JP2001298244A - Printed board for mounting semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed board for mounting a semiconductor device which allows an easy detection of a positional deviation between electrode terminals of semiconductor devices and pads for mounting, whether mounting is conducted by a BGA package method or flip bonding method wherein the electrode terminals and pads for connection are hidden under the semiconductor devices, and which is suppressed with the increase in an area of a mounting face required for detecting the positional deviation to the minimum. SOLUTION: The printed board for mounting a semiconductor device comprises pads for detecting a positional deviation, each of which consists of two insulated regions and is printed on the mounting face of a substrate 9, internal wires 2 which are printed on the mounting face of the substrate 9 and are connected to the pads 1 for detecting a positional deviation and pads for inspection, pairs of pads 3 for inspection which are printed on the mounting face of the substrate 9 and are connected by the divided regions of each pad 1 for detecting a positional deviation, and pads 4 for mounting which are printed like a lattice of regular intervals on the mounting face of the substrate 9 and which are solder-bonded by the electrode terminals of the semiconductor devices.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a semiconductor device BG.
The present invention relates to a printed circuit board for mounting a semiconductor device, which makes it easy to confirm the quality of mounting by A (Ball Grid Array) package or flip bonding.

[0002]

2. Description of the Related Art FIG. 7 is a block diagram of an inspection apparatus for detecting a positional shift when a semiconductor device is mounted by a conventional method.
In FIG. 7, reference numeral 5 denotes a semiconductor device, 11 denotes a printed circuit board on which the semiconductor device 5 is mounted, 12 denotes an image input unit for photographing the semiconductor device 5 mounted on the printed circuit board 11 to obtain an image for inspection, and 13 denotes an image input unit. An image processing unit 14 performs image processing on the inspection image obtained by the unit, and a mounting failure detection processing unit 14 detects a position shift of the semiconductor device 5 from the image-processed inspection image.

[0003] Next, the operation of the conventional inspection apparatus configured as described above will be described. First, the image input unit 12 is connected to the printed circuit board 1 by an optical image input unit such as a video camera.
The semiconductor device 5 mounted on 1 is photographed to obtain an image for inspection. Next, the image processing unit 13 performs predetermined image processing such as edge detection on the inspection image obtained by the image input unit 12 to extract the outer shape of the electrode terminals of the semiconductor device 5 and the mounting pads of the printed board 11. Generate a detection image. The detection image generated by the image processing unit 13 is sent to a mounting failure detection processing unit 14.

On the other hand, the mounting failure detection processing unit 14 stores in advance a model of a detected image when the semiconductor device 5 is mounted at a desired position on the printed circuit board 11. The mounting failure detection processing unit 14 detects a positional shift by comparing the detected image with the model to determine whether the semiconductor device 5 is mounted at a desired position on the pattern substrate 11.

Further, as a second conventional technique for detecting a defective solder joint at the time of mounting the semiconductor device 5, for example, Japanese Unexamined Patent Publication No.
Japanese Patent Application Laid-Open No. 0-74800 discloses “Inspection Method of Semiconductor Device Mounting Structure, Mounting Board and Mounting State”. In the mounting board of the semiconductor device disclosed in the document, all mounting pads on the mounting board to which the electrode terminals of the semiconductor device are soldered are respectively divided into a plurality of regions, and the divided mounting pads are Each is connected to a separate inspection terminal by an internal wiring. Here, the test terminal uses a pad printed on a substrate.

When the electrode terminals of the semiconductor device are satisfactorily soldered to the mounting pads on the mounting board, the divided areas of the mounting pads are connected to each other by solder bumps. On the other hand, when the solder connection of the electrode terminals is poor, the divided areas of the mounting pad are not connected to each other. Therefore, after the semiconductor device is mounted, the conduction state is inspected between the verification pads to which the divided regions of the mounting pad are connected, so that the electrode terminals of the semiconductor device and the mounting pads have insufficient or insufficient solder. It is possible to confirm solder joint failure due to leakage failure.

[0007]

In the inspection apparatus using the conventional optical image input means, the BGA package mounting in which the electrode terminals of the semiconductor device and the mounting pads on the printed circuit board are hidden on the lower surface of the semiconductor device. In a mounting method such as a flip-chip mounting method or the like, there is a problem that the electrode terminal and the mounting pad cannot be directly photographed, and a positional deviation at the time of mounting cannot be detected.

On the other hand, there is a method of detecting a relative positional relationship between a semiconductor device and a printed board by the inspection device and estimating a positional deviation of an electrode terminal and a mounting pad hidden on the lower surface of the semiconductor device based on the detected positional relationship. Is being done.

However, in the process of manufacturing a semiconductor device, the process of forming the electrode terminals and the process of forming the outer shape of the package of the semiconductor device are generally performed completely separately. Therefore, while the pitch interval between the electrode terminals arranged in a lattice pattern is highly accurate, in the process of forming the outer shape of the semiconductor device package, the variation in the position of the entire electrode terminal arrangement on the package for each semiconductor device is different. Will happen.

On the other hand, as the degree of integration of the semiconductor device increases and the number of required electrode terminals increases, the pitch distance between the electrode terminals decreases. In such a case, the variation in the position of the entire arrangement of the electrode terminals on the package of the semiconductor device is not negligible compared to the pitch distance between the electrode terminals. There has been a problem that the misalignment of the terminals and the mounting pads cannot be accurately estimated.

On the other hand, according to the mounting substrate of the second prior art, even if the electrode terminals and the connection pads are hidden on the lower surface of the semiconductor device, the quality of the solder joint of each electrode terminal is determined. be able to. However, as described above, when the degree of integration of the semiconductor device has increased and the number of electrode terminals has increased, the size of each electrode terminal has been reduced and the pitch distance has become extremely small, so that the mounting of the electrode terminal has been completed. The size of the pad is limited. In this case, dividing all the mounting pads into a plurality of regions, connecting the internal wiring to each of the divided regions, and providing separate inspection pads for each of the divided regions is difficult in terms of mounting area restrictions and inspection complexity. Not realistic from.

The test pads and the internal wiring connected to the test pads are connected to the electrode terminals of the semiconductor device other than during the test, that is, even when the semiconductor device is properly mounted and functioning normally. In this case, there is a problem that interference between signals occurs in the inspection pad and the internal wiring.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem, and there is provided a mounting method such as a BGA package mounting or a flip bonding mounting in which electrode terminals and connection pads are hidden on the lower surface of a semiconductor device. It is possible to easily detect the positional deviation between the electrode terminal of the semiconductor device and the mounting pad, and to reduce the area on the mounting surface required to arrange the inspection pad and the internal wiring for detecting the positional deviation. An object of the present invention is to provide a printed circuit board for mounting a semiconductor device in which the increase is as small as possible.

[0014]

In order to solve the above-mentioned problems and achieve the object, in a printed circuit board for mounting a semiconductor device according to the present invention, an electrode terminal of the semiconductor device is bonded to a mounting surface of the substrate. A plurality of mounting pads printed in a grid pattern at equal pitch intervals, and a straight line of the mounting pads on the mounting surface of the substrate and outside each of four sides of the grid array of the mounting pads. A plurality of misregistration detection pads consisting of a plurality of regions insulated from each other, which are printed at positions at the pitch intervals from the outermost mounting pads of the lattice-like arrangement on the extension of the lattice-like arrangement, A plurality of inspection pads which are printed on the mounting surface of the substrate and correspond to the respective misalignment detection pads, and a plurality of divided regions of the misalignment inspection pads are separately connected to each other. Characterized in that was.

In the printed circuit board for mounting a semiconductor device according to the next invention, at least two pairs of the inspection pads are provided, and one of the inspection pads is divided into a plurality of misalignment detection pads. One of the regions is connected, and the other of the plurality of position detecting pads is connected to the other of the inspection pads.

In a printed circuit board for mounting a semiconductor device according to the next invention, the inspection pads are printed on the back surface of the board.

In the printed circuit board for mounting a semiconductor device according to the next invention, a plurality of divided positional shift inspection pads correspond to the respective positional shift detection pads instead of the inspection pads. Are provided on the substrate with a plurality of through holes each of which is separately connected.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 FIG. 1 is a configuration diagram showing an outline of a semiconductor device mounting portion of a printed circuit board according to the first embodiment. In FIG. 1, reference numeral 9 denotes a substrate, and 1 denotes a position shift detecting pad which is composed of two mutually insulated regions and is printed on the mounting surface of the substrate 9; A pair of inspection pads printed on the mounting surface of the substrate 9 and connected to the divided areas of the misalignment detection pads 1; Reference numeral 4 denotes mounting pads printed on the mounting surface of the substrate 9 in a grid pattern at regular intervals on which the electrode terminals of the semiconductor device not shown in FIG. 1, a semiconductor device mounting portion of a printed circuit board including an internal wiring 2, an inspection pad 3, and a mounting pad 4. In the first embodiment, the inspection pad 3 is used as an inspection terminal for performing an inspection for occurrence of displacement after mounting the semiconductor device.

A semiconductor device of a BGA package is mounted on the semiconductor device mounting portion 10 of the printed circuit board according to the first embodiment. In a semiconductor device of a BGA package to be mounted, hemispherical electrode terminals are arranged in a lattice on the lower surface of the semiconductor device. The number of the electrode terminals is generally as large as several hundreds, and the pitch interval between the terminals is generally about 1 mm. To solder this electrode terminal,
The mounting pads 4 are printed on the substrate 9 in a grid pattern at the same pitch as the electrode terminals. In FIG. 1,
Although only 16 mounting pads 4 are shown for simplicity of description, actually, the number corresponding to the number of electrode terminals of the semiconductor device is printed. The semiconductor device mounting portion 10 and other necessary patterns are printed on the mounting surface of the substrate 9 to form a printed board on which the semiconductor device and other components are mounted.

Semiconductor device mounting portion 10 of the first embodiment
In this embodiment, the misalignment detection pads 1 are arranged one on each side outside the mounting pads 4 arranged in a lattice. The misalignment detection pad 1 is arranged at a distance equal to the pitch interval from the outermost mounting pad 4 on an extension of the mounting pad 4 arranged linearly.

Here, the misalignment that occurs during the mounting of the semiconductor device is caused by the so-called self-alignment effect caused by the surface tension of the melted solder, and is generated using the pitch interval as a minimum unit. No small displacement occurs. Therefore,
When a position shift occurs during mounting of the semiconductor device, the electrode terminal of the semiconductor device is always joined to any of the position shift detection pads 1 arranged at the predetermined position.

Each of the displacement detecting pads 1 is divided into two half-moon-shaped regions. Each of the divided areas is connected to a separate inspection pad 3 by an internal wiring 2. Therefore, the displacement detection pad 1 is not soldered to the electrode terminal of the semiconductor device,
In a state where the divided areas are not connected to each other by the solder bumps, the pair of inspection pads 3 connected to one misalignment detection pad does not conduct.

FIG. 2 is an explanatory view showing a case where the semiconductor device is mounted at a correct position on the semiconductor device mounting portion 10 and no positional displacement occurs between the electrode terminal and the mounting pad. In FIG. 2, reference numeral 5 denotes a mounted semiconductor device, and reference numeral 6 denotes an electrode terminal arranged on the lower surface of the semiconductor device. In FIG. 2, the electrode terminal 6, the misalignment detection pad 1, and the mounting pad 4 of the semiconductor device are shown for explanation, but these are hidden under the semiconductor device 5. 5 cannot be seen from above.

As shown in FIG. 2, when the semiconductor device is mounted at a correct position and the electrode terminal 6 and the mounting pad 4 are joined without any positional deviation, any of the positional deviation detecting pads 1 is connected to the electrode terminal. It is not joined and does not conduct at all the test pads 3. In the position shift inspection after mounting the semiconductor device, the continuity check of each test pad 3 is performed. As a result, there is no continuity in all the test pads 3, so that the semiconductor device is mounted in a correct position without a position shift. Is confirmed.

Next, a case where a position shift occurs during mounting of the semiconductor device will be described with reference to FIG. In FIG.
The semiconductor device is mounted on the upper left side of the figure on the semiconductor device mounting portion 10 with respect to the correct position, and a positional shift occurs between the electrode terminal of the semiconductor device and the mounting pad. In this case, the misalignment detection pads 1 arranged above and on the left side of the mounting pads 4 arranged in a lattice are respectively joined to the electrode terminals 6 of the semiconductor device.

As described above, in the misalignment detection pad 1 soldered to the electrode terminal 6, the two divided areas are connected to each other by the solder bumps and connected to the detection pad 1 via the internal wiring 2. The conduction between the pair of test pads 3 is conducted. Therefore, in the case shown in FIG. 3, the inspection pads 3 corresponding to the misalignment detection pads 1 arranged above and on the left side of the mounting pad 4 in the figure become conductive. In the positional displacement inspection after mounting the semiconductor device, the continuity of the inspection pad 3 is checked. As a result, the continuity of the inspection pad 3 above and on the left side of the mounting pad 4 causes the semiconductor device to be displaced. It is confirmed that.

With this configuration, in the printed circuit board according to the first embodiment, the electrode terminals are arranged on the lower surface of the package of the semiconductor device, and the positions of the electrode terminals 6 and the mounting pads 4 of the semiconductor device mounting portion 10 are determined. Can not be directly confirmed, the positional deviation can be easily detected. In addition, even if the number of electrode terminals 6 of the semiconductor device to be mounted is large, the number of positional displacement inspection pads 1 only needs to be four outside the mounting pad 4, one each for upper, lower, left and right,
An increase in the wiring area on the printed circuit board can be suppressed, and the number of continuity checks at the time of inspection can be minimized.

When the semiconductor device is mounted at a correct position on the printed circuit board, the misalignment detection pad 1, the internal wiring 2, and the inspection pad 3 arranged for misalignment detection are connected to the semiconductor device. Connected to other electrode terminals and other signal lines. Therefore, when the semiconductor device actually operates, the misalignment detection pad 1, the internal wiring 2, and the inspection pad 3 do not cause signal interference or the like and do not affect the operation of the semiconductor device. There is such an effect.

In the first embodiment, the misalignment detecting pads 1 are arranged one by one on each of the upper, lower, left and right sides outside the mounting pads 4 arranged in a lattice. The configuration is not limited to one, but may be a configuration in which two or more are arranged on one side. Further, the above-described position shift detection pad 1 is divided into two half-moon-shaped regions, but the shape of the divided region is not limited to this.
Other shapes may be used as long as the two regions are connected to each other by joining the solder bumps.

Embodiment 2 FIG. In the second embodiment, one of the two divided regions of all the displacement detection pads is connected to one inspection pad, and the other region is connected to another inspection pad. Accordingly, the presence or absence of connection of all the displacement detection pads by the solder bumps can be confirmed by the continuity check of the pair of inspection pads.

FIG. 4 is a configuration diagram showing a print pattern of a semiconductor device mounting portion of the printed circuit board according to the second embodiment. In FIG. 4, reference numeral 7 denotes an internal wiring for connecting the divided area of each position shift detection pad and the inspection pad. In the present embodiment, two pairs of inspection pads 3 are provided on the semiconductor device mounting portion 10, and the inspection pads 3 are divided into two of the plurality of misalignment detection pads 1 via the internal wiring 7. Connected to each other. That is, one of the two divided areas is connected to one inspection pad 3 by an internal wiring 7 shown by a solid line in FIG. 4, and the other area is connected by another internal wiring 7 shown by a broken line in FIG. It is connected to one inspection pad 3. In the second embodiment, all the positional displacement inspection pads 1 are connected to the pair of inspection pads 3 via the internal wiring 7, and other components are the same as those in the first embodiment. Therefore, the same reference numerals are given and the description is omitted.

Hereinafter, a method of detecting a positional shift of a semiconductor device using the printed circuit board according to the second embodiment configured as described above will be described. First, when the semiconductor device is mounted at a correct position on the printed circuit board, none of the plurality of misalignment detecting pads 1 arranged outside the mounting pads 4 are soldered, and The divided areas of the pad 1 are not connected by the solder bump. Therefore, even if the continuity check of the inspection pad 3 is performed, the continuity is not confirmed, so that it is determined that the positional shift has not occurred.

On the other hand, when the semiconductor device is not mounted at the correct position on the substrate, one of the misalignment detecting pads is soldered to the electrode terminal of the semiconductor device and the divided areas are solder bumped. Connected. in this case,
When the continuity check of the inspection pad 3 is performed, the continuity is confirmed, and the occurrence of the displacement is detected.

With this configuration, in the printed circuit board according to the second embodiment, even if the electrode terminals are on the lower surface of the semiconductor device and the positional relationship between the electrode terminals and the mounting pads cannot be directly confirmed. In addition, it is possible to provide a printed circuit board capable of easily detecting a positional deviation during mounting. Further, since all the displacement inspection pads are connected to the pair of inspection pads, the presence / absence of the displacement can be confirmed by a single conduction check, and the number of work steps required for the inspection can be reduced. At the same time, there is an effect that the area required for disposing the inspection pads 3 is reduced.

Embodiment 3 FIG. In the third embodiment, by arranging the inspection pads 3 on the back surface of the printed board, the area required for arranging the inspection pads on the mounting surface of the printed board is reduced.

FIG. 5 is a configuration diagram showing an outline of a semiconductor device mounting portion of a printed circuit board according to the third embodiment. FIG.
On the mounting surface of the substrate 9 shown in (a), one misalignment detection pad 1 is printed on each of the upper, lower, left and right sides outside the mounting pads 4 arranged in a grid pattern at equal intervals.

On the other hand, on the back surface of the substrate 9 shown in FIG. 5B, the inspection pads 3 corresponding to the above-mentioned misalignment detection pads 1 are printed. The inspection pad 3
Is printed on a portion inside the semiconductor device mounting portion 10 on which the mounting pad 4 and the misalignment detection and detection pad 1 are printed on the mounting surface.

The divided area of each position shift inspection pad 1 and the corresponding inspection pad 3 are shown in FIG.
As shown in the cross section of the semiconductor device mounting portion 10 in (c), they are connected to each other by the internal wiring 2 penetrating the substrate 9. The other components are the same as those of the first embodiment.
Therefore, the same reference numerals are given and the description is omitted.

With the above-described configuration, in the third embodiment, the inspection pads 3 are provided on the back surface of the printed circuit board to reduce the increase in the wiring area on the mounting surface required for detecting the positional deviation. It is possible to obtain a printed circuit board that can be reduced in size and that can easily perform a positional displacement inspection of a semiconductor device even when the component mounting density is high.

In the third embodiment, the inspection pad 3 is printed on the inside of the semiconductor device mounting portion 10 on the back surface of the substrate 9, but this is not limited to the above-mentioned portion. And the semiconductor device mounting part 1
The mounting pad 4 and the misalignment detection and detection pad 1 on the mounting surface also on the back surface of the substrate 9, depending on the bonding structure required for mounting the electronic component disposed adjacent to the electronic component 0.
The same effect can be obtained by printing on a portion outside the printed semiconductor device mounting portion 10.

Embodiment 4 FIG. FIG. 6 is a configuration diagram showing an outline of a semiconductor device mounting portion of a printed circuit board according to the fourth embodiment. In FIG. 6, on the mounting surface of the printed circuit board,
The misalignment detection pads 1 are arranged outside the grid-like arrangement of the mounting pads 4. Reference numeral 8 denotes a pair of two through holes corresponding to the above-described misalignment detection pads 1. In the fourth embodiment, the through-hole 8 is used as an inspection terminal for inspecting the occurrence of displacement after mounting the semiconductor device. The divided areas of the position shift detection pads 1 are connected to separate through holes 8 by the internal wiring 2. The inside diameter of the through hole 8 is set to a size that allows easy insertion of an inspection electrode terminal of an inspection device used for a continuity check described later. In addition,
The other components are the same as those in the first embodiment, and thus the same reference numerals are given and the description is omitted.

In the positional displacement inspection after the mounting of the semiconductor device, an inspection electrode terminal of an inspection device is inserted into the pair of through holes 8 to check the continuity. As a result, if there is no conduction in the pair of through holes 8 corresponding to all the positional displacement inspection pads 1, it is determined that the semiconductor device is mounted at a correct position without positional displacement, and any of the through holes 8 When there is conduction in the pair, it is determined that the position shift of the semiconductor device has occurred.

With such a configuration, in the printed circuit board according to the fourth embodiment, the through holes connected to the respective displacement detection pads are provided as inspection terminals, so that the displacement after mounting the semiconductor device is achieved. When conducting a continuity check for inspection, it is easy to connect inspection equipment, and a continuity check for positional deviation inspection can be performed from both the mounting surface and the back surface of the printed circuit board, thereby increasing the work efficiency at the time of inspection. This has the effect. Further, the inspection work efficiency can be further improved by performing an inspection by setting an inspection pin in the through hole.

[0044]

As described above, in the printed circuit board for mounting a semiconductor device according to the present invention, the position divided into a plurality of mutually insulated regions is provided at a predetermined position outside the mounting pads arranged in a grid. A misalignment detection pad is arranged and an inspection pad corresponding to each misalignment detection pad is provided. If a misalignment of the semiconductor device occurs during mounting, any of the misalignment detection pads is used. Since the electrode terminals of the semiconductor device are joined to the pads, the divided areas of the position shift detection pads are connected to each other by solder bumps, and the corresponding test pads are electrically connected. Therefore, according to the present invention, it is possible to confirm the presence / absence of misalignment of the semiconductor device by checking the continuity of the inspection pad. It is possible to provide a printed circuit board for mounting a semiconductor device, which can easily detect a positional deviation at the time of mounting even in a BGA package mounting or flip bonding mounting hidden behind the lower surface of the semiconductor device.

Further, at least one pair of test pads is provided, one of the test pads is connected to one of the divided regions of the plurality of misalignment detection pads, and the other test pad is connected to the plurality of test pads. By connecting the other area of the misalignment detection pad to the other area, the number of inspection pads is reduced, the wiring area required for the installation is reduced, and the number of continuity checks between the inspection pads is reduced. It is possible to provide a printed circuit board for mounting a semiconductor device, which can reduce and easily perform a displacement inspection.

Further, since the inspection pads are arranged on the back surface of the printed circuit board for mounting the semiconductor device, the area required for disposing the inspection pads on the mounting surface can be reduced.
It is possible to reduce the increase in the wiring area on the mounting surface required for detecting the displacement, and to easily perform the displacement inspection of the semiconductor device even when the component mounting density is high. A substrate can be provided.

Further, the provision of through holes in place of the inspection pads facilitates connection of the inspection electrode terminals of the inspection equipment at the time of the continuity check performed in the positional deviation inspection, and the work efficiency required for the inspection. Can be provided.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing an outline of a semiconductor device mounting portion of a printed circuit board according to a first embodiment of the present invention.

FIG. 2 is an explanatory diagram showing a case where the semiconductor device is normally bonded to the semiconductor device mounting portion according to the first embodiment of the present invention.

FIG. 3 is an explanatory diagram showing a case where the semiconductor device is bonded to the semiconductor device mounting portion according to the first embodiment of the present invention while including a positional shift;

FIG. 4 is a configuration diagram showing an outline of a semiconductor device mounting portion of a printed circuit board according to a second embodiment of the present invention.

FIG. 5 is a configuration diagram showing an outline of a semiconductor device mounting portion of a printed circuit board according to a third embodiment of the present invention.

FIG. 6 is a configuration diagram showing an outline of a semiconductor device mounting portion of a printed circuit board according to a fourth embodiment of the present invention.

FIG. 7 is a configuration diagram of a conventional inspection device that detects a positional shift when a semiconductor device is mounted.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Position shift detection pad 2, 7 Internal wiring 3 Inspection pad 4 Mounting pad 5 Semiconductor device 6 Electrode terminal of semiconductor device 8 Through hole 9 Substrate 10 Semiconductor device mounting portion 11 Printed substrate 12 Image input unit 13 Image processing unit 14 Mounting failure detection processing unit

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 13/08 H01L 23/12 L

Claims (4)

[Claims] A plurality of mounting pads printed on a mounting surface of a substrate and formed in a grid pattern at equal pitches to which electrode terminals of a semiconductor device are joined; and a mounting pad also on the mounting surface of the substrate. Outside of each of the four sides of the lattice-shaped array of the above-mentioned grid-shaped array, printed at a position at the pitch interval from the outermost mounting pads of the lattice-shaped array on the extension of the linear array of the mounting pads,
A plurality of misregistration detection pads including a plurality of regions insulated from each other; and a plurality of divided regions of the misregistration detection pads which are also provided on the substrate and correspond to the misalignment detection pads. And a plurality of inspection terminals, each of which is separately connected. 2. A method according to claim 1, wherein at least two pairs of the inspection terminals are provided, and one of the inspection terminals is connected to one of divided regions of a plurality of misalignment detection pads, and the other of the inspection terminals is connected to the other of the inspection terminals. Is characterized in that the other region of the plurality of displacement detection pads are connected to each other,
A printed circuit board for mounting a semiconductor device according to claim 1. 3. The inspection terminal according to claim 1, wherein the inspection terminal is printed on a back surface of the substrate.
A printed circuit board for mounting a semiconductor device according to item 1. 4. The printed circuit board according to claim 1, wherein the inspection terminal has a through hole.