TW202424799A - Detection method of circuit board lead configuration - Google Patents

Abstract

A detection method of circuit board lead configuration is provided to solve the problem that the conventional circuit board leads deviate from the soldering position. The method includes overlapping a circuit image of a circuit board with an image of solder bumps of an electronic component, so that a plurality of leads of the circuit are aligned with a plurality of solder bumps one by one, extracting a rectangle from the overlapping area of each lead and each solder bump, keeping the two sides of the rectangle that parallel to the extending direction of the lead as two line segments, measuring the length of the two line segments and the shortest distance between the two line segments as a line width, marking the coordinates of a center point of the two line segments, and comparing the aforementioned measurement results of the two line segments with the specification of the electronic component and soldering configuration.

Description

Circuit board pin configuration detection method

The present invention relates to a circuit board circuit improvement technology, and more particularly to a circuit board pin configuration detection method for confirming that the circuit board circuit meets the component solder joint position.

In response to the development trend of miniaturization, lightness and high performance of electronic products, the circuit layout technology can complete the high-density wiring and pattern line width of the printed circuit board, which is used to solder the microelectronic components to several circuit pins on the printed circuit board. In order to ensure that the electronic components are electrically connected to the correct circuit, the solder bumps used by the electronic components must be able to overlap with the corresponding circuit pins on the circuit board. The conventional inspection method is to confirm whether the configuration of the circuit board pins is consistent with the electronic components carried by manual inspection or automatic optical inspection (AOI) or automatic visual inspection (AVI) systems.

However, as electronic products become more miniaturized and their functions become more advanced, the density of components to be installed on circuit boards increases and the connections of components become more complex, making it more difficult to detect and confirm the connection configuration between circuit board lines and component solder joints. It is known that manual circuit board inspection not only causes manpower burden, but is also prone to misjudgment or missed inspections. Even if an automated system is used to replace manual inspection, due to the dense distribution of line pins, the system may capture an erroneous circuit board image, resulting in the inability to distinguish the correct position and line width of each pin, causing the system to output an erroneous inspection result or stop the operation due to inspection failure.

In view of this, the conventional circuit board pin configuration detection method still needs to be improved.

To solve the above problems, the purpose of the present invention is to provide a circuit board pin configuration detection method that can improve the assembly yield of electronic products.

A second object of the present invention is to provide a circuit board pin configuration detection method that can avoid manual detection misjudgment to improve detection efficiency.

The quantifiers "a" or "an" used in the elements and components described throughout the present invention are only for convenience of use and to provide a general meaning of the scope of the present invention; they should be interpreted in the present invention as including one or at least one, and the single concept also includes the plural case unless it is obvious that it means otherwise.

The circuit board pin configuration detection method of the present invention comprises: overlapping a circuit image of a circuit board with a solder joint image of an electronic component so that a plurality of pins in the circuit and a plurality of solder joints are aligned one by one; capturing a rectangle from the overlapping area of each of the pins and each of the solder joints, and retaining two sides of the rectangle parallel to the extension direction of the pin as two line segments; measuring the length of one of the two line segments and the shortest distance between the two line segments as a line width, and marking the coordinates of a center point of the two line segments; and comparing the above-mentioned measurement results of the two line segments with the specifications and soldering configuration of the electronic component.

Accordingly, the circuit board pin configuration detection method of the present invention can establish the distribution information of the circuit board pins by superimposing the images of the line pins and the component solder joints, and then analyzing the size and position of each pin, which is used for comparison with the specifications and installation plan of the electronic components installed on the circuit board to confirm that the solder joints on the electronic components can be accurately soldered to the predetermined pin positions. In addition, by using computer software to assist in the detection process, it is possible to avoid misjudgment or missed detection in manual detection, which has the effects of reducing the manpower burden, improving the circuit board detection efficiency and improving the product yield.

The width of each solder joint is greater than the width of each pin, so that a deformation space for melting solder during soldering can be reserved, thereby preventing the solder from overflowing out of the soldering range.

Each pin is aligned with the center line of the corresponding solder joint. In this way, each pin is confirmed to be within the range of the corresponding solder joint during alignment, and each solder joint is prevented from covering the adjacent circuit, which can prevent the defects of open circuit or short circuit between the circuit and the component, and has the effect of improving the electrical properties and yield of the product.

The circuit board has a plurality of sets of two line segments, and each line segment is given an identification condition. In this way, it is possible to confirm whether two adjacent line segments belong to the same rectangle, so as to avoid measuring erroneous image information, and it has the effect of automatic measurement and improving detection efficiency.

Among them, the identification condition is directionality, and the two line segments of the same group are one up and one down, or one left and one right. In this way, when the selected two line segments are in the same direction, it can be judged that they do not belong to the same line, and it can also be used to mark the measurement start direction, which has the effect of automatic judgment.

The identification condition is in the form of coding, giving the two line segments of the same group corresponding numbers or symbols, and giving the corresponding digital sequence according to the arrangement order. In this way, the line segments of the same group can be judged, and the output measurement information can also be encoded, which has the effect of assisting the measurement circuit and comparing the component configuration.

Among them, a circuit in any area of the circuit board is selected, and then the two line segments are captured as multiple groups, and the arrangement direction of the selected circuits is the same. In this way, the circuits at different positions on the circuit board can be detected and classified according to different functions and welding directions, which has the effect of comparing the configuration of electronic components.

Among them, a center line is designated at the measurement position of the selected line, and a range width is shifted parallel to both sides of the center line to form two boundary lines, and multiple line segments are formed at the positions where all pins and solder joints overlap between the two boundary lines. In this way, all lines in the same area or the same side can be quickly selected and detected, which has the effect of simplifying the line selection steps.

A computer-aided design software is used to automatically capture multiple sets of two-wire segments on the circuit board and measure the information of the two-wire segments. In this way, the pin configuration of the circuit board can be automatically determined and measured, which has the effect of improving the detection efficiency and accuracy.

In order to make the above and other purposes, features and advantages of the present invention more clearly understood, the following specifically describes the preferred embodiments of the present invention in detail with reference to the accompanying drawings.

Please refer to Figures 1 to 5, which are implementation diagrams of a preferred embodiment of the circuit board pin configuration detection method of the present invention, including aligning and overlapping the pin image and the solder joint image; each solder joint B intercepts two line segments P on the corresponding pin L, the two line segments P are parallel to the pin L, and each line segment P is given an identification condition; a length H, a line width W and the coordinates of a center point C of the same pair of the two line segments P are measured; and the measurement data is output and compared with the product specifications.

Please refer to FIG. 1, the printed circuit board includes a plurality of parallel lines. The direction of the line arrangement can be horizontal, vertical or oblique according to the electronic component installation requirements. The present invention is not limited to this. The plurality of pins L are located at the ends of the plurality of lines and are used to solder the plurality of solder joints B of the electronic components. In order to confirm that each of the pins L can be correctly electrically connected to each of the solder joints B, the detection method of the present invention first connects the pins L of a circuit board to the solder joints B. The pin image is overlapped with the solder joint image of the electronic component, so that the plurality of pins L and the plurality of solder joints B are aligned one by one. The width of each solder joint B can be slightly larger than the width of each pin L to reserve deformation space for melting solder during welding. In addition, it is preferred to align the center line of each pin L with the corresponding solder joint B to avoid each pin L exceeding the range of the corresponding solder joint B during alignment, or each solder joint B covering the adjacent circuit.

Please refer to Figures 2 to 4. A set of superimposed images of pins L and solder joints B can determine two line segments P. As shown in Figure 2, a rectangle can be captured from the overlapping area of the pins L and the solder joints B, and the two sides of the rectangle parallel to the extension direction of the pins L are retained as the two line segments P.

Multiple groups of two line segments P can be captured on the circuit board. By giving each line segment P an identification condition, it is possible to confirm whether two adjacent line segments P belong to the same rectangle, thereby avoiding measuring erroneous image information. For example, as shown in FIG. 3 , the identification condition can be directional. The two line segments P of the same group can be one up and one down (or one left and one right). Before measuring the image information of the two line segments P, it is first confirmed that the left line segment P is facing up and the right line segment P is facing down. If the two line segments P are in the same group, If the directions of the line segments P are the same or the left side is downward and the right side is upward, it is determined that the measurement is failed. In addition, the identification condition can also be in the form of coding, giving the two line segments P of the same group corresponding numbers or symbols, and can also give corresponding digital sequences according to the line arrangement, for example: [1,1], [2,2], ..., or [1+,1-], [2+,2-], ..., or [1,2], [3,4], ..., etc. Confirming the coding before measuring can avoid misjudgment.

In addition, when selecting the detected line and its pin L, the detection method of the present invention can select the line in any area, and then extract multiple groups of the two line segments P from the selected line, but the arrangement direction of the selected line must be consistent. As shown in Figure 4, the arrangement direction of the line can be vertical, horizontal or oblique. The selected line can be extracted and converted into identifiable line segment P information through the above steps. For example, using Computer Aided Design (CAD), In the Fence mode of CAD software, a fence line can be drawn on the PCB image to include all the lines crossed by the fence line into the measurement selection range; or, a center line M can be specified in the area to be measured, and a range width can be preset through the software. The software will parallelly shift the range width from the center line M to both sides (up and down or left and right) to form two boundary lines D. Multiple line segments P are formed at the positions where all pins L and solder joints B overlap between the two boundary lines D, and the identification conditions for all selected line segments P are given for identification.

Please refer to FIG. 5 , and measure and calibrate the coordinates of each group of the two line segments P, including the length H of each line segment P, the length of the vertical line from the midpoint of one line segment P to the other line segment (i.e., the shortest distance between the two line segments P) as the line width W, and the midpoint of the line as the center point C of the two line segments P. For example, using computer-aided design software, a function macro can be pre-set to automatically search and determine the same group of two line segments P by the identification condition, and automatically measure the length H, the line width W and the coordinates of the center point C of the two line segments P. A text identification code S can also be given to each group of the two line segments P. The text identification code S preferably corresponds to the arrangement order of each group, for example: numbers (1, 2, 3, …) or letters (A, B, C, …), each character identification code S can be located next to each center point C.

The measurement results of each group of the two line segments P are compiled into a table and classified according to the coordinates of each center point C or each text identification code S. The position, welding direction, welding area and spacing between the pins L of all the pins L on the circuit board can be obtained, which is used to compare the specifications and welding configuration of the electronic components to determine whether the electronic components can be correctly installed on the circuit board. The correct position of the electronic components to be installed and the amount of solder used for welding can be further obtained, which can improve the assembly yield of electronic products.

In summary, the circuit board pin configuration detection method of the present invention can establish the distribution information of the circuit board pins by superimposing the images of the line pins and the component solder joints, and then analyzing the size and position of each pin, which is used for comparison with the specifications and installation plan of the electronic components installed on the circuit board to confirm that the solder joints on the electronic components can be accurately soldered to the predetermined pin positions. In addition, the detection process is assisted by computer software, which can avoid misjudgment or missed detection in manual detection, and has the effects of reducing the burden of manpower, improving circuit board detection efficiency and improving product yield.

Although the present invention has been disclosed using the above-mentioned preferred embodiments, they are not intended to limit the present invention. Any person skilled in the art may make various changes and modifications to the above-mentioned embodiments without departing from the spirit and scope of the present invention, and the scope of protection of the present invention shall include all changes within the meaning and equivalent scope recorded in the attached patent application.

B: solder joint L: pin P: line segment H: length W: line width C: center point M: center line D: boundary line S: text identification code

[Figure 1] A diagram showing the positioning of the pins of a circuit board according to a preferred embodiment of the present invention. [Figure 2] A diagram showing the capturing of the pin segments according to a preferred embodiment of the present invention. [Figure 3] A diagram showing the marking of the pin segments according to a preferred embodiment of the present invention. [Figure 4] A diagram showing the selection of the pins of the circuit board according to a preferred embodiment of the present invention. [Figure 5] A diagram showing the measurement of the pin segments according to a preferred embodiment of the present invention.

B: Soldering point

L: Pin

P: Line segment

Claims (9)

A circuit board pin configuration detection method includes: Overlapping a circuit image of a circuit board with a solder joint image of an electronic component to align several pins in the circuit with several solder joints one by one; Capturing a rectangle from the overlapping area of each pin and each solder joint, retaining two sides of the rectangle parallel to the extension direction of the pin as two line segments; Measuring the length of one of the two line segments and the shortest distance between the two line segments as a line width, and marking the coordinates of one of the center points of the two line segments; and Comparing the above measurement results of the two line segments with the specifications and soldering configuration of the electronic component. A circuit board pin configuration detection method as claimed in claim 1, wherein the width of each solder joint is greater than the width of each pin. A circuit board pin configuration detection method as claimed in claim 1, wherein each pin is aligned with the center line of the corresponding solder joint. As in claim 1, the circuit board pin configuration detection method comprises a plurality of sets of the two line segments on the circuit board, and each of the line segments is given an identification condition. A circuit board pin configuration detection method as claimed in claim 4, wherein the identification condition is directionality, and the two line segments of the same group are one up and one down, or one left and one right. As in claim 4, the circuit board pin configuration detection method, wherein the identification condition is in a coded form, giving numbers or symbols corresponding to the two line segments of the same group, and giving a corresponding digital sequence according to the arrangement order. A circuit board pin configuration detection method as claimed in claim 1, wherein a line in any area on the circuit board is selected and then captured as multiple groups of two line segments, and the arrangement direction of the selected lines is the same. A circuit board pin configuration detection method as claimed in claim 7, wherein a center line is specified at the selected line measurement position, and a range of widths are parallelly displaced to both sides of the center line to form two boundary lines, and multiple line segments are formed at the positions where all pins and solder joints overlap between the two boundary lines. A circuit board pin configuration detection method as claimed in any one of claims 1 to 8, wherein a computer-aided design software is used to automatically capture multiple groups of the two-line segments on the circuit board and measure information of the two-line segments.

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