JP3403818B2 - Inspection method and device for mounted parts - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting component inspection method and apparatus for inspecting the mounting state of mounted chip components in the mounting process of electronic components.

[0002]

2. Description of the Related Art Recently, high-density mounting has progressed, electronic components have become smaller, and the mounting pitch has become narrower, so visual inspection becomes difficult. There is an increasing demand for automated mounting part inspection methods and their equipment.

According to the above demands, a laser-type mounted component inspection method and its device, and a mounted component inspection method and device in which annular illuminations for emitting light of different wavelengths are stepped and arranged concentrically Etc. have been put into practical use, but none of them have yet to meet the demands of high-precision, high-speed, high-reliability and low-cost production sites.

Of these, the mounted component inspection method and apparatus using the color image processing technique are the most promising candidates for satisfying the requirements of the above-mentioned production site, but there are still problems to be improved. .

The following is a conventional example of a mounting component inspection method and apparatus using the color image processing technique, for example, Japanese Patent Laid-Open No. Hei 4 (1999) -264.
The mounted component inspection device described in Japanese Patent No. 348052 will be described with reference to FIG.

In FIG. 11, when the presence or absence of the chip component 2 is inspected, the color camera 21 images the inspection target mounting circuit board 1 on which the chip component 2 is mounted, and A / D converts the color video signal. The inspection target mounted circuit board 1
3 primary color image data, and the color conversion unit 22 converts the 3 primary color image data of the inspection target mounting circuit board 1 into
The color extracting unit 23 converts the color into a form that can be easily processed. Color extraction unit 23
Then, only the color components preset for each body color of each type of chip component 2 to be inspected are extracted, and the presence / absence determining unit 24 compares the existing position of each extracted color component with the reference position. The presence / absence of each of the various types of chip components 2 to be inspected is determined.

When inspecting the displacement of the chip component 2,
After determining the presence or absence of the inspection target chip component 2 as described above, the edge position detection unit 25 detects the edge position of the electrode portion of the inspection target chip component 2 from the brightness image data and calculates the mounting deviation amount. The unit 26 compares the detected edge position with a reference position to calculate the mounting deviation amount of the inspection target chip component 2, and the determination unit 27 determines the calculated inspection target chip component 2 of the inspection target chip component 2. The mounting deviation amount is compared with a preset mounting deviation amount allowable value to determine whether the mounting deviation amount is good or bad, and the inspection result display unit 28 displays the inspection result.

[0008]

However, in the configuration of the above conventional example, when the presence / absence detection of a part is determined by color extraction,
When the body color of each chip part to be inspected on the mounted circuit board increases, the number of color extraction parameters for extracting a predetermined color increases, and the operation is complicated and difficult for general workers to use. There is a problem that becomes.

In particular, when the body color of the chip component to be inspected is green, which is the same color as the color of the circuit board, the green portion of the circuit board is extracted together with the body portion of the component, so that the presence / absence determination cannot be performed. There is a point.

Further, when the presence / absence detection of the component is judged by the edge detection, the distribution of the luminance level change amount of the electrode part of the chip component after the reflow and the luminance distribution show that only the solder is welded without mounting the chip component. Since the distribution of the brightness level change of the land part and the distribution of the brightness are similar, if the color of the chip component and the color of the circuit board are the same, only the electrode part and the solder are welded. There is a problem in that the land portion cannot be discriminated by the edge detection, and it is practically impossible to detect the presence or absence of the component.

Further, in the case where the displacement of the component is judged by the edge detection, in the displacement inspection of the chip component after the reflow, the brightness level and the mounting of the printed wiring pattern around the mounting component are affected by the influence of oxidation in the reflow furnace. There is a problem that the brightness level of the electrode part of the component is similar, and the printed wiring pattern is erroneously recognized as an electrode, which causes an erroneous determination of misalignment.

Further, in the inspection of the displacement of the chip component after the reflow, the luminance level of the solder fixed on the land and the luminance of the electrode portion of the component are detected even though the mounting position of the electrode-equipped chip component is largely displaced. Since the levels are close to each other, there is a problem that the solder is erroneously recognized as an electrode of a component, and an erroneous determination that the component is normally mounted is caused.

Further, when performing the front-back reversal inspection of the electrode-equipped chip component, the body color of the back surface of the electrode-equipped chip component is white. Therefore, the brightness level of the electrode portion on the back surface of the chip component to be inspected and the back surface The brightness level of the body color becomes almost the same, and even in the color extraction, the electrode part of the component and the body color of the back surface are simultaneously extracted, which makes it virtually impossible to determine the front and back sides. .

The present invention solves the above-mentioned problems, and uses a color image processing technique to inspect mounted parts capable of highly accurate, high-speed, highly reliable and low-cost component presence / absence determination, position displacement determination, front / back determination. It is an object to provide a method and an apparatus therefor.

[0015]

According to a first aspect of the present invention, there is provided a mounted component inspection method, wherein a mounting target circuit board to be inspected is color imaged, and a color video signal thereof is A / D converted to obtain three primary colors of the mounting target circuit board to be inspected. As the color image data, the flux color extraction area for extracting the flux color from the three primary color image data is set to the area including the flux portions flowing out to the both sides of the central portion between the electrodes of the regularly mounted component, and the color is set. Extraction means extracts pixels having a color component of the flux color from within the flux color extraction area, and a recognition determination unit counts the number of extracted pixels, and detects the absence of a component from the excessive number of counted pixels. It is characterized by doing.

In the mounting component inspection method of the second invention of the present application, the mounting target circuit board to be inspected is color imaged, and the color video signal is A / D converted into the three primary color image data of the mounting target circuit board to be inspected. The electrode color extraction areas for extracting the electrode colors from the three primary color image data are located on both sides of the regularly mounted parts in the direction between the electrodes, and a little away from both sides and parallel to these sides. In the area including, the color extraction means extracts the pixel having the color component of the electrode color from the electrode color extraction area, the recognition determination unit counts the number of extracted pixels, and the counted number of pixels The feature is that the deviation of the parts is determined from the excess of.

In the mounting component inspection method of the third invention of the present application, the mounting target circuit board to be inspected is color imaged, and the color video signal is A / D converted into the three primary color image data of the mounting target circuit board to be inspected. The back color extraction area for extracting the back color of the component from the three primary color image data is set to an area including the central portion between the electrodes of the properly mounted component, and the color extraction means selects from the back color extraction area. A pixel having a color component of the back color of the component is extracted, the recognition determination unit counts the number of extracted pixels, and detects the inversion of the component from the front side based on the excessive number of the counted pixels. .

The mounted component inspection apparatus according to the fourth aspect of the present invention comprises a color image pickup means for picking up a color image of the mounting target circuit board to be inspected, and A / D conversion of the color video signal from the color image signal, and the three primary colors of the mounting circuit board to be inspected. A flux color extraction area for extracting a flux color from the three primary color image data is an area including a color image processing section for image data and a flux section flowing out on both sides of a central portion between electrodes of a properly mounted component. Flux color extraction area storage means for storing a command to specify, a color extraction means for extracting pixels having a color component of a flux color from within the flux color extraction area, and the number of extracted pixels is counted and counted. And a recognition determination unit that detects the absence of a component from the excessive number of pixels.

The mounted component inspection apparatus according to the fifth aspect of the present invention comprises a color image pickup means for picking up a color image of the mounting target circuit board to be inspected, and A / D conversion of the color video signal of the color image signal, and the three primary colors of the mounting circuit board to be inspected. The color image processing unit for image data and the areas on both sides in the inter-electrode direction of the normally mounted component, which are a little away from the both sides and include a part parallel to the both sides, are the three primary colors. Electrode color extraction area storage means for storing a command for designating an electrode color extraction area for extracting an electrode color from color image data, and color extraction means for extracting a pixel having a color component of the electrode color from within the electrode color extraction area. And a recognition determination unit that counts the number of extracted pixels and determines the deviation of the component from the excessive number of counted pixels.

The mounted component inspection apparatus according to the sixth aspect of the present invention is a color image pickup means for picking up a color image of a mounting target circuit board to be inspected, and A / D conversion of the color video signal from the color image signal, and the three primary colors of the mounting circuit board to be inspected. A command for designating a color image processing unit as image data and an area including the central portion between the electrodes of the component mounted properly as a back color extraction area for extracting the back color of the component from the three primary color image data is issued. Back color extraction area storage means for storing, color extraction means for extracting pixels having a color component of the back color of the component from the back color extraction area, counting the number of extracted pixels, and counting pixels It is characterized by having a recognition determination unit that detects the reverse of the front and back of the component from the excessive number.

[0021]

The mounting component inspection method and apparatus according to the first and fourth inventions of the present application provide two lands to which the electrodes of the component are soldered when the component is not mounted on the mounting target circuit board to be inspected. The flux around the solder applied above is separated from each other, and there is no flux part in the separated middle part, and when parts are mounted, the solder surroundings on two lands Flux in
It uses the bleeding around the parts,
Color images of the mounting target circuit board to be inspected after reflow are taken, and the color video signals are A / D converted into three primary color image data of the mounting circuit board to be inspected. Then, flux colors are extracted from the three primary color image data. The flux color extraction area to be extracted is set to an area including the flux portion flowing out to both sides of the central portion between the electrodes of the regularly mounted component, and the color extraction means selects the flux color from the inside of the flux color extraction area. A pixel having a color component is extracted, the recognition determination unit counts the number of extracted pixels, and detects the absence of a component from the number of counted pixels being too small.

The mounted component inspection method and apparatus according to the second and fifth inventions of the present invention are arranged on both sides in the inter-electrode direction of a component which is normally mounted when the component is misaligned on the mounted circuit board to be inspected. Yes, it uses the fact that the electrode part of the component is protruding in an area that is slightly away from both sides and that is parallel to both sides. After the video signal is A / D converted into the three-primary-color image data of the mounting target circuit board to be inspected, the electrode-color extraction area for extracting the electrode color from the three-primary-color image data is provided in the regularly mounted component. It is located on both sides in the direction between the electrodes, and is set to an area that is slightly apart from both sides and that includes parallel portions on both sides, and the color extraction means selects the color component of the electrode color from within the electrode color extraction area. Extract pixels with Identification determination unit determines a deviation of part of the extracted number of pixels of the counting, the counted excessive number of pixels.

In the mounting component inspection method and the apparatus thereof according to the third and sixth inventions of the present application, in the mounting target circuit board to be inspected, when the components are turned upside down, the central portion between the electrodes of the properly mounted components is The area to be included utilizes the color of the back of the component, that is, the white color. The color image of the mounting target circuit board to be inspected is picked up, and the color video signal is A / D converted to obtain the mounting circuit to be inspected. After the three primary color image data of the board is set, a back color extraction area for extracting the back color of the component from the three primary color image data is set to an area including the central portion between the electrodes of the normally mounted component, The color extraction means extracts pixels having a color component of the back color of the component from the back color extraction area, the recognition determination unit counts the number of extracted pixels, and the number of counted pixels is excessive. Detects front / back inversion of parts.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First to fourth embodiments of a mounting component inspecting apparatus using the mounting component inspecting method of the present invention will be described with reference to FIGS.

FIG. 1 is a block diagram showing the arrangement of a mounted component inspection apparatus commonly used in the first to fourth embodiments.

In FIG. 1, an inspection target mounting circuit board 1 on which a chip component 2 is mounted is placed on an XY table whose operation is controlled by an XY table controller, and a color CC is mounted.
The D camera 4 picks up an image of the inspection target mounting circuit board 1 on which the chip component 2 is mounted, and A / D converts the color video signal to obtain the three primary color image data of the inspection target mounting circuit board 1.

Color coordinate conversion means 9 of the color image processing section 8
Converts the three primary color image data of the mounting circuit board 1 to be inspected so that the designated extraction designated color can be easily extracted.

In the storage section 7, for each of the designated extraction designated colors, color extraction area storage means 7a, 7b, 7c. .., and the following color extraction means 10
Specify the color extraction area in.

The color extraction means 10 of the color image processing unit 8 extracts only the color component of the extraction designated color from the designated color extraction area and binarizes it based on a preset color extraction threshold. .

The recognition determination unit 5 counts the number of pixels of the binary image, and makes various determinations depending on the number of counted pixels.

Next, a first embodiment of the present invention for determining the presence / absence of parts after reflow will be described with reference to FIGS.

FIG. 3 shows the setting of the flux color extraction area 30 of this embodiment.

In FIGS. 1 and 3, based on the mounting information stored in the flux color extraction area storage unit 7a of the storage unit 7, the control unit 6 controls the three primary color image data of the mounting circuit board 1 to be inspected. In addition, an inspection area 20 for inspecting the mounting state of each component and a flux color extraction area 30 for extracting the flux color are set. The left side of FIG. 3 shows the solder 23, 23 on the land and the flux portions 22b, 22b around the solder when the component 2 is not mounted, and the right side thereof is the component 2 when the component 2 is mounted. 2 shows the electrode portions 21 and 21 of the component 2 and the flux portion 22a around the component that oozes around the component 2. As is clear from FIG.
The shape of the flux part depends on the presence or absence of the component 2,
When the component 2 is not mounted, the flux portions 22b, 22b around the solder are separated, and there is no flux portion between them. When the component 2 is mounted,
Flux parts 22b, 22b around the solder around the component 2
It oozes out and is connected. Flux color extraction area 3
0 is an area for extracting the flux color, and is an area including both sides of the central portion between the electrodes of the component which is normally mounted in order to determine the presence or absence of the component 2. In this area, the flux oozes out when the component 2 is mounted, and the flux does not exist when the component 2 is not mounted.

Next, the operation of this embodiment will be described with reference to FIG.

In step # 1 of FIG. 2, the inspection area 20 is set.

In step # 2, the flux color extraction area 30 is set.

In step # 3, the flux color is extracted in the flux color extraction area 30 and binarized based on a preset color extraction threshold value.

In step # 4, the number of binarized flux color extraction pixels is counted.

In step # 5, it is determined that there is a component if the counted number of the flux color extraction pixels is within the preset range of the number of pixels, and if there is no match, it is determined that there is no component.

Next, a second embodiment of the present invention for determining a component deviation after reflow will be described with reference to FIGS. 1, 4 and 5.

FIG. 5 shows the electrode color extraction area 40 of this embodiment.
Indicates the setting of.

In FIGS. 1 and 5, based on the mounting information stored in the electrode color extraction area storage unit 7b of the storage unit 7, the control unit 6 controls the three primary color image data of the mounting circuit board 2 to be inspected. In addition, an inspection area 20 for inspecting the mounting state of each component and an electrode color extraction area 40 for extracting the electrode color are set. The left side of FIG. 5 shows the misaligned component 2 and the electrode 2 of the component 2 when the component 2 is mounted with displacement.
1 and 21, the solders 23 and 23 on the land and the flux portions 22b and 22b around the solder, and the right part is the component 2 and the electrode portions 21 and 21 of the component 2 and the component 2 when the component 2 is mounted. Flux part 22a around the parts exuding around the
And indicates. As is clear from FIG. 5, when the component 2 is displaced, the electrode portions 21, 21 of the component 2 are projected to both sides of the position of the component 2 when the component 2 is properly mounted. The electrode color extraction area 40 is an area for extracting a color corresponding to the electrode portion 21. The electrode color extraction area 40 is located on both sides in the inter-electrode direction of a component that is normally mounted in order to determine the displacement of the component 2. The area is set a little away and includes parallel parts on both sides. In the electrode color extraction area 40, the electrode portion 21 does not exist when the component 2 is properly mounted, and the electrode portion 21 exists when the component 2 is mounted with a shift.

Next, the operation of this embodiment will be described with reference to FIG.

In step # 6 of FIG. 4, the inspection area 20 is set.

In step # 7, the electrode color extraction area 40 is set.

In step # 8, the electrode color is extracted in the electrode color extraction area 40 and binarized based on a preset color extraction threshold value.

In step # 9, the number of binarized electrode color extraction pixels is counted.

In step # 10, if the number of counted electrode color extraction pixels is equal to or larger than the preset number of pixels, it is determined that there is a deviation, and if it is less than that, it is determined that there is no deviation.

Next, a third embodiment of the present invention for determining the presence / absence of parts and the deviation of parts after reflow will be described with reference to FIGS. 1 and 6 to 8.

FIG. 7 shows the settings of the flux color extraction area 30 and the electrode color extraction area 40 of this embodiment.

In FIGS. 1 and 7, the control unit 6 is based on the mounting information stored in the flux color extraction area storage unit 7a and the electrode color extraction area storage unit 7b of the storage unit 7.
In the three primary color image data of the circuit board 2 to be inspected, an inspection area 20 for inspecting the mounting state of each component, a flux color extraction area 30 for extracting a flux color, and an electrode color extraction area 40 for extracting an electrode color are included. And.
On the left side of FIG. 7, when the component 2 is mounted while being displaced, the component 2 and the electrodes 21, 21 of the component 2, the solder 23, 23 on the land, and the flux portion 22 around the solder are displaced.
b and 22b and flux bleeding flux portions 22c and 22c where the flux oozes out, and the right portion bleeds around the component 2 and the electrode portions 21 and 21 of the component 2 and the component 2 when the component 2 is mounted. Flux part 22a around parts
And indicates. As is clear from FIG. 7, when the component 2 is displaced, the electrode portions 21, 21 of the component 2 protrude to both sides of the position of the component 2 when it is properly mounted, and when the component 2 is properly mounted, The electrodes 21 and 21 are present at positions where they are not present. The electrode color extraction area 40 is an area for extracting a color corresponding to the electrode portion 21, and is located on both sides in the inter-electrode direction of a component mounted in order to determine the displacement of the component 2,
The area is set a little away from both sides and includes an area parallel to both sides.

The flux color extraction area 30 is an area for extracting the flux color, and is an area including both side portions of the central portion between the electrodes of the component mounted in order to determine the presence or absence of the component 2. . The left side shows the case where the component 2 is mounted with a shift, and the flux has a bleeding flux portion 22 that oozes out on both sides of the component 2.
Since there are c and 22c, the flux parts 22c and 22c are detected from the inside of the flux color extraction area 30 even if the component 2 is mounted while being displaced.

Next, the operation of this embodiment will be described with reference to FIG.

In step # 11 of FIG. 6, the inspection area 20 is set.

In step # 12, the flux color extraction area 30 is set.

In step # 13, the electrode color extraction area 40 is set.

In step # 14, the flux color is extracted in the flux color extraction area 30 and binarized based on the preset color extraction threshold value 1.

In step # 15, the electrode color is extracted in the electrode color extraction area 40 and binarized based on the preset color extraction threshold value 2.

In step # 16, the number of binarized flux color extraction pixels is counted.

In step # 17, if the number of the counted flux color extraction pixels is the number of pixels in the preset pixel number range, it is determined that there is a component, and the process proceeds to step # 18. Determined as none.

In step # 18, the number of binarized electrode color extraction pixels is counted.

In step # 19, it is determined that there is a deviation in the number of counted electrode color extraction pixels when there is a number of pixels in a preset pixel number range, and it is determined that there is no deviation.

In the above case, two kinds of binary images are obtained at the same time, and two kinds of binary images are processed at the same time. This process is shown in FIG. FIG. 8 is one byte composed of 8 bits, and the presence / absence of one type of binary image is allocated by 1 and 0 for each bit position of 8 bits. For example, as shown in FIG. 8, the presence or absence of a pixel of a binary image in which the flux is extracted at the 5th bit is assigned 1 or 0. The presence or absence of the pixel of the binary image in which the electrode is extracted in the 6th bit is assigned by 1 and 0. As a result, eight kinds of binary images can be processed at the same time. In the present embodiment, the color extracting means 10 can also extract eight types of colors at the same time.

Next, a fourth embodiment of the present invention for determining whether the chip parts with electrodes are turned upside down after reflow will be described with reference to FIGS. 1, 9 and 10.

FIG. 10 shows the back color extraction area 50 of this embodiment.
Indicates the setting of.

1 and 10, based on the mounting information stored in the back color extraction area storage means 7c of the storage unit 7, the control unit 6 controls the three primary color image data of the inspection target mounting circuit board 2 to be used. In addition, an inspection area 20 for inspecting the mounting state of each component and a back color extraction area 50 for extracting the back color are set. The left side of FIG. 10 shows the back color part 51 of the front / back inverted component 2a and the electrodes 21a, 21a on the back side of the component 2 in which the component 2 is mounted by flipping the component 2 upside down, and the right side shows that the component 2 is properly mounted. In the case of the component 2, the electrode parts 21 and 21 of the component 2
And the body color portion 52 of the component 2. As is clear from FIG. 10, when the component 2 is turned upside down, the central portion of the component 2a is the back color portion, and the central portion of the properly mounted component 2 is the body color portion 52. Therefore, the back color extraction area 5
0 is an area for extracting the color of the back surface of the component 2, that is, white, and is set in the central portion of the component 2.

Next, the operation of this embodiment will be described with reference to FIG.

In step # 20 of FIG. 9, the inspection area 20 is set.

In step # 21, the back color extraction area 50 is set.

In step # 22, the white component color is extracted in the back color extraction area 50 and binarized based on a preset color extraction threshold value.

In step # 23, the number of binarized white extracted pixels is counted.

In step # 24, if the number of counted white extracted pixels is equal to or more than the preset number of pixels, it is determined that the front and back are reversed, and if it is less than that, it is determined that it is normal.

[0073]

According to the mounting component inspection method and apparatus of the first and fourth inventions of the present application, the flux color extraction area for extracting the flux color from the three primary color image data is provided in the central portion between the electrodes of the components which are normally mounted. By setting the area including the flux flowing out on both sides of the board, the color image processing technology can be used to determine the presence / absence of parts on the mounting circuit board, regardless of the body color of the chip parts. It has an effect that inspection can be performed with reliability and low cost.

In the mounting component inspection method and the apparatus thereof according to the second and fifth inventions of the present application, the electrode color extraction areas for extracting the electrode colors from the three primary color image data are provided on both sides in the inter-electrode direction of the components which are normally mounted. The color image processing technology is used to determine the presence or absence of component mounting misalignment by setting the area slightly apart from both sides and including parallel parts on both sides. Irrespective of the above, there is an effect that inspection can be performed with high accuracy, high speed, high reliability, and low cost.

In the mounting component inspection method and the apparatus thereof according to the third and sixth inventions of the present application, the back color extraction area for extracting the back color of the component from the three primary color image data is provided at the center between the electrodes of the components which are normally mounted. By setting the area including the parts, it is possible to use the color image processing technology to determine whether or not the parts are mounted upside down with high accuracy, high speed, high reliability, and low cost regardless of the color of the backside of the chip part. It has the effect of being able to inspect.

[Brief description of drawings]

FIG. 1 is a block diagram showing a configuration common to first to fourth embodiments of a mounted component inspection device using a mounted component inspection method of the present invention.

FIG. 2 is a flowchart showing a first embodiment of the mounted component inspection method of the present invention.

FIG. 3 is a diagram showing a flux color extraction area used in the first embodiment of the mounting component inspection method of the present invention.

FIG. 4 is a flowchart showing a second embodiment of the mounted component inspection method of the present invention.

FIG. 5 is a diagram showing an electrode color extraction area used in a second embodiment of the mounted component inspection method of the present invention.

FIG. 6 is a flowchart showing a third embodiment of the mounted component inspection method of the present invention.

FIG. 7 is a diagram showing a flux color extraction area and an electrode color extraction area used in a third embodiment of the mounted component inspection method of the present invention.

FIG. 8 is a diagram showing bit allocation of a binary image used in the third embodiment of the mounted component inspection method of the present invention.

FIG. 9 is a flowchart showing a fourth embodiment of the mounted component inspection method of the present invention.

FIG. 10 is a diagram showing a back color extraction area used in a fourth embodiment of the mounting component inspection method of the present invention.

FIG. 11 is a block diagram showing a configuration of a conventional example of a mounted component inspection device.

[Explanation of symbols]

1 circuit board 2 parts 2a Reversed parts 4 color CCD camera 5 Recognition judgment section 6 control unit 7 storage means 7a Flux color extraction area storage means 7b Electrode color extraction area storage means 7c Back color extraction area storage means 8 Color image processing unit 9-color coordinate conversion means 10 color extraction means 20 inspection areas 21 Electrode part 22a Flux part around parts 22b Flux part around solder 22c Bleeding flux part 23 Solder on land 30 Flux color extraction area 40 electrode color extraction area 50 Back color extraction area

─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Kazuhiro Wang, 1006 Kadoma, Kadoma City, Osaka Prefecture, Matsushita Electric Industrial Co., Ltd. (56) Reference JP-A-2-41578 (JP, A) JP-A-6 -45799 (JP, A) JP-A-2-138804 (JP, A) JP-A-2-21208 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H05K 13/08 H05K 13/04

Claims (6)

(57) [Claims] 1. A color image of a mounting circuit board to be inspected is picked up,
The color video signal is A / D converted into three primary color image data of the mounting circuit board to be inspected, and a flux color extraction area for extracting a flux color from the three primary color image data is provided for a normally mounted component. Set it in the area including the flux that has flowed out to both sides of the central part between the electrodes,
The color extraction means extracts pixels having a color component of the flux color from within the flux color extraction area, and the recognition determination unit counts the number of extracted pixels, and determines that there is no part from the excessive number of counted pixels. A method for inspecting mounted parts, which is characterized by detecting. 2. A color image of a mounting circuit board to be inspected is picked up,
The color video signal is A / D converted into the three primary color image data of the inspection target mounted circuit board, and the electrode color extraction area for extracting the electrode color from the three primary color image data is provided for the normally mounted component. Located on both sides in the direction between the electrodes,
The color extraction means extracts a pixel having a color component of the electrode color from the electrode color extraction area by setting the area slightly apart from the both sides and including a portion parallel to the both sides, and the recognition determination is performed. A mounting component inspection method, wherein the unit counts the number of extracted pixels, and determines a component deviation from the excessive number of counted pixels. 3. A color image of the mounting circuit board to be inspected is picked up,
The color video signal is A / D converted into the three primary color image data of the mounting circuit board to be inspected, and the back color extraction area for extracting the back color of the component from the three primary color image data is normally mounted. Set in an area including the central part between the electrodes of the component, the color extraction means extracts pixels having a color component of the color of the back side of the component from the back color extraction area, and the recognition determination unit performs the extraction. A method for inspecting a mounted component, which comprises counting the number of pixels and detecting whether the component is turned upside down from the excessive number of counted pixels. 4. A color image pickup means for picking up a color image of a mounting target circuit board to be inspected, and a color image processing section for A / D converting the color video signal into three primary color image data of the mounting circuit board to be inspected. , A flux color that stores a command to specify an area including a flux portion that flows out on both sides of the central portion between the electrodes of a normally mounted component as a flux color extraction area that extracts a flux color from the three primary color image data Extraction area storage means, color extraction means for extracting pixels having a color component of a flux color from within the flux color extraction area, and the number of extracted pixels is counted. A mounted component inspection device, comprising: a recognition determination unit for detecting. 5. A color image pickup means for picking up a color image of a mounting target circuit board to be inspected, and a color image processing section for A / D converting the color video signal into three primary color image data of the mounting target circuit board to be inspected. , Electrode areas are extracted from the three primary color image data in areas that are on both sides in the inter-electrode direction of the regularly mounted component, and are slightly apart from the both sides and that include a part parallel to the both sides. Electrode color extraction area storage means for storing a command to specify in the electrode color extraction area, color extraction means for extracting pixels having a color component of the electrode color from within the electrode color extraction area, and counting the number of extracted pixels Then, the mounted component inspection device is provided with a recognition determination unit that determines a displacement of the component based on an excessive number of counted pixels. 6. A color image pickup means for picking up a color image of a mounting target circuit board to be inspected, and a color image processing section for A / D converting the color video signal into three primary color image data of the mounting circuit board to be inspected. A back color extraction area storage means for storing a command for designating an area including a central portion between the electrodes of the component which is normally mounted as a back color extraction area for extracting the back color of the component from the three primary color image data. A color extracting means for extracting pixels having a color component of the back color of the component from the inside of the back color extraction area, counting the number of extracted pixels, and reversing the front and back of the component from the excessive number of counted pixels. A mounted component inspection device, comprising: a recognition determination unit for detecting.