e of the straight line 20b and the straight line 20d in the direction parallel to the first side 13a is the length d2 of the protrusion 18. The distance between the second side 13b and the straight line 20d in the second direction D2 is the protrusion length d3 of the protrusion 18. The distance from the intersection point M2 of the curve 20c and the second side 13b to the intersection point 20e in the direction parallel to the second side 13b is the length d4 of the protrusion 18.

於圖5所示之積層片材11a及圖6所示之第4例之積層片材11b中,亦與圖1及圖2所示之積層片材10同樣地剝離第2樹脂基板16。於此情形時,與圖1及圖2所示之積層片材10同樣,可抑制凝集破壞等剝離疵點產生,亦可抑制步驟內污染。 又,於圖5所示之積層片材11a及圖6所示之第4例之積層片材11b中,亦可如圖4所示之積層片材11般為如下構成:於突出部18之表面18a上有積層體19,該積層體19依序積層有不同之中間層19a及不同之第1樹脂基板19b。 In the laminated sheet 11a shown in FIG. 5 and the laminated sheet 11b of the fourth example shown in FIG. 6, the second resin substrate 16 is peeled off in the same manner as the laminated sheet 10 shown in FIG. 1 and FIG. 2. In this case, as in the laminated sheet 10 shown in FIG. 1 and FIG. 2, the generation of peeling defects such as cohesion damage can be suppressed, and contamination in the step can also be suppressed. In addition, in the laminated sheet 11a shown in FIG. 5 and the laminated sheet 11b of the fourth example shown in FIG. 6 , the laminated sheet 11 shown in FIG. 4 may also be configured as follows: a laminated body 19 is provided on the surface 18a of the protruding portion 18, and the laminated body 19 sequentially laminates different intermediate layers 19a and different first resin substrates 19b.

<積層片材之剝離方法> 圖7係表示本發明之實施方式之積層片材之第1例之剝離方法的模式性俯視圖,圖8係表示本發明之實施方式之積層片材之第1例之剝離方法的模式性剖視圖。圖8係由圖7之C-C線所得的模式性剖視圖。 於積層片材之剝離方法中,將第2樹脂基板16從突出部18之對角方向朝向突出部18進行剝離。 如圖7及圖8所示,使第1樹脂基板12之表面12a朝向吸附台30之表面30a,將積層片材10載置於吸附台30之表面30a。繼而,吸附台30抽吸積層片材10而固定積層片材10。 此時,於突出部18與吸附台30之間設置有遮罩32。藉由遮罩32,可抑制突出部18與吸附台30之接觸。 <Laminated sheet peeling method> FIG. 7 is a schematic top view showing the first example of the laminated sheet peeling method of the embodiment of the present invention, and FIG. 8 is a schematic cross-sectional view showing the first example of the laminated sheet peeling method of the embodiment of the present invention. FIG. 8 is a schematic cross-sectional view obtained along the C-C line of FIG. 7 . In the laminated sheet peeling method, the second resin substrate 16 is peeled from the diagonal direction of the protrusion 18 toward the protrusion 18. As shown in FIG. 7 and FIG. 8 , the surface 12a of the first resin substrate 12 is directed toward the surface 30a of the adsorption platform 30, and the laminated sheet 10 is placed on the surface 30a of the adsorption platform 30. Then, the adsorption platform 30 sucks the laminated sheet 10 to fix the laminated sheet 10. At this time, a mask 32 is provided between the protrusion 18 and the adsorption platform 30. The mask 32 can suppress the contact between the protrusion 18 and the adsorption platform 30.

遮罩32例如使用黏著帶。藉由使用黏著帶,可在與積層片材之形狀對應之位置配置遮罩。 遮罩32除了使用上述黏著帶以外,例如還可使用將PET膜片等切割成較積層片材10略大之尺寸者。將上述PET膜片等作為遮罩32載置於吸附台30。 又,亦可不設置遮罩32而例如使吸附台30之吸附孔圖案與積層片材10相同。又,亦可使於利用吸附台30吸附積層片材10時使用之吸附孔對照積層片材10形狀而適當使用。 遮罩32與積層部15之距離d m較佳為大於0 mm且為5 mm以下,上限更佳為2 mm以下。 距離d m係與距離d m相當之任意10處之距離之平均值。 再者,於距離d m超過5 mm之情形時,在剝離第2樹脂基板16時,積層片材10整體有時會偏移。又,於剝離第2樹脂基板16時,有時洩漏變大,而無法充分地抽吸固定積層片材10。其結果為,於積層片材10發生捲縮之情形或積層片材10之剛性較低之情形時,積層片材10出現皺褶或捲縮,在貼合於玻璃基板時發生不良情況。 The mask 32 may be formed by, for example, an adhesive tape. By using the adhesive tape, the mask can be arranged at a position corresponding to the shape of the laminated sheet. In addition to the adhesive tape, the mask 32 may be formed by, for example, cutting a PET film or the like into a size slightly larger than the laminated sheet 10. The PET film or the like is placed on the adsorption table 30 as the mask 32. Alternatively, the mask 32 may not be provided, and, for example, the adsorption hole pattern of the adsorption table 30 may be made the same as that of the laminated sheet 10. Alternatively, the adsorption holes used when the laminated sheet 10 is adsorbed by the adsorption table 30 may be appropriately used in accordance with the shape of the laminated sheet 10. The distance d m between the mask 32 and the laminated portion 15 is preferably greater than 0 mm and less than 5 mm, and the upper limit is more preferably less than 2 mm. The distance dm is the average value of the distances at any 10 points that are equivalent to the distance dm . Furthermore, when the distance dm exceeds 5 mm, the entire laminated sheet 10 may be displaced when the second resin substrate 16 is peeled off. Also, when the second resin substrate 16 is peeled off, leakage may become larger, and the laminated sheet 10 may not be sufficiently sucked and fixed. As a result, when the laminated sheet 10 is curled or the rigidity of the laminated sheet 10 is low, the laminated sheet 10 is wrinkled or curled, and a defect occurs when it is attached to the glass substrate.

遮罩32之厚度t m例如與積層部15之厚度相同。因此,由第1樹脂基板12及中間層14各自之厚度來決定遮罩32之厚度t m。 若遮罩32之厚度t m較厚,則於抽吸積層片材10時,有可能在中間層14與第2樹脂基板16之界面產生剝離,產生剝離疵點。若產生剝離疵點,則於剝落部分附著微粒而導致貼合疵點。 再者,於上述距離d m及遮罩32之厚度t m適宜之情形時,第2樹脂基板16與中間層14不會意外剝離,於有意剝離第2樹脂基板16時,積層片材10可不偏移地剝離。因此,無剝離疵點,定位精度亦良好,可貼合於玻璃基板。 遮罩32之厚度t m係利用接觸式膜厚測定裝置測定5個以上之任意位置上之遮罩32之厚度,將其等進行算術平均而得者。 The thickness tm of the mask 32 is, for example, the same as the thickness of the laminated portion 15. Therefore, the thickness tm of the mask 32 is determined by the thickness of the first resin substrate 12 and the intermediate layer 14. If the thickness tm of the mask 32 is thick, peeling may occur at the interface between the intermediate layer 14 and the second resin substrate 16 when the laminated sheet 10 is sucked, resulting in peeling defects. If peeling defects occur, particles adhere to the peeled portion, resulting in bonding defects. Furthermore, when the distance dm and the thickness tm of the mask 32 are appropriate, the second resin substrate 16 and the intermediate layer 14 will not be accidentally peeled off, and when the second resin substrate 16 is intentionally peeled off, the laminated sheet 10 can be peeled off without deviation. Therefore, there is no peeling defect, the positioning accuracy is also good, and it can be attached to the glass substrate. The thickness tm of the mask 32 is obtained by measuring the thickness of the mask 32 at more than 5 arbitrary positions using a contact-type film thickness measuring device and taking the arithmetic average thereof.

其次,從相對於突出部18側之第1樹脂基板12之角部12e而處於對角之角部12e,將第2樹脂基板16在朝向突出部18側之角部12e之方向Dp上進行剝離。此時,突出部18側之角部12e成為剝離終止部。在相當於該剝離終止部之中間層14之背面14b之區域不會產生凝集破壞等剝離疵點。中間層14無剝離疵點。 於將第2樹脂基板16剝離後,將露出之中間層14之背面14b貼合於玻璃基板22。此時,因中間層14無剝離疵點,故在貼合於玻璃基板22後,不發生貼合不良。再者,剝離疵點於玻璃貼合時被視認為貼合不良。 Next, the second resin substrate 16 is peeled off from the corner 12e of the first resin substrate 12 on the side of the protrusion 18 and at the diagonal corner 12e. At this time, the corner 12e on the side of the protrusion 18 becomes the peeling end portion. In the area of the back surface 14b of the intermediate layer 14 corresponding to the peeling end portion, no peeling defects such as coagulation damage will occur. The intermediate layer 14 has no peeling defects. After the second resin substrate 16 is peeled off, the exposed back surface 14b of the intermediate layer 14 is bonded to the glass substrate 22. At this time, since the intermediate layer 14 has no peeling defects, there will be no poor bonding after bonding to the glass substrate 22. Furthermore, peeling defects are regarded as poor bonding when the glass is bonded.

此處,圖10及圖11係按步驟順序表示先前之積層片材之第2樹脂基板之剝離方法的模式性俯視圖。 再者,於圖10及圖11中,對與圖1及圖2所示之積層片材10相同之構成物標註相同之符號,省略其詳細之說明。 如圖10所示,先前之積層片材100係無突出部18之構成,外形為四邊形。使第1樹脂基板12(未圖示)朝向吸附台30之表面30a,將先前之積層片材100載置於吸附台30之表面30a。繼而,吸附台30抽吸先前之積層片材100而固定先前之積層片材100。 於該固定之狀態下,於先前之積層片材100中,將第2樹脂基板16從角部100e在朝向對角之角部100f之方向上進行剝離。角部100f為剝離終止部。 剝離後,在相當於剝離終止部之中間層14之背面14b之角部14e產生由凝集破壞所致之剝離疵點102。 於將產生了剝離疵點102之中間層14貼合於圖9所示之玻璃基板22之情形時,剝離疵點102被視認為貼合不良。 Here, FIG. 10 and FIG. 11 are schematic top views showing a method of peeling off the second resin substrate of the previous laminated sheet in step order. Furthermore, in FIG. 10 and FIG. 11, the same symbols are given to the same components as the laminated sheet 10 shown in FIG. 1 and FIG. 2, and their detailed description is omitted. As shown in FIG. 10, the previous laminated sheet 100 is a structure without a protrusion 18, and its outer shape is a quadrilateral. The first resin substrate 12 (not shown) is directed toward the surface 30a of the adsorption platform 30, and the previous laminated sheet 100 is placed on the surface 30a of the adsorption platform 30. Then, the adsorption platform 30 sucks the previous laminated sheet 100 and fixes the previous laminated sheet 100. In this fixed state, in the previous laminated sheet 100, the second resin substrate 16 is peeled from the corner 100e in the direction toward the diagonal corner 100f. The corner 100f is the peeling end portion. After peeling, a peeling defect 102 caused by cohesion damage occurs at the corner 14e of the back surface 14b of the intermediate layer 14 corresponding to the peeling end portion. When the intermediate layer 14 with the peeling defect 102 is bonded to the glass substrate 22 shown in FIG. 9, the peeling defect 102 is regarded as poor bonding.

(積層片材之另一例) 圖12~圖14係按步驟順序表示積層片材之另一例之製造方法之一例的模式性俯視圖及剖視圖。圖15及圖16係按步驟順序表示積層片材之另一例之製造方法之另一例的模式性剖視圖。圖17係表示積層片材之另一例之第2樹脂基板之剝離方法的模式性剖視圖。 再者,於圖12~圖17中,對與圖1及圖2所示之積層片材10相同之構成物標註相同之符號,省略其詳細之說明。 如圖12及圖13所示,準備依序積層有第2樹脂基板16、中間層14及第1樹脂基板12之積層材40。 於積層材40中,例如使用旋轉塗佈或模嘴塗佈於第1樹脂基板12之背面12b形成中間層14。其次,將第2樹脂基板16貼合於中間層14之背面14b。上述中間層14之形成可為單片式,亦可為捲對捲方式。 其次,從積層材40之第1樹脂基板12側起,使切割線17形成為四邊形框狀。由切割線17包圍之區域41成為製品,切割線17之外側之區域42為無用部。切割線17之外側之區域42作為無用部而被除去。 切割線17如圖13所示地貫通第1樹脂基板12及中間層14,並不到達第2樹脂基板16。切割線17對於第1樹脂基板12及中間層14為全切。切割線17例如可藉由雷射或沖切而形成。 切割線17之寬度δ較佳為10 mm以上20 mm以下。若切割線17之寬度δ為10 mm以上20 mm以下,則可抑制上述剝離疵點之產生,且亦可抑制操作時第1樹脂基板12或第2樹脂基板16意外剝離。 (Another example of laminated sheet) Figures 12 to 14 are schematic top views and cross-sectional views showing an example of a manufacturing method of another example of laminated sheet in order of steps. Figures 15 and 16 are schematic cross-sectional views showing another example of a manufacturing method of another example of laminated sheet in order of steps. Figure 17 is a schematic cross-sectional view showing a method of peeling off the second resin substrate of another example of laminated sheet. In addition, in Figures 12 to 17, the same symbols are assigned to the same components as those of the laminated sheet 10 shown in Figures 1 and 2, and their detailed descriptions are omitted. As shown in FIG. 12 and FIG. 13, a laminate material 40 is prepared in which the second resin substrate 16, the intermediate layer 14, and the first resin substrate 12 are laminated in sequence. In the laminate material 40, the intermediate layer 14 is formed on the back surface 12b of the first resin substrate 12 by, for example, rotary coating or die nozzle coating. Next, the second resin substrate 16 is bonded to the back surface 14b of the intermediate layer 14. The intermediate layer 14 may be formed in a single-piece manner or in a roll-to-roll manner. Next, from the side of the first resin substrate 12 of the laminate material 40, the cutting line 17 is formed into a quadrilateral frame shape. The area 41 surrounded by the cutting line 17 becomes the product, and the area 42 outside the cutting line 17 is a useless part. The area 42 outside the cutting line 17 is removed as a useless part. As shown in FIG. 13, the cutting line 17 passes through the first resin substrate 12 and the intermediate layer 14, and does not reach the second resin substrate 16. The cutting line 17 fully cuts the first resin substrate 12 and the intermediate layer 14. The cutting line 17 can be formed, for example, by laser or punching. The width δ of the cutting line 17 is preferably greater than 10 mm and less than 20 mm. If the width δ of the cutting line 17 is greater than 10 mm and less than 20 mm, the occurrence of the above-mentioned peeling defects can be suppressed, and the first resin substrate 12 or the second resin substrate 16 can also be suppressed from accidentally peeling off during operation.

其次,如圖14所示,除去切割線17之外側之區域42(參照圖13),獲得積層片材44。積層片材44之第1樹脂基板12與中間層14為相同大小,外形為四邊形。第2樹脂基板16較第1樹脂基板12及中間層14大,外形為四邊形。第1樹脂基板12、中間層14及第2樹脂基板16係相互使各邊平行而配置。 又,於積層片材44中,第2樹脂基板16之表面16a之一部分露出。 於積層片材44中,剝離第2樹脂基板16,於露出之中間層14之背面14b如圖9所示地貼合玻璃基板22。 Next, as shown in FIG. 14, the area 42 outside the cutting line 17 is removed (see FIG. 13), and a laminated sheet 44 is obtained. The first resin substrate 12 and the intermediate layer 14 of the laminated sheet 44 are of the same size and have a quadrilateral shape. The second resin substrate 16 is larger than the first resin substrate 12 and the intermediate layer 14 and has a quadrilateral shape. The first resin substrate 12, the intermediate layer 14, and the second resin substrate 16 are arranged so that the sides are parallel to each other. In addition, in the laminated sheet 44, a portion of the surface 16a of the second resin substrate 16 is exposed. In the laminated sheet 44, the second resin substrate 16 is peeled off, and the glass substrate 22 is bonded to the back surface 14b of the exposed intermediate layer 14 as shown in FIG. 9.

又,如圖15所示,使用旋轉塗佈或模嘴塗佈於第1樹脂基板12之背面12b形成中間層14。此時,第1樹脂基板12與中間層14為相同大小。 其次,如圖16所示,將面積較第1樹脂基板12及中間層14大之第2樹脂基板16貼合於中間層14之背面14b。藉此,可獲得積層片材44。 於圖16所示之積層片材44中,亦剝離第2樹脂基板16,於露出之中間層14之背面14b如圖9所示地貼合玻璃基板22。 Furthermore, as shown in FIG. 15 , the middle layer 14 is formed on the back surface 12b of the first resin substrate 12 by using a rotary coating or a die nozzle coating. At this time, the first resin substrate 12 and the middle layer 14 are the same size. Next, as shown in FIG. 16 , the second resin substrate 16 having a larger area than the first resin substrate 12 and the middle layer 14 is bonded to the back surface 14b of the middle layer 14. Thus, a laminated sheet 44 can be obtained. In the laminated sheet 44 shown in FIG. 16 , the second resin substrate 16 is also peeled off, and the glass substrate 22 is bonded to the exposed back surface 14b of the middle layer 14 as shown in FIG. 9 .

於將積層片材44之第2樹脂基板16剝離之情形時,如圖17所示,使第1樹脂基板12朝向吸附台30之表面30a,將積層片材44載置於吸附台30之表面30a。於第2樹脂基板16與吸附台30之間配置有遮罩32。繼而,吸附台30抽吸積層片材44而固定積層片材44。再者,遮罩32之配置與上述圖8所示之遮罩32相同,因此省略其詳細之說明。 於圖17所示之積層片材44固定於吸附台30之狀態下,於積層片材44中,將第2樹脂基板16從相對於對角線(未圖示)對向之一角部(未圖示)在朝向另一角部(未圖示)之方向上進行剝離。此時,另一角部為剝離終止部。 第2樹脂基板16之面積大於第1樹脂基板12及中間層14,因此中間層14之端不成為剝離終止端。因此,於剝離第2樹脂基板16時可抑制上述圖11所示之剝離疵點102之產生。 再者,剝離第2樹脂基板16時之積層片材之固定並不限定於上述吸附台30,亦可為靜電吸盤。 When the second resin substrate 16 of the laminated sheet 44 is peeled off, as shown in FIG17, the first resin substrate 12 is directed toward the surface 30a of the adsorption platform 30, and the laminated sheet 44 is placed on the surface 30a of the adsorption platform 30. A mask 32 is arranged between the second resin substrate 16 and the adsorption platform 30. Then, the adsorption platform 30 sucks the laminated sheet 44 to fix the laminated sheet 44. In addition, the arrangement of the mask 32 is the same as the mask 32 shown in FIG8 above, so its detailed description is omitted. In the state where the laminated sheet 44 shown in FIG. 17 is fixed to the adsorption platform 30, the second resin substrate 16 is peeled from one corner (not shown) opposite to the diagonal line (not shown) in the laminated sheet 44 in the direction toward the other corner (not shown). At this time, the other corner is the peeling end portion. The area of the second resin substrate 16 is larger than the first resin substrate 12 and the intermediate layer 14, so the end of the intermediate layer 14 does not become the peeling end end. Therefore, when the second resin substrate 16 is peeled, the generation of the peeling defect 102 shown in FIG. 11 can be suppressed. Furthermore, the fixation of the laminated sheet when peeling off the second resin substrate 16 is not limited to the above-mentioned adsorption platform 30, but can also be an electrostatic suction cup.

以下,對構成積層片材10之第1樹脂基板12、中間層14及第2樹脂基板16進行詳細敍述。The first resin substrate 12, the intermediate layer 14, and the second resin substrate 16 constituting the laminated sheet 10 are described in detail below.

(第1樹脂基板及第2樹脂基板) 第1樹脂基板12及第2樹脂基板16係保護中間層14者,作為保護層發揮作用,亦稱為保護膜。又,第1樹脂基板12及第2樹脂基板16在貼合於玻璃基板時,任一者從中間層14被剝離。因此,第1樹脂基板12及第2樹脂基板16中之從中間層14被剝離者亦被稱為離型膜。 作為構成第1樹脂基板12及第2樹脂基板16之材料,例如可例舉:聚醯亞胺樹脂、聚酯樹脂(例如,聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯)、聚烯烴樹脂(例如,聚乙烯、聚丙烯)、聚胺酯樹脂。其中,較佳為聚酯樹脂,更佳為聚對苯二甲酸乙二酯(PET)。因此,第1樹脂基板12及第2樹脂基板16更佳為聚對苯二甲酸乙二酯基板。 (First resin substrate and second resin substrate) The first resin substrate 12 and the second resin substrate 16 protect the intermediate layer 14 and function as a protective layer, and are also called protective films. In addition, when the first resin substrate 12 and the second resin substrate 16 are attached to the glass substrate, either one is peeled off from the intermediate layer 14. Therefore, the first resin substrate 12 and the second resin substrate 16 that is peeled off from the intermediate layer 14 is also called a release film. As materials constituting the first resin substrate 12 and the second resin substrate 16, for example, polyimide resin, polyester resin (e.g., polyethylene terephthalate, polyethylene naphthalate), polyolefin resin (e.g., polyethylene, polypropylene), polyurethane resin can be cited. Among them, polyester resin is preferred, and polyethylene terephthalate (PET) is more preferred. Therefore, the first resin substrate 12 and the second resin substrate 16 are preferably polyethylene terephthalate substrates.

為了降低從外部受到之力之影響,第1樹脂基板12及第2樹脂基板16之厚度較佳為20 μm以上,更佳為30 μm以上,進而較佳為50 μm以上。作為第1樹脂基板12及第2樹脂基板16之厚度之上限值,較佳為500 μm以下,更佳為300 μm以下,進而較佳為100 μm以下。In order to reduce the influence of the force received from the outside, the thickness of the first resin substrate 12 and the second resin substrate 16 is preferably 20 μm or more, more preferably 30 μm or more, and further preferably 50 μm or more. The upper limit of the thickness of the first resin substrate 12 and the second resin substrate 16 is preferably 500 μm or less, more preferably 300 μm or less, and further preferably 100 μm or less.

(中間層) 中間層14設置於第1樹脂基板12及第2樹脂基板16之間。 中間層14係於在中間層14上配置有聚醯亞胺膜(未圖示)之情形時用以防止聚醯亞胺膜之剝離之膜。 (Intermediate layer) The intermediate layer 14 is provided between the first resin substrate 12 and the second resin substrate 16. The intermediate layer 14 is a film used to prevent the polyimide film from being peeled off when a polyimide film (not shown) is disposed on the intermediate layer 14.

中間層14可為有機層,亦可為無機層。 作為有機層之材質,例如可例舉:丙烯酸樹脂、聚烯烴樹脂、聚胺酯樹脂、聚醯亞胺樹脂、聚矽氧樹脂、聚醯亞胺聚矽氧樹脂、氟樹脂。又,亦可混合若干種樹脂而構成中間層14。 作為無機層之材質,例如可例舉:氧化物、氮化物、氮氧化物、碳化物、碳氮化物、矽化物、氟化物。作為氧化物(較佳為金屬氧化物)、氮化物(較佳為金屬氮化物)、氮氧化物(較佳為金屬氮氧化物),例如可例舉選自Si、Hf、Zr、Ta、Ti、Y、Nb、Na、Co、Al、Zn、Pb、Mg、Bi、La、Ce、Pr、Sm、Eu、Gd、Dy、Er、Sr、Sn、In及Ba中之1種以上元素之氧化物、氮化物、氮氧化物。 作為碳化物(較佳為金屬碳化物)、碳氮化物(較佳為金屬碳氮化物),例如可例舉選自Ti、W、Si、Zr及Nb中之1種以上元素之碳化物、碳氮化物、碳氧化物。 作為矽化物(較佳為金屬矽化物),例如可例舉選自Mo、W及Cr中之1種以上元素之矽化物。 作為氟化物(較佳為金屬氟化物),例如可例舉選自Mg、Y、La及Ba中之1種以上元素之氟化物。 The intermediate layer 14 may be an organic layer or an inorganic layer. As materials for the organic layer, for example, acrylic resin, polyolefin resin, polyurethane resin, polyimide resin, polysilicone resin, polyimide polysilicone resin, and fluororesin can be cited. In addition, several types of resins can be mixed to form the intermediate layer 14. As materials for the inorganic layer, for example, oxides, nitrides, oxynitrides, carbides, carbonitrides, silicides, and fluorides can be cited. Examples of oxides (preferably metal oxides), nitrides (preferably metal nitrides), and oxynitrides (preferably metal oxynitrides) include oxides, nitrides, and oxynitrides of one or more elements selected from Si, Hf, Zr, Ta, Ti, Y, Nb, Na, Co, Al, Zn, Pb, Mg, Bi, La, Ce, Pr, Sm, Eu, Gd, Dy, Er, Sr, Sn, In, and Ba. Examples of carbides (preferably metal carbides) and carbonitrides (preferably metal carbonitrides) include carbides, carbonitrides, and carbon oxides of one or more elements selected from Ti, W, Si, Zr, and Nb. As silicide (preferably metal silicide), for example, silicide of one or more elements selected from Mo, W and Cr can be cited. As fluoride (preferably metal fluoride), for example, fluoride of one or more elements selected from Mg, Y, La and Ba can be cited.

中間層14亦可為電漿聚合膜。 於中間層14為電漿聚合膜之情形時,形成電漿聚合膜之材料可例舉:CF 4、CHF 3、C 2F 6、C 3F 6、C 2F 2、CH 3F、C 4F 8等氟碳單體、甲烷、乙烷、丙烷、乙烯、丙烯、乙炔、苯、甲苯等碳氫單體、氫、SF 6等。 The middle layer 14 may also be a plasma polymerized film. When the middle layer 14 is a plasma polymerized film, the material forming the plasma polymerized film may include fluorocarbon monomers such as CF4 , CHF3 , C2F6 , C3F6 , C2F2 , CH3F , C4F8 , etc. , carbon hydrogen monomers such as methane, ethane , propane, ethylene, propylene , acetylene, benzene, toluene , hydrogen, SF6 , etc.

其中,就耐熱性或剝離性方面而言,作為中間層14之材質,較佳為聚矽氧樹脂、聚醯亞胺聚矽氧樹脂,更佳為聚矽氧樹脂,更佳為由縮合反應型聚矽氧形成之聚矽氧樹脂。 以下,對中間層14為聚矽氧樹脂層之態樣進行詳細敍述。 Among them, in terms of heat resistance or peeling properties, the material of the intermediate layer 14 is preferably polysilicone resin, polyimide polysilicone resin, more preferably polysilicone resin, and more preferably polysilicone resin formed by condensation reaction type polysilicone. The following describes in detail the state in which the intermediate layer 14 is a polysilicone resin layer.

聚矽氧樹脂係包含規定之有機矽烷氧基單元之樹脂,通常,可使硬化性聚矽氧硬化而獲得。硬化性聚矽氧根據其硬化機制而分類為加成反應型聚矽氧、縮合反應型聚矽氧、紫外線硬化型聚矽氧及電子束硬化型聚矽氧,但均可使用。其中,較佳為縮合反應型聚矽氧。 作為縮合反應型聚矽氧,可適宜地使用作為單體之水解性有機矽烷化合物或其混合物(單體混合物)、或者使單體或單體混合物進行部分水解縮合反應而獲得之部分水解縮合物(有機聚矽氧烷)。 使用該縮合反應型聚矽氧,使水解、縮合反應(溶膠凝膠反應)進行,藉此可形成聚矽氧樹脂。 Polysilicone resin is a resin containing a specified organic silaneoxy unit, and is usually obtained by curing hardening polysilicone. Hardening polysilicone is classified into addition reaction type polysilicone, condensation reaction type polysilicone, ultraviolet curing type polysilicone, and electron beam curing type polysilicone according to its curing mechanism, but all of them can be used. Among them, condensation reaction type polysilicone is preferred. As the condensation reaction type polysilicone, a hydrolyzable organic silane compound or a mixture thereof (monomer mixture) as a monomer, or a partially hydrolyzed condensate (organic polysiloxane) obtained by subjecting a monomer or a monomer mixture to a partial hydrolysis and condensation reaction can be suitably used. Using this condensation reaction type polysilicone, hydrolysis and condensation reactions (sol-gel reactions) are carried out to form polysilicone resin.

中間層14較佳為使用包含硬化性聚矽氧之硬化性組合物而形成。 硬化性組合物亦可除了包含硬化性聚矽氧以外,還包含溶劑、鉑觸媒(使用加成反應型聚矽氧作為硬化性聚矽氧之情形)、調平劑、金屬化合物等。作為金屬化合物中包含之金屬元素,例如可例舉:3d過渡金屬、4d過渡金屬、鑭系金屬、鉍(Bi)、鋁(Al)、錫(Sn)。金屬化合物之含量並無特別限制,可適當調整。 The intermediate layer 14 is preferably formed using a curable composition containing curable polysilicone. The curable composition may also contain a solvent, a platinum catalyst (when an addition reaction type polysilicone is used as the curable polysilicone), a leveler, a metal compound, etc. in addition to the curable polysilicone. Examples of metal elements contained in the metal compound include: 3d transition metals, 4d transition metals, yttrium metals, bismuth (Bi), aluminum (Al), and tin (Sn). The content of the metal compound is not particularly limited and can be adjusted appropriately.

中間層14較佳為具有羥基。構成中間層14之聚矽氧樹脂之Si-O-Si鍵之一部分斷開,可出現羥基。又,於使用縮合反應型聚矽氧之情形時,其羥基可成為中間層14之羥基。The intermediate layer 14 preferably has a hydroxyl group. A portion of the Si-O-Si bonds of the polysiloxane constituting the intermediate layer 14 are broken to generate a hydroxyl group. In addition, when a condensation-reactive polysiloxane is used, the hydroxyl group thereof can become the hydroxyl group of the intermediate layer 14.

中間層14之第1樹脂基板12之表面12a之法線方向之厚度較佳為50 μm以下,更佳為30 μm以下,進而較佳為12 μm以下。另一方面,中間層14之厚度較佳為超過1 μm,就異物嵌埋性更加優異之方面而言,更佳為6 μm以上。上述厚度係利用接觸式膜厚測定裝置測定5個以上之任意位置處之中間層14之厚度,將其等進行算術平均而得者。 再者,異物嵌埋性優異意指即便中間層14與其他基板等之間有異物,亦可由中間層14將異物嵌埋。若異物之嵌埋性優異,則不易於中間層產生由異物導致之凸部,於在聚醯亞胺膜上形成有電子裝置用構件時,抑制由凸部所致之於電子裝置用構件中之斷線等風險。再者,由於上述凸部產生時所形成之空隙被觀察為氣泡,因此可根據有無氣泡產生來評估異物嵌埋性。 The thickness of the intermediate layer 14 in the normal direction of the surface 12a of the first resin substrate 12 is preferably 50 μm or less, more preferably 30 μm or less, and further preferably 12 μm or less. On the other hand, the thickness of the intermediate layer 14 is preferably more than 1 μm, and more preferably 6 μm or more in terms of better foreign body embedding performance. The above thickness is obtained by measuring the thickness of the intermediate layer 14 at more than 5 arbitrary positions using a contact-type film thickness measuring device and arithmetically averaging them. Furthermore, excellent foreign body embedding performance means that even if there is foreign matter between the intermediate layer 14 and other substrates, the foreign matter can be embedded by the intermediate layer 14. If the embedding property of foreign matter is excellent, it is not easy to generate convex parts caused by foreign matter in the middle layer. When a component for electronic device is formed on the polyimide film, the risk of wire breakage in the component for electronic device caused by the convex parts is suppressed. Furthermore, since the gaps formed when the convex parts are generated are observed as bubbles, the embedding property of foreign matter can be evaluated based on whether bubbles are generated.

此處,例如,於玻璃基板(未圖示)上形成聚醯亞胺膜,若進行高溫熱處理,則聚醯亞胺膜黃變,因此難以應用於透明之電子裝置。然,雖機制不明,但藉由於玻璃基板上形成中間層14,於中間層14上形成聚醯亞胺膜,能夠抑制由高溫熱處理所致之聚醯亞胺膜之黃變。Here, for example, a polyimide film is formed on a glass substrate (not shown), and if a high-temperature heat treatment is performed, the polyimide film turns yellow, and thus it is difficult to apply to transparent electronic devices. However, although the mechanism is unknown, by forming the intermediate layer 14 on the glass substrate and forming the polyimide film on the intermediate layer 14, the yellowing of the polyimide film caused by the high-temperature heat treatment can be suppressed.

(玻璃基板) 貼合中間層14之玻璃基板22係支持並補強第1樹脂基板12及中間層14之構件。又,玻璃基板22作為搬送基板發揮作用。 作為玻璃之種類,較佳為無鹼硼矽酸玻璃、硼矽酸玻璃、鈉鈣玻璃、高二氧化矽玻璃、以其他氧化矽作為主要成分之氧化物系玻璃。作為氧化物系玻璃,較佳為氧化物換算所得之氧化矽之含量為40~90質量%之玻璃。 作為玻璃板,更具體而言,可例舉包含無鹼硼矽酸玻璃之玻璃板(AGC股份有限公司製造之名為「AN100」之商品、及線膨脹係數38×10 -7/℃之AGC股份有限公司製造之名為「AN-Wizus」之商品)。 至於玻璃板之製造方法,通常,使玻璃原料熔融,使熔融玻璃成形為板狀而獲得。此種成形方法可為一般者,例如可例舉:浮式法、熔融法、流孔下引法。 玻璃基板22較佳為不為軟性。因此,玻璃基板22之厚度較佳為0.3 mm以上,更佳為0.5 mm以上。 另一方面,玻璃基板22之厚度較佳為1.0 mm以下。 玻璃基板22之表面粗糙度Ra較佳為未達0.4 nm,更佳為未達0.25 nm。若玻璃基板22之表面粗糙度較大,則聚矽氧樹脂層與玻璃基板表面之接觸面積增加,水分子容易從玻璃基板移行至聚矽氧樹脂層,聚醯亞胺樹脂層容易黃變。因此,玻璃基板22之表面粗糙度較佳為一定值以下。 (Glass substrate) The glass substrate 22 bonded to the intermediate layer 14 is a member that supports and reinforces the first resin substrate 12 and the intermediate layer 14. In addition, the glass substrate 22 functions as a conveying substrate. As the type of glass, preferably alkali-free borosilicate glass, borosilicate glass, sodium calcium glass, high silica glass, and oxide-based glass with other silicon oxides as the main component. As oxide-based glass, preferably, a glass having a silicon oxide content of 40 to 90% by mass calculated as oxide is used. As a glass plate, more specifically, there can be cited a glass plate comprising alkali-free borosilicate glass (a product named "AN100" manufactured by AGC Co., Ltd., and a product named "AN-Wizus" manufactured by AGC Co., Ltd. with a linear expansion coefficient of 38×10 -7 /°C). As for the manufacturing method of the glass plate, usually, the glass raw materials are melted and the molten glass is formed into a plate shape to obtain it. Such forming methods can be general ones, for example, there can be cited: floating method, melting method, flow hole down-drawing method. The glass substrate 22 is preferably not soft. Therefore, the thickness of the glass substrate 22 is preferably not less than 0.3 mm, and more preferably not less than 0.5 mm. On the other hand, the thickness of the glass substrate 22 is preferably not more than 1.0 mm. The surface roughness Ra of the glass substrate 22 is preferably less than 0.4 nm, and more preferably less than 0.25 nm. If the surface roughness of the glass substrate 22 is larger, the contact area between the polysilicone resin layer and the surface of the glass substrate increases, water molecules are easy to migrate from the glass substrate to the polysilicone resin layer, and the polyimide resin layer is easy to yellow. Therefore, the surface roughness of the glass substrate 22 is preferably below a certain value.

玻璃基板22之從玻璃基板22之表面之法線方向觀察時之形狀並無特別限制,可為四邊形,亦可為圓形,但較佳為四邊形。The shape of the glass substrate 22 when viewed from the normal direction of the surface of the glass substrate 22 is not particularly limited, and may be a quadrilateral or a circle, but is preferably a quadrilateral.

玻璃基板22較中間層14及第1樹脂基板12大,於玻璃基板22之表面存在未配置有中間層14及第1樹脂基板12之周邊區域,玻璃基板22之周緣區域之表面露出。 玻璃基板22之周緣區域之寬度並無特別限制,較佳為1 mm~30 mm,更佳為3 mm~10 mm。周緣區域之寬度對應於從第1樹脂基板12之外周緣起至玻璃基板22之外緣為止之距離。 若玻璃基板22之周緣區域之寬度為30 mm以下,則形成電子裝置等時之有效面積變得更大,電子裝置之製作效率提高。又,藉由周緣區域之寬度為1 mm以上,於在中間層14上製作聚醯亞胺膜之情形時,聚醯亞胺膜之剝離更加不易發生。 The glass substrate 22 is larger than the intermediate layer 14 and the first resin substrate 12. There is a peripheral area on the surface of the glass substrate 22 where the intermediate layer 14 and the first resin substrate 12 are not arranged, and the surface of the peripheral area of the glass substrate 22 is exposed. The width of the peripheral area of the glass substrate 22 is not particularly limited, preferably 1 mm to 30 mm, and more preferably 3 mm to 10 mm. The width of the peripheral area corresponds to the distance from the outer periphery of the first resin substrate 12 to the outer edge of the glass substrate 22. If the width of the peripheral area of the glass substrate 22 is less than 30 mm, the effective area when forming an electronic device becomes larger, and the manufacturing efficiency of the electronic device is improved. Furthermore, since the width of the peripheral area is greater than 1 mm, when a polyimide film is formed on the intermediate layer 14, the polyimide film is less likely to peel off.

(積層體之用途) 藉由貼合所獲得之積層體可用於各種用途,例如可例舉製造下述顯示裝置用面板、PV(photovoltaic,光伏)、薄膜二次電池、於表面形成有電路之半導體晶圓、接收感測器面板等電子零件之用途。於該等用途中,亦存在積層體於大氣氛圍下、高溫條件(例如,450℃以上)下暴露(例如,20分鐘以上)之情形。 顯示裝置用面板包括LCD、OLED(Organic Light Emitting Diode)、電子紙、電漿顯示面板、場發射面板、量子點LED(Light Emitting Diode,發光二極體)面板、微LED顯示面板、MEMS(Micro Electro Mechanical Systems,微機電系統)快門面板等。 接收感測器面板包括電磁波接收感測器面板、X射線受光感測器面板、紫外線受光感測器面板、可見光線受光感測器面板、及紅外線受光感測器面板等。用於接收感測器面板之基板亦可藉由樹脂等補強片材等進行補強。 [實施例] (Application of laminated bodies) Laminated bodies obtained by lamination can be used for various applications, such as the manufacture of electronic components such as panels for display devices, PV (photovoltaic), thin-film secondary batteries, semiconductor wafers with circuits formed on the surface, and receiving sensor panels. In these applications, there are also cases where the laminated body is exposed (for example, for more than 20 minutes) in an atmospheric atmosphere and under high temperature conditions (for example, above 450°C). Panels for display devices include LCD, OLED (Organic Light Emitting Diode), electronic paper, plasma display panels, field emission panels, quantum dot LED (Light Emitting Diode) panels, micro LED display panels, MEMS (Micro Electro Mechanical Systems) shutter panels, etc. The receiving sensor panel includes an electromagnetic wave receiving sensor panel, an X-ray receiving sensor panel, an ultraviolet light receiving sensor panel, a visible light receiving sensor panel, and an infrared light receiving sensor panel. The substrate used for the receiving sensor panel can also be reinforced by a reinforcing sheet such as resin. [Example]

以下,藉由實施例等對本發明具體地進行說明,但本發明並不受該等例所限制。 以下所示之例1~7中,例1~5為實施例,例6及7為比較例。 The present invention is specifically described below by way of examples, etc., but the present invention is not limited to such examples. Among the examples 1 to 7 shown below, examples 1 to 5 are examples, and examples 6 and 7 are comparative examples.

[積層片材之製作] <硬化性聚矽氧之製備> 於1 L(升)之燒瓶中添加三乙氧基甲基矽烷(179 g)、甲苯(300 g)、乙酸(5 g),將混合物於25℃下攪拌20分鐘後,進而,加熱至60℃,反應12小時,獲得反應粗液。 將所獲得之反應粗液冷卻至25℃後,使用水(300 g),對反應粗液進行3次清洗。於清洗後之反應粗液中添加氯化三甲基矽烷(70 g),將混合物於25℃下攪拌20分鐘後,進而,加熱至50℃,反應12小時。將所獲得之反應粗液冷卻至25℃後,使用水(300 g),對反應粗液進行3次清洗。 將甲苯從清洗後之反應粗液中減壓蒸餾去除,成為漿體狀態後,利用真空乾燥機整夜進行乾燥,藉此獲得作為白色之有機聚矽氧烷化合物之硬化性聚矽氧1。 硬化性聚矽氧1之M單元與T單元之莫耳比為13:87,有機基均為甲基,平均OX基數為0.02。M單元意指(R) 3SiO 1/2所表示之有機矽烷氧基單元,T單元意指RSiO 3/2所表示之有機矽烷氧基單元,各式中之R表示氫原子或有機基。平均OX基數係表示1個Si原子上平均鍵結有幾個OX基(X為氫原子或烴基)之數值。 [Preparation of laminated sheets] <Preparation of curable polysilicone> Add triethoxymethylsilane (179 g), toluene (300 g), and acetic acid (5 g) to a 1 L (liter) flask, stir the mixture at 25°C for 20 minutes, and then heat it to 60°C and react for 12 hours to obtain a crude reaction solution. Cool the obtained crude reaction solution to 25°C, and then wash it three times with water (300 g). Add trimethylsilyl chloride (70 g) to the washed crude reaction solution, stir the mixture at 25°C for 20 minutes, and then heat it to 50°C and react for 12 hours. The obtained crude reaction liquid was cooled to 25°C and washed three times with water (300 g). Toluene was removed from the washed crude reaction liquid by reduced pressure distillation to obtain a slurry, which was then dried overnight in a vacuum dryer to obtain a curable polysiloxane 1 as a white organic polysiloxane compound. The molar ratio of the M unit to the T unit of the curable polysiloxane 1 was 13:87, the organic groups were all methyl groups, and the average OX group number was 0.02. The M unit means an organic silaneoxy unit represented by (R) 3 SiO 1/2 , and the T unit means an organic silaneoxy unit represented by RSiO 3/2 . R in each formula represents a hydrogen atom or an organic group. The average OX group number refers to the number of OX groups (X is a hydrogen atom or a hydrocarbon group) bonded to one Si atom on average.

<硬化性組合物之製備> 將硬化性聚矽氧1(20 g)、作為金屬化合物之辛酸鋯化合物(「ORGATIX ZC-200」,Matsumoto Fine Chemical股份有限公司製造)(0.16 g)、2-乙基己酸鈰(III)(Alfa Aesar公司製造,金屬含有率12質量%)(0.17 g)、及作為溶劑之Isoper G(TonenGeneral Sekiyu股份有限公司製造)(19.7 g)進行混合,使用孔徑0.45 μm之過濾器對所獲得之混合液進行過濾,藉此獲得硬化性組合物1。 <Preparation of curable composition> Curing polysilicone 1 (20 g), zirconium octanoate compound ("ORGATIX ZC-200", manufactured by Matsumoto Fine Chemical Co., Ltd.) (0.16 g) as a metal compound, 2-ethylhexanoic acid (III) (manufactured by Alfa Aesar, metal content 12% by mass) (0.17 g), and Isoper G (manufactured by Tonen General Sekiyu Co., Ltd.) (19.7 g) as a solvent were mixed, and the obtained mixed solution was filtered using a filter with a pore size of 0.45 μm to obtain curable composition 1.

<例1 積層片材> 準備PET膜(東洋紡股份有限公司製造,Toyobo Ester(註冊商標)膜 HPE,厚度50 μm)作為第1樹脂基板(離型膜),於該第1樹脂基板之表面上塗佈所製備之硬化性組合物1,使用加熱板於140℃下加熱10分鐘,藉此於第1樹脂基板(離型膜)上形成聚矽氧樹脂層。 於聚矽氧樹脂層之上貼合PET膜(東洋紡股份有限公司製造,Ester(註冊商標)膜 HPE,厚度50 μm)作為第2樹脂基板(保護膜)。其次,使用沖切機,以於尺寸912(L 2)mm×722(L 1)mm之1個角部形成L字形狀之突出部之方式進行切斷。 以突出部在第1方向D 1上突出之長度d 1、及突出部在第2方向D 2上突出之長度d 3成為10 mm之方式,並以與第1邊13a平行之方向上之突出部18之長度d 2、及與第2邊13b平行之方向上之突出部18之長度d 4成為20 mm之方式,形成突出部。 使用刀具,從作為第1樹脂基板(離型膜)之PET膜側將作為第1樹脂基板(離型膜)之PET膜及聚矽氧樹脂層(中間層)全切切斷,將作為第2樹脂基板(保護膜)之PET膜半切切斷至其厚度之中途。將使用刀具將積層片材半切之切斷方式設為「沖切方式」。 以此方式,獲得依序積層有第1樹脂基板(離型膜)、聚矽氧樹脂層(中間層)及第2樹脂基板(保護膜)之積層片材1。所獲得之積層片材1之厚度為110 μm。於例1中,突出部為圖1所示之形狀。 再者,於下述表1中,將突出部在第1方向D 1上突出之長度d 1、及突出部在第2方向D 2上突出之長度d 3記為「突出部突出之長度d 1、d 3」。 又,於下述表1中,將與第1邊13a平行之方向上之突出部18之長度d 2、及與第2邊13b平行之方向上之突出部18之長度d 4記為「突出部之長度d 2、d 4」。 <Example 1 Laminated sheet> A PET film (Toyobo Ester (registered trademark) HPE, 50 μm thick, manufactured by Toyobo Co., Ltd.) was prepared as a first resin substrate (release film), and the prepared curable composition 1 was applied on the surface of the first resin substrate, and heated at 140°C for 10 minutes using a heating plate to form a silicone resin layer on the first resin substrate (release film). A PET film (Toyobo Ester (registered trademark) HPE, 50 μm thick, manufactured by Toyobo Co., Ltd.) was laminated on the silicone resin layer as a second resin substrate (protective film). Next, a punching machine was used to cut the sheet so that an L-shaped protrusion was formed at one corner of the sheet with a size of 912 (L 2 ) mm × 722 (L 1 ) mm. The protrusion was formed so that the length d 1 of the protrusion in the first direction D 1 and the length d 3 of the protrusion in the second direction D 2 were 10 mm, and the length d 2 of the protrusion 18 in the direction parallel to the first side 13 a and the length d 4 of the protrusion 18 in the direction parallel to the second side 13 b were 20 mm. Using a cutter, the PET film and the silicone resin layer (middle layer) serving as the first resin substrate (release film) are fully cut from the PET film side serving as the first resin substrate (release film), and the PET film serving as the second resin substrate (protective film) is half-cut to the middle of its thickness. The cutting method for half-cutting the laminated sheet using a cutter is set to "punching method". In this way, a laminated sheet 1 is obtained in which the first resin substrate (release film), the silicone resin layer (middle layer), and the second resin substrate (protective film) are laminated in this order. The thickness of the obtained laminated sheet 1 is 110 μm. In Example 1, the protrusion has a shape as shown in FIG1. In Table 1 below, the length d1 of the protrusion in the first direction D1 and the length d3 of the protrusion in the second direction D2 are recorded as "lengths d1 , d3 of the protrusion". In Table 1 below, the length d2 of the protrusion 18 in the direction parallel to the first side 13a and the length d4 of the protrusion 18 in the direction parallel to the second side 13b are recorded as "lengths d2 , d4 of the protrusion".

<例2~7> 除了於上述切斷時,以積層片材之尺寸以及積層片材之突出部之外形及尺寸、積層片材之半切之切斷方式成為下述表1所示之例2~8之關係之方式將積層片材切斷以外,按照與上述例1相同之順序而獲得積層片材。 再者,於下述表1中記為「-」之情形時,表示無符合者。 於例2中,突出部為圖1所示之形狀。 於例2中,不使用沖切機而是使用雷射加工機,以於尺寸912(L 2)mm×722(L 1)mm之1個角部形成L字形狀之突出部之方式進行切斷。以突出部在第1方向D 1上突出之長度d 1、及突出部在第2方向D 2上突出之長度d 3成為10 mm之方式,並以與第1邊13a平行之方向上之突出部18之長度d 2、及與第2邊13b平行之方向上之突出部18之長度d 4成為20 mm之方式,形成突出部。 使用雷射加工機,從作為第1樹脂基板(離型膜)之PET膜側將作為第1樹脂基板(離型膜)之PET膜及聚矽氧樹脂層(中間層)全切切斷,將作為第2樹脂基板(保護膜)之PET膜半切切斷至其厚度之中途。將使用雷射加工機將積層片材半切之切斷方式設為「雷射方式」。 雷射加工機係使用CO 2線性運動描繪機雷射(linear motion plotter laser)。 <Examples 2 to 7> Laminated sheets were obtained in the same order as in Example 1 above, except that the laminated sheets were cut in such a manner that the dimensions of the laminated sheets, the shape and dimensions of the protruding portion of the laminated sheets, and the half-cutting method of the laminated sheets became the relationships of Examples 2 to 8 shown in Table 1 below. In addition, in the case of "-" in Table 1 below, it means that there is no compliance. In Example 2, the protruding portion has the shape shown in Figure 1. In Example 2, a laser processing machine was used instead of a punching machine to form an L-shaped protruding portion at one corner of the size of 912 ( L2 ) mm × 722 ( L1 ) mm. The protrusions were formed so that the length d1 of the protrusion in the first direction D1 and the length d3 of the protrusion in the second direction D2 were 10 mm, and the length d2 of the protrusion 18 in the direction parallel to the first side 13a and the length d4 of the protrusion 18 in the direction parallel to the second side 13b were 20 mm. The PET film as the first resin substrate (release film) and the silicone resin layer (intermediate layer) were fully cut from the PET film side of the first resin substrate (release film) using a laser processing machine, and the PET film as the second resin substrate (protective film) was half-cut to the middle of its thickness. The cutting method of half-cutting the laminated sheet using the laser processing machine was set to "laser method". The laser processing machine uses a CO 2 linear motion plotter laser.

於例3中,突出部為圖1所示之形狀。 於例3中,使用雷射加工機,將積層片材1以於尺寸912(L 2)mm×722(L 1)mm之1個角部形成L字形狀之突出部之方式進行切斷。以突出部在第1方向D 1上突出之長度d 1、及突出部在第2方向D 2上突出之長度d 3成為20 mm之方式,並以與第1邊13a平行之方向上之突出部18之長度d 2、及與第2邊13b平行之方向上之突出部18之長度d 4成為40 mm之方式,形成突出部。 於例4中,突出部為圖5所示之形狀。 於例4中,使用雷射加工機,將積層片材1以於尺寸912(L 2)mm×722(L 1)mm之1個角部形成扇形狀之突出部之方式進行切斷。以圖5所示之最大之長度d 5成為20 mm之方式形成突出部。 In Example 3, the protrusion is in the shape shown in FIG. 1. In Example 3, the laminated sheet 1 is cut by a laser processing machine so that an L-shaped protrusion is formed at one corner of the sheet with a size of 912 (L 2 ) mm × 722 (L 1 ) mm. The protrusion is formed so that the length d 1 of the protrusion in the first direction D 1 and the length d 3 of the protrusion in the second direction D 2 are 20 mm, and the length d 2 of the protrusion 18 in the direction parallel to the first side 13 a and the length d 4 of the protrusion 18 in the direction parallel to the second side 13 b are 40 mm. In Example 4, the protrusion is in the shape shown in FIG. 5. In Example 4, the laminated sheet 1 was cut using a laser processing machine so as to form a fan-shaped protrusion at one corner of the sheet having a size of 912 (L 2 ) mm×722 (L 1 ) mm. The protrusion was formed so that the maximum length d 5 shown in FIG. 5 was 20 mm.

於例5中,突出部為圖6所示之形狀。關於例5,於下述表1之「突出部之外形」之欄中記為「-」。 於例5中,使用雷射加工機,將積層片材1以於尺寸912(L 2)mm×722(L 1)mm之1個角部形成圖6所示之外形之突出部之方式進行切斷。以突出部在第1方向D 1上突出之長度d 1、及突出部在第2方向D 2上突出之長度d 3成為5 mm之方式,並以與第1邊13a平行之方向上之突出部18之長度d 2、及與第2邊13b平行之方向上之突出部18之長度d 4成為20 mm之方式,形成突出部。 In Example 5, the protrusion is in the shape shown in FIG6. Regarding Example 5, "-" is written in the column of "Protrusion shape" in Table 1 below. In Example 5, the laminated sheet 1 was cut using a laser processing machine so that a protrusion of the shape shown in FIG6 was formed at one corner of the size 912 ( L2 ) mm × 722 ( L1 ) mm. The protrusion was formed so that the length d1 of the protrusion in the first direction D1 and the length d3 of the protrusion in the second direction D2 were 5 mm, and the length d2 of the protrusion 18 in the direction parallel to the first side 13a and the length d4 of the protrusion 18 in the direction parallel to the second side 13b were 20 mm.

例6係無突出部之構成。於例6中,使用雷射加工機,將積層片材1切斷為尺寸912(L 2)mm×722(L 1)mm。 再者,關於例6,於下述表1之「突出部之外形」之欄中記為「-」。 於例7中,突出部為圖1所示之形狀。 於例7中,使用雷射加工機,將積層片材1以於尺寸912(L 2)mm×722(L 1)mm之1個角部形成L字形狀之突出部之方式進行切斷。以突出部在第1方向D 1上突出之長度d 1、及突出部在第2方向D 2上突出之長度d 3成為25 mm之方式,並以與第1邊13a平行之方向上之突出部18之長度d 2、及與第2邊13b平行之方向上之突出部18之長度d 4成為50 mm之方式,形成突出部。 Example 6 is a structure without a protrusion. In Example 6, a laser processing machine is used to cut the laminated sheet 1 into a size of 912 (L 2 ) mm × 722 (L 1 ) mm. In addition, regarding Example 6, "-" is recorded in the column of "Outer shape of protrusion" in the following Table 1. In Example 7, the protrusion is the shape shown in Figure 1. In Example 7, a laser processing machine is used to cut the laminated sheet 1 in a manner such that an L-shaped protrusion is formed at one corner of the size of 912 (L 2 ) mm × 722 (L 1 ) mm. The protrusion is formed so that the length d1 of the protrusion in the first direction D1 and the length d3 of the protrusion in the second direction D2 are 25 mm, and the length d2 of the protrusion 18 in the direction parallel to the first side 13a and the length d4 of the protrusion 18 in the direction parallel to the second side 13b are 50 mm.

<突出部之作為離型膜之PET膜及聚矽氧樹脂層之剝離> 於例1~5及例7中,將積層片材1以作為離型膜之PET膜為上之方式載置於吸附台,於積層片材1之突出部貼附隱形膠帶(3M公司製造之Scotch,CM-12)。其後,用手拉拽隱形膠帶,將作為離型膜之PET膜及聚矽氧樹脂層剝離。 <Peeling of the PET film and the silicone resin layer as the release film on the protruding portion> In Examples 1 to 5 and Example 7, the laminated sheet 1 was placed on the adsorption table with the PET film as the release film on top, and an invisible tape (Scotch, CM-12 manufactured by 3M) was attached to the protruding portion of the laminated sheet 1. Thereafter, the invisible tape was pulled by hand to peel off the PET film and the silicone resin layer as the release film.

<操作性之評估> 用兩手拿著剝離了作為離型膜之PET膜及聚矽氧樹脂層之積層片材1之短邊側,從台上拿起,進而置於台上,於螢光燈下觀察積層片材1之角部。基於觀察結果,按照以下之評估基準進行剝離疵點之評估。將結果示於下述表1。 A:於積層片材1之角部未視認到剝離疵點。 B:於積層片材1之角部視認到剝離疵點。 <Evaluation of operability> Hold the short side of the laminated sheet 1 from which the PET film and the silicone resin layer as the release film have been peeled off with both hands, pick it up from the table, and place it on the table, and observe the corner of the laminated sheet 1 under a fluorescent light. Based on the observation results, the peeling defect is evaluated according to the following evaluation criteria. The results are shown in Table 1 below. A: No peeling defect is visible at the corner of the laminated sheet 1. B: Peeling defect is visible at the corner of the laminated sheet 1.

<作為保護膜之PET膜之剝離> 將聚矽氧膜黏著帶(日本萬勝股份有限公司製造之626001-NB-20-50X50)以空出尼龍網格中央部之916 mm×726 mm,利用黏著帶遮住其外周部之方式,貼附於精密單片貼合機(Climb Products股份有限公司製造之SE1208aa)之尼龍網格表面。將剝離了作為離型膜之PET膜及聚矽氧樹脂層之積層片材1以作為離型膜之PET膜相接之方式,載置於網格未被遮住之916 mm×726 mm之內側,抽吸尼龍網格,固定積層片材1。 於例1~5及例7中,將隱形膠帶(3M公司製造之Scotch,CM-12)貼附在位於積層片材1之突出部之對角的作為保護膜之PET,朝向突出部所在之方向進行剝離。 於例6中,將隱形膠帶貼附於任意之積層片材1之角,將作為保護膜之PET膜剝離。 <Peeling off the PET film as a protective film> The silicone film adhesive tape (626001-NB-20-50X50 manufactured by Japan Maxim Co., Ltd.) was attached to the surface of the nylon grid of the precision single-sheet bonding machine (SE1208aa manufactured by Climb Products Co., Ltd.) in a manner that the 916 mm×726 mm in the center of the nylon grid was left empty and the outer periphery was covered with the adhesive tape. The laminated sheet 1 from which the PET film as a release film and the silicone resin layer were peeled off was placed on the inner side of the 916 mm×726 mm that was not covered by the grid in a manner that the PET film as a release film was connected, and the nylon grid was sucked to fix the laminated sheet 1. In Examples 1 to 5 and 7, invisible tape (Scotch, CM-12 manufactured by 3M) was attached to the PET film as a protective film located at the corner opposite to the protrusion of the laminated sheet 1, and peeled off in the direction of the protrusion. In Example 6, invisible tape was attached to any corner of the laminated sheet 1, and the PET film as a protective film was peeled off.

<剝離疵點之評估> 將作為第2樹脂基板(保護膜)之PET膜從積層片材剝離,於螢光燈下觀察第2樹脂基板(保護膜)之剝離終止部。基於觀察結果,按照以下評估基準進行剝離疵點之評估。將剝離疵點之結果示於下述表1。 剝離疵點係指於聚矽氧樹脂層(中間層)與第2樹脂基板(保護膜)之界面不剝離,而於聚矽氧樹脂層(中間層)之內部發生破壞而產生之疵點。於剝離第2樹脂基板(保護膜)時,若發生該剝離不良情況,則聚矽氧樹脂層(中間層)附著於第2樹脂基板(保護膜)之表面。剝離疵點(附著之聚矽氧樹脂層(中間層))於螢光燈下進行視認。 評估基準 A:於第2樹脂基板(保護膜)之剝離終止部未視認到剝離疵點。 B:於第2樹脂基板(保護膜)之剝離終止部視認到剝離疵點。 <Evaluation of peeling defects> The PET film serving as the second resin substrate (protective film) was peeled off from the laminated sheet, and the peeling end portion of the second resin substrate (protective film) was observed under a fluorescent lamp. Based on the observation results, the peeling defects were evaluated according to the following evaluation criteria. The results of the peeling defects are shown in Table 1 below. Peeling defects refer to defects that occur in the silicone resin layer (intermediate layer) without peeling at the interface between the silicone resin layer (intermediate layer) and the second resin substrate (protective film), but are caused by damage inside the silicone resin layer (intermediate layer). When peeling the second resin substrate (protective film), if the peeling defect occurs, the silicone resin layer (intermediate layer) is attached to the surface of the second resin substrate (protective film). The peeling defect (attached silicone resin layer (intermediate layer)) is visually observed under a fluorescent light. Evaluation criteria A: No peeling defect is visually observed at the peeling end of the second resin substrate (protective film). B: A peeling defect is visually observed at the peeling end of the second resin substrate (protective film).

<積層體之製作> 利用水系玻璃清洗劑(Parker Corporation股份有限公司製造之「PK-LCG213」)進行清洗後利用純水進行清洗之920 mm×730 mm、厚度0.5 mm之玻璃基板「AN Wizus」(支持基板,楊氏模數85 GPa),及從剝離了作為離型膜之PET膜及聚矽氧樹脂層之積層片材1剝離作為保護膜之PET膜,使用精密單片貼合機(Climb Products股份有限公司製造之SE1208aa)將積層片材1之形成有聚矽氧樹脂層之作為離型膜之PET膜與玻璃基板貼合,而製作依序配置有玻璃基板、聚矽氧樹脂層及PET膜之積層體。 於在操作性之評估或剝離疵點之評估中在積層片材1視認到剝離疵點之例6及7中,於積層體中亦於相同位置視認到聚矽氧樹脂與玻璃基板之未接著之疵點。 <Production of laminated body> A 920 mm × 730 mm, 0.5 mm thick glass substrate "AN Wizus" (support substrate, Young's modulus 85 GPa) was cleaned with a water-based glass cleaner ("PK-LCG213" manufactured by Parker Corporation) and then cleaned with pure water, and the PET film as a protective film was peeled off from the laminated sheet 1 from which the PET film as a release film and the polysilicone resin layer were peeled off. The laminated sheet was then laminated using a precision single-sheet laminating machine (Climb SE1208aa manufactured by Products Co., Ltd.) The PET film as a release film formed with a silicone resin layer of the laminated sheet 1 is bonded to a glass substrate to produce a laminated body having a glass substrate, a silicone resin layer and a PET film arranged in sequence. In Examples 6 and 7 where peeling defects were observed in the laminated sheet 1 during the evaluation of operability or peeling defects, defects of non-bonding between the silicone resin and the glass substrate were also observed at the same position in the laminated body.

[表1] 積層片材之尺寸(L 2×L 1mm) 積層片材之半切之切斷方式 突出部之外形 突出部突出之長度d 1、d 3(mm) 突出部之長度d 2、d 4(mm) 突出部之最大之長度d 5(mm) 操作性評估 剝離評估 例1 912×722 沖切方式 L字 10 20 - A A 例2 912×722 雷射方式 L字 10 20 - A A 例3 912×722 雷射方式 L字 20 40 - A A 例4 912×722 雷射方式 扇形 - - 20 A A 例5 912×722 雷射方式 - 5 20 - A A 例6 912×722 雷射方式 - - - - A B 例7 912×722 雷射方式 L字 25 50 - B B [Table 1] Dimensions of laminated sheets (L 2 × L 1 mm) Half-cutting method for laminated sheets Shape of protrusion Protruding length d 1 , d 3 (mm) Length of protrusion d 2 , d 4 (mm) Maximum length of protrusion d 5 (mm) Operational Assessment Peel-off Assessment Example 1 912×722 Punching method The L Word 10 20 - A A Example 2 912×722 Laser method The L Word 10 20 - A A Example 3 912×722 Laser method The L Word 20 40 - A A Example 4 912×722 Laser method sector - - 20 A A Example 5 912×722 Laser method - 5 20 - A A Example 6 912×722 Laser method - - - - A B Example 7 912×722 Laser method The L Word 25 50 - B B

根據表1所示之例1~例7之比較,與例6、7相比,例1~5無剝離疵點,剝離評估良好。 例6係無突出部之構成,產生了剝離疵點。 例7之突出部較大,操作性較差。 再者,於如上所述地在操作性之評估或剝離疵點之評估中在積層片材1視認到剝離疵點之例6及7中,於積層體中亦於相同位置視認到聚矽氧樹脂與玻璃基板之未接著之疵點。 According to the comparison of Examples 1 to 7 shown in Table 1, compared with Examples 6 and 7, Examples 1 to 5 had no peeling defects and the peeling evaluation was good. Example 6 had a structure without a protrusion and had peeling defects. The protrusion of Example 7 was larger and the operability was poor. Furthermore, in Examples 6 and 7 where peeling defects were observed in the laminated sheet 1 in the evaluation of operability or the evaluation of peeling defects as described above, defects of non-bonding of the silicone resin and the glass substrate were also observed at the same position in the laminate.

對本發明詳細地、又參照特定之實施方式進行了說明,但對業者而言顯而易見的是,於不脫離本發明之精神及範圍之情況下,可添加各種修正或變更。 本申請係基於2022年11月21日申請之日本專利申請2022-185672號者,其內容作為參照引入於此。 The present invention has been described in detail and with reference to specific embodiments, but it is obvious to those skilled in the art that various modifications or changes may be made without departing from the spirit and scope of the present invention. This application is based on Japanese Patent Application No. 2022-185672 filed on November 21, 2022, the contents of which are incorporated herein by reference.

10,11,11a,11b,44,100:積層片材 12:第1樹脂基板 12a,14a,16a,18a,30a:表面 12b,14b:背面 12e,14e,100e,100f:角部 13a:第1邊 13b:第2邊 13c:第3邊 13d:第4邊 13e:頂點 14:中間層 15:積層部 16:第2樹脂基板 17:切割線 18:突出部 18e:頂點 19:積層體 19a:不同之中間層 19b:不同之第1樹脂基板 20a:曲線 20b:直線 20c:曲線 20d:直線 20e:交點 22:玻璃基板 30:吸附台 32:遮罩 40:積層材 41,42:區域 102:剝離疵點 D 1:第1方向 D 2:第2方向 Dp:方向 d 1,d 3:突出部突出之長度 d 2:與第1邊平行之方向上之突出部之長度 d 4:與第2邊平行之方向上之突出部之長度 d 5:最大之長度 d m:距離 L 1:長度 L 2:長度 M 1,M 2:交點 r:半徑 t m:厚度 δ:寬度 10,11,11a,11b,44,100: laminated sheet 12: first resin substrate 12a,14a,16a,18a,30a: surface 12b,14b: back surface 12e,14e,100e,100f: corner 13a: first side 13b: second side 13c: third side 13d: fourth side 13e: vertex 14: middle layer 15: Lamination 16: Second resin substrate 17: Cutting line 18: Protrusion 18e: Vertex 19: Lamination 19a: Different intermediate layer 19b: Different first resin substrate 20a: Curve 20b: Straight line 20c: Curve 20d: Straight line 20e: Intersection 22: Glass substrate 30: Adsorption platform 32: Mask 40: Lamination material 41, 42: Area 102: Peeling defect D 1 : 1st direction D 2 : 2nd direction Dp: Directions d 1 , d 3 : Length of protrusion d 2 : Length of protrusion in the direction parallel to the 1st side d 4 : Length of protrusion in the direction parallel to the 2nd side d 5 : Maximum length d m : Distance L 1 : Length L 2 : Length M 1 , M 2 : Intersection point r: Radius t m : Thickness δ: Width

圖1係表示本發明之實施方式之積層片材之第1例的模式性俯視圖。 圖2係表示本發明之實施方式之積層片材之第1例的模式性剖視圖。 圖3係表示本發明之實施方式之積層片材之第2例的模式性俯視圖。 圖4係表示本發明之實施方式之積層片材之第2例的模式性剖視圖。 圖5係表示本發明之實施方式之積層片材之第3例的模式性俯視圖。 圖6係表示本發明之實施方式之積層片材之第4例的模式性俯視圖。 圖7係表示本發明之實施方式之積層片材之第1例之剝離方法的模式性俯視圖。 圖8係表示本發明之實施方式之積層片材之第1例之剝離方法的模式性剖視圖。 圖9係表示於將本發明之實施方式之積層片材之第1例之第2樹脂基板剝離後貼合於玻璃基板之狀態的模式性剖視圖。 圖10係表示先前之積層片材之第2樹脂基板之剝離方法的模式性俯視圖。 圖11係表示先前之積層片材之第2樹脂基板之剝離方法的模式性俯視圖。 圖12係按步驟順序表示積層片材之另一例之製造方法之一例的模式性俯視圖。 圖13係按步驟順序表示積層片材之另一例之製造方法之一例的模式性剖視圖。 圖14係按步驟順序表示積層片材之另一例之製造方法之一例的模式性剖視圖。 圖15係按步驟順序表示積層片材之另一例之製造方法之另一例的模式性剖視圖。 圖16係按步驟順序表示積層片材之另一例之製造方法之另一例的模式性剖視圖。 圖17係表示積層片材之另一例之第2樹脂基板之剝離方法的模式性剖視圖。 FIG. 1 is a schematic top view showing the first example of the laminated sheet material of the embodiment of the present invention. FIG. 2 is a schematic cross-sectional view showing the first example of the laminated sheet material of the embodiment of the present invention. FIG. 3 is a schematic top view showing the second example of the laminated sheet material of the embodiment of the present invention. FIG. 4 is a schematic cross-sectional view showing the second example of the laminated sheet material of the embodiment of the present invention. FIG. 5 is a schematic top view showing the third example of the laminated sheet material of the embodiment of the present invention. FIG. 6 is a schematic top view showing the fourth example of the laminated sheet material of the embodiment of the present invention. FIG. 7 is a schematic top view showing the peeling method of the first example of the laminated sheet material of the embodiment of the present invention. FIG8 is a schematic cross-sectional view showing a peeling method of the first example of the laminated sheet of the embodiment of the present invention. FIG9 is a schematic cross-sectional view showing a state in which the second resin substrate of the first example of the laminated sheet of the embodiment of the present invention is peeled off and then bonded to a glass substrate. FIG10 is a schematic top view showing a peeling method of the second resin substrate of the previous laminated sheet. FIG11 is a schematic top view showing a peeling method of the second resin substrate of the previous laminated sheet. FIG12 is a schematic top view showing an example of a manufacturing method of another example of the laminated sheet in step order. FIG. 13 is a schematic cross-sectional view showing an example of another method for manufacturing a laminated sheet in a step-by-step manner. FIG. 14 is a schematic cross-sectional view showing an example of another method for manufacturing a laminated sheet in a step-by-step manner. FIG. 15 is a schematic cross-sectional view showing another example of another method for manufacturing a laminated sheet in a step-by-step manner. FIG. 16 is a schematic cross-sectional view showing another example of another method for manufacturing a laminated sheet in a step-by-step manner. FIG. 17 is a schematic cross-sectional view showing a method for peeling off the second resin substrate of another example of a laminated sheet.

10:積層片材 10: Laminated Sheets

12:第1樹脂基板 12: 1st resin substrate

12a,18a:表面 12a,18a: Surface

12e:角部 12e: Corner

13a:第1邊 13a: Side 1

13b:第2邊 13b: Side 2

13c:第3邊 13c: Side 3

13d:第4邊 13d: 4th side

13e:頂點 13e: Vertex

15:積層部 15: Layered part

18:突出部 18: Protrusion

18e:頂點 18e: Vertex

D1:第1方向 D 1 : 1st direction

D2:第2方向 D 2 : 2nd direction

Dp:方向 Dp: Direction

d1,d3:突出部突出之長度 d 1 ,d 3 : Length of the protruding part

d2:與第1邊平行之方向上之突出部之長度 d 2 : Length of the protrusion in the direction parallel to the first side

d4:與第2邊平行之方向上之突出部之長度 d 4 : Length of the protrusion in the direction parallel to the second side

L1:長度 L 1 : Length

L2:長度 L 2 : Length

M1,M2:交點 M 1 ,M 2 : intersection point

Claims (6)

一種積層片材,其係依序積層有第1樹脂基板、中間層及第2樹脂基板者,且 上述第1樹脂基板與上述中間層係形狀及大小相同且積層而構成積層部,上述第1樹脂基板之從上述第1樹脂基板之表面之法線方向觀察到之外形為四邊形, 上述第2樹脂基板係面積大於上述第1樹脂基板及上述中間層,且於從上述第1樹脂基板之上述表面之上述法線方向觀察之情形時,在包含上述第1樹脂基板之第1邊與第2邊正交地相交之頂點的角部,具有從上述第1邊、上述頂點及上述第2邊之外緣突出之突出部, 上述突出部在與上述第1邊正交之第1方向上從上述第1邊突出之長度為5 mm以上20 mm以下,與上述第1邊平行之方向上之上述突出部距上述突出部與上述第1邊之交點之長度為10 mm以上40 mm以下,上述突出部在與上述第2邊正交之第2方向上從上述第2邊突出之長度為5 mm以上20 mm以下,與上述第2邊平行之方向上之上述突出部距上述突出部與上述第2邊之交點之長度為10 mm以上40 mm以下。 A laminated sheet, which is laminated with a first resin substrate, an intermediate layer and a second resin substrate in sequence, and the first resin substrate and the intermediate layer are of the same shape and size and are laminated to form a laminated portion, the first resin substrate has a quadrilateral shape when observed from the normal direction of the surface of the first resin substrate, the second resin substrate has a larger area than the first resin substrate and the intermediate layer, and when observed from the normal direction of the surface of the first resin substrate, at the corner including the vertex where the first side and the second side of the first resin substrate intersect orthogonally, there is a protrusion protruding from the first side, the vertex and the outer edge of the second side, The length of the protrusion from the first side in the first direction perpendicular to the first side is 5 mm to 20 mm, the length of the protrusion from the intersection of the protrusion and the first side in the direction parallel to the first side is 10 mm to 40 mm, the length of the protrusion from the second side in the second direction perpendicular to the second side is 5 mm to 20 mm, the length of the protrusion from the intersection of the protrusion and the second side in the direction parallel to the second side is 10 mm to 40 mm. 如請求項1之積層片材,其中於上述第2樹脂基板之上述突出部上,依序積層有與上述積層部分離地配置且與上述中間層不同之中間層及與上述第1樹脂基板不同之第1樹脂基板。As in claim 1, a laminated sheet, wherein an intermediate layer which is separated from the laminated portion and different from the intermediate layer, and a first resin substrate which is different from the first resin substrate are sequentially laminated on the protruding portion of the second resin substrate. 如請求項1或2之積層片材,其中上述突出部之從上述第1樹脂基板之上述表面之上述法線方向觀察到之外形的輪廓由直線及曲線中之至少一者構成。A laminated sheet as claimed in claim 1 or 2, wherein the outline of the shape of the protrusion observed from the normal direction of the surface of the first resin substrate is composed of at least one of a straight line and a curve. 如請求項1或2之積層片材,其中上述突出部之從上述第1樹脂基板之上述表面之上述法線方向觀察到之外形為多邊形、扇形或橢圓扇形。A laminated sheet as claimed in claim 1 or 2, wherein the shape of the protrusion observed from the normal direction of the surface of the first resin substrate is a polygon, a sector or an elliptical sector. 如請求項1或2之積層片材,其中上述中間層為聚矽氧樹脂層。The laminated sheet of claim 1 or 2, wherein the intermediate layer is a polysilicone resin layer. 如請求項1或2之積層片材,其中上述第1樹脂基板及上述第2樹脂基板為聚對苯二甲酸乙二酯基板。The laminated sheet of claim 1 or 2, wherein the first resin substrate and the second resin substrate are polyethylene terephthalate substrates.
TW112142193A 2022-11-21 2023-11-02 Laminated Sheets TW202430372A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022-185672 2022-11-21

Publications (1)

Publication Number Publication Date
TW202430372A true TW202430372A (en) 2024-08-01

Family

ID=

Similar Documents

Publication Publication Date Title
JP7303963B2 (en) LAMINATED BODY, ELECTRONIC DEVICE MANUFACTURING METHOD, LAMINATED PRODUCTION METHOD
JP7099478B2 (en) Laminates, methods for manufacturing laminates, and methods for manufacturing electronic devices
JPWO2015119210A1 (en) Glass laminate
KR102475698B1 (en) Manufacturing method of laminated board and electronic device
TWI820384B (en) Laminated substrate, manufacturing method of laminated body, laminated body, laminated body with components for electronic device, manufacturing method of electronic device
JP2021062571A (en) Laminated substrate and peeling method
KR102510793B1 (en) Laminated substrate, method for manufacturing laminate, laminate, laminate with components for electronic devices, method for manufacturing electronic devices
TWI831378B (en) Laminated body and method of manufacturing the laminated body
TW202430372A (en) Laminated Sheets
TW202106509A (en) Laminated substrate, method for manufacturing electronic device, and method for manufacturing laminated substrate comprising a supporting substrate made of glass and a polyimide resin layer arranged on the supporting substrate
JP2024074489A (en) Laminated Sheet
TW202434452A (en) Laminated sheet, peeling method and laminating method
JP2024074514A (en) Laminated sheet, peeling method and laminating method
JP7255726B1 (en) Laminate, laminate with electronic device member, and method for manufacturing electronic device
JP7279840B1 (en) laminate
TW202330727A (en) Laminate laminate with electronic device member and method for producing electronic device