KR101133968B1 - Method for detecting a bridge connecting failure - Google Patents

Abstract

Disclosed is a bridge connection failure detection method for detecting a bridge disposed between terminals of a driving element mounted on a bare substrate and shorting terminals to each other. The bridge connection failure detection method includes: obtaining three-dimensional image data by measuring a three-dimensional shape of a driving element through a three-dimensional shape measurement device; setting at least one inspection area by checking the shape of the driving element; And analyzing the height information in the inspection area to determine whether or not the bridge exists. As described above, the accuracy of detection of bridge connection failure can be improved by checking whether there is a bridge between the terminals using the three-dimensional image data including the height information according to the position.

Terminal of device, bad connection of bridge, inspection area

Description

METHOD FOR DETECTING A BRIDGE CONNECTING FAILURE [0002]

The present invention relates to a bridge connection failure detection method, and more particularly, to a bridge connection failure detection method capable of detecting a bridge connection failure occurring between terminals of a device.

Generally, a driving element mounted on a bare board is composed of a body having a driving circuit and a plurality of terminals protruding from a side surface of the body. Here, the terminals of the driving element are electrically connected to the driving circuit in the body, and electrically connected to pads of the bare board by solder portions. That is, the driving element is disposed on the bare board, and then electrically connects each of the terminals to the pads by soldering.

However, when each of the terminals is electrically connected to the pads by the solder portions, solder material may be formed between the terminals. At this time, the solder material formed between the terminals may electrically connect the terminals to be separated from each other to cause a shorting failure between the terminals. Hereinafter, the solder material formed between the terminals is referred to as a bridge, and the shorting failure generated between the terminals is referred to as a bridge connecting failure.

Therefore, after the driving element is mounted on the bare board, it is necessary to check whether or not the bridge connection failure has occurred between the terminals. On the other hand, a two-dimensional shape of the driving element mounted on the bare substrate was measured as a method capable of detecting a conventional bridge connection failure. That is, a photograph of the driving device was photographed and the photograph was analyzed to check whether the bridge connection failure occurred. However, the two-dimensional analysis method has a limitation in accurately detecting the bridge connection failure.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a bridge connection failure detection method capable of improving the detection accuracy of a bridge connection failure occurring between terminals of a driving device .

A bridge connection failure detection method according to an exemplary embodiment of the present invention relates to a detection method for detecting a bridge disposed between terminals of a drive element mounted on a bare board and shorting the terminals to each other .

The bridge connection failure detection method includes the steps of measuring three-dimensional shape of the driving element through a three-dimensional shape measurement device and obtaining three-dimensional image data including height information according to the position (hereinafter referred to as three-dimensional shape measurement step (Hereinafter, referred to as inspection area setting step) for checking the shape of the driving element from the three-dimensional image data and detecting at least one bridge connection failure, (Hereinafter, referred to as a bridge determination primary determination step) by analyzing the height information and determining whether or not there is a bridge that short-circuits the terminals within the inspection area.

Wherein the inspection region setting step comprises the steps of: identifying the body of the driving element from the three-dimensional image data; identifying terminals of the driving element protruding from the body from the three-dimensional image data; In a region between the first and second regions.

Determining whether or not an object exists in the inspection area is equal to or greater than a threshold height; and determining the object as the bridge when the height of the object is less than the threshold height, I can not. Here, the threshold height may have a value between 10% and 40% of the maximum height at the terminals of the driving device.

If the inspection area includes a part of the body of the driving element, the part of the body may be excluded from the determination of the bridge.

Meanwhile, the bridge connection failure detection method may include a step of checking the visibility of the object when the object determined to be the bridge is present in the inspection area, (Hereinafter, also referred to as a step of determining whether the object is a bridge or not), and secondarily determining whether the object is the bridge using the visibility in the object .

In the bridge visibility checking step, the visibility of the object can be confirmed by using the measurement data of the object included in the three-dimensional image data.

The visibility of the object is judged as the bridge when the visibility of the object is higher than the reference value as a result of checking the visibility of the object at the secondary determination whether or not the bridge is based on the visibility, , It may not be determined that the object is the bridge.

The bridge connection failure detection method may further include a step of checking the color of the object when the object determined to be the bridge is present in the inspection area as a result of the first determination as to whether or not the object is the bridge , And secondarily determining whether the object is the bridge using the color of the object (hereinafter, referred to as a second determining whether the object is a bridge by color).

The bridge color checking step may include obtaining two-dimensional color image data of the driving element, and checking the color of the object using the two-dimensional color image data.

Determining whether the color of the object is substantially the same as the color of the solder portions formed on the terminals when the color of the object is substantially identical to the color of the object in the bridge determination based on the color, And may not determine the object as the bridge if the color of the object is not substantially the same as the color of the solder portions.

The bridge connection failure detection method may further include a step of checking height information of the surface of the bare board in the object when an object determined to be the bridge is present in the inspection area as a result of the first determination whether the bridge exists (Hereinafter referred to as the step of checking the surface of the substrate), and secondarily determining whether the object is the bridge in consideration of the surface height information of the bare substrate . The bridge connection failure detection method may further include the step of measuring the surface of the bare substrate through the three-dimensional shape measurement device and obtaining the surface height information of the bare substrate before the three-dimensional shape measurement step have.

In the secondary determining whether or not the bridge is caused by the surface height, it is possible to determine whether the object is the bridge by using the actual height of the object in a state where the surface height of the bare substrate is removed from the height of the object.

According to the bridge connection failure detection method of the present invention, by detecting whether or not a bridge connection failure has occurred between terminals using the three-dimensional image data including the height information in the inspection area, It is possible to further improve the detection accuracy of the sensor.

The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

The terms first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms " comprising " or " having ", and the like, are intended to specify the presence of stated features, integers, steps, operations, elements, parts, or combinations thereof, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, parts, or combinations thereof.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the meaning in the context of the relevant art and are to be interpreted as ideal or overly formal in meaning unless explicitly defined in the present application Do not.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

≪ Example 1 >

1 is a flowchart showing a bridge connection failure detection method according to a first embodiment of the present invention.

Referring to FIG. 1, the bridge connection failure detection method according to the present embodiment is directed to a detection method which is disposed between terminals of a driving element and can accurately detect whether or not there is a bridge that short- will be.

Before explaining the bridge connection failure detection method in detail, the driving element mounted on the bare board and the three-dimensional shape measurement apparatus used in the bridge connection failure detection method will be described.

FIG. 2 is a perspective view showing a state in which a driving device is mounted on a bare substrate, FIG. 3 is a plan view showing a driving device of FIG. 2 viewed from above, 5 is a cross-sectional view taken along the line I-I 'of Fig. 4. Fig.

2 to 5, the driving device 20 is disposed on the bare board 10 and is electrically connected to the bare board 10, so that the driving device 20 An embedded printed circuit board may be formed.

The bare board 10 is a printed circuit board in a state before the drive element 20 is mounted and includes a base board 12, a plurality of wirings (not shown), a plurality of pads 14, a solder resist layer 16, and the like. The wires and the pads 14 are formed on the base substrate 12 and are electrically connected to each other and the solder resist layer 16 covers the wires and exposes the pads 16. [ And may be formed on the base substrate 12.

The driving element 20 includes a body 22 disposed on the bare substrate 10 and a plurality of terminals 24 connected to the body 22. The body 22 includes a plurality of terminals 24, The body 22 includes a drive circuit therein and the terminals 24 are electrically connected to the drive circuit in the body 22 and protrude from the body 22 to form the pads 16 . The terminals 24 are preferably protruded from the sides of the body 22, for example, two opposing sides, wherein the side of the body 22 is inclined relative to the base substrate 12 Or may be stepped.

The terminals 24 may be electrically connected to the pads 16 by solder portions 30 formed to cover each of the terminals 24. Here, when the solder portions 30 are formed on the terminals 24, a solder material 32 made of the same material as the solder portions 30 is formed between the terminals 24 as shown in FIG. More than one may be formed. The solder material 32 is a conductive material that electrically connects the terminals 24 to each other to cause a shorting failure and will be referred to as a bridge 32 hereinafter. In addition, a shorting fault caused by the bridge 32 will be referred to as a bridge connecting failure.

The bridge connection failure detection method according to the present embodiment is directed to an inspection method for detecting the bridge 32 that may exist between the terminals 24, and in order to check whether the bridge 32 exists, A plurality of inspection regions ROI should be set between the plurality of inspection regions 24. For example, if the terminals 24 are protruded from each of the two sides of the body 22 by five, eight inspection regions ROI may be set between the terminals 24. Here, it is preferable that a portion of the body 22 is not included in the inspection regions ROI, but it may be set to include a portion of the body 22 as shown in FIG. 3 or 4 .

On the other hand, a separate silk line SL may be further formed on the bare substrate 10. The silk line SL may be disposed at a lower portion of the terminals 24 and may be disposed in a part of the inspection regions ROI.

6 is a diagram conceptually showing a three-dimensional shape measuring device capable of measuring the three-dimensional shape of the driving element of FIG.

Referring to FIG. 6, the three-dimensional shape measuring apparatus used in the bridge connection failure detection method includes a measurement stage unit 100, an image capturing unit 200, first and second illumination units 300 and 400, Unit 500, a module control unit 600, and a central control unit 700. [

The measurement stage unit 100 may include a stage 110 for supporting the bare substrate 10 on which the driving device 20 is mounted and a stage transfer unit 120 for transferring the stage 110 . In this embodiment, as the bare substrate 10 is moved relative to the image pickup unit 200 and the first and second illumination units 300 and 400 by the stage 110, The measurement position on the substrate 10 can be changed.

The image capturing unit 200 is disposed on the stage 110 and receives light reflected from the driving device 20 to measure an image of the driving device 20. That is, the image capturing unit 200 receives the light emitted from the first and second illumination units 300 and 400 and reflected by the driving device 20, and transmits the three-dimensional image of the driving device 20 .

The image capturing unit 200 may include a camera 210, an image forming lens 220, a filter 230, and a circular lamp 240. The camera 210 receives the light reflected from the driving device 20 and captures an image of the driving device 20. For example, any one of a CCD camera and a CMOS camera may be used. The image forming lens 220 is disposed under the camera 210 to image the light reflected from the driving device 20 in the camera 210. The filter 230 is disposed at a lower portion of the image forming lens 220 to filter the light reflected from the measurement object 10 and provide the image to the image forming lens 220. For example, And an intensity adjustment filter. The circular lamp 240 may be disposed under the filter 230 to provide light to the driving device 20 to capture a specific image such as a two-dimensional shape of the driving device 20.

The first illumination unit 300 may be disposed at an angle to the stage 110 on the right side of the image capturing unit 200. The first illumination unit 300 may include a first illumination unit 310, a first grating unit 320, a first grating transfer unit 330, and a first condenser lens 340. The first illumination unit 310 is composed of an illumination source and at least one lens to generate light. The first grating unit 320 is disposed below the first illuminating unit 310 and changes the light generated in the first illuminating unit 310 into a first grating pattern light having a lattice pattern. The first grating transfer unit 330 is connected to the first grating unit 320 and transfers the first grating unit 320. For example, the first grating transfer unit 330 may be a PZT (Piezoelectric) transfer unit or a fine linear transfer unit . The first condensing lens 340 is disposed below the first grating unit 320 and condenses the first grating pattern light emitted from the first grating unit 320 to the driving device 20.

The second illuminating unit 400 may be disposed at an angle to the stager 110 on the left side of the image capturing unit 200. The second illumination unit 400 may include a second illumination unit 410, a second grating unit 420, a second grating transfer unit 430, and a second condenser lens 440. Here, the second illuminating unit 400 is substantially the same as the first illuminating unit 300 described above, and thus a detailed description thereof will be omitted.

The first illuminating unit 300 illuminates the first grating pattern light with the driving device 20 while the first grating transfer unit 330 sequentially moves the first grating unit 320 N times, The image capturing unit 200 may sequentially receive the N first grid pattern light reflected by the driving device 20 and take N first pattern images. The second illuminating unit 400 may be configured such that the second grating transfer unit 430 sequentially moves the second grating unit 420 N times, The image capturing unit 200 may sequentially receive the N second grid pattern light reflected by the driving device 20 and take N second pattern images. Here, N is a natural number, for example, 3 or 4.

In the present embodiment, only the first and second illumination units 300 and 400 are described as an illumination device for generating the first and second grid-patterned lights, but the number of the illumination units may be three or more . That is, the grid pattern light irradiated to the measurement object 10 is irradiated in various directions, and various types of pattern images can be photographed. For example, when three illumination units are arranged in an equilateral triangle shape around the image capturing unit 200, three grid pattern lights can be applied to the driving elements 20 in different directions, The four grid pattern light beams may be applied to the driving elements 20 in different directions.

The image acquisition unit 500 is electrically connected to the camera 210 of the image capturing unit 200 and acquires and stores the pattern images from the camera 210. For example, the image acquisition unit 500 includes an image system for receiving and storing the N first pattern images and the N second pattern images captured by the camera 210.

The module control unit 600 is electrically connected to the measurement stage unit 100, the image capturing unit 200, the first illuminating unit 300, and the second illuminating unit 400 to control the module. The module control unit 600 includes, for example, a Z-axis controller, a lighting controller, a lattice controller, and a stage controller. The Z axis controller can adjust the focus by moving the image pickup unit 200, the first illumination unit 300, and the second illumination unit 400 in the Z axis direction. The illumination controller controls the first and second illumination units 310 and 410 to generate light, and the lattice controller controls the first and second lattice transfer units 330 and 430, respectively, Thereby moving the first and second grating units 320 and 420. The stage controller may control the stage transfer unit 120 to move the stage 110 in the XY axis direction.

The central control unit 700 is electrically connected to the image acquisition unit 500 and the module control unit 600 to control the respective units. Specifically, the central control unit 700 receives the N first pattern images and the N second pattern images from the image system of the image obtaining unit 500, Three-dimensional image data of the element 20 can be obtained. At this time, the three-dimensional image data includes height information according to a position on the bare substrate 10. [ In addition, the central control unit 700 may control the Z-axis controller, the illumination controller, the lattice controller, and the stage controller of the module control unit 600, respectively. In order to perform the above functions, the central control unit 700 may include an image processing board, a control board, and an interface board, for example.

Hereinafter, a bridge connection failure detection method according to the present embodiment will be described in detail with reference to FIG.

First, the three-dimensional shape of the driving device 20 is measured through the three-dimensional shape measuring device, and the three-dimensional shape data including the height information according to the position is obtained (S100). This process will be hereinafter referred to as a three-dimensional shape measurement step (S100).

After the three-dimensional shape measurement step S100, the shape of the driving device 20 is checked from the three-dimensional image data, and the inspection areas ROI for detecting the bridge connection failure are set S200). This process will be referred to as an inspection area setting step (S200). In the present embodiment, the inspection area setting step S200 may include the following three steps.

First, the body 22 of the driving device 20 is checked from the three-dimensional image data obtained in the three-dimensional shape measuring step S100 (S210). Here, the meaning of confirming the body 22 from the three-dimensional image data means that the position, size, shape and the like of the body 22 are found from the three-dimensional image data.

After confirming the position, size, shape, and the like of the body 22, the terminals 24 of the driving device 20 protruding from the body 22 are checked again from the three-dimensional image data at step S220. Since the terminals 24 are protruded from the side surface of the body 22, the position, size, and shape of the terminals 24 may be determined after the body 22 is first identified.

When the position, size and shape of the terminals 24 are confirmed, finally, the inspection areas ROI for detecting the bridge 32 are set within the area between the terminals 24 (S230). The inspection regions ROI may be formed in a rectangular shape elongated in the protruding direction of the terminals 24 and may be formed in the inspection regions ROI as shown in FIG. 22 may be included.

After completion of the inspection area setting step S200, height information in the inspection areas ROI is analyzed to determine whether the bridge 32 exists in the inspection areas ROI (S300) . This process will be hereinafter referred to as a bridge determination step (S300).

A concrete method of determining whether or not the bridge 32 exists in the bridge determination step S300 is as follows. The height H1 of the arbitrary object is analyzed so that the height of the object is equal to or greater than the critical height, . That is, it is determined that the bridge 32 exists between the terminals 24, and it can be confirmed that the bridge connection failure has occurred. On the other hand, if the height H1 of the object is less than the threshold height, the bridge 32 does not determine the object. That is, it is determined that the bridge 32 does not exist between the terminals 24, so that it can be confirmed that the bridge connection failure does not occur. Here, it is preferable that the position to be a reference in determining the height H1 of the object is the surface of the bare board 10, for example, the surface of the solder resist layer 16. [

The threshold height may have a value between 10% and 40% of the maximum height H2 at the terminals 24 of the driving device 20. [ The maximum height H2 at the terminals 24 means the thickness from the surface of the bare board 10 to the top of the solder portions 30 formed on the terminals 24. [

In the present embodiment, when the inspection regions ROI include a portion of the body 22 of the driving element 20, a part of the body 22 is connected to the bridge (not shown) 32), it can be excluded from the judgment of whether or not the bridge 32 is present.

As described above, according to the present embodiment, the existence of the bridge in the inspection regions ROI is determined using the three-dimensional image data including the height information in the inspection regions ROI, The detection accuracy of the bridge connection failure can be further improved.

≪ Example 2 >

FIG. 7 is a flowchart showing a bridge connection failure detection method according to a second embodiment of the present invention, and FIG. 8 is a cross-sectional view showing a state where a foreign matter is disposed between terminals of the driving element.

Referring to FIG. 7, since the bridge connection failure detection method according to the present embodiment is substantially the same as the bridge connection failure detection method according to the first embodiment from the beginning to the first determination step S300, The detailed description up to the step of determining the difference (S300) will be omitted and will be described later only.

The bridge determination step S300 is performed to primarily determine whether an arbitrary object existing in the inspection area ROI is the bridge 32 or not. If it is determined that the object is the bridge 32, the following steps are further performed.

First, the visibility of the object determined as the bridge 32 is checked in the inspection areas GOI (S400). This process will be hereinafter referred to as a bridge visibility checking step (S400).

The visibility checking method in the bridge visibility checking step ($ 400) may be performed through the three-dimensional image data obtained in the three-dimensional shape measuring step (S100). This is because the three-dimensional image data includes the measurement data on the object, that is, the visibility information on the object.

On the other hand, the value of the visibility in the object is generally determined according to the material of the object, which indicates the angle of incidence of the light, the angle of observation of the light reflected by the object, and the degree of reflection from the object . In this embodiment, since the incident angle and the observation angle are considered to be fixed, the visibility of the object is determined according to the material of the object.

Next, using the visibility of the object identified through the bridge view visibility step ($ 400), the object is secondarily determined as to whether the object is the bridge 32 (S500). Hereinafter, this process will be referred to as a second determination step (S500) as to whether or not the bridge is based on visibility.

If the degree of visibility in the object is higher than the reference value in the secondary determination step S500 of determining whether or not the object is a bridge based on the view, the object is determined as the bridge 32, The bridge 32 may not determine the object if the visibility at the bridge 32 is less than the reference value.

The second determination step (S500) of whether or not the bridge is based on the above view will be described in more detail as follows. When the object is a silver lead capable of reflecting light, the visibility of the object has a relatively high value, so that the object can be determined by the bridge 32 in this embodiment. That is, when the visibility of the object is equal to or greater than the reference value, the object may include a lead component having a relatively high visibility, so that the bridge 32 can determine this.

On the other hand, referring to FIG. 8, when the object existing in the inspection regions ROI is a foreign object 40 that does not reflect light, the visibility of the object has a relatively low value, It can be determined that the object is not the bridge 32. That is, if the visibility of the object is less than the reference value even if the height of the object is higher than the threshold height and the bridge 32 is primarily determined in the bridge determination first step S300, It is possible to determine that the object is not the bridge 32 by reversing the judgment.

As described above, according to the present embodiment, after the bridging primary determining step (S300), the visibility in the object is checked and the secondary determining whether the bridging is performed by the visibility (S500) It is possible to more accurately determine whether the object existing in the ROI is the bridge 32. [

≪ Example 3 >

9 is a flowchart showing a bridge connection failure detection method according to the third embodiment of the present invention.

Referring to FIG. 9, since the bridge connection failure detection method according to the present embodiment is substantially the same as the bridge connection failure detection method according to the first embodiment from the beginning to the first determination step S300, The detailed description up to the step of determining the difference (S300) will be omitted and will be described later only.

The bridge determination step S300 is performed to primarily determine whether an arbitrary object existing in the inspection area ROI is the bridge 32 or not. If it is determined that the object is the bridge 32, the following steps are further performed.

First, the color of the object determined to be the bridge 32 is checked in the inspection areas GOI (S600). This process will hereinafter be referred to as bridge color checking step (S600).

The bridge color checking step S600 includes, for example, obtaining two-dimensional color image data of the driving element 20 and checking the color of the object using the two-dimensional color image data can do. Here, the two-dimensional color image data can be obtained by applying three-color light of red light, green light and blue light to the driving element 20, and can be measured, for example, through the three-dimensional shape measuring equipment. Meanwhile, the step of acquiring the two-dimensional color image data of the driving element 20 may be performed after the step S300 of determining whether or not the bridge is present, but may be performed simultaneously with or before the three-dimensional shape measuring step S100 .

Next, in step S700, it is determined whether the object is the bridge 32 using the color of the object identified through the bridge color checking step (step 600). Hereinafter, this process will be referred to as a secondary determination step (S700) of whether or not the bridge is based on colors.

As a result of checking the color of the object, the color of the object is substantially the same as the color of the solder portions 30 formed on the terminals 24 in the second determination step S700, , The bridge 32 determines the object. On the other hand, if the color of the object is not substantially the same as the color of the solder portions 30, the object may not be determined as the bridge 32. That is, when the object existing in the inspection regions ROI is a foreign substance having a color different from that of the solder portions 30, even if it is determined that the object is the bridge 32 in the first determination step S300, It can be determined that the object is not the bridge 32. [

As described above, according to the present embodiment, after checking the color of the object after the first determining step S300 of the bridging state, the second determining step S700 of determining whether or not the object is bridged by the color, Can be more accurately judged whether the object present in the bridge 32 is the bridge 32 or not.

<Example 4>

FIG. 10 is a flowchart showing a bridge connection failure detection method according to a fourth embodiment of the present invention, and FIG. 11 is a sectional view showing a state in which a silk line is formed between terminals of a driving element.

Referring to FIG. 10, the bridge connection failure detection method according to the present embodiment is substantially similar to the bridge connection failure detection method according to the first embodiment from the three-dimensional shape measurement apparatus S100 to the bridge determination primary determination step (S300) The detailed description from the three-dimensional shape measuring apparatus S100 to the first determining step S300 will be omitted and will be described later.

The bridge determination step S300 is performed to primarily determine whether an arbitrary object existing in the inspection area ROI is the bridge 32 or not. If it is determined that the object is the bridge 32, the following steps are further performed.

First, height information of the object determined as the bridge 32 in the inspection areas GOI among the surface height information of the bare board 10 is checked (S800). This process will be hereinafter referred to as a bare board surface confirmation step (S800).

In the present embodiment, the bridge connection failure detection method measures the surface of the bare board 10 through the three-dimensional shape measurement device before the three-dimensional shape measurement step S100, And obtaining the surface height information of the surface. That is, before the driving element 20 is mounted on the bare board 10, the height information of the bare board 10 is obtained through the three-dimensional shape measuring device, (S900).

Subsequently, in step S900, it is determined whether the object is the bridge 32 considering the height information of the bare substrate in the object identified through the step of checking the surface of the bare board (S800). Hereinafter, this process will be referred to as a second determination step (S900) as to whether or not the bridge is based on the surface height.

Referring to FIG. 11, in step S900, it is determined whether or not the height H3 of the surface of the bare substrate 10 is greater than the height H1 of the object. The actual height (HR) of the object is obtained. Here, the reference height position in the height H1 of the object and the height H3 of the surface of the bare substrate 10 may be the surface of the solder resist layer 16 or the surface of the base substrate 12. [ Then, it is determined whether the object is the bridge 32 by using the actual height HR of the object. That is, if the actual height HR of the object is equal to or greater than the threshold height, the object is determined to be the bridge 32, whereas if the actual height HR of the object is less than the threshold height, (32).

On the other hand, in the present embodiment, the actual height HR of the object is different from the height H1 of the object because the surface of the bare board 10 may be uneven and uneven. For example, as shown in FIG. 11, the silk line SL may be formed on the solder paste layer 16 or the base substrate 12 to make the surface of the bare substrate 10 rough.

As described above, according to the present embodiment, it is possible to check the height information of the surface of the bare board 10 in the object after the first determination step (S300) It is possible to more accurately determine whether the object existing in the inspection regions ROI is the bridge 32. [

According to the present invention, the presence or absence of a bridge in the inspection areas is primarily determined by using three-dimensional image data including height information in inspection areas, It can be detected more accurately.

In addition, after the presence or absence of the bridge is first determined, the visibility, the color, and the height information of the object are checked and the presence or absence of the bridge is secondarily determined again. Thus, It is possible to more accurately detect whether or not a failure has occurred.

While the present invention has been described in connection with what is presently considered to be practical and exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention. Accordingly, the foregoing description and drawings are to be regarded in an illustrative rather than a restrictive sense of the invention.

1 is a flowchart showing a bridge connection failure detection method according to a first embodiment of the present invention.

2 is a perspective view showing a state in which a driving element is mounted on a bare substrate.

3 is a plan view showing a state in which the driving element of FIG. 2 is viewed from above.

FIG. 4 is a plan view showing solder portions formed on the terminals of FIG. 3. FIG.

5 is a cross-sectional view taken along the line I-I 'in FIG.

Fig. 6 conceptually shows a three-dimensional shape measuring device capable of measuring the three-dimensional shape of the driving element of Fig. 2. Fig.

7 is a flowchart showing a bridge connection failure detection method according to a second embodiment of the present invention.

8 is a cross-sectional view showing a state in which foreign matter is disposed between the terminals of the driving element.

9 is a flowchart showing a bridge connection failure detection method according to the third embodiment of the present invention.

10 is a flowchart showing a bridge connection failure detection method according to a fourth embodiment of the present invention.

11 is a cross-sectional view showing a state in which a silk line is formed between terminals of a driving element.

   <Short description of main drawing number>

10: Bare board 12: Base board

14: pad 16: solder resist layer

20: driving element 22: body

24: Terminal 30: Solder part

32: Bridge 40: Foreign matter

SL: Silk line 100: Measurement stage part

200: image capturing unit 300: first illuminating unit

400: second illuminating unit 500: image acquiring unit

600: module control unit 700: central control unit

Claims (14)

delete A bridge connection failure detection method for detecting a bridge disposed between terminals of a driving element mounted on a bare board and shorting the terminals to each other, Measuring a three-dimensional shape of the driving element through a three-dimensional shape measuring device and obtaining three-dimensional image data including height information according to the position (hereinafter, referred to as a three-dimensional shape measuring step); Determining at least one inspection area for detecting the bridge connection failure by checking the shape of the driving device from the three-dimensional image data (hereinafter referred to as an inspection area setting step); And (Hereinafter, referred to as &quot; bridging primary determination &quot;) by analyzing height information in the inspection area and determining whether or not there is a bridge that short-circuits the terminals within the inspection area, The inspection area setting step Confirming the body of the driving element from the three-dimensional image data; Identifying terminals of the driving element protruding from the body from the three-dimensional image data; And And setting the inspection area within the area between the terminals. 3. The method according to claim 2, Judges the object as the bridge when the height of an arbitrary object existing in the inspection area is not less than a threshold height, And does not determine the object as the bridge when the height of the object is less than the threshold height. 4. The method of claim 3, wherein the threshold height And a value between 10% and 40% of a maximum height at the terminals of the driving element. 4. The method according to claim 3, Wherein a part of the body is excluded from the judgment object of the bridge when the inspection area includes a part of the body of the driving element. A bridge connection failure detection method for detecting a bridge disposed between terminals of a driving element mounted on a bare board and shorting the terminals to each other, Measuring a three-dimensional shape of the driving element through a three-dimensional shape measuring device and obtaining three-dimensional image data including height information according to the position (hereinafter, referred to as a three-dimensional shape measuring step); Determining at least one inspection area for detecting the bridge connection failure by checking the shape of the driving device from the three-dimensional image data (hereinafter referred to as an inspection area setting step); (Hereinafter, referred to as a bridge determination primary determination step) by analyzing height information in the inspection area and judging whether or not there is a bridge for shorting the terminals within the inspection area; Confirming a visibility of the object (hereinafter, referred to as a bridge visibility checking step) when an object judged to be the bridge is present in the inspection area as a result of the first determination whether or not the bridge exists; And Further comprising a step of determining whether the object is the bridge by using the visibility in the object (hereinafter, referred to as a bridge determining whether or not the object is a bridge by visualization) Way. 7. The method according to claim 6, wherein in the bridge visibility checking step Wherein the visibility of the object using the measurement data for the object included in the three-dimensional image data is checked. 7. The method according to claim 6, wherein in the step And judging the object as the bridge when the visibility of the object is higher than the reference value as a result of checking the visibility of the object, And does not judge the object as the bridge when the visibility in the object is less than the reference value. A bridge connection failure detection method for detecting a bridge disposed between terminals of a driving element mounted on a bare board and shorting the terminals to each other, Measuring a three-dimensional shape of the driving element through a three-dimensional shape measuring device and obtaining three-dimensional image data including height information according to the position (hereinafter, referred to as a three-dimensional shape measuring step); Determining at least one inspection area for detecting the bridge connection failure by checking the shape of the driving device from the three-dimensional image data (hereinafter referred to as an inspection area setting step); (Hereinafter, referred to as a bridge determination primary determination step) by analyzing height information in the inspection area and judging whether or not there is a bridge for shorting the terminals within the inspection area; Checking the color of the object (hereinafter referred to as a bridge color checking step) when an object judged to be the bridge is present in the inspection area as a result of the first determination whether the bridge exists; And Further comprising a second determining step of determining whether the object is the bridge using the color of the object (hereinafter, referred to as a second determining whether the object is a bridge by color). 10. The method of claim 9, wherein the bridge color checking step Obtaining two-dimensional color image data of the driving element; And And checking the color of the object using the two-dimensional color image data. 10. The method according to claim 9, wherein in the second determining whether the color is bridged Determining the color of the object as the bridge if the color of the object is substantially the same as the color of the solder portions formed on the terminals, If the color of the object is not substantially the same as the color of the solder portions, does not determine the object as the bridge. A bridge connection failure detection method for detecting a bridge disposed between terminals of a driving element mounted on a bare board and shorting the terminals to each other, Measuring a three-dimensional shape of the driving element through a three-dimensional shape measuring device and obtaining three-dimensional image data including height information according to the position (hereinafter, referred to as a three-dimensional shape measuring step); Determining at least one inspection area for detecting the bridge connection failure by checking the shape of the driving device from the three-dimensional image data (hereinafter referred to as an inspection area setting step); (Hereinafter, referred to as a bridge determination primary determination step) by analyzing height information in the inspection area and judging whether or not there is a bridge for shorting the terminals within the inspection area; Checking the surface height information of the bare substrate on the object (hereinafter referred to as a bare board surface checking step) when an object judged to be the bridge is present in the inspection area as a result of the first determination as to whether or not the bridge is present; And Further comprising the step of secondarily determining whether the object is the bridge in consideration of the surface height information of the bare board (hereinafter, referred to as &quot; second determining whether or not the bridge is based on the surface height &quot;). Detection method. 13. The method according to claim 12, further comprising the step of measuring the surface of the bare substrate through the three-dimensional shape measuring device and obtaining the surface height information of the bare substrate before the three-dimensional shape measuring step A bridge connection fault detection method. 13. The method according to claim 12, And determining whether the object is the bridge using the actual height of the object in a state where the surface height of the bare substrate is removed from the height of the object.

Images