JP2024074514A - Laminated sheet, peeling method and laminating method - Google Patents

Abstract

To provide a laminated sheet capable of suppressing peeling defects and to provide a method for peeling a laminated sheet and a laminating method using the laminated sheet.SOLUTION: There is provided a laminated sheet obtained by laminating a first resin substrate, an intermediate layer and a second resin substrate in this order, wherein an outer shape of the first resin substrate as viewed from a normal direction of a surface of the first resin substrate is quadrangle, the laminated sheet has at least two cutout parts partitioned by cut lines in a peripheral area, each cutout part includes a vertex and the cutout lines penetrate the first resin substrate and the intermediate layer and reach halfway in a thickness direction of the second resin substrate.SELECTED DRAWING: Figure 2

Description

The present invention relates to a laminated sheet, a peeling method, and a bonding method.

A polyimide resin layer is used as a substrate when manufacturing electronic devices such as solar cells, liquid crystal panels (LCDs), organic electroluminescent panels (OLEDs), and receiving sensor panels that detect electromagnetic waves, X-rays, ultraviolet rays, visible light, infrared rays, etc. The polyimide resin layer is used in the form of a laminate provided on a glass substrate, and the laminate is provided for manufacturing the electronic device.
A laminate having a polyimide resin layer is formed, for example, by providing an adsorption layer such as a silicone resin layer on a glass substrate, and then forming a polyimide resin layer on the adsorption layer.
When forming a laminate having a polyimide resin layer, a protective film is provided on an adsorption layer such as a silicone resin layer on a glass substrate.
For example, a laminate of a release film, an adsorption layer, and a protective film is used to manufacture a laminate having a polyimide resin layer. In this laminate, the release film and the adsorption layer are cut, unnecessary parts are removed, the protective film is peeled off, and the adsorption layer is attached to a glass substrate to provide the adsorption layer on the glass substrate. With the adsorption layer on the glass substrate, a polyimide resin layer is formed on the adsorption layer as described above.

A method for cutting the laminate of the release film, the adsorption layer, and the protective film described above has been proposed (Patent Document 1). More specifically, Patent Document 1 discloses that the laminate is half-cut into a square frame, and the half-cut portion is continuously scraped by a peeling roll and wound up by a scrap-removing roll.

JP 2009-137255 A

In Patent Document 1, when removing the waste from the part that has been half-cut into a square frame, i.e., when peeling off the unnecessary part, the unnecessary part to be removed tends to come into contact with the remaining part, resulting in peeling defects, and an improvement in this regard was necessary.
An object of the present invention is to provide a laminate sheet capable of suppressing peeling defects.
Another object of the present invention is to provide a method for peeling off a laminated sheet and a lamination method using a laminated sheet.

As a result of intensive research, the present inventors have found that the above-mentioned problems can be solved by the following configuration.
(1) A laminated sheet in which a first resin substrate, an intermediate layer, and a second resin substrate are laminated in that order, the first resin substrate has a rectangular outline when viewed from the normal direction of the surface thereof, and has at least two cutout portions in the peripheral region separated by a cut line, each cutout portion including an apex, and the cut line passes through the first resin substrate and the intermediate layer and reaches partway through the thickness direction of the second resin substrate.
(2) A laminate sheet described in (1), in which the cut line is tapered in a cross section of the intermediate layer and the second resin substrate in a direction perpendicular to the direction in which the cut line extends, and the cut length in the thickness direction of the second resin substrate is longer than the thickness of the intermediate layer.

(3) A laminated sheet in which a first resin substrate, an intermediate layer, and a second resin substrate are laminated in that order, the first resin substrate has a rectangular outer shape when viewed from a normal direction to the surface of the first resin substrate, and has a cutout portion defined by a first linear cut line and a second linear cut line that is connected to the first cut line and extends in a direction perpendicular to the first cut line, the first cut line extending to one side of the outer edge of the laminated sheet, and the second cut line extending to another side of the outer edge different from the one side of the laminated sheet, the first cut line and the second cut line penetrating the first resin substrate and the intermediate layer and reaching halfway through the thickness direction of the second resin substrate.
(4) A laminate sheet described in (3), in which the first cut line is tapered in a cross section of the intermediate layer and the second resin substrate in a direction perpendicular to the direction in which the first cut line extends, the second cut line is tapered in a cross section of the intermediate layer and the second resin substrate in a direction perpendicular to the direction in which the second cut line extends, and the first cut line and the second cut line have a cut length in the thickness direction of the second resin substrate that is longer than the thickness of the intermediate layer.
(5) The laminate sheet according to any one of (1) to (4), wherein the intermediate layer is a silicone resin layer.
(6) The laminate sheet according to any one of (1) to (5), wherein the first resin substrate and the second resin substrate are polyethylene terephthalate substrates.

(7) A peeling method comprising a step of peeling the cut-out portion from the laminated sheet according to any one of (1) to (6), in which the peeling step peels the cut-out portion from an outer edge of the laminated sheet toward the inside.
(8) A peeling method comprising the steps of: forming a cut line in a peripheral region of a laminated sheet in which a first resin substrate, an intermediate layer, and a second resin substrate are laminated in that order, the laminated sheet having a rectangular outer shape when viewed from a normal direction to the surface of the first resin substrate, the cut line penetrating the first resin substrate and the intermediate layer and reaching partway through the thickness direction of the second resin substrate, and forming at least two cutout portions including vertices using the cut line; and peeling the cutout portions, the peeling step peeling the cutout portions from the outer edge of the laminated sheet inward.
(9) A peeling method comprising the steps of: forming a cutout portion in a laminated sheet in which a first resin substrate, an intermediate layer, and a second resin substrate are laminated in that order, by forming a linear first cut line extending to one side of the outer edge of the laminated sheet and a linear second cut line joining the first cut line, extending in a direction perpendicular to the first cut line, and extending to another side of the outer edge different from the one side of the laminated sheet; and peeling off the cutout portion, wherein the first cut line and the second cut line penetrate the first resin substrate and the intermediate layer and reach partway through the thickness direction of the second resin substrate, and the peeling step peels off the cutout portion from the outer edge of the laminated sheet inward.

(10) A bonding method comprising the steps of peeling off a cut-out portion from a laminate sheet described in any one of (1) to (6), peeling off the second resin substrate to expose the intermediate layer, and bonding the exposed intermediate layer to a glass substrate.

The present invention provides a laminated sheet that can suppress peeling defects when removing unnecessary parts. The present invention also provides a method for peeling a laminated sheet and a method for laminating a laminated sheet.

FIG. 1 is a schematic cross-sectional view showing a first example of a laminate sheet according to an embodiment of the present invention. FIG. 1 is a schematic plan view showing a first example of a laminate sheet according to an embodiment of the present invention. FIG. 2 is a schematic plan view showing a second example of a laminate sheet according to an embodiment of the present invention. FIG. 2 is a schematic plan view showing a third example of a laminate sheet according to an embodiment of the present invention. FIG. 11 is a schematic plan view showing a fourth example of a laminate sheet according to an embodiment of the present invention. FIG. 11 is a schematic plan view showing a fifth example of a laminate sheet according to an embodiment of the present invention. FIG. 2 is a schematic side view showing a bonding method for a first example of a laminate sheet according to an embodiment of the present invention. FIG. 2 is a schematic side view showing a bonding method for a first example of a laminate sheet according to an embodiment of the present invention. FIG. 2 is a schematic side view showing a bonding method for a first example of a laminate sheet according to an embodiment of the present invention. FIG. 2 is a schematic plan view showing a lamination method of a first example of a laminate sheet according to an embodiment of the present invention. FIG. 2 is a schematic plan view showing a lamination method of a first example of a laminate sheet according to an embodiment of the present invention. FIG. 2 is a schematic plan view showing a lamination method of a first example of a laminate sheet according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view showing an example of a laminate obtained by a lamination method according to a first example of the laminate sheet of the embodiment of the present invention. FIG. 1 is a schematic plan view showing a laminate sheet of Example 8. FIG. 13 is a schematic plan view showing the laminate sheet of Example 9.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. However, the following embodiment is merely an example for explaining the present invention, and the present invention is not limited to the following embodiment. Note that various modifications and substitutions can be made to the following embodiment without departing from the scope of the present invention.
In the following description, a numerical range expressed using "to" means a range including the numerical values before and after "to" as the lower and upper limits.
In the following description, unless otherwise specified, "perpendicular" and "parallel" include a generally acceptable error range.

The laminated sheet of the present invention is characterized in that it is a laminated sheet in which a first resin substrate, an intermediate layer, and a second resin substrate are laminated in this order, the outer shape of the first resin substrate as viewed from the normal direction of the surface is a rectangle, the peripheral region has four cutouts partitioned by cut lines, each cutout includes an apex, and the cut lines penetrate the first resin substrate and the intermediate layer and reach halfway through the thickness direction of the second resin substrate, thereby suppressing peeling defects when peeling off the four cutouts as unnecessary parts, thereby obtaining the desired effect.
The laminated sheet of the present invention is characterized in that it is a laminated sheet in which a first resin substrate, an intermediate layer, and a second resin substrate are laminated in this order, the outer shape of the first resin substrate as viewed from the normal direction of the surface is a rectangle, the cutout portion is partitioned by a linear first cut line and a linear second cut line that is connected to the first cut line and extends in a direction perpendicular to the first cut line, the first cut line extends to one side of the outer edge of the laminated sheet, and the second cut line extends to another side of the outer edge different from the one side of the laminated sheet, and the first cut line and the second cut line penetrate the first resin substrate and the intermediate layer and reach the middle of the thickness direction of the second resin substrate, thereby suppressing peeling defects when peeling the cutout portion as an unnecessary portion. This provides the desired effect.

<First Example of Laminate Sheet>
FIG. 1 is a schematic cross-sectional view showing a first example of a laminate sheet according to an embodiment of the present invention, and FIG. 2 is a schematic plan view showing the first example of a laminate sheet according to an embodiment of the present invention.
The schematic cross-sectional view of the first example of the laminate sheet shown in FIG. 1 shows a cross section in a direction perpendicular to the direction in which the score lines 17 extend.
In the schematic cross-sectional view of Fig. 1, the cut line 17 is shown as a wedge whose width gradually narrows from the first resin substrate 12 to the second resin substrate 16, but is shown by a dashed line in the schematic plan view of Fig. 2. In schematic plan views other than Fig. 2, the cut line 17 is also shown by a dashed line.
A laminate sheet 10 of the first example shown in FIG. 1 is formed by laminating a first resin substrate 12, an intermediate layer 14, and a second resin substrate 16 in this order.
In the laminate sheet 10 , an intermediate layer 14 is disposed on a surface 16 a of a second resin substrate 16 , and a first resin substrate 12 is disposed on a surface 14 a of the intermediate layer 14 .
2, the laminate sheet 10 has a rectangular outer shape when viewed from the normal direction of the surface 12a of the first resin substrate 12. The first resin substrate 12, the intermediate layer 14, and the second resin substrate 16 each have a rectangular outer shape when viewed from the normal direction of the surface 12a of the first resin substrate 12. The first resin substrate 12, the intermediate layer 14, and the second resin substrate 16 are the same size and are arranged with their sides parallel to each other.

2 has two parallel sides 10a and 10b, and two parallel sides 10c and 10d that are perpendicular to the side 10a. The length _L1 of the side 10a is shorter than the length _L2 of the side 10b.
In the laminate sheet 10, the length _L1 of the side 10a may be longer than the length _L2 of the side 10b, or the length _L1 of the side 10a may be the same as the length _L2 of the side 10b. When the length _L1 of the side 10a is the same as the length _L2 of the side 10b, the outer shape of the first resin substrate 12 viewed from the normal direction of the surface 12a is a square.

The laminated sheet 10 has four cut lines 17 and four cut portions 19 defined by the four cut lines 17. Each cut portion 19 is a portion to be peeled off as an unnecessary portion, and each cut portion 19 includes a vertex 10e of the laminated sheet 10. The cut portions 19 are rectangular.
Specifically, a cut line 17 is provided that is parallel to side 10a and shorter than side 10a, and its end extends to side 10d.
A cut line 17 is provided parallel to side 10b and shorter than side 10b, and its end extends to side 10c.
A cut line 17 is provided parallel to side 10c and shorter than side 10c, one end of which is connected to the cut line 17 parallel to side 10b and the other end of which extends to side 10a.
A cut line 17 is provided parallel to side 10d and shorter than side 10d, one end of which is connected to the cut line 17 parallel to side 10a and the other end of which extends to side 10b.
When cut-out portion 19 is peeled off as an unnecessary portion, product portion 18 surrounded by four cut lines 17 is an area that remains without being peeled off. Intermediate layer 14 of product portion 18 is bonded to a glass substrate as described below.
The size of product portion 18 is determined by the distance between two cut lines 17 parallel to side 10a in the direction of length _L2 of side 10c and the distance between cut lines 17 parallel to side 10c in the direction of length _L1 of side 10a. That is, the size of product portion 18 is determined by width d of cutout portion 19. Width d of cutout portion 19 is preferably 4 mm to 19 mm.

The cut line 17 shown in FIG. 1 penetrates the first resin substrate 12 and the intermediate layer 14, and reaches the middle of the thickness direction of the second resin substrate 16. The cut line 17 is, for example, wedge-shaped. The cut line 17 is a full cut with respect to the first resin substrate 12 and the intermediate layer 14, and a half cut with respect to the second resin substrate 16. Such a cut line 17 separates the intermediate layer 14 of the cutout portion 19 from the intermediate layer 14 of the product portion 18, and suppresses the intermediate layer 14 from being torn off when the cutout portion 19 is peeled off. This suppresses the occurrence of peeling defects such as the intermediate layer 14 of the product portion 18 being damaged or the intermediate layer 14 remaining on the second resin substrate 16. If the intermediate layer 14 remaining on the second resin substrate 16 falls off, it will lead to in-process contamination, but this is also suppressed.
1 and 2, when the cutout portion 19 is peeled off as an unnecessary portion from the laminate sheet 10, the cutout portion 19 is peeled off in a direction that does not contact the periphery of the product portion 18. Specifically, the cutout portion 19 is peeled off from the apex 10e toward the center of the product portion 18. This prevents the cutout portion 19 from contacting the product portion 18, and prevents peeling defects such as peeling at the interface between the intermediate layer and the first resin substrate or the second resin substrate.
Furthermore, dust may be generated due to contact between the intermediate layer 14 of the cutout portion 19 and the intermediate layer 14 of the product portion 18, but this dust generation is also suppressed, and contamination within the process can also be suppressed.

<Second to fifth examples of laminated sheets>
FIG. 3 is a schematic plan view showing a second example of a laminate sheet according to an embodiment of the present invention.
FIG. 4 is a schematic plan view showing a third example of a laminate sheet according to an embodiment of the present invention.
FIG. 5 is a schematic plan view showing a fourth example of a laminate sheet according to an embodiment of the present invention.
FIG. 6 is a schematic plan view showing a fifth example of a laminate sheet according to an embodiment of the present invention.
In addition, in Figs. 3 to 6, the same components as those of the laminate sheet 10 shown in Figs. 1 and 2 are denoted by the same reference numerals, and detailed description thereof will be omitted.
The second example of the laminate sheet 11 shown in Figure 3 differs from the laminate sheet 10 shown in Figures 1 and 2 in the configuration of the cut lines 17, but the other configurations are similar to those of the laminate sheet 10 shown in Figures 1 and 2.

3 has two cutouts 19 in its peripheral region, which are defined by a score line 17. The laminated sheet 11 has two score lines 17. The cutouts 19 are rectangular.
Specifically, a cut line 17 is provided parallel to side 10d and has the same length as side 10d, with one end extending to side 10a and the other end extending to side 10b.
A cut line 17 is provided parallel to side 10b and shorter than side 10b, one end of which is connected to the cut line 17 parallel to side 10d and the other end of which extends to side 10c.
In the laminated sheet 11, the size of the product portion 18 is determined by the width d of the cutout portion 19.
3, when the cut-out portion 19 is peeled off as an unnecessary portion from the laminated sheet 11, the cut-out portion 19 is peeled off in a direction that does not contact the periphery of the product portion 18. For example, the cut-out portion 19 is peeled off from the apex 10e toward the center of the product portion 18. This prevents the cut-out portion 19 from contacting the product portion 18, and as a result, the occurrence of peeling defects can be suppressed as described above, and in-process contamination can also be suppressed.
1 and 2, the laminate sheet is not limited to a configuration having four cutouts 19, but may have at least two cutouts 19. When there are two cutouts 19, it is preferable that the two cutouts 19 are provided on two perpendicular sides, not on opposing sides.

The third example of the laminate sheet 11a shown in Figure 4 differs from the laminate sheet 10 shown in Figures 1 and 2 in the configuration of the cutout portion 19, but the other configurations are similar to those of the laminate sheet 10 shown in Figures 1 and 2.
4 has a cutout portion 19 in the peripheral region, which is defined by a linear first cut line 20 and a linear second cut line 22. The cutout portion 19 is an L-shaped portion to be peeled off as an unnecessary portion.
The laminated sheet 11a defines the cutout portion 19 with a linear first cut line 20 and a linear second cut line 22 that is connected to the first cut line 20 and extends in a direction perpendicular to the first cut line 20. The first cut line 20 is parallel to the side 10d and extends to one side of the outer edge of the laminated sheet 11a. That is, the first cut line 20 extends to the side 10a. The second cut line 22 is parallel to the side 10b and extends to one side of the laminated sheet 11a, i.e., the other side of the outer edge different from the side 10a. That is, the second cut line 22 extends to the side 10c.
The size of the product portion 18 is determined by the distance _d1 from the side 10d to the first cut line 20 and the distance _d2 from the side 10b to the second cut line 22. The distances _d1 and _d2 are preferably 4 mm to 19 mm.
The distance d ₁ is the average value of the distances at any ten points corresponding to the distance between the side 10 d and the first cut line 20 .
The distance d ₂ is the average value of the distances at any ten points corresponding to the distance between the side 10 b and the second cut line 22 .

1 , the first cut line 20 and the second cut line 22 penetrate the first resin substrate 12 and the intermediate layer 14 and reach partway through the thickness direction of the second resin substrate 16. The cut line 17 is a full cut with respect to the first resin substrate 12 and the intermediate layer 14, and a half cut with respect to the second resin substrate 16.
When the cut-out portion 19 is peeled off as an unnecessary portion from the laminated sheet 11a shown in Fig. 4, the cut-out portion 19 is peeled off in a direction that does not contact the periphery of the product portion 18. Specifically, the cut-out portion 19 is peeled off from the apex 10e (the outside of the laminated sheet) toward the center of the product portion 18. This causes the cut-out portion 19 to peel off along the periphery of the product portion 18, suppressing contact between the cut-out portion 19 and the product portion 18, thereby suppressing the occurrence of peeling defects as described above and also suppressing in-process contamination.

The third example of the laminate sheet 11b shown in Figure 5 has a different configuration of the cutout portion 19 compared to the laminate sheet 10 shown in Figures 1 and 2, but the other configurations are similar to those of the laminate sheet 10 shown in Figures 1 and 2.
5, a cut line 23 is provided at the midpoint of the side 10c, which is perpendicular to the side 10c and the side 10d and parallel to the side 10a and the side 10b. The cut line 23 has the same length as the side 10a and the side 10b, and reaches from the side 10c to the side 10d.
The score line 23 divides the laminated sheet 11b into a first region 13a and a second region 13b.

In the first region 13a, a cutout portion 19 is formed, which is defined by a linear first cut line 24 and a linear second cut line 25. The first cut line 24 and the second cut line 25 are perpendicular to each other and connected to each other.
The first cut line 24 extends to one side of the outer edge of the laminated sheet 11b, i.e., to side 10b. The second cut line 25 extends to the other side of the outer edge of the laminated sheet 11b, i.e., to side 10c, which is different from side 10b.
Further, there is a third cut line 26 which is a straight line parallel to side 10c, and a fourth cut line 27 which is connected to the third cut line 26 and extends in a direction perpendicular to the third cut line 26. The third cut line 26 and the fourth cut line 27 define cutout portion 19a.
Specifically, one end of the third cut line 26 is connected to the fourth cut line 27 and the other end is connected to the second cut line 25 .
The fourth score line 27 has one end connected to the third score line 26 and the other end connected to the first score line 24 .
In the first region 13a, the region surrounded by the cutout portion 19 and the cutout portion 19a becomes the product portion 18.

In the second region 13b, similarly to the first region 13a, a cutout portion 19 is formed, which is defined by a linear first cut line 24 and a linear second cut line 25. The first cut line 24 and the second cut line 25 are joined to each other.
The first cut line 24 extends to one side of the outer edge of the laminated sheet 11b, i.e., to side 10a. The second cut line 25 extends to the other side of the outer edge of the laminated sheet 11b, i.e., to side 10c, which is different from side 10a.
The cutout portion 19a includes a third cut line 26 that is linear and parallel to the side 10c, and a fourth cut line 27 that is connected to the third cut line 26 and extends in a direction perpendicular to the third cut line 26. The third cut line 26 and the fourth cut line 27 define the cutout portion 19a.
Specifically, one end of the third cut line 26 is connected to the fourth cut line 27 and the other end is connected to the second cut line 25 .
The fourth score line 27 has one end connected to the third score line 26 and the other end connected to the first score line 24 .
In the second region 13b, similar to the first region 13a, the region surrounded by the cutout portion 19 and the cutout portion 19a becomes the product portion 18.

In the laminated sheet 11b, the cutouts 19, 19a are L-shaped.
In laminate sheet 11b, the size of product portion 18 in first region 13a is determined by distance _d1 from side 10d to first cut line 24, distance d3 from cut line 23 to second cut line ₂₅ , distance _d4 from side 10c to third cut line 26, and distance _d5 from side 10b to fourth cut line 27.
In addition, the size of the product portion 18 in the second region 13b is determined by the distance _d1 from side 10d to the first cut line 24, the distance _d3 from the cut line 23 to the second cut line 25, the distance _d4 from side 10c to the third cut line 26, and the distance _d6 from side 10a to the fourth cut line 27.
The distances d ₁ , d ₃ , d ₄ , d ₅ and d ₆ are preferably from 4 mm to 19 mm.
The distance d ₁ is the average value of the distances at any ten points corresponding to the distance between the side 10 d and the first cut line 24 .
The distance d ₃ is the average value of the distances at any ten points corresponding to the distance between the cut line 23 and the second cut line 25 .
The distance _d4 is the average value of the distances at any ten points corresponding to the distance between the side 10d and the third cut line 26.
The distance d ₅ is the average value of the distances at any ten points corresponding to the distance between the side 10 b and the fourth cut line 27 .
The distance d ₆ is the average value of the distances at any ten points corresponding to the distance between the side 10 a and the fourth cut line 27 .

1 , the cut line 23, the first cut line 24, the second cut line 25, the third cut line 26, and the fourth cut line 27 penetrate the first resin substrate 12 and the intermediate layer 14 and reach partway through the thickness direction of the second resin substrate 16. The cut line 17 is a full cut with respect to the first resin substrate 12 and the intermediate layer 14, and a half cut with respect to the second resin substrate 16.
As with the cut line 17, the cut lines 23, the first cut line 24, the second cut line 25, the third cut line 26, and the fourth cut line 27 separate the intermediate layer 14 in the cutout portion 19 from the intermediate layer 14 in the product portion 18, and prevent the intermediate layer 14 from being torn off when the cutout portion 19 is peeled off. This prevents the occurrence of peeling defects such as damage to the intermediate layer 14 in the product portion 18 or the intermediate layer 14 remaining on the second resin substrate 16. If the intermediate layer 14 remaining on the second resin substrate 16 falls off, it will lead to in-process contamination, but in-process contamination is also prevented.

When the cut-out portion 19 and the cut-out portion 19a are peeled off as unnecessary portions from the laminated sheet 11b shown in Fig. 5, the cut-out portion 19 is peeled off in a direction that does not contact the periphery of the product portion 18. Specifically, the cut-out portion 19 is peeled off from the intersection 10f (outside the laminated sheet) of the cut line 23 and the side 10d toward the center of the product portion 18. Also, for example, the cut-out portion 19a is peeled off from the apex 10e (outside the laminated sheet) toward the center of the product portion 18. As a result, the cut-out portion 19 is peeled off along the periphery of the product portion 18, and contact between the cut-out portion 19 and the product portion 18 is suppressed, thereby suppressing the occurrence of peeling defects as described above and suppressing in-process contamination.
In addition, in the laminated sheet 11b, unnecessary portions around the entire periphery of the product portion 18 can be removed by peeling off the cut-out portions 19 and 19a, and the number of peeling operations is smaller than that of the laminated sheet 10 shown in FIGS.

The third example laminate sheet 11c shown in Figure 6 differs from the laminate sheet 11b shown in Figure 5 in that it does not have the cut-out portion 19a, but otherwise has the same configuration as the laminate sheet 10 shown in Figures 1 and 2.
A laminated sheet 11c of a third example shown in FIG. 6 does not have the third cut line 26 and the fourth cut line 27 of the laminated sheet 11b shown in FIG.
In the laminated sheet 11c, the size of the product portion 18 is determined by the distance _d1 from the side 10d to the first cut line 24 and the distance _d3 from the cut line 23 to the second cut line 25.
When the cut-out portion 19 is peeled off as an unnecessary portion from the laminated sheet 11c shown in Fig. 6, the cut-out portion 19 is peeled off in a direction that does not contact the periphery of the product portion 18. For example, the cut-out portion 19 is peeled off from the intersection 10f (outside the laminated sheet) of the cut line 23 and the side 10d toward the center of the product portion 18. This causes the cut-out portion 19 to peel off along the periphery of the product portion 18, suppressing contact between the cut-out portion 19 and the product portion 18, thereby suppressing the occurrence of peeling defects as described above and also suppressing in-process contamination.

The score line 17, the first score lines 20, 24, the second score lines 22, 25, the score line 23, the third score line 26 and the fourth score line 27 can all be formed by laser or punching.
The cut lines 17, the first cut lines 20, 24, the second cut lines 22, 25, the cut lines 23, the third cut lines 26, and the fourth cut lines 27 are all tapered (see FIG. 1) in the cross sections of the intermediate layer 14 and the second resin substrate 16 in a direction perpendicular to the direction in which the cut lines 17, the first cut lines 20, 24, the second cut lines 22, 25, the cut lines 23, the third cut lines 26, and the fourth cut lines 27 extend. It is preferable that the cut length t 2 (see FIG. 1) of the cut lines 17, the first cut lines 20, 24, the second cut lines 22, 25, the cut lines 23, the third cut lines 26, and the fourth cut lines 27 in the thickness direction Dt (see FIG. 1) of the second resin substrate ₁₆ is longer than the thickness tc (see FIG. 1) of the intermediate layer 14. With this configuration, the intermediate layer 14 in the product portion 18 and the intermediate layer 14 in the cutout portion 19 can be separated, and thus the occurrence of peeling defects can be more reliably prevented.
The above-mentioned tapered shape refers to a shape in which the width of the cut line 17 gradually narrows from the first resin substrate 12 toward the second resin substrate 16 in the above-mentioned cross section as shown in FIG.
By using a laser to form the cut line 17, the first cut lines 20, 24, the second cut lines 22, 25, the cut line 23, the third cut line 26 and the fourth cut line 27, the cut line 17, the first cut lines 20, 24, the second cut lines 22, 25, the cut line 23, the third cut line 26 and the fourth cut line 27 can each be tapered in the cross section of the intermediate layer 14 and the second resin substrate 16 in a direction perpendicular to the direction in which each cut line 17, the first cut lines 20, 24, the second cut lines 22, 25, the cut line 23, the third cut line 26 and the fourth cut line 27 extends.

<Method of Peeling Off Laminated Sheet>
In the method of peeling the laminated sheet, the cut portion is peeled from the outer edge of the laminated sheet inward as described above.
(Method of forming cutout portion of laminated sheet)
The method for peeling the laminated sheets may include a step of forming the cutouts 19, 19a in each of the laminated sheets 10, 11, 11a, 11b, and 11c described above. After the step of forming the cutouts 19, 19a, a step of peeling the cutouts 19, 19a is performed. As described above, the cutouts 19, 19a can be formed by laser or punching.
Regarding the process of forming the cutout portion 19, for example, in the laminate sheet 10 shown in FIG. 2 and the laminate sheet 11 shown in FIG. 3, a first resin substrate 12, an intermediate layer 14, and a second resin substrate 16 are laminated in this order, and the laminate sheet has a rectangular outline when viewed from the normal direction of the surface 12a of the first resin substrate 12. A cut line 17 that penetrates the first resin substrate 12 and the intermediate layer 14 and reaches halfway in the thickness direction Dt of the second resin substrate 16 is formed in the peripheral region, and at least two cutout portions 19 including vertices 10e are formed by the cut line 17.
Also, for example, in the laminate sheet 11a shown in Figure 4, the laminate sheet 11b shown in Figure 5, and the laminate sheet 11c shown in Figure 6, the first resin substrate 12, the intermediate layer 14, and the second resin substrate 16 are laminated in this order, and the laminate sheet has a rectangular outer shape when viewed from the normal direction of the surface 12a of the first resin substrate 12. The cutout portion is formed by linear first cut lines 20, 24 extending to one side of the outer edge of the laminate sheet, and linear second cut lines 22, 25 that connect to the first cut lines 20, 24, extend in a direction perpendicular to the first cut lines 20, 24, and extend to another side of the outer edge that is different from the one side of the laminate sheet.

<Laminated Sheet Bonding Method>
Next, a method for laminating the laminated sheets will be described.
The lamination method of the laminated sheet will be described by taking the laminated sheet 10 shown in Figs. 1 and 2 as an example.
7 to 9 are schematic side views showing the process sequence of a lamination method of a first example of a laminated sheet according to an embodiment of the present invention. Fig. 10 to Fig. 12 are schematic plan views showing the process sequence of a lamination method of a first example of a laminated sheet according to an embodiment of the present invention.
7 to 12, the same components as those of the laminated sheet 10 shown in FIGS. 1 and 2 are denoted by the same reference numerals, and detailed description thereof will be omitted.
7 to 12, FIG. 7 corresponds to FIG. 10, FIG. 8 corresponds to FIG. 11, and FIG. 9 corresponds to FIG. 12.
The lamination method of the laminated sheet includes a step of peeling off the cut-out portion 19 (unnecessary portion) of the laminated sheet (peeling step), and a step of peeling off the second resin substrate to expose the intermediate layer and laminating the exposed intermediate layer to the glass substrate (lamination step). The lamination method of the laminated sheet will be specifically described below.

In the lamination method of the laminated sheet, first, the cutout portion 19 is peeled off from the laminated sheet 10 shown in Fig. 1 and Fig. 2 (peeling step). In this case, the cutout portion 19 is peeled off from the outer edge of the laminated sheet 10 toward the inside.
Specifically, first, the laminated sheet 10 shown in Figures 1 and 2 is placed on the stage 30 (see Figures 7 and 10). For example, adhesive tape (not shown) is attached to each vertex 10e of the four cutouts 19 of the laminated sheet 10. Then, the cutouts 19 are peeled off in a direction that does not allow them to come into contact with the product portion 18 by using the adhesive tape. More specifically, the cutouts 19 are peeled off from the vertices 10e toward the center of the product portion 18 of the laminated sheet 10.
As a result, the cutout portion 19 is removed, as shown in FIGS. 7 and 10, and the surface 16a of the second resin board 16 is exposed.

Next, the second resin substrate 16 is peeled off from the laminate sheet 10 in a state in which the cutout portion 19 shown in Figures 7 and 10 has been peeled off, to expose the intermediate layer 14. More specifically, as shown in Figure 8, the laminate sheet 10 from which the cutout portion 19 has been peeled off is fixed on a stage 32 with the first resin substrate 12 facing down. The stage 32 is, for example, a suction stage, and the laminate sheet 10 from which the cutout portion 19 has been peeled off is fixed on the stage 32 by suction. In this state, the second resin substrate 16 is peeled off.
As a result, the second resin substrate 16 is removed and the intermediate layer 14 is exposed, as shown in FIGS.
Next, the exposed intermediate layer 14 is bonded to a glass substrate 36 (bonding step). More specifically, as shown in Fig. 9, the back surface 14b of the exposed intermediate layer 14 is brought into contact with the front surface 36a of a glass substrate 36 fixed to a substrate stage 34. With the intermediate layer 14 in contact with the glass substrate 36, a bonding roll 35 arranged on the back surface 32b of the stage 32 is moved along the back surface 32b of the stage 32 to bond the intermediate layer 14 to the glass substrate 36 as shown in Figs. 9 and 12.
This results in the laminate 38 shown in Fig. 13. In the laminate 38, the intermediate layer 14 is disposed on the surface 36a of the glass substrate 36, and the first resin substrate 12 is disposed on the surface 14a of the intermediate layer 14.
The method of laminating a laminate sheet has been described using the laminate sheet 10 shown in Figures 1 and 2 as an example, but is not limited to this. For example, the laminate sheet 11b shown in Figure 5 and the laminate sheet 11c shown in Figure 6, which have two product portions 18, can also be laminated to a glass substrate 36 in the same manner as the laminate sheet 10 shown in Figures 1 and 2.

The first resin substrate 12, intermediate layer 14, and second resin substrate 16 that make up the laminate sheet 10 are described in detail below.

(First Resin Substrate and Second Resin Substrate)
The first resin substrate 12 and the second resin substrate 16 protect the intermediate layer 14 and function as a protective layer, and are also called protective films. In addition, either the first resin substrate 12 or the second resin substrate 16 is peeled off from the intermediate layer 14 when the substrate is attached to the glass substrate. For this reason, the first resin substrate 12 or the second resin substrate 16 that is peeled off from the intermediate layer 14 is also called a release film.
Examples of materials constituting the first resin substrate 12 and the second resin substrate 16 include polyimide resin, polyester resin (e.g., polyethylene terephthalate, polyethylene naphthalate), polyolefin resin (e.g., polyethylene, polypropylene), and polyurethane resin. Among these, polyester resin is preferable, and polyethylene terephthalate (PET) is more preferable. For this reason, it is more preferable that the first resin substrate 12 and the second resin substrate 16 are polyethylene terephthalate substrates.

The thickness of the first resin substrate 12 and the second resin substrate 16 is preferably 20 μm or more, more preferably 30 μm or more, and even more preferably 50 μm or more in order to reduce the influence of external forces. The upper limit of the thickness of the first resin substrate 12 and the second resin substrate 16 is preferably 500 μm or less, more preferably 300 μm or less, and even more preferably 100 μm or less.

(Middle class)
The intermediate layer 14 is provided between the first resin substrate 12 and the second resin substrate 16 .
The intermediate layer 14 is a film for preventing peeling of a polyimide film (not shown) when the polyimide film is disposed on the intermediate layer 14 .

The intermediate layer 14 may be an organic layer or an inorganic layer.
Examples of materials for the organic layer include acrylic resin, polyolefin resin, polyurethane resin, polyimide resin, silicone resin, polyimide silicone resin, and fluororesin. The intermediate layer 14 can also be made by mixing several types of resin.
Examples of the material of the inorganic layer include oxides, nitrides, oxynitrides, carbides, carbonitrides, silicides, and fluorides. Examples of the oxides (preferably metal oxides), nitrides (preferably metal nitrides), and oxynitrides (preferably metal oxynitrides) include oxides, nitrides, and oxynitrides of one or more elements selected from Si, Hf, Zr, Ta, Ti, Y, Nb, Na, Co, Al, Zn, Pb, Mg, Bi, La, Ce, Pr, Sm, Eu, Gd, Dy, Er, Sr, Sn, In, and Ba.
Examples of the carbide (preferably a metal carbide) and carbonitride (preferably a metal carbonitride) include carbides, carbonitrides, and carbonates of one or more elements selected from Ti, W, Si, Zr, and Nb.
The silicide (preferably a metal silicide) may be, for example, a silicide of one or more elements selected from Mo, W, and Cr.
The fluoride (preferably a metal fluoride) may be, for example, a fluoride of one or more elements selected from Mg, Y, La, and Ba.

The intermediate layer 14 may be a plasma polymerized membrane.
When the intermediate layer 14 is _{a plasma polymerized film, materials for forming the plasma polymerized film include fluorocarbon monomers such as CF4, CHF3, C2H6, C3H6 , C2H2 , CH3F , and C4H8 ,} hydrocarbon monomers such as methane, ethane, _propane , ethylene, propylene, acetylene, benzene, and _toluene , hydrogen, and _SF6 .

Among these, from the viewpoints of heat resistance and releasability, the material for the intermediate layer 14 is preferably a silicone resin or a polyimide silicone resin, more preferably a silicone resin, and even more preferably a silicone resin formed from a condensation reaction type silicone.
An embodiment in which the intermediate layer 14 is a silicone resin layer will be described in detail below.

Silicone resin is a resin containing a specific organosiloxy unit, and is usually obtained by curing a curable silicone. Curable silicones are classified into addition reaction type silicones, condensation reaction type silicones, ultraviolet curable silicones, and electron beam curable silicones according to their curing mechanism, and any of them can be used. Among them, condensation reaction type silicones are preferred.
As the condensation reaction type silicone, a hydrolyzable organosilane compound which is a monomer or a mixture thereof (monomer mixture), or a partial hydrolysis condensate (organopolysiloxane) obtained by subjecting a monomer or a monomer mixture to a partial hydrolysis condensation reaction can be suitably used.
This condensation reaction type silicone can be used to cause a hydrolysis-condensation reaction (sol-gel reaction) to form a silicone resin.

The intermediate layer 14 is preferably formed using a curable composition that includes a curable silicone.
The curable composition may contain, in addition to the curable silicone, a solvent, a platinum catalyst (when an addition reaction type silicone is used as the curable silicone), a leveling agent, a metal compound, etc. Examples of the metal element contained in the metal compound include 3d transition metals, 4d transition metals, lanthanoid metals, bismuth (Bi), aluminum (Al), and tin (Sn). The content of the metal compound is not particularly limited and can be adjusted appropriately.

It is preferable that the intermediate layer 14 has a hydroxy group. A part of the Si-O-Si bond constituting the silicone resin of the intermediate layer 14 may be broken, and a hydroxy group may appear. In addition, when a condensation reaction type silicone is used, the hydroxy group may become a hydroxy group of the intermediate layer 14.

The thickness of the intermediate layer 14 in the normal direction to the surface 12a of the first resin substrate 12 is preferably 50 μm or less, more preferably 30 μm or less, and even more preferably 12 μm or less. On the other hand, the thickness of the intermediate layer 14 is preferably more than 1 μm, and more preferably 6 μm or more in terms of better foreign matter embedding properties. The above thickness is the arithmetic average of the thicknesses of the intermediate layer 14 measured at five or more arbitrary positions using a contact film thickness measuring device.
In addition, excellent foreign matter embedding ability means that even if a foreign matter is present between the intermediate layer 14 and another substrate, etc., the foreign matter is embedded by the intermediate layer 14. When the foreign matter embedding ability is excellent, convex portions due to foreign matter are unlikely to occur in the intermediate layer, and when an electronic device member is formed on the polyimide film, the risk of disconnection in the electronic device member due to the convex portions is suppressed. In addition, since the voids formed when the convex portions occur are observed as air bubbles, the foreign matter embedding ability can be evaluated based on the presence or absence of air bubbles.

Here, for example, if a polyimide film is formed on a glass substrate (not shown) and subjected to high-temperature heat treatment, the polyimide film will turn yellow, making it difficult to apply to transparent electronic devices. However, although the mechanism is unclear, by forming an intermediate layer 14 on a glass substrate and then forming a polyimide film on the intermediate layer 14, it is possible to suppress the yellowing of the polyimide film due to high-temperature heat treatment.

(Glass substrate)
The glass substrate 36 to which the intermediate layer 14 is attached is a member that supports and reinforces the first resin substrate 12 and the intermediate layer 14. The glass substrate 36 also functions as a transfer substrate.
As the type of glass, alkali-free borosilicate glass, borosilicate glass, soda-lime glass, high silica glass, and other oxide-based glasses containing silicon oxide as a main component are preferable. As the oxide-based glass, glass having a silicon oxide content calculated as an oxide of 40 to 90 mass % is preferable.
More specifically, the glass plate may be a glass plate made of alkali-free borosilicate glass (product name "AN100" manufactured by AGC Inc., and product name "AN-Wizus" manufactured by AGC Inc., having a linear expansion coefficient of 38×10 ⁻⁷ /° C.).
The method for producing a glass sheet is usually to melt a glass raw material and form the molten glass into a sheet. Such a forming method may be a general one, for example, a float method, a fusion method, or a slot downdraw method.
It is preferable that the glass substrate 36 is not flexible, and therefore the thickness of the glass substrate 36 is preferably 0.3 mm or more, and more preferably 0.5 mm or more.
On the other hand, the thickness of the glass substrate 36 is preferably 1.0 mm or less.
The surface roughness Ra of the glass substrate 36 is preferably less than 0.4 nm, more preferably less than 0.25 nm. If the surface roughness of the glass substrate 36 is large, the contact area between the silicone resin layer and the glass substrate surface increases, water molecules are more likely to migrate from the glass substrate to the silicone resin layer, and the polyimide resin layer is more likely to yellow. Therefore, it is preferable that the surface roughness of the glass substrate 36 is equal to or less than a certain value.

The shape of the glass substrate 36 when observed from the normal direction of the surface 36a of the glass substrate 36 is not particularly limited and may be either rectangular or circular, with a rectangular shape being preferred.

The glass substrate 36 is larger than the intermediate layer 14 and the first resin substrate 12, and the surface 36a of the glass substrate 36 has a peripheral area where the intermediate layer 14 and the first resin substrate 12 are not disposed, and the surface 36a of the peripheral area of the glass substrate 36 (see Figure 9) is exposed.
The width of the peripheral region of the glass substrate 36 is not particularly limited, but is preferably 1 mm to 30 mm, and more preferably 3 mm to 10 mm. The width of the peripheral region corresponds to the distance from the outer periphery of the first resin substrate 12 to the outer edge of the glass substrate 36.
If the width of the peripheral region of the glass substrate 36 is 30 mm or less, the effective area for forming electronic devices and the like is increased, improving the efficiency of fabricating electronic devices. In addition, if the width of the peripheral region is 1 mm or more, peeling of the polyimide film becomes less likely to occur when a polyimide film is fabricated on the intermediate layer 14.

(Applications of the laminate)
The laminate obtained by lamination can be used for various applications, including, for example, applications for producing electronic components such as display device panels, PV, thin-film secondary batteries, semiconductor wafers with circuits formed on the surface, and receiving sensor panels, which will be described later. In these applications, the laminate may be exposed (for example, for 20 minutes or more) under high temperature conditions (for example, 450° C. or higher) in the air.
Panels for display devices include LCDs, OLEDs (Organic Light Emitting Diodes), electronic paper, plasma display panels, field emission panels, quantum dot LED (Light Emitting Diode) panels, micro LED display panels, MEMS (Micro Electro Mechanical Systems) shutter panels, and the like.
The receiving sensor panel includes an electromagnetic wave receiving sensor panel, an X-ray receiving sensor panel, an ultraviolet light receiving sensor panel, a visible light receiving sensor panel, an infrared light receiving sensor panel, etc. The substrate used in the receiving sensor panel may be reinforced with a reinforcing sheet of resin or the like.

The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples.
Of the following Examples 1 to 9, Examples 1 to 7 are working examples, and Examples 8 and 9 are comparative examples.

[Preparation of Laminated Sheet]
Preparation of Curable Silicone
Triethoxymethylsilane (179 g), toluene (300 g), and acetic acid (5 g) were added to a 1 L (liter) flask, and the mixture was stirred at 25° C. for 20 minutes, and then heated to 60° C. and reacted for 12 hours to obtain a crude reaction liquid.
The resulting reaction crude liquid was cooled to 25° C., and then washed three times with water (300 g). Chlorotrimethylsilane (70 g) was added to the washed reaction crude liquid, and the mixture was stirred at 25° C. for 20 minutes, and then heated to 50° C. and reacted for 12 hours. The resulting reaction crude liquid was cooled to 25° C., and then washed three times with water (300 g).
Toluene was removed from the washed reaction crude liquid under reduced pressure to give a slurry, which was then dried overnight in a vacuum dryer to obtain Curable Silicone 1, which was a white organopolysiloxane compound.
Curable silicone 1 had a molar ratio of M units to T units of 13:87, all organic groups were methyl groups, and the average number of OX groups was 0.02. M units are organosiloxy units represented by (R) ₃ SiO _1/2 , and T units are organosiloxy units represented by RSiO _3/2 , where R in each formula represents a hydrogen atom or an organic group. The average number of OX groups is a value that represents how many OX groups (X is a hydrogen atom or a hydrocarbon group) are bonded to one Si atom on average.

<Preparation of Curable Composition>
Curable silicone 1 (20 g), a zirconium octylate compound ("Orgatix ZC-200", manufactured by Matsumoto Fine Chemical Co., Ltd.) (0.16 g) as a metal compound, and cerium (III) 2-ethylhexanoate (manufactured by Alfa Aesar, metal content 12% by mass) (0.17 g), and Isoper G (manufactured by Tonen General Sekiyu K.K.) (19.7 g) as a solvent were mixed, and the resulting mixture was filtered using a filter with a pore size of 0.45 μm, to obtain curable composition 1.

<Example 1: Laminated sheet>
A PET film (Toyobo Ester (registered trademark) Film HPE, thickness 50 μm, manufactured by Toyobo Co., Ltd.) was prepared as a first resin substrate (release film), and the prepared curable composition 1 was applied onto the surface of this first resin substrate. The prepared curable composition 1 was then heated at 140° C. for 10 minutes using a hot plate, thereby forming a silicone resin layer on the first resin substrate (release film).
A PET film (Ester (registered trademark) film HPE, thickness 50 μm, manufactured by Toyobo Co., Ltd.) was laminated as a second resin substrate (protective film) on the applied silicone resin layer. Next, a cutter was inserted from the PET film side, which was the first resin substrate (release film), and the film was cut to a size of 950 ( _L2 ) mm × 760 ( _L1 ) mm.
In this manner, a laminate sheet 1 was obtained in which the first resin substrate (release film), the silicone resin layer (intermediate layer), and the second resin substrate (protective film) were laminated in this order. The thickness of the obtained laminate sheet 1 was 110 μm.
Further, a _CO2 linear motion plotter laser was used as the laser processing machine. The laminated sheet 1 was placed on the stage of the laser processing machine. Next, the laser was irradiated from the PET film side, which is the first resin substrate (release film), so that the dimensions of the product part were 912 ( _D2 ) mm x 722 ( _D1 ) mm. Then, the PET film and the silicone resin layer (intermediate layer), which are the first resin substrate (release film), were fully cut, and the PET film, which is the second resin substrate (protective film), was half-cut to the middle of its thickness. The cutting method of half-cutting the laminated sheet using a laser processing machine is called the "laser method". In Example 1, the cut line 17 is the pattern shown in FIG. 2, and the shape of the cutout portion 19 is rectangular. There are four cutout portions 19, but all of them have the same width, and the width is set to 19 mm.

<Examples 2 to 9>
A laminate sheet was obtained following the same procedure as in Example 1 above, except that the laminate sheet was cut so that the laminate sheet dimensions, the dimensions of the product parts of the laminate sheet, the number of product parts of the laminate sheet, the half-cut cutting method of the laminate sheet, the half-cut shape of the peripheral part of the laminate sheet, and the minimum width of the half-cut pieces satisfied the relationships shown in Table 1 below for Examples 2 to 9.
In Example 2, the cut lines have the pattern shown in Fig. 2. In Example 2, the shape of the cutout portion 19 is rectangular. There are four cutout portions 19, but all of them have the same width, which is 19 mm.
In Example 2, the laminated sheet 1 was cut using a cutter to a size of 950 ( _L2 ) mm x 760 ( _L1 ) mm. Further, the laminated sheet 1 was cut using a punching machine so that the shape of the product portion 18 was rectangular and the dimensions of the product portion were 912 ( _D2 ) mm x 722 ( _D1 ) mm. The cutting method of half-cutting the laminated sheet using a punching machine is referred to as the "punching method".

In Example 3, the cut lines have the pattern shown in Fig. 4. In Example 3, the cutout portion 19 has an L-shape and a constant width of 19 mm.
In Example 3, the laminate sheet 1 was cut using a cutter to a size of 931 ( _L2 ) mm × 741 ( _L1 ) mm. Furthermore, the laminate sheet was cut using a laser processing machine so that the shape of the product portion 18 was rectangular, the dimensions of the product portion were 912 ( _D2 ) mm × 722 ( _D1 ) mm, and the unnecessary portion on the periphery of the laminate sheet was L-shaped.
In Example 4, the cut lines have the pattern shown in Fig. 4. In Example 4, the cutout portion 19 has an L-shape and a constant width of 19 mm.
In Example 4, the laminated sheet 1 was cut using a cutter to a size of 931 ( _L2 ) mm × 741 ( _L1 ) mm. Furthermore, the laminated sheet was cut using a punching machine so that the shape of the product portion 18 was rectangular, the dimensions of the product portion were 912 ( _D2 ) mm × 722 ( _D1 ) mm, and the unnecessary portion on the periphery of the laminated sheet was L-shaped.

In Example 5, the cut lines have the pattern shown in Fig. 3. In Example 5, the shape of the cutout portion 19 is rectangular. There are two cutout portions 19, but both have the same width, which is 19 mm.
In Example 5, the laminate sheet 1 was cut using a cutter to a size of 931 ( _L2 ) mm × 741 ( _L1 ) mm. Further, the laminate sheet was cut using a laser processing machine so that the shape of the product portion 18 was square, the dimensions of the product portion were 912 ( _D2 ) mm × 722 ( _D1 ) mm, and the unnecessary portion on the periphery of the laminate sheet was rectangular.

In Example 6, the cut lines have the pattern shown in Fig. 5. In Example 6, the shape of the cutouts 19, 19a is L-shaped, the minimum width δ of the cutout 19 is 4 mm, and the width of the other cutouts 19, 19a is 19 mm.
In Example 6, the laminate sheet 1 was cut using a cutter to a size of 950 ( _L2 ) mm x 760 ( _L1 ) mm. Further, the laminate sheet 1 was cut using a laser processing machine so that the shape of the product portion 18 was rectangular, the dimensions of the product portion were 452 ( _D2 ) mm x 722 ( _D1 ) mm, the shape of the unnecessary portion on the periphery of the laminate sheet was L-shaped, the number of product portions of the laminate sheet was two, the minimum width δ of the unnecessary portion was 4 mm, and the remaining cut-out portions 19, 19a were 19 mm.

In Example 7, the cut lines have the pattern shown in Fig. 6. In Example 7, the shape of the cutout portion 19 is L-shaped, the minimum width δ of the cutout portion 19 is 4 mm, and the width of the other cutout portions 19 is 19 mm.
In Example 7, the laminate sheet 1 was cut using a cutter to a size of 912 ( _L2 ) mm x 741 ( _L1 ) mm. Further, the laminate sheet 1 was cut using a laser processing machine so that the shape of the product portion 18 was rectangular, the dimensions of the product portion were 452 ( _D2 ) mm x 722 ( _D1 ) mm, the shape of the unnecessary portion on the periphery of the laminate sheet was L-shaped, the number of product portions of the laminate sheet was 2, the minimum width δ of the unnecessary portion was 4 mm, and the width of the other cut-out portion 19 was 19 mm.

The laminated sheet of Example 8 has cut lines 17 in the pattern of the laminated sheet 100 shown in Figure 14. In Example 8, the cutout portion 19 was composed of a single member surrounding the periphery of the laminated sheet 100. The cutout portion 19 had a square shape and a constant width. The width of the cutout portion 19 was 19 mm.
In Example 8, the laminated sheet 1 was cut using a cutter to a size of 950 ( _L2 ) mm x 760 ( _L1 ) mm. Further, the laminated sheet was cut using a laser processing machine so that the shape of the product portion 18 was rectangular, the dimensions of the product portion were 912 ( _D2 ) mm x 722 ( _D1 ) mm, the unnecessary portion on the periphery of the laminated sheet was in the shape of a square, and the width of the cutout portion 19 was 19 mm.

The laminated sheet of Example 9 had cut lines 17 in the pattern of laminated sheet 101 shown in Fig. 15. In Example 9, cutout portion 19 was formed of a single member surrounding the periphery of two product portions 18. The shape of cutout portion 19 was a square, with the minimum width δ of cutout portion 19 being 8 mm and the remaining width being 19 mm.
In Example 9, the laminated sheet 1 was cut using a cutter to a size of 950 ( _L2 ) mm x 760 ( _L1 ) mm. Further, the laminated sheet 1 was cut using a laser processing machine so that the shape of the product portion 18 was rectangular, the dimensions of the product portion were 452 ( _D2 ) mm x 722 ( _D1 ) mm, the shape of the unnecessary portion on the periphery of the laminated sheet was L-shaped, the number of product portions of the laminated sheet was two, the minimum width δ of the unnecessary portion was 8 mm, and the width of the other cut-out portion 19 was 19 mm.

<Peeling of the PET film of the release film and the silicone resin layer>
(Example 1)
The laminate sheet of Example 1 was placed on a table, and mending tape (3M Scotch, CM-12) was attached to the apex of the PET film, which was the first resin substrate (release film) of the laminate sheet. The mending tape was then pulled by hand to peel off the unnecessary parts of the laminate sheet (the PET film and silicone resin layer of the release film on the periphery) in a direction that did not contact the periphery of the product part of the laminate sheet. The periphery of the product part included the surface of the second resin substrate (protective film) exposed around the product part.
(Examples 2 to 5)
The laminate sheets of Examples 2 to 5 were each placed on a table, and mending tape (3M Scotch, CM-12) was attached to the apex of the PET film, which was the first resin substrate (release film) of the laminate sheet, in the same manner as in Example 1. The mending tape was then pulled by hand to peel off the unnecessary parts of the laminate sheet (the PET film and silicone resin layer of the release film on the periphery) in a direction that did not contact the periphery of the product part of the laminate sheet.

(Examples 6 and 7)
The laminate sheets of Examples 6 and 7 were placed on a table, and mending tape (3M Scotch, CM-12) was attached to the apex of the PET film, which was the first resin substrate (release film) of the laminate sheet, in the same manner as in Example 1. Furthermore, in Examples 6 and 7, mending tape was attached to the intersection 10f (see Figures 5 and 6) of the PET film. After that, the mending tape was pulled by hand to peel off the unnecessary parts of the laminate sheet (the PET film and silicone resin layer of the release film on the periphery) in a direction that did not contact the periphery of the product part of the laminate sheet.
The laminated sheets of Examples 8 and 9 were placed on a table, and mending tape was attached to the apex of the PET film, which was the first resin substrate (release film) of the laminated sheet. Then, the mending tape was pulled toward the inside of the laminated sheet by hand to peel off the unnecessary part of the laminated sheet.

Observation of the cut line
The cut line portions of the laminated sheets of Examples 1 and 2 were observed using a microscope. Five openings of the cut line were observed, and the average size of the openings was measured. The results are shown in "Opening of cut portion" in Table 1 below.

<Evaluation of peeling defects>
After peeling off the unnecessary part of the laminated sheet, the periphery of the product part was observed with an optical microscope at a magnification of 50 times by transmitted light. Based on the observation results, peeling defects were evaluated according to the following evaluation criteria. The peeling defect results are shown in Table 1 below.
The peeling defect is an interface peeling between the first resin substrate and the silicone resin layer that occurs at the periphery of the product part, and is visually recognized as an interference fringe when observed using the optical microscope described above.
Evaluation criterion A: Of 10 laminate sheets from which unnecessary portions had been peeled off, 8 or more sheets had no visible peeling defects around the product portion of the laminate sheet.
B: Of the 10 laminate sheets from which the unnecessary portions had been peeled off, 6 to 7 sheets had no visible peeling defects around the product portions of the laminate sheets.
C: Of 10 laminate sheets from which unnecessary portions had been peeled off, 5 or less sheets had no visible peeling defects around the product portion of the laminate sheet.

<Preparation of Laminate>
A 920 mm x 730 mm, 0.5 mm thick glass substrate "AN Wizus" (support substrate, Young's modulus 85 GPa) was washed with a water-based glass cleaner ("PK-LCG213" manufactured by Parker Corporation) and then with pure water. The PET protective film was peeled off from the laminated sheet 1 from which the PET release film and silicone resin layer had been peeled off, and the PET release film on which the silicone resin layer of the laminated sheet 1 had been formed was bonded to the glass substrate to produce a laminate in which the glass substrate, silicone resin layer and PET film were arranged in this order.
In Examples 8 and 9, in which peeling defects were visually observed around the product portion of the laminate sheet 1 in the peeling defect evaluation, non-adhesion defects between the silicone resin and the glass substrate were visually observed in the same positions on the laminate.

Comparing Examples 1 to 9 in Table 1, Examples 1 to 7 had no peeling defects and had better peeling evaluations than Examples 8 and 9. Also, comparing Examples 1 and 2, the laser method for cutting the half-cut laminated sheet had a better peeling evaluation. This is thought to be because the opening of the cut line is larger with the laser method than with the punching method, so that the unnecessary part is less likely to come into contact with the periphery of the product part when it is peeled off.
In both Examples 8 and 9, the cut lines did not reach the sides of the laminated sheet, and therefore, when the unnecessary portion was peeled off, the unnecessary portion came into contact with the periphery of the product portion, causing peeling defects.
When laminates were produced using Examples 8 and 9 as described above, defects of non-adhesion between the silicone resin and the glass substrate were visually observed at the same positions as the peeling defects.

10, 11, 11a, 11b, 11c, 100, 101 Laminated sheet 10a, 10b, 10c, 10d Side 10e Vertex 10f Intersection 12 First resin substrate 12a, 14a, 16a, 36a Surface 13a First region 13b Second region 14 Intermediate layer 14b Back surface 16 Second resin substrate 17, 23 Cut line 18 Product portion 19 Cutout portion 20, 24 First cut line 22, 25 Second cut line 26 Third cut line 27 Fourth cut line 30, 32 Stage 32b Back surface 34 Substrate stage 35 Laminating roll 36 Glass substrate 38 Laminate _d1 , _d2 , _d3 , _d4 , _d5 , d ₆ Distance δ Minimum width

Claims (10)

A laminated sheet in which a first resin substrate, an intermediate layer, and a second resin substrate are laminated in this order,
The first resin substrate has a rectangular shape as viewed from a normal direction of a surface thereof,
The device has at least two cutouts in a peripheral region defined by score lines;
each said cutout includes an apex;
The cut line penetrates the first resin substrate and the intermediate layer and reaches partway through the thickness direction of the second resin substrate. The laminated sheet according to claim 1, wherein the cut line is tapered in a cross section of the intermediate layer and the second resin substrate in a direction perpendicular to the direction in which the cut line extends, and the cut length in the thickness direction of the second resin substrate is longer than the thickness of the intermediate layer. A laminated sheet in which a first resin substrate, an intermediate layer, and a second resin substrate are laminated in this order,
The first resin substrate has a rectangular shape as viewed from a normal direction of a surface thereof,
A cutout portion is defined by a linear first cut line and a linear second cut line that is connected to the first cut line and extends in a direction perpendicular to the first cut line,
The first cut line extends to one side of the outer edge of the laminated sheet,
The second cut line extends to another side of the outer edge of the laminated sheet that is different from the one side,
A laminated sheet, wherein the first cut line and the second cut line penetrate the first resin substrate and the intermediate layer and reach partway through the thickness direction of the second resin substrate. The laminated sheet according to claim 3, wherein the first cut line is tapered in a cross section of the intermediate layer and the second resin substrate in a direction perpendicular to the direction in which the first cut line extends, the second cut line is tapered in a cross section of the intermediate layer and the second resin substrate in a direction perpendicular to the direction in which the second cut line extends, and the first cut line and the second cut line have a cut length in the thickness direction of the second resin substrate that is longer than the thickness of the intermediate layer. The laminate sheet according to any one of claims 1 to 4, wherein the intermediate layer is a silicone resin layer. The laminate sheet according to any one of claims 1 to 4, wherein the first resin substrate and the second resin substrate are polyethylene terephthalate substrates. The method includes a step of peeling off the cutout portion from the laminated sheet according to any one of claims 1 to 4,
A peeling method, wherein the peeling step peels the cutout portion from an outer edge of the laminated sheet toward an inside. a step of forming a cut line in a peripheral region of a laminate sheet in which a first resin substrate, an intermediate layer, and a second resin substrate are laminated in this order, the laminate sheet having a rectangular outer shape as viewed in a normal direction to a surface of the first resin substrate, the cut line penetrating the first resin substrate and the intermediate layer and reaching partway through a thickness direction of the second resin substrate, and forming at least two cutout portions including vertices by the cut line;
and peeling off the cutout portion.
A peeling method, wherein the peeling step peels the cutout portion from an outer edge of the laminated sheet toward an inside. a step of forming a cutout portion in a laminate sheet in which a first resin substrate, an intermediate layer, and a second resin substrate are laminated in this order, the laminate sheet having a rectangular outer shape as viewed in a normal direction to a surface of the first resin substrate, by a linear first cut line extending to one side of an outer edge of the laminate sheet, and a linear second cut line joining the first cut line, extending in a direction perpendicular to the first cut line, and extending to another side of the outer edge different from the one side of the laminate sheet;
and peeling off the cutout portion.
the first cut line and the second cut line penetrate the first resin substrate and the intermediate layer and reach a partway through the thickness direction of the second resin substrate,
A peeling method, wherein the peeling step peels the cutout portion from an outer edge of the laminated sheet toward an inside. A step of peeling off the cut-out portion from the laminated sheet according to any one of claims 1 to 4;
peeling off the second resin substrate to expose the intermediate layer, and bonding the exposed intermediate layer to a glass substrate.

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