TW202421409A - Molding die, resin molding device, and method for manufacturing resin molded product - Google Patents

Abstract

The purpose of the present invention is to provide a molding die that can suppress deformation of a lead frame even when a lead frame without a frame component is used. The molding die (1000) of the present invention is a molding die for performing resin molding by exposing the back side of a pad (301) of a lead frame (300), and comprises an upper mold (100) and a lower mold (200), and at least one of the upper mold (100) and the lower mold (200) comprises a deformation suppression mechanism (122a), (222a) or (222ax) for suppressing deformation of the lead frame (300) when the mold is closed, and the deformation suppression mechanism contacts at least a part of the end face of the lead frame (300) to suppress deformation of the lead frame (300).

Description

Molding die, resin molding device, and method for manufacturing resin molded product

The present invention relates to a molding die, a resin molding device and a method for manufacturing a resin molded product.

Electronic components such as ICs and semiconductor chips (hereinafter sometimes referred to as "chips") are often used after being sealed with resin (resin molding). More specifically, for example, by resin-sealing a chip, the chip can be made into a resin-sealed electronic component (also referred to as a finished electronic component or packaged product, etc.; hereinafter sometimes referred to as "electronic component").

In the manufacture of electronic components, as described in Patent Document 1, for example, a lead frame (or simply referred to as a frame) on which a chip is mounted is resin-sealed (resin-molded).

In FIG. 1 of Patent Document 1, in order to solve the problem that the lead frame is deformed due to thermal expansion during resin molding, and the connecting rod (1g) is deformed to absorb the deformation, a protrusion (4b) is provided in the mold at a position adjacent to the outer periphery of the connecting rod.

Prior art documents Patent documents Patent document 1   Publication No. 03-100413 of Shikaiping

Invention Problems to be Solved

However, in the method of providing a protrusion on the mold to suppress deformation of the connecting bar as in Patent Document 1, if the design of the lead frame is different, it is necessary to change the shape, position, size, etc. of the protrusion, that is, it is necessary to change the mold. Specifically, for example, if the number of leads in the lead frame, the interval between the leads (lead pitch), etc. are different, the shape, position, size, etc. of the protrusion of the mold must be changed accordingly.

Therefore, an object of the present invention is to provide a molding die, a resin molding device and a method for manufacturing a resin molded product, which can suppress deformation of the lead frame without changing the molding die even if the design of the lead frame is different.

Problem Solving Methods

To achieve this purpose, the molding die of the present invention is a molding die for exposing the back side of the pad of the lead frame and performing resin molding, having an upper mold and a lower mold, at least one of the upper mold and the lower mold having a deformation suppression mechanism for suppressing deformation of the lead frame when the mold is closed, and the deformation suppression mechanism contacts at least a portion of the end surface of the lead frame to suppress deformation of the lead frame.

The resin molding device of the present invention comprises the molding die of the present invention.

The manufacturing method of the resin molded product of the present invention is a manufacturing method of the resin molded product which uses a molding die to expose the back side of the pad of the lead frame and performs resin molding. The manufacturing method of the resin molded product comprises: a lead frame loading step of loading the lead frame on the lower mold; and a lead frame deformation suppression step of suppressing the deformation of the lead frame by the deformation suppression mechanism. In a state where the deformation of the lead frame is suppressed by the deformation suppression mechanism, the upper mold and the lower mold are clamped to perform resin molding on the lead frame.

Effect of invention

According to the present invention, a molding die, a resin molding device and a method for manufacturing a resin molded product can be provided, which can suppress deformation of the lead frame without changing the molding die even if the design of the lead frame is different.

In the present invention, the molding die is not particularly limited, and may be, for example, a metal die or a ceramic die.

In the present invention, when the deformation of the lead frame is “suppressed”, unless otherwise specified, it is not limited to suppressing the deformation of the lead frame to be small, and includes making the deformation of the lead frame zero. In the present invention, for example, when the displacement of the lead is “suppressed”, unless otherwise specified, it is not limited to suppressing the displacement of the lead to be small, and includes making the displacement of the lead to be zero.

In the present invention, "at least a portion of the end surface is in contact" may be in contact with a portion of the end surface or the entire end surface. In addition, when a portion of the end surface is in contact, the portion in contact with the end surface may be a surface, a line, or a point.

In the present invention, the resin molded product is not particularly limited, and for example, it may be an electronic component in which a chip is sealed with resin. In addition, generally speaking, the term "electronic component" may refer to the situation of a chip before resin sealing or may refer to the situation in which a chip is sealed with resin. However, in the present invention, the chip before resin sealing is referred to as an "electronic element", and the chip after resin sealing is referred to as an "electronic component" (as a finished electronic component). That is, in the present invention, "chip" and "electronic element" are synonymous, and specifically, for example, IC, semiconductor chip, semiconductor element for power control, resistor element, capacitor element and other chips can be cited. In addition, "semiconductor element" refers to, for example, a circuit element made of a semiconductor. In the present invention, the "chip" or "electronic element" is not particularly limited as long as it is a chip before resin sealing, and it may not be in the form of a chip.

In the present invention, there is no particular limitation on the resin material before molding and the resin after molding, and for example, it may be a thermosetting resin such as an epoxy resin or a silicone resin, or it may be a thermoplastic resin. Furthermore, it may be a composite material that partially includes a thermosetting resin or a thermoplastic resin. In the present invention, the form of the resin material before molding may include, for example, powdered resin (including granular resin), liquid resin, sheet resin, plate resin, etc. In the present invention, the liquid resin may be liquid at room temperature, and also includes a molten resin that becomes liquid by heating and melting. As for the form of the resin, other forms are also acceptable as long as it can be supplied to the cavity or groove of the molding mold.

In the method for producing the resin molded product of the present invention, the resin molding method is not particularly limited, and may be, for example, transfer molding, injection molding, compression molding, etc.

According to the present invention, for example, as described above, even if the design of the number of leads in the lead frame, the interval between the leads, etc. is different, the deformation of the lead frame can be suppressed. In addition, in the present invention, the lead frame can have a frame component, but as described later, the lead frame may not have a frame component. According to the present invention, even if the lead frame does not have a frame component, that is, even if the outermost part of the lead frame (the position closest to the outside) is not connected, the deformation of the lead frame can be suppressed, so that resin molding can be appropriately performed. As a result, there is no need for a process of cutting and removing the outermost frame component of the lead frame. In addition, since a frame component is not required, the cost of the lead frame can be reduced.

The specific implementation of the present invention will be described below based on the attached drawings. For the convenience of explanation, each drawing will be appropriately omitted, exaggerated, etc. and schematically described.

[Implementation method 1]

In this embodiment, an example of the molding die of the present invention, an example of the method for producing the resin molded product of the present invention using the molding die, and an example of the lead frame used therein are described.

First, an example of a lead frame used in the present embodiment is described. In the present embodiment, the back side (the side on which the chip is not mounted) of the pad (chip mounting plate, also called mold pad) of the lead frame is exposed for molding. FIG6(a) is a plan view showing an example of a lead frame used in a molding die of the present embodiment described later and a method for manufacturing a resin molded product of the present invention using the same. FIG6(b) is an enlarged view of the portion surrounded by a rectangular frame line at the upper left corner of FIG6(a). In FIG6(b), only the leftmost row of pads is shown, and the pads of the inner rows are omitted. FIG6(c) is a three-dimensional view of the portion shown in FIG6(b). As shown in the figure, the lead frame 300 has a pad 301, a connecting rod 302, a pin 303, a lead 304, and a connecting component 311. The lead frame 300 is rectangular as a whole, and a long plate-shaped connecting part 311 is arranged on two long sides of the rectangle of the lead frame 300. The lead 304 is arranged on both sides of the pad 301 in parallel with the connecting part 311. The connecting rod 302 is rod-shaped, and a plurality of connecting rods 302 are arranged perpendicularly to the lead 304. Both ends of each connecting rod 302 are connected to the connecting part 311 respectively. The pad 301 is rectangular, and there are a plurality of them. The plurality of pads 301 are arranged to be sandwiched between two adjacent connecting rods 302. In addition, as shown in FIG. 6 (c), each pad 301 is suspended on the connecting rod 302 by a hanging pin 303. The thickness of the pin 303 is not particularly limited, and it is, for example, thinner than the lead 304. As shown in the figure, the lead frame 300 does not have a frame member that surrounds the entirety of the pad 301, the connecting rod 302, the lead 304, and the pin 303. That is, as shown in the portion surrounded by the frame line A in FIG6 (b), there is no frame member at the outermost side of the lead frame 300. In the portion surrounded by the frame line A, there is a lead 304 instead of a frame member. The connecting member 311 only sandwiches the pad 301, the connecting rod 302, the lead 304, and the pin 303 from both sides, and does not surround the entirety of the lead frame 300. Since such a lead frame 300 does not have a frame component and the outermost lead 304 is not connected, it can achieve weight reduction, resource saving, and cost reduction compared to a lead frame with a frame component. On the other hand, since the lead frame 300 is lower in strength than a lead frame with a frame component, the connecting rod 302 and the like are easily deformed. In addition, as shown in the portion surrounded by the frame line B in FIG6 (b), a connecting rod 302 is in the shape of a long rod and is connected to multiple pads 301. Specifically, as shown in FIG6 (a), each connecting rod 302 extends from a connecting portion with a connecting component 311 on one side to a connecting portion with a connecting component 311 on the other side. Thus, the length of the connecting rod 302 is also a reason why the connecting rod 302 is easily deformed. 6, the connecting rod 302 connects the two connecting members 311 to hold the skeleton of the lead frame 300, and plays a role in fixing the pad 301 via the pin 303. In addition, the connecting rod 302 also plays a role in preventing the resin from leaking from the cavity.

Fig. 6(d) shows the state where the lead frame 300 of Fig. 6(a) is placed on the lower mold of a conventional molding die. As shown in the figure, the lead frame 300 is arranged so that the pad 301 contacts the bottom surface of the lower mold cavity 201, the pin 303 extends obliquely upward from the pad 301, and the connecting rod 302 connected to the pin 303 and the lead 304 cross-connected to the connecting rod are arranged so as to slightly float from the mold surface of the lower mold 200.

When a conventional molding die is used for resin molding, as shown in the schematic diagram of FIG7 , the connecting rod 302 is at risk of being bent outward under the pressure during mold closing. This phenomenon is described in more detail using the process cross-sectional views of FIG11 (a) to (c). As shown in the figure, the molding die 1000 has an upper mold 100 and a lower mold 200. The upper mold 100 has an upper mold cavity 101. The lower mold 200 has a lower mold cavity 201. The upper mold cavity 101 and the lower mold cavity 201 are arranged at positions opposite to each other. When the upper mold 100 and the lower mold 200 are closed, the upper mold cavity 101 and the lower mold cavity 201 are combined to form a mold cavity, and resin molding can be performed in the mold cavity.

When resin molding is performed using the molding die 1000 of FIG11 and the lead frame 300 of FIG6 , for example, the situation shown in the process cross-sectional diagrams of FIG11 (a) to (c) occurs. In FIG11 (a) to (c), the left end of the figure is the outermost side of the lead frame 300, and the right side direction of the figure is the inner side direction of the lead frame 300.

First, as shown in FIG. 11( a ), the lead frame 300 is placed on the lower mold 200. As shown in the figure, the lead frame 300 is placed in a manner such that the pad 301 contacts the bottom surface of the lower mold cavity 201. As described above, the pad 301 is suspended on the connecting rod 302 by the hanging pin 303. In order to expose the back side of the pad 301 during molding, so that the pad 301 can reliably contact the bottom surface of the lower mold cavity 201, or so that the pad 301 can be pressed against the bottom surface of the cavity, the height of the hanging pin 303 is designed to be slightly higher than the depth of the lower mold cavity 201. Therefore, as shown in the figure, the lead 304 is slightly floated from the lower mold 200. 11( a ) to ( c ), but as shown in FIG 6 , the connecting rod 302 is arranged perpendicularly to the lead 304. Therefore, in FIG 11( a ), the connecting rod 302 is also slightly lifted from the lower mold 200 similarly to the lead 304.

Next, as shown by arrow X31 in Fig. 11(b), the lower mold 200 is raised. As a result, as shown in the figure, the lead 304 contacts the upper mold 100, and at this time, the connecting rod 302 also contacts the upper mold.

The lower mold 200 is further raised, and the upper mold 100 and the lower mold 200 are clamped as shown by the arrow X32 in Figure 11 (c). As a result, the upper mold cavity 101 and the lower mold cavity 201 are combined to form a mold cavity, and resin molding can be performed in the mold cavity. At this time, the pin 303 is pushed by the pressure of the clamping mold and expands laterally, but the upper mold 100 and the lower mold 200 are in contact with the lead frame 300 without a gap, and the mold is clamped. If it is a lead frame with a frame member, the connecting rod 302 and the frame member attempt to suppress the deformation of the lead frame caused by the displacement of the lateral expansion of the pin 303. However, in the case of the lead frame 300 of the present embodiment without a frame member, although the connecting rod 302 attempts to suppress the displacement of the lateral expansion of the pin 303, its deformation (bending) is relatively large. The deformation of the connecting rod 302 increases as the position is closer to the outer side of the lead frame 300, and the deformation amount of the connecting rod 302 at the outermost side (the position closest to the outer side) is the largest (see FIG. 7).

The inventors of the present invention have conducted intensive studies to suppress the deformation of the lead frame and have completed the present invention.

The process cross-sectional views of FIG. 1 (a) to (c) show a part of the process of the molding die of the present embodiment and the method for manufacturing the resin molded product of the present embodiment using the same. As shown in the figure, the molding die 1000 of the present embodiment is the same as the molding die 1000 of FIG. 11 except that the upper mold 100 has a lead frame pressing mechanism 120 and the lead frame pressing mechanism 120 has a deformation suppression portion 122a described later. The deformation suppression portion 122a is equivalent to the "deformation suppression mechanism" in the molding die of the present invention.

The lead frame pressing mechanism 120 includes an elastic member 121 and a pressing member 122. The pressing member 122 of the present embodiment is a rectangular shape in top view (same shape as the pressing member 222 of FIG. 4 (b) described later, but arranged on the upper mold 100 differently from FIG. 4 (b)) of a size capable of pressing the entire lead 304 at the outermost portion (the position closest to the outer side) of the lead frame 300, and is arranged at a position capable of pressing the outermost leads 304 located at both ends of the lead frame 300. The pressing member 122 is mounted on the main body of the upper mold 100 via the elastic member 121, and is arranged to protrude from the mold surface of the upper mold 100 (see FIG. 1 (a)). The pressing member 122 can move up and down by the extension and contraction of the elastic member 121. At the lower end of the pressing member 122, the portion where the deformation suppressing portion 122a is not provided is flush with the mold surface of the upper mold 100 by mold clamping.

A deformation suppression portion 122a is provided at a portion of the lower end of the pressing component 122. The deformation suppression portion 122a is provided at the outer portion of the lower end of the pressing component 122 as viewed from the lead 304. At the lower end of the pressing component 122, the portion where the deformation suppression portion 122a is provided protrudes downward more than the portion where the deformation suppression portion 122a is not provided. The pressing component 122 can press the lead 304 at the portion where the deformation suppression portion 122a is not provided. In addition, as described later, the deformation suppression portion 122a suppresses displacement of the lead 304 by contacting at least a portion of the end face of the lead 304 (i.e., the end face of the lead frame 300), thereby suppressing deformation of the lead frame 300. 1 , for the sake of clarity, the pressing member 122 is shown with the deformation suppressing portion 122a and other portions separated from each other. However, the present invention is not limited thereto, and the pressing member 122 may be formed integrally with the deformation suppressing portion 122a and other portions.

The method for manufacturing a resin molded product using the molding die 1000 of Fig. 1 can be performed, for example, as follows: The lead frame 300 shown in Figs. 1(a) to 1(c) is the same as the lead frame 300 shown in Fig. 6 .

First, as shown in FIG1(a), the lead frame 300 is placed on the lower mold 200 (lead frame placement process). At this time, as shown in the figure, the lead frame 300 is placed in a manner such that the pad 301 contacts the bottom surface of the lower mold cavity 201. As described above, the pad 301 is suspended on the connecting rod 302 by the hanging pin 303. As in FIG11, the height of the hanging pin 303 is designed to be slightly higher than the depth of the lower mold cavity 201. Therefore, as shown in the figure, the connecting rod 302 and the lead 304 are slightly floated from the mold surface of the lower mold 200.

Next, as shown by arrow X11 in FIG. 1( b ), the lower mold 200 is raised. As a result, as shown in the figure, the outermost lead 304 is pressed downward by the portion of the pressing component 122 where the deformation suppression portion 122a is not provided. At this time, the deformation suppression portion 122a provided on the pressing component 122 contacts at least a portion of the end face (side face) of the lead 304. (See FIG. 4( e )). As a result, the displacement of the lead 304 is suppressed. In addition, by suppressing the displacement of the lead 304, the overall deformation of the lead frame 300 is suppressed. However, in this state, the deformation suppression portion 122a and the end face of the lead 304 may not contact each other but there may be a gap. In this case, in the process of FIG. 1( c ) described later, the lead 304 is displaced, the deformation suppression portion 122 a contacts the end surface of the lead 304, the displacement of the lead 304 is suppressed, and the deformation of the lead frame 300 as a whole is suppressed. Specifically, for example, this is the same as the description of the second embodiment described later and FIG. 10 .

Next, as shown by arrow X12 in FIG. 1( c ), the lower mold 200 is further raised, and the upper mold 100 and the lower mold 200 are clamped. At this time, the elastic member 121 contracts, and the pressing member 122 rises. Through this clamping, the upper mold cavity 101 and the lower mold cavity 201 are combined to form a mold cavity, and resin molding can be performed in the mold cavity. At this time, similar to FIG. 11( c ), the connecting rod 302 is pushed by the pressure of the clamping, and mainly the pin 303 is deformed, and the upper mold 100 contacts the lead frame 300 (the lead 304 of the lead frame 300) and the lower mold 200 without a gap, and the mold is clamped. In the present embodiment, at this time, as described above, deformation of the lead 304 is suppressed by the deformation suppressing portion 122a, thereby suppressing deformation of the entire lead frame 300 including the connection bar 302.

In addition, in FIG. 1 (b) and FIG. 1 (c), the process of suppressing the deformation of the connecting rod 302 by pressing the lead 304 with the pressing member 122, and the process of suppressing the displacement of the lead 304 by making the deformation suppression portion 122a contact at least a part of the end face of the lead 304 can be said to be part of the "lead frame deformation suppression process" in the manufacturing method of the resin molded product of the present invention. However, as described later, the "lead frame deformation suppression process" of the present invention is not limited to this. For example, in FIG. 1 (b) and (c), it is also possible to make only the process of suppressing the displacement of the lead 304 by making the deformation suppression portion 122a contact at least a part of the end face of the lead 304 as the "lead frame deformation suppression process" in the manufacturing method of the resin molded product of the present invention.

In the present embodiment, there is no particular limitation on the resin molding method, and for example, it may be the same as or based on a conventional resin molding method. The resin molding method in the present embodiment, for example, may also be transfer molding, injection molding, compression molding, etc. as described above. More specifically, for example, after the process of FIG. 1 (a) and before the process of FIG. 1 (b), a solid resin material (not shown) may be supplied to the lower mold cavity 201, and the resin may be melted by the heat of the molding mold 1000 to perform resin molding. As described above, the shape of the resin material is also not particularly limited, and may be a powdery resin (including a granular resin), a sheet resin, a plate resin, etc. In addition, for example, as shown in FIG. 1( c ), after the molds are closed, a liquid resin (not shown) is injected into the mold cavity formed by the upper mold cavity 101 and the lower mold cavity 201 to solidify (harden) the liquid resin to perform resin molding. The liquid resin is also not particularly limited, and for example, as described above, it may be a resin that is liquid at room temperature or a molten resin that is melted by heating to become liquid.

In addition, the lead frame that can be used in the present invention is not limited to the forms of Figures 6 and 7, and is arbitrary and can be any lead frame. According to the present invention, as described above, even if a lead frame without a frame component is used, the deformation of the lead frame can be suppressed. Therefore, in the present invention, it is preferred to use a lead frame without a frame component. If a lead frame without a frame component is used, for example, as described above, it is possible to achieve lightweight, resource saving, and low cost of the lead frame. For example, since the lead frame does not have a frame component, there is no need for a process of cutting and removing the frame component of the lead frame after resin molding, and the cost can be reduced accordingly. In addition, in the present invention, the lead frame "does not have (does not have) a frame component" means that it does not have a frame component that surrounds the entire lead frame (for example, the entirety of the pad, lead, connection rod, and suspender). For example, in the lead frame 300 of FIG6 , two connecting parts 311 are arranged on the long side portion of the rectangle of the lead frame 300, but do not exist on the short side portion of the rectangle of the lead frame 300. That is, as described above, the connecting parts 311 only sandwich the pad 301, the lead 304, the connecting rod 302 and the pin 303 from both sides, and do not surround the entirety. Therefore, the connecting parts 311 are not "frame parts". In the present invention, a lead frame without a frame part may be, for example, a lead frame in which at least a portion of the peripheral portion of the lead frame does not have a connecting part. The lead frame 300 of FIG6 has connecting parts on two sides of the peripheral portion, and does not have connecting parts on the other two sides. However, in the present invention, a lead frame without a frame part is not limited thereto. For example, a lead frame without a frame component may be a lead frame having connecting components on three sides of the periphery and not having connecting components on the other side, or may be a lead frame having connecting components on one side of the periphery and not having connecting components on the other three sides. In addition, a lead frame without a frame component may be, for example, a lead frame having no connecting components for more than 10%, more than 20%, more than 30%, more than 40% or more than 50% of the length of the periphery. In addition, in the present invention, a lead frame without a frame component may be, for example, a lead frame having leads, connecting rods, suspenders or pads arranged on at least a portion of the periphery of the lead frame. A lead frame with a frame component is arranged with a frame component on the entire periphery of the lead frame, but a lead frame without a frame component is arranged with a component that is not a frame component on at least a portion of the periphery. The component that is not the frame component may be, for example, a lead, a connecting rod, a pin, or a pad, as described above. For example, as described above, the lead frame 300 of FIG. 6 is provided with leads 304 on both sides of the peripheral portion. In the present invention, a lead frame that does not have a frame component may be, for example, a lead frame that has leads, connecting rods, pins, or pads on one, two, three, or four sides of the peripheral portion. In addition, in the present invention, a lead frame that does not have a frame component may be, for example, a lead frame that has leads, connecting rods, pins, or pads arranged at more than 10%, more than 20%, more than 30%, more than 40%, or more than 50% of the length of the peripheral portion. However, the lead frame that can be used in the present invention is not particularly limited as described above and is arbitrary.

In addition, as described above, the resin molding device of the present invention is a resin molding device including the molding die of the present invention. The structure of the resin molding device of the present invention is not particularly limited. For example, in addition to including the molding die of the present invention, it can also be the same as or based on a conventional resin molding device. The overall structure of the resin molding device in this embodiment is also not particularly limited. For example, it can also be as shown in FIG. 2. FIG. 2 is explained below.

FIG2 is a plan view showing an example of the overall structure of the resin molding device of the present invention. As shown in the figure, the resin molding device 1 includes: a supply module 2 for supplying a lead frame 300 and a resin sheet T before resin sealing (resin molding), two resin molding modules 1000A and 1000B for performing resin molding, and a carry-out module 4 for carrying out the resin molded product as components. In addition, the supply module 2, the resin molding modules 1000A and 1000B, and the carry-out module 4 as components can be detached from each other and can be replaced.

In addition, the resin molding device 1 includes: a conveying mechanism 5 (hereinafter referred to as "loader 5") for conveying the lead frame 300 and the resin sheet T supplied by the supply module 2 to the resin molding modules 1000A and 1000B, and a conveying mechanism 6 (hereinafter referred to as "unloader 6") for conveying the resin molded product resin-molded by the resin molding modules 1000A and 1000B to the unloading module 4.

In addition, the resin sheet T can be melted to become a molten resin. In addition, the molten resin can become a sealing resin for resin sealing the lead frame 300 by solidifying (hardening).

The supply module 2 of the present embodiment is obtained by integrating the substrate supply module 7 and the resin supply module 8.

The substrate supply module 7 includes a substrate delivery unit 71 and a substrate supply unit 72. The substrate delivery unit 71 delivers the lead frame 300 in the cassette to the substrate arrangement unit. The substrate supply unit 72 receives the lead frame 300 from the substrate delivery unit 71, arranges the received lead frame 300 in a predetermined direction, and delivers it to the loader 5.

The resin molding modules 1000A and 1000B each include a molding die 1000. Each molding die 1000 includes a lower die 200 and an upper die 100 as shown in FIG.

In addition, a heating unit (not shown) such as a heater may be embedded in the upper mold 100 and the lower mold 200. The upper mold 100 and the lower mold 200 can be heated by the heating unit.

The operation of the resin molding device 1 of FIG. 2 is as follows, for example. First, the substrate delivery section 71 delivers the lead frame 300 in the box to the substrate supply section 72. The substrate supply section 72 arranges the received lead frame 300 in a predetermined direction and delivers it to the loader 5. At the same time, the resin delivery section 81 delivers the resin sheet T received from the stocker (not shown) to the resin supply section 82. The resin supply section 82 delivers the required number (four in FIG. 2) of the received resin sheets T to the loader 5.

Next, the loader 5 simultaneously transfers the received two lead frames 300 and four resin sheets T to the molding die 1000 . The loader 5 supplies the lead frames 300 to the mounting portion of the lower die 200 , and supplies the resin sheets T to the inside of the grooves formed in the lower die 200 .

After that, the upper mold 100 and the lower mold 200 are closed. Then, the molten resin obtained by heating and melting the resin sheet T in the groove block (not shown) is pressed by a plunger (not shown). As a result, the molten resin is injected into the interior of the cavity (see Figures 1 (a) to (c)) formed in the upper mold 100 and the lower mold 200 through the runner (resin channel) and the gate. Then, the molten resin is solidified by heating the molten resin for the time required for solidification to form a solidified resin. As a result, the pad 301 in the cavity is sealed in the solidified resin (sealing resin) formed corresponding to the shape of the cavity.

Then, after the required time for curing, the upper mold 100 and the lower mold 200 are opened to demould the resin molded product (not shown). Then, the unloader 6 is used to store the resin molded product sealed by the molding mold 1000 in the substrate storage part 401 of the unloading module 4.

The overall operation of the resin molding device 1 including the above-mentioned series of operations is controlled by the control unit 9. The control unit 9 is provided in the supply module 2 in FIG. 1 , but may also be provided in other modules.

The control unit 9 is composed of, for example, a dedicated or general-purpose computer including a CPU, an internal memory, an AD converter, an input/output inverter, and the like.

[Implementation Method 2]

Next, another embodiment of the present invention is described.

In this embodiment, another example of the molding die of the present invention and an example of the manufacturing method of the resin molded product of the present invention using the same are described. In addition, the lead frame used in this embodiment is the same as the lead frame used in Embodiment 1.

The process cross-sectional views of FIG3 (a) to (c) show a part of the process of the molding die of the present embodiment and the method for manufacturing the resin molded product of the present embodiment using the same. As shown in the figure, the molding die 1000 of the present embodiment is the same as the molding die 1000 of FIG11 except that the lower mold 200 has a lead frame pressing mechanism 220 and the lead frame pressing mechanism 220 has a deformation suppression portion 222a described later. The deformation suppression portion 222a is equivalent to the "deformation suppression mechanism" in the molding die of the present invention.

In the molding die 1000 of the present embodiment, the upper die 100 does not have the lead frame pressing mechanism 120, but the lower die 200 has the lead frame pressing mechanism 220 instead. The lead frame pressing mechanism 220 includes an elastic member 221 and a pressing member 222. The pressing member 222 of the present embodiment is a rectangular shape in plan view (same shape as the pressing member 222 of FIG. 4 (b) described later) of a size capable of pressing the entire outermost (closest to the outer side) lead 304 of the lead frame 300, and is disposed at a position capable of pressing the outermost leads 304 located at both ends of the lead frame 300. The pressing member 222 is mounted on the main body of the lower mold 200 via the elastic member 221, and is protruded from the mold surface of the lower mold 200 (see FIG. 3 (a)). In the present embodiment, the protrusion of the pressing member 222 is preferably a distance that can support the lead 304 and the connecting rod 302 that float from the mold surface of the lower mold of the lead frame 300 placed on the lower mold 200. The pressing member 222 can move up and down by the extension and contraction of the elastic member 221. At the upper end of the pressing member 222, the portion where the deformation suppression portion 222a is not provided is flush with the mold surface of the lower mold 200 by closing the mold.

A deformation suppression portion 222a is provided at a portion of the upper end of the pressing component 222. The deformation suppression portion 222a is provided at the outer portion of the upper end of the pressing component 222 as viewed from the lead 304. At the upper end of the pressing component 222, the portion where the deformation suppression portion 222a is provided protrudes upward more than the portion where the deformation suppression portion 222a is not provided. The pressing component 222 can press the lead 304 at the portion where the deformation suppression portion 222a is not provided. In addition, as described later, the deformation suppression portion 222a suppresses displacement of the lead 304 by contacting at least a portion of the end face of the lead 304 (i.e., the end face of the lead frame 300), thereby suppressing deformation of the lead frame 300. 3, for the sake of clarity, the pressing member 222 is shown with the deformation suppressing portion 222a and other portions separated from each other. However, the present invention is not limited thereto, and the pressing member 222 may be formed integrally with the deformation suppressing portion 222a and other portions.

The method for manufacturing a resin molded product using the mold 1000 of Fig. 3 can be performed, for example, as follows. As described above, the lead frame 300 shown in Figs. 3(a) to 3(c) is the same as the lead frame used in the first embodiment, that is, the lead frame 300 shown in Fig. 6 .

First, as shown in FIG. 3( a ), the lead frame 300 is placed on the lower mold 200 (lead frame placing process). As in Embodiment 1, the lead frame 300 is placed in a manner such that the pad 301 contacts the bottom surface of the lower mold cavity 201 . In addition, since the height of the hanging pin 303 is designed to be slightly higher than the depth of the lower mold cavity 201 , the connecting rod 302 and the lead 304 are slightly floated from the mold surface of the lower mold 200 . In the present embodiment, as described above, the pressing part 222 of the lead frame pressing mechanism 220 is arranged to protrude from the lower mold 200 by the elastic part 221 by the floating distance. Therefore, at this time, the pressing part 122 supports the outermost lead 304 and the connecting rod 302 of the lead frame 300 from below. In addition, at this time, the deformation suppression portion 222a contacts at least a portion of the end surface of the lead 304 to suppress the displacement of the lead 304, thereby suppressing the deformation of the lead frame 300 as a whole. Therefore, the outermost connecting rod 302 is further suppressed compared with the case of the first embodiment. However, in this state, the deformation suppression portion 222a and the end surface of the lead 304 may not contact each other but there may be a gap. In this case, in the process of FIG. 3 (b) or FIG. 3 (c) described later, the lead 304 is displaced, and the deformation suppression portion 222a contacts the end surface of the lead 304 to suppress the displacement of the lead 304, and the deformation of the lead frame 300 as a whole including the connecting rod 302 is suppressed. Specifically, for example, as shown in FIG. 10 described later.

In addition, the cross-sectional view of Fig. 8 is an enlarged view of a part of Fig. 3(a). As shown in Fig. 3(a) and Fig. 8, the pressing member 222 supports the outermost lead 304 and the connecting rod 302 of the lead frame 300 from below, and the deformation suppression portion 222a contacts at least a part of the end surface of the lead 304. As described above, the displacement of the lead 304 is suppressed, thereby suppressing the deformation of the entire lead frame 300 including the connecting rod 302.

In addition, FIG. 9 shows a plan view and a stereoscopic view of the state of FIG. 3 (a). FIG. 9 (a) is a plan view of the lead frame 300 and the deformation suppression portion 222a as a whole. The lead frame 300 is the same as the lead frame 300 of FIG. 6. FIG. 9 (b) and (c) are enlarged views of the portion where the deformation suppression portion 222a contacts at least a portion of the end surface of the lead 304 in FIG. 9 (a). FIG. 9 (b) is a top view, and FIG. 9 (c) is a stereoscopic view. As shown in FIG. 9 (b) and (c), the deformation suppression portion 222a contacts at least a portion of the end surface of the lead 304.

In addition, the enlarged cross-sectional view of FIG. 10 illustrates the state of the deformation suppression portion 222a and the lead 304 in the state of FIG. 3 (a). As shown in the figure, the deformation suppression portion 222a does not contact the end surface of the lead 304, and a small gap G is left. By leaving a small margin in the size in this way, when the lead frame 300 is placed on the lower mold 200, the lead 304 is not easily caught by the deformation suppression portion 222a. In this case, in the process of FIG. 3 (b) or FIG. 3 (c) described later, the lead 304 is displaced and the deformation suppression portion 222a contacts the end surface of the lead 304. As a result, the lead 304 cannot be further displaced in the direction of the deformation suppression portion 222a, thereby suppressing the deformation of the entire lead frame 300 including the connecting rod 302. In addition, as shown in FIG. 10 , the surface α of the deformation suppression portion 222a that contacts the end surface of the lead 304 is not completely parallel to the end surface of the lead 304, but is slightly inclined so as to be farther away from the end surface of the lead 304 as it goes upward. As a result, when the lead frame 300 is placed on the lower mold 200, the lead 304 is not easily caught by the deformation suppression portion 222a, so that the lead frame 300 is more easily placed. In addition, in this way, when the surface α of the deformation suppression portion 222a that contacts the end surface of the lead 304 is not completely parallel to the end surface of the lead 304 but is slightly inclined, the deformation suppression portion 222a may contact the lead 304 only at the lower end of the end surface of the lead 304, for example.

In the present invention, the state in which the deformation suppression mechanism contacts at least a portion of the end surface of the lead frame means that, as described above, the portion in which the deformation suppression mechanism contacts the end surface of the lead frame may be a "surface", a "line" or a "point". For example, as described above, the surface α in FIG. 10 may contact the lead 304 only at the lower end (i.e., "line") of the end surface of the lead 304.

Next, as shown by arrow X21 in FIG. 3( b ), the lower mold 200 is raised so that the connecting rods 302 and the leads 304 come into contact with the upper mold 100 .

Next, as shown by arrow X22 in FIG. 3 (c), the lower mold 200 is further raised, and the upper mold 100 and the lower mold 200 are clamped. At this time, the elastic member 221 contracts, and the pressing member 222 descends. Through this clamping, the upper mold cavity 101 and the lower mold cavity 201 are combined to form a mold cavity, and resin molding can be performed in the mold cavity. At this time, similar to FIG. 1 (c) of Implementation Method 1, the connecting rod 302 is pushed by the pressure of the clamping, and the upper mold 100 contacts the lead frame 300 (the lead 304 of the lead frame 300) and the lower mold 200 without a gap, and the mold is clamped. At this time, similarly to FIG1(c) of Embodiment 1, the deformation suppressing portion 222a suppresses displacement of the lead 304, thereby suppressing deformation of the entire lead frame 300 including the connecting bar 302. By suppressing deformation of the connecting bar 302, the connecting bar 302 does not bend outward as shown in FIG7 .

In addition, in FIG. 3 (a) to (c), the process of suppressing the deformation of the connecting rod 302 by pressing the lead 304 with the pressing member 222, and the process of suppressing the displacement of the lead 304 by making the deformation suppression portion 222a contact the end face of the lead 304 can be said to be part of the "lead frame deformation suppression process" in the method for manufacturing a resin molded product of the present invention. However, the "lead frame deformation suppression process" of the present invention is not limited to this. For example, in FIG. 3 (a) to (c), only the process of suppressing the displacement of the lead 304 by making the deformation suppression portion 122a contact the end face of the lead 304 can be used as the "lead frame deformation suppression process" in the method for manufacturing a resin molded product of the present invention.

In addition, in this embodiment, the resin molding method is not particularly limited, and can be the same as or based on a conventional resin molding method, for example, it can also be the same as the resin molding method described in Embodiment 1. Moreover, the overall structure and operation of the resin molding device are not particularly limited, and can also be the same as FIG. 2 (Embodiment 1).

[Implementation Method 3]

In addition, the present invention is not limited to Embodiments 1 and 2. In this embodiment, various examples of the molding die of the present invention are described.

The lower mold 211 of FIG. 4 (a) does not have a lower mold pressing part 222, and a deformation suppression part (deformation suppression mechanism) 222ax is provided on the main body of the lower mold 200 instead of the lower mold pressing part 222. A deformation suppression part 222ax is provided on the outer side of the left and right outermost lower mold cavities 201, respectively. At the upper end of the lower mold 200, the portion provided with the deformation suppression part 222ax protrudes upward more than the portion not provided with the deformation suppression part 222ax. The deformation suppression part 222ax is the same as the deformation suppression part 222a described in FIG. 3 and FIG. 8 to FIG. 10, and suppresses the displacement of the lead 304 by contacting at least a portion of the end face of the lead 304 (i.e., the end face of the lead frame 300), thereby suppressing the deformation of the lead frame 300.

The lower mold 200 of FIG. 4 (b) is the same as the lower mold 200 of FIG. 3 and FIG. 8 to FIG. 10, and has a pressing member 222 on the outer side of the lower mold cavity 201 at both ends. The above-mentioned deformation suppression portion 222a is provided on the pressing member 222. In addition, FIG. 4 (e) is a partial enlarged view when the lead frame is arranged on the lower mold of FIG. 4 (b).

The lower mold 200 of FIG. 4 (c) is an example in which the pressing part 222 of FIG. 4 (b) is divided into a plurality of parts (here, divided into three parts). Each pressing part 222 is provided with a deformation suppression portion 222a, similar to FIG. 4 (b). In this example, the pressing part 222 is divided into the same size, but the part in the central part where the deformation is greater may be larger than the other parts. The number of divisions and the size of the divided pressing parts 222 are preferably designed according to the shape of the lead frame to be molded.

The pressing part 222 of the lower mold 200 of FIG4(d) has a length and a width to press only the central part of the outermost lead 304 of the lead frame 300, and is set at a position to press only the central part of the outermost lead 304. Except for this, the lower mold 200 in FIG4(d) is the same as the lower mold 200 in FIG4(b). The pressing part 222 is provided with a deformation suppression portion 222a as in FIG4(b). The lower mold 200 of FIG4(d) is suitable for, for example, a case where the shape of the lead frame to be molded is greatly deformed in the central part.

In addition, in the molding die of the present invention, the position of the pressing part is not particularly limited, but in order to suppress the deformation of the lead frame, it is preferred to press the position of the low (weak) strength portion of the lead frame. The position where the pressing part is set is preferably a position that can press the connecting rod, and the position that can press the outermost connecting rod is particularly preferred. This is because, as mentioned above, the connecting rod has low strength and is easy to deform, and the connecting rod on the outer side is more likely to deform. In addition, Figures 4 (b) to (d) are examples of setting a deformation suppression mechanism on a part of the pressing part, but the present invention is not limited to this, and the pressing part and the deformation suppression mechanism can also be formed separately. For example, in an example in which a deformation suppressing portion (deformation suppressing mechanism) 222ax is provided on the main body of the lower mold 200 as shown in FIG. 4( a ), the lower mold 200 may include a pressing member separately from the deformation suppressing portion 222ax.

4( a ) to ( d ) show examples of the structure of the lower mold 200 . However, in the molding die of the present invention, the deformation suppression mechanism and the pressing member may be provided on the upper mold as described above.

In the molding die of the present invention, as described above, in order to suppress the deformation of the connecting rod, the pressing component is preferably set as far as possible on the outside, and more preferably can be located at a position that can suppress the deformation of the outermost connecting rod. As described above, this is because the deformation of the connecting rod is more likely to increase as it is farther outward. The pressing component can, for example, press the outermost lead as shown in FIG4 (b), or can be set to press the part of the lead frame where the deformation is large as shown in FIG4 (c) or (d). The shape of the pressing component is not limited to the top-view rectangular shape shown in FIG4 (b) to (d), and can also be a pin shape or a circular shape. However, considering the ease of processing and the uniformity of force application, the shape of the pressing component is preferably a top-view rectangular shape. In addition, the position where the pressing component presses the lead frame is not limited to the lead portion, but may be both the lead and the connecting rod, or may be only the connecting rod portion. Furthermore, the molding die of the present invention may have a pressing component or may not have a pressing component. In addition, in the molding die of the present invention, as described above, the deformation suppression mechanism may be integrated with the pressing component or may be formed separately from the pressing component. Furthermore, when the molding die of the present invention has a pressing component, the pressing component may be provided on both the upper mold and the lower mold, or may be provided on only one of them.

The molding die of the present invention is not limited thereto. The cross-sectional views of Fig. 5 (a) to (d) show examples of a portion of the molding die of the present invention. Fig. 5 (a) to (d) are cross-sectional views of only the outermost portions of the upper die 100 and the lower die 200 in the molding die 1000, respectively.

FIG5(a) shows an example in which pressing parts are provided on both the upper mold 100 and the lower mold 200, and a deformation suppression part (deformation suppression mechanism) is provided on the pressing part of the lower mold 200. In FIG5(a), the upper mold 100 has the same lead frame pressing mechanism 120 (including the elastic part 121 and the pressing part 122) as the upper mold 100 of FIG1 except that the deformation suppression part 122a is not provided. In FIG5(a), the lower mold 200 has the same lead frame pressing mechanism 220 (including the elastic part 221 and the pressing part 222) as the lower mold 200 of FIG3, and a deformation suppression part 222a is provided at the upper end of the pressing part 222 as in FIG3. In addition, the lower mold 200 of FIG5(a) is the same as the lower mold 200 of FIG4(b).

Fig. 5(b) shows an example in which no pressing member is provided in the upper mold 100 and the lower mold 200, and only the deformation suppression portion 222ax is provided in the lower mold 200. The lower mold 200 in Fig. 5(b) is the same as the lower mold 200 in Fig. 4(a).

FIG5(c) shows an example in which no pressing member is provided on the upper mold 100, but a lead frame pressing mechanism 220 (including an elastic member 221 and a pressing member 222) similar to FIG3 and FIG5(a) is provided on the lower mold 200. A deformation suppression portion 222a is provided at the upper end of the pressing member 222 similar to FIG3 and FIG5(a). In addition, the lower mold 200 of FIG5(c) is the same as the lower mold 200 of FIG4(b).

FIG5(d) shows an example in which no pressing member is provided on the lower mold 200, but a lead frame pressing mechanism 120 (including an elastic member 121 and a pressing member 122) similar to FIG1 is provided on the upper mold 100. The pressing member 122 is provided with a deformation suppression portion 122a similar to FIG1. The upper mold 100 and the lower mold 200 of FIG5(d) are the same as those of FIG1.

As described above, the pressing component of the molding die of the present invention can be provided on both the upper die and the lower die, can be provided on only one of the two, or can be provided at no time. It is particularly preferred that the pressing component is provided only on the lower die and not on the upper die. If no pressing component is provided on the upper die, as shown in FIG1(b), the connecting rod 302 will not be deformed by being pressed by the pressing component 122 of the upper die, and thus it is easier to suppress the deformation of the lead frame 300. On the other hand, if a pressing component is provided on the lower die, for example, as shown in FIG3(b), the pressing component 222 of the lower die can also act as a dam to prevent the resin from leaking from the lower die cavity 201. In addition, in the molding die of the present invention, as described above, the deformation suppression mechanism may be provided on both the upper die and the lower die, or may be provided on only one of them, or may not be provided, but it is preferred that the deformation suppression mechanism be provided on at least the lower die. If the deformation suppression mechanism is provided on the lower die, for example, as shown in FIG. 3( a ), when the lead frame 300 is placed on the lower die 200, the end face of the lead frame 300 is engaged with the deformation suppression portion (deformation suppression mechanism) 222 a, so that deformation of the entire lead frame 300 including the connecting rod 302 can be suppressed. In addition, it is particularly preferred that a pressing member is provided on the lower die, and the deformation suppression mechanism is provided on the pressing member of the lower die. Because if such a structure is adopted, as shown in, for example, Fig. 3 (a) to (b), the deformation suppression portion (deformation suppression mechanism) 222a provided on the pressing member 222 can easily suppress the deformation of the entire lead frame 300 including the connecting rod 302. In addition, according to such a structure, as described above, the pressing member 222 of the lower mold can also play the role of a dam to prevent the resin from leaking from the lower mold cavity 201.

Furthermore, the present invention is not limited to the above-mentioned embodiments, and any and appropriate combination, modification, or selection can be performed as needed without departing from the scope of the present invention.

Part or all of the above-mentioned implementation method may also be recorded as the following notes, but is not limited to the following contents.

(Note 1) A molding die for performing resin molding with the back side of a lead frame pad exposed, The molding die has an upper die and a lower die, At least one of the upper die and the lower die has a deformation suppression mechanism for suppressing deformation of the lead frame when the mold is closed, The deformation suppression mechanism contacts at least a portion of the end face of the lead frame to suppress deformation of the lead frame.

(Note 2) According to the molding die described in Note 1, the lead frame has a lead, a connecting rod and a pin in addition to the pad, the pad is suspended on the connecting rod by the pin, the lead frame has a frame member that surrounds the pad, the lead, the connecting rod and the pin as a whole, the end face of the lead frame includes the end face of the frame member, the deformation suppression mechanism suppresses the displacement of the frame member by contacting at least a part of the end face of the frame member, thereby suppressing the deformation of the lead frame.

(Note 3) According to the molding die described in Note 1, the lead frame has a lead, a connecting rod and a pin in addition to the pad, the pad is suspended on the connecting rod by the pin, the lead frame does not have a frame member that surrounds the pad, the lead, the connecting rod and the pin as a whole, the end surface of the lead frame includes the end surface of the lead, the deformation suppression mechanism suppresses the displacement of the lead by contacting at least a part of the end surface of the lead, thereby suppressing the deformation of the lead frame.

(Supplementary Note 4) The molding die according to Supplementary Note 2 or 3, wherein the molding die includes a pressing member for pressing the lead frame to suppress deformation of the connecting rod.

(Note 5) According to the molding die described in Note 4, the pressing member is provided on at least one of the upper die and the lower die.

(Note 6) The molding die according to Note 4 or 5, wherein a deformation suppression mechanism for suppressing deformation of the lead frame is provided on the pressing member.

(Note 7) According to any one of Notes 4 to 6, the molding die, wherein the pressing member is provided at a position capable of pressing the outermost portion of the lead frame.

(Note 8) A resin molding device comprising a molding die as described in any one of Notes 1 to 7.

(Note 9) A method for manufacturing a resin molded product, wherein the back side of a pad of a lead frame is exposed by using a molding die to perform resin molding, The method for manufacturing a resin molded product comprises: A lead frame loading step of loading the lead frame on the lower mold; and A lead frame deformation suppression step of suppressing deformation of the lead frame by the deformation suppression mechanism, In a state where the deformation of the lead frame is suppressed by the deformation suppression mechanism, the upper mold and the lower mold are clamped to perform resin molding on the lead frame.

This application claims priority based on Japanese patent application No. 2022-188768 filed on November 25, 2022, the disclosure of which is incorporated herein in its entirety.

1: Resin molding device 2: Supply module 4: Carry-out module 5: Conveyor mechanism (loader) 6: Conveyor mechanism (unloader) 7: Substrate supply module 8: Resin supply module 9: Control unit 71: Substrate delivery unit 72: Substrate supply unit 81: Resin delivery unit 82: Resin supply unit 100: Upper mold 101: Upper mold cavity 120: Lead frame pressing mechanism 121: Elastic component 122: Pressing component 122a: Deformation suppression unit (deformation suppression mechanism) 200: Lower mold 201: Lower mold cavity 220: Lead frame pressing mechanism 221: Elastic component 222: Pressing part 222a: Deformation suppression part (deformation suppression mechanism) 222ax: Deformation suppression part (deformation suppression mechanism) 300: Lead frame 301: Pad 302: Connecting rod 303: Pin 311: Connecting part 401: Substrate storage part 1000: Molding die 1000A, 1000B: Resin molding die A: Frame line indicating that the lead frame 300 does not have a frame part B: Frame line indicating that the connecting rod 302 is longer T: Resin sheet X11, X12, X21, X22, X31, X32: Arrows indicating the ascending direction of the lower die 200 Y11, Y12, Y13: Arrows indicating that a parallel force is applied to the connecting rod 302 G: Gap α: The surface of the deformation suppression portion 222a in contact with the end surface of the lead 304

1( a ) to ( c ) are process cross-sectional views showing an example of a molding die of the present invention and a method for producing a resin molded product of the present invention using the molding die.

FIG2 is a plan view showing an example of the overall structure of the resin molding device of the present invention.

3( a ) to ( c ) are process cross-sectional views showing another example of the molding die of the present invention and the method for producing the resin molded product of the present invention using the molding die.

Fig. 4 (a) is a plan view showing an example of a lower mold in the molding die of the present invention. Fig. 4 (b) to (d) are plan views showing another example of a lower mold in the molding die of the present invention. Fig. 4 (e) is a partial enlarged view when a lead frame is arranged on the lower mold of Fig. 4 (b).

Fig. 5(a) is a cross-sectional view showing an example of a deformation suppression mechanism in a molding die of the present invention. Fig. 5(b) is a cross-sectional view showing another example of a deformation suppression mechanism in a molding die of the present invention. Fig. 5(c) is a cross-sectional view showing still another example of a deformation suppression mechanism in a molding die of the present invention. Fig. 5(d) is a cross-sectional view showing still another example of a deformation suppression mechanism in a molding die of the present invention.

FIG6(a) is a plan view showing an example of a lead frame used in the molding die of the present invention and the method for manufacturing a resin molded product of the present invention using the molding die. FIG6(b) is an enlarged view of a portion of the lead frame of FIG6(a). FIG6(c) is a perspective view of the portion shown in FIG6(b). FIG6(d) is a cross-sectional schematic view of the lead frame of FIG6(a) when it is arranged in the lower mold of a conventional molding die.

FIG. 7 is a schematic diagram showing deformation of a connection bar in the lead frame shown in FIG. 6 .

FIG. 8 is a cross-sectional view showing an example of a state in which the deformation suppression mechanism of the molding die of the present invention is in contact with the end surface of the lead frame shown in FIG. 6 , and is an enlarged view of a portion of FIG. 3( a ).

Fig. 9 is a cross-sectional view showing an example of a state in which the deformation suppression mechanism of the molding die of the present invention is in contact with the end surface of the lead frame shown in Fig. 6. Fig. 9(a) is an overall plan view, Fig. 9(b) is a partially enlarged view, and Fig. 9(c) is a partially enlarged perspective view.

FIG. 10 is a cross-sectional view showing an example of a deformation suppression mechanism of the molding die of the present invention.

11( a ) to ( c ) are process cross-sectional views showing deformation of the connection bar in the lead frame shown in FIG. 6 .

without

100: Upper mold

101: Upper mold cavity

120: Lead frame pressing mechanism

121: Elastic parts

122: Pressing parts

122a: Deformation suppression unit (deformation suppression mechanism)

200: Lower mold

201: Lower mold cavity

300:Lead frame

301: Solder pad

303:Revoked

1000: Molding mold

X11, X12: Arrows indicating the rising direction of the lower die 200

Claims (9)

A molding die for performing resin molding by exposing the back side of a pad of a lead frame, the molding die comprising: an upper die; and a lower die, wherein at least one of the upper die and the lower die has a deformation suppression mechanism for suppressing deformation of the lead frame when the die is closed, wherein the deformation suppression mechanism contacts at least a portion of an end face of the lead frame to suppress deformation of the lead frame. A molding die as described in claim 1, wherein, the lead frame has a lead, a connecting rod and a pin in addition to the pad, the pad is suspended on the connecting rod by the pin, the lead frame has a frame member that surrounds the pad, the lead, the connecting rod and the pin as a whole, the end face of the lead frame includes the end face of the frame member, the deformation suppression mechanism suppresses the displacement of the frame member by contacting at least a portion of the end face of the frame member, thereby suppressing the deformation of the lead frame. A molding die as described in claim 1, wherein, the lead frame has a lead, a connecting rod and a pin in addition to the pad, the pad is suspended on the connecting rod by the pin, the lead frame does not have a frame member surrounding the pad, the lead, the connecting rod and the pin as a whole, the end surface of the lead frame includes the end surface of the lead, the deformation suppression mechanism suppresses the displacement of the lead by contacting at least a portion of the end surface of the lead, thereby suppressing the deformation of the lead frame. A molding die as described in claim 2 or 3, wherein the molding die includes a pressing component that presses the lead frame to suppress deformation of the connecting rod. A molding die as described in claim 4, wherein the pressing part is provided on at least one of the upper die and the lower die. A molding die as described in claim 4 or 5, wherein the deformation suppression mechanism for suppressing deformation of the lead frame is provided on the pressing part. A molding die as described in any one of claims 4 to 6, wherein the pressing part is arranged at an outermost position capable of pressing the lead frame. A resin molding device, comprising the molding die described in any one of claims 1 to 7. A method for manufacturing a resin molded product, wherein the back side of a pad of a lead frame is exposed by using a molding die to perform resin molding, The method for manufacturing a resin molded product comprises: a lead frame loading step of loading the lead frame on the lower mold; and A lead frame deformation suppression step of suppressing deformation of the lead frame by the deformation suppression mechanism, In a state where the deformation of the lead frame is suppressed by the deformation suppression mechanism, the upper mold and the lower mold are clamped to perform resin molding on the lead frame.

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