TW202423273A - 顯示器結構及其製造方法 - Google Patents

顯示器結構及其製造方法 Download PDF

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Publication number
TW202423273A
TW202423273A TW111145717A TW111145717A TW202423273A TW 202423273 A TW202423273 A TW 202423273A TW 111145717 A TW111145717 A TW 111145717A TW 111145717 A TW111145717 A TW 111145717A TW 202423273 A TW202423273 A TW 202423273A
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TW
Taiwan
Prior art keywords
bump
substrate
disposed
display structure
manufacturing
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Application number
TW111145717A
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English (en)
Other versions
TWI836755B (zh
Inventor
梁育馨
黃婉真
王脩華
林威廷
Original Assignee
友達光電股份有限公司
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Publication date
Application filed by 友達光電股份有限公司 filed Critical 友達光電股份有限公司
Priority to TW111145717A priority Critical patent/TWI836755B/zh
Priority claimed from TW111145717A external-priority patent/TWI836755B/zh
Priority to CN202310059607.6A priority patent/CN115842082A/zh
Application granted granted Critical
Publication of TWI836755B publication Critical patent/TWI836755B/zh
Publication of TW202423273A publication Critical patent/TW202423273A/zh

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Abstract

一種顯示器結構包含第一基板、第二基板、第一凸塊、發光單元、連通柱、第二凸塊以及第三凸塊。第二基板設置於第一基板上。第一凸塊設置於第二基板之頂面上。發光單元設置於第一凸塊上。連通柱填充貫穿第一基板以及第二基板之通孔。第二凸塊設置於第二基板之頂面上並連接連通柱。第二凸塊之厚度大於第一凸塊之厚度。第三凸塊設置於第一基板之底面上並連接連通柱。
TW111145717A 2022-11-29 2022-11-29 顯示器結構及其製造方法 TWI836755B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW111145717A TWI836755B (zh) 2022-11-29 2022-11-29 顯示器結構及其製造方法
CN202310059607.6A CN115842082A (zh) 2022-11-29 2023-01-17 显示器结构及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW111145717A TWI836755B (zh) 2022-11-29 2022-11-29 顯示器結構及其製造方法

Publications (2)

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TWI836755B TWI836755B (zh) 2024-03-21
TW202423273A true TW202423273A (zh) 2024-06-01

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TW111145717A TWI836755B (zh) 2022-11-29 2022-11-29 顯示器結構及其製造方法

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CN (1) CN115842082A (zh)
TW (1) TWI836755B (zh)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9615453B2 (en) * 2012-09-26 2017-04-04 Ping-Jung Yang Method for fabricating glass substrate package
US9367094B2 (en) * 2013-12-17 2016-06-14 Apple Inc. Display module and system applications
US9829710B1 (en) * 2016-03-02 2017-11-28 Valve Corporation Display with stacked emission and control logic layers
TWM553882U (zh) * 2017-08-10 2018-01-01 欣興電子股份有限公司 發光二極體顯示裝置
KR102504834B1 (ko) * 2019-03-11 2023-02-28 삼성전자 주식회사 집적회로 칩 및 그 제조 방법과 집적회로 칩을 포함하는 집적회로 패키지 및 디스플레이 장치
US11437551B2 (en) * 2019-03-19 2022-09-06 Seoul Viosys Co., Ltd. Light emitting device package and application thereof
KR20220099543A (ko) * 2019-11-12 2022-07-13 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치, 표시 모듈, 전자 기기, 및 표시 장치의 제작 방법
US11362251B2 (en) * 2019-12-02 2022-06-14 Facebook Technologies, Llc Managing thermal resistance and planarity of a display package
CN113763837B (zh) * 2021-11-09 2022-04-01 Tcl华星光电技术有限公司 混接面板及拼接面板

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