TW202421348A - Cutting device and method for manufacturing cut product - Google Patents

Abstract

The problem to be solved by the present invention is to provide a cutting device and a method for manufacturing a cut product, wherein the cutting device can provide information that helps improve the quality of the cut product to the operator, and the method for manufacturing the cut product can improve the quality of the cut product. In order to solve the above problem, the cutting device cuts the cutting object. The cutting device is equipped with: a platform, a cutting mechanism, and a shooting device. The platform holds the cutting object. The cutting mechanism cuts the cutting object held on the platform. The shooting device shoots the cutting object held on the platform. The object to be cut includes a plurality of marks formed in the shooting area of the shooting device. The cutting device further includes: a memory unit and a display unit. The memory unit stores each image and coordinate of the plurality of marks used as a reference. The display unit displays the offset of the coordinates stored in the memory unit compared with the corresponding mark among the plurality of marks used as a reference for each of the plurality of marks shot by the shooting device.

Description

Cutting device and method for manufacturing cut product

The present invention relates to a cutting device and a method for manufacturing a cut product.

Japanese Patent Publication No. 2018-142572 (Patent Document 1) discloses a cutting device that cuts a package substrate along a predetermined dividing line to separate packaged devices. In this cutting device, a plurality of alignment marks provided on the package substrate are detected. Then, the distance (maximum warp amount) between the straight line connecting the alignment mark as the starting point of the predetermined dividing line and the alignment mark as the end point of the predetermined dividing line, i.e., the baseline, and the alignment mark farthest from the baseline among the plurality of alignment marks corresponding to the predetermined dividing line is calculated. Cutting of the package substrate is performed based on whether the calculated maximum warp amount is below the allowable value (refer to Patent Document 1). [Prior Technical Document] (Patent Document)

Patent document 1: Japanese Patent Application Publication No. 2018-142572

[The problem the invention is trying to solve]

In the cutting device disclosed in the above-mentioned patent document 1, the cutting method of the package substrate is determined after considering the maximum warp amount of the package substrate, so even if the substrate has warp, the predetermined dividing line can be cut with good accuracy. However, the above-mentioned patent document 1 does not disclose a technology that further improves the quality of the package device (an example of the cut product) manufactured by the cutting device (an example of the cutting device).

The present invention is completed to solve such a problem, and its purpose is to provide a cutting device and a method for manufacturing a cut product, wherein the cutting device can provide the operator with information that helps improve the quality of the cut product, and the method for manufacturing the cut product can improve the quality of the cut product. [Technical means for solving the problem]

A cutting device according to one aspect of the present invention cuts a cutting object. The cutting device comprises: a platform, a cutting mechanism, and a photographing device. The platform holds the cutting object. The cutting mechanism cuts the cutting object held on the platform. The photographing device photographs the cutting object held on the platform. The cutting object includes a plurality of marks formed in a photographing area of the photographing device. The cutting device further comprises: a memory unit, and a display unit. The memory unit stores each image and coordinates of a plurality of marks serving as a reference. The display unit displays, for each of the plurality of markers photographed by the photographing device, an offset of coordinates stored in the storage unit compared with a corresponding marker among the plurality of markers serving as a reference.

In addition, a method for manufacturing a cut product according to another aspect of the present invention is a method for manufacturing a cut product using the above-mentioned cutting device. The above-mentioned cutting mechanism cuts the cutting object according to a pre-set cutting rule. The method for manufacturing a cut product includes: a step of displaying the offset of the coordinates of each of a plurality of marks photographed by a photographing device; a step of changing the setting of the cutting rule based on the displayed offset of the coordinates; and a step of manufacturing a cut product by cutting the cutting object according to the changed cutting rule. [Effects of the invention]

According to the present invention, a cutting device and a method for manufacturing a cut product can be provided. The cutting device can provide an operator with information that helps improve the quality of the cut product being manufactured, and the method for manufacturing the cut product can improve the quality of the cut product being manufactured.

Hereinafter, an embodiment of one aspect of the present invention (hereinafter also referred to as "the present embodiment") is described in detail using drawings. In addition, the same or corresponding parts in the drawings are given the same symbols and their descriptions are not repeated. In addition, for easy understanding, appropriate objects are schematically depicted in each drawing in an omitted or exaggerated manner.

[1. Configuration] ＜1-1. Configuration of cutting device＞ FIG. 1 is a schematic plan view of a cutting device 1 according to the present embodiment. The cutting device 1 is configured to singulate a package substrate (an example of a cutting object) into a plurality of electronic components (an example of a cut product) by cutting the package substrate. In the package substrate, a substrate or a lead frame to which a semiconductor chip is fixed is sealed with resin. In addition, the cutting object does not necessarily have to be a package substrate, and may be, for example, a substrate (including a wafer) that is not sealed with resin.

Examples of package substrates include BGA (ball grid array) package substrates, LGA (land grid array) package substrates, CSP (chip size package) package substrates, LED (light emitting diode) package substrates, and QFN (quad flat no-lead) package substrates.

Furthermore, the cutting device 1 is configured to be able to inspect each of the plurality of electronic components after being singulated. In the cutting device 1, an image of each electronic component is captured, and each electronic component is inspected based on the image. Inspection data is generated through the inspection, and each electronic component is classified as "good" or "defective".

In this example, a package substrate P1 is used as a cutting object, and the package substrate P1 is singulated into a plurality of electronic components S1 by the cutting device 1. In the following description, of the two sides of the package substrate P1, the side sealed with resin is referred to as a molding side, and the side opposite to the molding side is referred to as a solder ball/lead side. In addition, in the case of a substrate that is not sealed with resin as the cutting object, the side facing upward during cutting (cutting side) is equivalent to the solder ball/lead side in this embodiment, and the side opposite to the cutting side is equivalent to the molding side in this embodiment.

As shown in FIG1 , the cutting device 1 includes a cutting module A1 and an inspection/storage module B1 as components. The cutting module A1 is configured to manufacture a plurality of electronic components S1 by cutting a package substrate P1. The inspection/storage module B1 is configured to inspect each of the plurality of manufactured electronic components S1 and then store the electronic components S1 on a tray. In the cutting device 1, each component is detachable and interchangeable with respect to other components.

The cutting module A1 mainly includes: a substrate supply part 3, a positioning part 4, a cutting platform 5, a spindle part 6 and a conveying part 7.

The substrate supply unit 3 supplies the package substrates P1 one by one to the positioning unit 4 by pushing the package substrates P1 one by one from a substrate magazine M1 that accommodates a plurality of package substrates P1. At this time, the package substrates P1 are arranged with the solder balls/leads facing upward.

The positioning section 4 positions the package substrate P1 pushed from the substrate supply section 3 on the rail section 4a, and then the positioning section 4 transports the positioned package substrate P1 to the cutting stage 5.

The cutting platform 5 holds the package substrate P to be cut. Here is an example of a cutting device 1 having a double cutting platform structure with two cutting platforms 5. The cutting platform 5 includes: a holding member 5a, a rotating mechanism 5b and a moving mechanism 5c. The holding member 5a holds the package substrate P1 by adsorbing the package substrate P1 conveyed by the positioning part 4 from below. The rotating mechanism 5b can rotate the holding member 5a on the horizontal plane in the θ1 direction of the figure. The moving mechanism 5c can move the holding member 5a along the Y axis of the figure.

Fig. 2 is a schematic plan view of the retaining member 5a. Fig. 3 is a schematic view of the III-III section of Fig. 2. Referring to Fig. 2 and Fig. 3, the retaining member 5a includes: a retaining member body 31, and a clamp 32. The retaining member body 31 is a metal member that is rectangular in a plan view. The clamp 32 is installed above the retaining member body 31. A packaging substrate P1 is arranged on the clamp 32. In the Z-axis direction, a space SP1 is formed between the retaining member body 31 and the clamp 32. The space SP1 is connected to a suction mechanism not shown in the figure.

The clamp 32 includes: a plate-shaped portion 33 made of metal or resin, and a rubber portion 34. The clamp 32 mounted on the retaining member body 31 can be exchanged. The rubber portion 34 is composed of an elastic member such as rubber. The plate-shaped portion 33 and the rubber portion 34 each have a rectangular shape when viewed from a plane. A plurality of protrusions PR1 are formed on the top surface of the rubber portion 34 in a matrix-like arrangement. In this example, 18 protrusions PR1 are formed in a manner arranged in 3 columns × 6 rows.

A hole H1 is formed in each protrusion PR1. Each hole H1 penetrates the rubber portion 34 and the plate-like portion 33. Through each hole H1, the space outside the holding member 5a is connected to the space SP1. By performing suction using a suction mechanism (not shown) connected to the space SP1, the package substrate P1 is adsorbed through each hole H1. In this way, the package substrate P1 arranged on the rubber portion 34 is adsorbed and held.

A groove G1 is formed between two adjacent protrusions PR1. As described in detail below, the package substrate P1 held by suction on the rubber portion 34 is cut by a blade 6a (described below). When the package substrate P1 is cut, the blade 6a is located in the groove G1 and is not in contact with the rubber portion 34.

Referring again to FIG. 1 , the spindle portion 6 separates the package substrate P1 into a plurality of electronic components S1 by cutting the package substrate P1. Here, a cutting device 1 having a double spindle structure with two spindle portions 6 is illustrated. The spindle portion 6 can move along the X-axis and the Z-axis of the figure. In addition, the cutting device 1 can also be configured as a single spindle structure with one spindle portion 6.

The spindle portion 6 includes a blade 6a and a rotating shaft 6c. The blade 6a cuts the package substrate P1 by rotating at high speed, thereby singulating the package substrate P1 into a plurality of electronic components S1. The blade 6a is mounted on the rotating shaft 6c in a state of being clamped by a first flange and a second flange (not shown). The first flange and the second flange are fixed to the rotating shaft 6c by a fastening member (not shown) such as a nut.

The spindle portion 6 is provided with a cutting water nozzle, a cooling water nozzle, and a waste material spraying water nozzle. The cutting water nozzle sprays cutting water toward the blade 6a rotating at a high speed. The cooling water nozzle sprays cooling water toward the vicinity of the cutting portion of the package substrate P1. The waste material spraying water nozzle sprays waste material spraying water to blow away cutting debris and the like.

After the cutting platform 5 absorbs the package substrate P1, the first position confirmation camera 5d photographs the package substrate P1 to confirm the position of the package substrate P1. The confirmation using the first position confirmation camera 5d is, for example, for confirming the position of the alignment mark AL1 set on the package substrate P1. The position information of the alignment mark AL1 is used, for example, to determine the cutting line of the package substrate P1.

FIG. 4 is a diagram schematically showing an example of an alignment mark AL1 shown on the solder ball/lead surface of the package substrate P1. As shown in FIG. 4, in this example, a plurality of alignment marks AL1 are printed on the solder ball/lead surface of the package substrate P1. In this example, each of the plurality of alignment marks AL1 has a cross shape. In addition, the alignment mark AL1 does not necessarily have to be a cross shape, and can be any shape as long as it is a characteristic shape (unique shape). In addition, the plurality of alignment marks AL1 may not be the same shape.

Referring to FIG. 1 again, when the position of the alignment mark AL1 is confirmed, the cutting line of the package substrate P1 is determined based on the position information of the alignment mark AL1. The rotation angle of the rotating mechanism 5b is adjusted based on the determined cutting line. This series of actions for adjusting the cutting position of the package substrate P1 is also called "alignment". Alignment will be described in detail later.

Then, the cutting platform 5 moves along the Y axis in the figure toward the mandrel portion 6. After the cutting platform 5 moves to the bottom of the mandrel portion 6, the package substrate P1 is cut by moving the cutting platform 5 and the mandrel portion 6 relative to each other. Then, as needed, the package substrate P1 is photographed by the second position confirmation camera 6b of the mandrel portion 6 to confirm the position of the package substrate P1, etc. The confirmation using the second position confirmation camera 6b is, for example, for confirmation of the cutting position and cutting width of the package substrate P1.

After completing the cutting of the package substrate P1, the cutting platform 5 moves along the Y-axis in the figure in the direction away from the eccentric axis 6 while adsorbing the plurality of singulated electronic components S1. During this movement, the upper surface (solder ball/lead surface) of the electronic component S1 is cleaned and dried by the first cleaner 5e. This cleaning can be performed, for example, by directly spraying cleaning water on the upper surface of the electronic component S1, or by supplying cleaning water to the upper surface of the electronic component S1 through a brush or the like. In addition, in the cutting device 1, two first cleaners 5e are arranged in the X-axis direction of the figure, but the number of first cleaners 5e is not limited to two.

The conveying unit 7 sucks the electronic component S1 held on the cutting platform 5 from above and conveys the electronic component S1 to the inspection platform 11 of the inspection/storage module B1. During the conveying process, the lower surface (molding surface) of the electronic component S1 is cleaned and dried by the second cleaner 7a. This cleaning can be performed, for example, by directly spraying cleaning water on the lower surface of the electronic component S1, or by supplying cleaning water to the lower surface of the electronic component S1 through a brush or the like.

The inspection/storage module B1 mainly includes an inspection platform 11, a first optical inspection camera 12, a second optical inspection camera 13, a configuration unit 14, and a withdrawal unit 15. In addition, the first optical inspection camera 12 may also be disposed in the cutting module A1.

The inspection platform 11 holds the electronic component S1 for optical inspection of the electronic component S1. The inspection platform 11 can move along the X axis in the figure. The inspection platform 11 can also be turned upside down. A holding member is provided on the inspection platform 11, and the holding member holds the electronic component S1 by adsorbing the electronic component S1.

The first optical inspection camera 12 and the second optical inspection camera 13 take pictures of both sides (solder ball/lead side and molded side) of the electronic component S1. Various inspections of the electronic component S1 are performed based on the images (image data) taken by the first optical inspection camera 12 and the second optical inspection camera 13. Each of the first optical inspection camera 12 and the second optical inspection camera 13 is arranged near the inspection platform 11 so as to be able to take pictures from above.

The first optical inspection camera 12 photographs the molded surface of the electronic component S1 transported to the inspection platform 11 by the transport unit 7. Then, the transport unit 7 places the electronic component S1 on the holding member of the inspection platform 11. After the holding member absorbs the electronic component S1, the inspection platform 11 is turned upside down. The inspection platform 11 moves to the top of the second optical inspection camera 13, and the second optical inspection camera 13 photographs the solder ball/lead surface of the electronic component S1.

The electronic component S1 that has been inspected is arranged in the arrangement section 14. The arrangement section 14 is movable along the Y axis in the figure. The inspection platform 11 arranges the electronic component S1 that has been inspected in the arrangement section 14.

The extraction section 15 transfers the electronic component S1 that has been arranged in the arrangement section 14 to the tray. The electronic component S1 is classified as "good" or "defective" based on the results of the inspection using the first optical inspection camera 12 and the second optical inspection camera 13. The extraction section 15 transfers each electronic component S1 to the tray 15a for good products or the tray 15b for defective products based on the results of the classification. That is, good products are stored in the tray 15a for good products, and defective products are stored in the tray 15b for defective products. Once each of the tray 15a for good products and the tray 15b for defective products is filled with electronic components S1, it is replaced with a new tray.

The cutting device 1 further includes a computer 50 and a monitor 20. The monitor 20 is configured to display images. The monitor 20 is configured by a display device such as a liquid crystal monitor or an organic EL (organic electroluminescence) monitor.

The computer 50 controls the operation of the cutting module A1 and the inspection/storage module B1. The computer 50 controls the operation of the substrate supply unit 3, the positioning unit 4, the cutting platform 5, the spindle unit 6, the conveying unit 7, the inspection platform 11, the first optical inspection camera 12, the second optical inspection camera 13, the configuration unit 14, the extraction unit 15, and the monitor 20.

<1-2. Hardware structure of computer> Figure 5 is a diagram schematically showing the hardware structure of computer 50. As shown in Figure 5, computer 50 includes a control unit 70, an input/output I/F (interface) 90, an input unit 95, and a memory unit 80, and each structure is electrically connected via a bus.

The control unit 70 includes a CPU (Central Processing Unit) 72, a RAM (Random Access Memory) 74, and a ROM (Read Only Memory) 76. The control unit 70 is configured to control each component in the computer 50 and each component in the cutting device 1 in accordance with information processing.

The input/output interface 90 is configured to communicate with each component included in the cutting device 1 via a signal line. The input/output interface 90 is used to transmit data from the computer 50 to each component in the cutting device 1, and to receive data transmitted from each component in the cutting device 1 to the computer 50. The input unit 95 is configured to receive instructions from a user (operator). The input unit 95 is, for example, composed of a part or all of a touch panel, a keyboard, a mouse, and a microphone.

The memory unit 80 is constituted by, for example, an auxiliary memory device such as a hard disk drive or a solid state hard disk drive. The memory unit 80 is constituted to store, for example, a control program 81. By executing the control program 81 by the control unit 70, various actions in the cutting device 1 are realized. When the control unit 70 is to execute the control program 81, the control program 81 is expanded into the RAM 74. In addition, the control unit 70 controls each component by interpreting and executing the control program 81 expanded into the RAM 74 by the CPU 72.

[2. Overview of alignment] As described above, in the cutting device 1, alignment is performed before the package substrate P1 is cut by the spindle portion 6. Generally, the shapes of the plurality of package substrates P1 prepared for the manufacture of the electronic component S1 are not exactly the same. For example, the substrate warping condition of each package substrate P1 is slightly different. From the perspective of suppressing the quality degradation of the manufactured electronic component S1, the cutting line of the package substrate P1 should be adjusted according to the warping condition of the package substrate P1. Therefore, in the cutting device 1, alignment is performed before the package substrate P1 is cut by the spindle portion 6. Next, an overview of alignment is described.

In the cutting device 1, the shape and coordinates of the alignment mark AL1 used for alignment are pre-registered. The pre-registered coordinates of the alignment mark AL1 are used as a reference for alignment. The registration of the shape and coordinates of the alignment mark AL1 is performed, for example, by an operator of the cutting device 1 (hereinafter also simply referred to as "operator"). Information indicating the shape and coordinates of the alignment mark AL1 is pre-stored in the memory unit 80 of the computer 50.

Fig. 6 schematically shows an example of alignment marks AL1 used for alignment when cutting the package substrate P1 along the long side direction (hereinafter also referred to as "first alignment"). Referring to Fig. 6, in this example, a plurality of alignment marks AL1 corresponding to three cutting lines CL1 extending along the long side direction are used as a reference for the first alignment.

FIG. 7 is a diagram schematically showing a data platform TB1 for managing data used for the first alignment. Referring to FIG. 7 , the data platform TB1 manages the shape information and coordinate information of each alignment mark AL1 used as a reference in the first alignment. The shape information and coordinate information of each alignment mark AL1 are generated based on the shape and coordinates of the alignment mark AL1 registered by the above-mentioned operator. In the data platform TB1, each alignment mark AL1 is assigned a unique number (No.), and the shape, X-coordinate value, and Y-coordinate value of the alignment mark AL1 are associated with each number. The data platform TB1 is stored in the memory unit 80 of the computer 50.

Fig. 8 schematically shows an example of alignment marks AL1 used for alignment when cutting the package substrate P1 along the short side direction (hereinafter also referred to as "second alignment"). Referring to Fig. 8, in this example, a plurality of alignment marks AL1 corresponding to three cutting lines CL1 extending along the short side direction are used as a reference for the second alignment.

FIG. 9 is a diagram schematically showing a data platform TB2 for managing data used for the second alignment. Referring to FIG. 9 , the data platform TB2 manages the shape information and coordinate information of each alignment mark AL1 used as a reference in the second alignment. The shape information and coordinate information of each alignment mark AL1 are generated based on the shape and coordinates of the alignment mark AL1 registered by the above-mentioned operator. In the data platform TB2, each alignment mark AL1 is assigned a unique number (No.), and the shape, X-coordinate value, and Y-coordinate value of the alignment mark AL1 are associated with each number. The data platform TB2 is stored in the memory unit 80 of the computer 50.

In the cutting device 1, the range to search for the alignment mark AL1 (hereinafter also referred to as the "first search range") is predetermined in the first alignment based on the coordinate information managed in the data platform TB1. The first search range is, for example, composed of a plurality of search ranges. The first search range is, for example, composed of a plurality of search ranges centered on the coordinates of each alignment mark AL1 managed in the data platform TB1.

Furthermore, in the cutting device 1, the range to search for the alignment mark AL1 (hereinafter also referred to as the "second search range") is predetermined during the second alignment based on the coordinate information managed in the data platform TB2. The second search range is, for example, composed of a plurality of search ranges. The second search range is, for example, composed of a plurality of search ranges centered on the coordinates of the alignment marks AL1 managed in the data platform TB2.

The first alignment is performed by photographing the package substrate P1 with the first position confirmation camera 5d in a state where the long side direction of the package substrate P1 is along the Y-axis. Specifically, a search is performed within the first search range for the image photographed by the first position confirmation camera 5d, and the coordinates of each alignment mark AL1 are detected and memorized. Based on the coordinates of each alignment mark AL1, the offset is calculated as described below to determine the cutting line of the package substrate P1. Then, the angle of the rotating mechanism 5b and the position of the blade 6a are adjusted to perform cutting along the determined cutting line. The first alignment is performed in this order.

In addition, the second alignment is performed by photographing the package substrate P1 with the first position confirmation camera 5d in the state where the short side direction of the package substrate P1 is along the Y axis. Specifically, a search is performed within the second search range for the image photographed by the first position confirmation camera 5d, and the coordinates of each alignment mark AL1 are detected and memorized. Based on the coordinates of each alignment mark AL1, the offset is calculated as described below to determine the cutting line of the package substrate P1. Then, the angle of the rotating mechanism 5b and the position of the blade 6a are adjusted to perform cutting along the determined cutting line. The second alignment is performed in this order.

In this manner, in the cutting device 1, alignment is performed before cutting the package substrate P1 by the spindle portion 6. Therefore, according to the cutting device 1, the package substrate P1 can be appropriately cut according to the warping state of each package substrate P1.

[3. Alignment mark offset display function] For example, the quality (e.g., cutting quality) of the electronic component S1 produced by the above alignment is sometimes insufficient. Also, sometimes it is desired to further improve the quality of the manufactured electronic component S1. In such a case, it is convenient if the cutting device 1 provides the operator with information that helps improve the quality of the manufactured electronic component S1.

In the cutting device 1, during the first alignment, for each alignment mark AL1 detected by shooting with the first position confirmation camera 5d, the offset of the coordinates obtained by comparing with the corresponding alignment mark AL1 among the plurality of alignment marks AL1 managed in the data platform TB1 as a reference is calculated, and the calculation result is stored in the memory unit 80. Furthermore, during the second alignment, for each alignment mark AL1 detected by shooting with the first position confirmation camera 5d, the offset of the coordinates obtained by comparing with the corresponding alignment mark AL1 among the plurality of alignment marks AL1 managed in the data platform TB2 as a reference is calculated, and the calculation result is stored in the memory unit 80.

For example, the offset calculated by each alignment is correlated with the warp condition of the package substrate P1. For example, when the quality of the manufactured electronic component S1 is insufficient, by confirming the offset related to the package substrate P1 used to manufacture the electronic component S1, it is sometimes possible to find that the reason for the insufficient quality of the electronic component S1 is the warp condition of the package substrate P1. If the cause is found, the quality of the electronic component S1 can be improved by eliminating the cause. That is, the offset calculated by each alignment can be information that helps improve the quality of the electronic component S1.

The cutting device 1 is provided with a function of displaying the deviation of the alignment mark. The deviation display function is a function of displaying the deviation calculated by each alignment on the monitor 20. For example, the deviation of the package substrate P1 selected by the operator among the plurality of package substrates cut by the cutting device 1 is displayed on the monitor 20.

Fig. 10 schematically shows an example of an image IM1 showing the offset in the X-axis direction calculated by the first alignment (indicated as "X-axis offset" in Fig. 14 described below). Referring to Fig. 10 , the image IM1 includes offset information MA1, MA2, and MA3. The image IM1 is displayed on the monitor 20, for example.

The offset information MA1 indicates the offset of each alignment mark AL1 corresponding to the cut line CL1 on the left (FIG. 6). The offset information MA1 is formed by connecting a plurality of offsets MP1 and grouping them. The length between each offset MP1 included in the offset information MA1 and the reference line SL1 on the left in the figure indicates the offset of each alignment mark AL1 in the X-axis direction.

The offset information MA2 indicates the offset of each alignment mark AL1 corresponding to the central cutting line CL1 (FIG. 6). The offset information MA2 is formed by connecting a plurality of offsets MP1 and grouping them. The length between each offset MP1 included in the offset information MA2 and the central reference line SL1 in the figure indicates the offset of each alignment mark AL1 in the X-axis direction.

The offset information MA3 indicates the offset of each alignment mark AL1 corresponding to the right-side cutting line CL1 (FIG. 6). The offset information MA3 is formed by connecting a plurality of offsets MP1 and grouping them. The length between each offset MP1 included in the offset information MA3 and the baseline SL1 on the right side of the figure indicates the offset of each alignment mark AL1 in the X-axis direction. In addition, each baseline SL1 may be displayed on the monitor 20 or not.

In this way, in the cutting device 1, for each of the plurality of alignment marks AL1 photographed by the first position confirmation camera 5d, the offset of the coordinates (specifically, the offset in the X-axis direction) obtained by comparing the corresponding alignment mark AL1 among the plurality of alignment marks AL1 serving as the reference stored in the memory unit 80 is displayed. The operator can identify the warp state of the package substrate P1, for example, by confirming the offset of each displayed coordinate. The warp state of the package substrate P1 is related to the quality of the electronic component S1, so the offset of each coordinate can be regarded as information that helps improve the quality of the electronic component S1. Therefore, according to the cutting device 1, by displaying the offset of each alignment mark AL1 on the monitor 20, it is possible to provide the operator with information that helps improve the quality of the manufactured electronic component S1.

Furthermore, in the cutting device 1, the offset of the alignment mark AL1 photographed by the first position confirmation camera 5d is displayed in group units (specifically, group units of the alignment mark AL1 for each cutting line). By confirming the offset displayed in group units, the operator can more easily recognize the warping state of the electronic component S1, for example. Therefore, according to the cutting device 1, by displaying each offset in group units on the monitor 20, it is possible to provide the operator with information that helps improve the quality of the manufactured electronic component S1.

[4. Action] ＜4-1. Alignment preparation action＞ Figure 11 is a flowchart showing the alignment preparation sequence. The processing shown in this flowchart is executed by the control unit 70 of the computer 50, for example. In addition, here, the case where all the alignment marks AL1 of one package substrate P1 are of the same shape is recorded. When part or all of the alignment marks AL1 in one package substrate P1 are different, it is sufficient to perform the alignment preparation action for each alignment mark AL1. The preparation sequence of the first alignment and the second alignment is substantially the same, so the preparation sequence of the first alignment is described here.

Referring to Figure 11, the control unit 70 executes the registration processing of each alignment mark AL1 used for the first alignment (step S100). For this registration processing, for example, the package substrate P1 selected by the operator is arranged on the retaining member 5a in a manner such that the long side direction is along the Y-axis direction. The package substrate P1 arranged on the retaining member 5a is photographed by the first position confirmation camera 5d. For example, based on the image photographed by the first position confirmation camera 5d, a plurality of alignment marks AL1 are detected, and the operator selects an alignment mark AL1 as a reference from the plurality of alignment marks AL1 detected. This selection is performed, for example, by the input unit 95 of the computer 50. The images and coordinates of each alignment mark AL1 selected as a reference are stored in the storage unit 80. With this, the login process is completed.

After the registration process is completed, the control unit 70 sets the area (shooting area) to be photographed by the first position confirmation camera 5d during the first alignment (step S110). In step S110, for example, a plurality of shooting areas are set. The plurality of shooting areas set in step S110 correspond to the plurality of search ranges included in the first search range. Information related to the set shooting areas is stored in the memory unit 80. In this way, the preparation for the first alignment is completed.

<4-2. Alignment and cutting operation> Figure 12 is a flowchart showing the sequence of alignment and cutting. The processing shown in this flowchart is executed by the control unit 70 of the computer 50, for example, when the package substrate P1 held by the holding member 5a is located below the first position confirmation camera 5d. In addition, the sequence of the first alignment and the second alignment is substantially the same, so the sequence of the first alignment and cutting is described here.

12, the control unit 70 controls the first position confirmation camera 5d to capture an uncaptured capture area among the plurality of capture areas set in step S110 of FIG. 11 (step S200). The control unit 70 detects the alignment mark AL1 included in the image captured by the first position confirmation camera 5d, and obtains the coordinate information of the detected alignment mark AL1 (step S210). The control unit 70 calculates the offset (sometimes simply referred to as "offset") of the detected alignment mark AL1 in the X-axis direction, and stores the calculated offset in the memory unit 80 (step S220).

The control unit 70 determines whether the shooting is completed for all of the plurality of shooting areas set in step S110 of Fig. 11 (step S230). If it is determined that the shooting is not completed (No in step S230), the control unit 70 executes the process of step S200 again.

On the other hand, if it is determined in step S230 that the shooting is completed (yes in step S230), the control unit 70 calculates a plurality of (three in this example) cutting lines based on the coordinate information of each of the plurality of detected alignment marks AL1 (step S240).

The control unit 70 determines whether the relative positional relationship between the cutting platform 5 and the blade 6a can be corrected so that the cutting is performed along the calculated cutting line (step S250). If it is determined that the positional relationship cannot be corrected (No in step S250), the cutting of the package substrate P1 will not be performed, and the processing shown in this flowchart ends. For example, when the blade 6a contacts the protrusion PR1 (FIG. 3) of the rubber portion 34 regardless of how the rotation angle of the rotating mechanism 5b and the position of the blade 6a are adjusted, it is determined that the positional relationship cannot be corrected.

On the other hand, if it is determined that the positional relationship can be corrected (yes in step S250), the control unit 70 corrects the relative positional relationship between the cutting platform 5 and the spindle unit 6 to perform cutting along the cutting line calculated in step S240 (step S260). Then, the control unit 70 controls the cutting platform 5 and the spindle unit 6 to perform cutting of the package substrate P1 (step S270).

<4-3. Display operation of the offset of the alignment mark> Figure 13 is a flowchart showing the display sequence of the offset of the alignment mark AL1. For example, when the operator performs the start operation of the offset display function, the processing shown in this flowchart is executed by the control unit 70 of the computer 50.

13, the control unit 70 determines whether the package substrate P1, which is the display target of the offset amount of the alignment mark AL1, has been selected by the operator (step S300). If it is determined that the package substrate P1 has not been selected (No in step S300), the control unit 70 waits until the package substrate P1 is selected.

On the other hand, if it is determined that the package substrate P1 has been selected (Yes in step S300), the control unit 70 reads the offset of each alignment mark AL1 of the selected package substrate P1 from the memory unit 80 (step S310). The control unit 70 controls the monitor 20 to display the read offsets (step S320).

FIG14 is a diagram showing an example of an image displayed on the monitor 20 in step S320 of FIG13. As shown in FIG14, this image includes display areas 21, 22, 23, 24, 25, and 26. Display area 21 displays information that specifies the package substrate P1 selected by the operator. Display area 22 displays an image showing the coordinates of each alignment mark AL1 used as a reference in the first alignment. Display area 23 displays an image showing the coordinates of each alignment mark AL1 used as a reference in the second alignment.

The display area 24 displays the offset information generated based on the offset calculated in the first alignment. The display area 25 displays the offset information generated based on the offset calculated in the second alignment. In the graphs displayed in the display areas 24 and 25, the scales are adjusted so that each offset is visually easy to identify. In each of the display areas 24 and 25, each baseline SL1 (Figure 10) can be further displayed. The display area 26 displays the coordinate information of each alignment mark AL1 displayed in the display area (display area 22 or display area 23) selected by the cursor CS1. The coordinate information of each alignment mark AL1 in the display area 26 can be easily understood if it is displayed in a separate table in group units (specifically, the group unit of the alignment mark AL1 of each cutting line).

Thus, in the cutting device 1, for each of the plurality of alignment marks AL1 photographed by the first position confirmation camera 5d, the offset of the coordinates (specifically, the offset in the X-axis direction) compared with the corresponding alignment mark AL1 among the plurality of alignment marks AL1 serving as the reference stored in the memory unit 80 is displayed. According to the cutting device 1, by displaying the offset of each alignment mark AL1 on the monitor 20, information that helps improve the quality of the manufactured electronic component S1 can be provided to the operator.

<4-4. Re-modification of manufacturing conditions> Figure 15 is a flowchart showing the procedure for re-modifying the manufacturing conditions of the electronic component S1. The steps shown in this flowchart are performed by the operator.

Referring to FIG. 15 , the operator confirms the offset information displayed on the monitor 20 (step S400). The operator changes the setting of the cutting rule of the package substrate P1 based on the offset information displayed on the monitor 20 (step S410). As an example of the cutting rule, there can be listed: the number of alignment marks AL1 used during alignment, and the calculation algorithm of the cutting line. The operator uses the cutting device 1 after changing the setting of the cutting rule to perform the manufacture of the electronic component S1 again (step S420).

Thus, in the manufacturing method of the electronic component S1, the setting of the cutting rule is changed based on the offset of the alignment mark AL1 displayed by the monitor 20. Therefore, according to the manufacturing method of the electronic component S1, the quality of the manufactured electronic component S1 can be improved by re-modifying the cutting rule.

[5. Features] As described above, in the cutting device 1 according to the present embodiment, for each of the plurality of alignment marks AL1 photographed by the first position confirmation camera 5d, the offset of the coordinates obtained by comparing the corresponding alignment mark AL1 among the plurality of alignment marks AL1 serving as a reference stored in the memory unit 80 is displayed. By confirming the offset of each displayed coordinate, the operator can, for example, identify the warp state of the package substrate P1. The warp state of the package substrate P1 is related to the quality of the electronic component S1, so the offset of each coordinate can be considered as information that helps improve the quality of the electronic component S1. Therefore, according to the cutting device 1, by displaying the offset of each alignment mark AL1 on the monitor 20, it is possible to provide the operator with information that helps improve the quality of the manufactured electronic component S1.

In addition, the cutting device 1 is an example of the "cutting device" in the present invention. The cutting platform 5 is an example of the "platform" in the present invention. The spindle part 6 is an example of the "cutting mechanism" in the present invention. The first position confirmation camera 5d is an example of the "shooting device" in the present invention. The memory unit 80 is an example of the "memory unit" in the present invention. The monitor 20 is an example of the "display unit" in the present invention. The input unit 95 is an example of the "input unit" in the present invention. The clamp 32 is an example of the "holding device" in the present invention.

[6. Other implementation forms] The concept of the above implementation forms is not limited to the implementation forms described above. The following describes an example of other implementation forms to which the concept of the above implementation forms can be applied.

<6-1> In the above-mentioned embodiment, the offsets of the plurality of alignment marks AL1 related to the package substrate P1 selected by the operator are displayed on the monitor 20 as offset information (offset information MA1, MA2, MA3) in group units corresponding to each cutting line CL1. However, the plurality of offsets do not necessarily need to be displayed in group units. For example, in each of the offset information MA1, MA2, MA3, the plurality of offsets MP1 may be displayed on the monitor 20 in a state where each offset MP1 is not connected by a line.

<6-2> For example, in each of the display areas 24 and 25 of FIG. 14 , only the offset information of the alignment mark AL1 is displayed. However, for example, other information may be additionally displayed in each of the display areas 24 and 25 .

FIG. 16 is a diagram for explaining a first example of additional information displayed. Referring to FIG. 16 , for example, in addition to the offset information MA1, MA2, and MA3, the cut lines CL11, CL12, and CL13 and the reference line SL1 may also be displayed on the monitor 20. Each of the cut lines CL11, CL12, and CL13 represents a cut line actually used for cutting the package substrate P1. By referring to the cut lines CL11, CL12, and CL13, the operator can explore the relationship between each cut line and the quality of the electronic component S1.

FIG. 17 is a diagram for explaining a second example of additional information displayed. Referring to FIG. 17 , for example, in addition to the example shown in FIG. 16 , further break line candidates CL21, CL22, and CL23 may also be displayed on the monitor 20. Each of the break line candidates CL21, CL22, and CL23 is calculated using an algorithm different from the algorithm used to calculate each of the break lines CL11, CL12, and CL13. As an example of an algorithm, an algorithm using the average value of the offset and an algorithm using the least squares method may be cited. By referring to the break line candidates CL21, CL22, and CL23, the operator can discuss the adoption of other break line candidates. In addition, a plurality of break line candidates may be displayed for each break line.

<6-3> FIG. 18 is a diagram schematically showing an example of other images displayed on the monitor 20. Referring to FIG. 18, this image includes display areas 27, 28, and 29. In display area 27, for example, the image of display area 25 of FIG. 14 is displayed. For example, when display area 25 is selected while the image of FIG. 14 is displayed on the monitor 20, the image shown in FIG. 18 is displayed on the monitor 20. For example, if display area 24 is selected while the image of FIG. 14 is displayed on the monitor 20, the image of display area 24 of FIG. 14 can be displayed in display area 27.

A plurality of selection items are displayed in the display area 28, and each selection item is associated with any one of the plurality of offset information displayed in the display area 27. In this example, the selection item displayed as "COL1" is associated with the offset information on the left. The selection item displayed as "COL2" is associated with the offset information in the center. The selection item displayed as "COL3" is associated with the offset information on the right. In this example, "COL1" is selected.

The display area 29 displays the offset information corresponding to the item selected in the display area 28. The display area 29 displays the offset information MA1, the cutting line CL1, the blade position information BL1 (specifically, the width of the blade is displayed as two straight lines), and the rubber position information RA1. The blade position information BL1 is information showing the position of the blade 6a when cutting along the cutting line CL1. In this example, the blade 6a is located in the groove G1. The rubber position information RA1 is information showing the position of the protrusion PR1 when cutting along the cutting line CL1. In addition, the display area 29 displays the positional relationship between the blade 6a and the protrusion PR1 in a state where the inclination of the cutting line CL1 is corrected. Furthermore, the inclination of the offset information MA1 is also corrected in conjunction with the correction of the inclination of the cutting line CL1.

Thus, in this cutting device 1, in addition to the cutting line, the blade position information BL1 and the rubber position information RA1 are further displayed on the monitor 20. Therefore, according to this cutting device 1, information showing the positional relationship between the cutting line, the protrusion PR1 of the rubber portion 34, and the blade 6a can be provided to the operator. For example, when the production of the electronic component S1 is stopped and the blade position information BL1 and the rubber position information RA1 overlap, if the operator continues the production of the electronic component S1, the blade 6a will contact the protrusion PR1, so that the operator can recognize that the production of the electronic component S1 has stopped.

<6-4> In the above-mentioned embodiment, the coordinates of the alignment mark AL1 used as the reference are pre-stored in the memory unit 80, and the offset between the coordinates of the alignment mark AL1 photographed by the first position confirmation camera 5d and the coordinates of the alignment mark AL1 used as the reference is calculated. By displaying the calculated offset on the monitor 20, it is determined to what extent the package substrate P1 photographed by the first position confirmation camera 5d is offset from the package substrate P1 used as the reference. However, the reference for confirming the offset between package substrates P1 is not limited to the alignment mark AL1. The information used as the reference is described in order below.

(6-4-1) FIG. 19 is a diagram schematically showing a first other example of a mark whose coordinates are pre-stored in the memory unit 80. Referring to FIG. 19, the mark MK1 represents the portion where the two longitudinal and transverse cutting grooves CG1 intersect in the package substrate P1 after cutting (an example of a characteristic portion in the package substrate P1 after cutting). For example, the coordinates of the mark MK1 serving as a reference may be pre-stored in the memory unit 80, and the offset between the coordinates of the mark MK1 detected in the image taken by the second position confirmation camera 6b and the coordinates of the mark MK1 serving as a reference may be displayed on the monitor 20. This enables the operator to recognize the offset caused by cutting the package substrate P1. For example, by confirming how the offset changes for each cutting rule, it is possible to find the cutting rule that minimizes the offset.

(6-4-2) FIG. 20 schematically shows a second other example of a mark whose coordinates are pre-stored in the memory unit 80. Referring to FIG. 20, the internal mark IN1 is printed on the molded surface of the electronic component S1, for example. For example, the coordinates of the internal mark IN1 serving as a reference may be pre-stored in the memory unit 80, and the offset between the coordinates of the internal mark IN1 detected in the image taken by the second position confirmation camera 6b and the coordinates of the internal mark IN1 serving as a reference may be displayed on the monitor 20. This enables the operator to identify the offset of the internal mark IN1 in each electronic component S1.

The above is an illustrative description of the embodiments of the present invention. That is, the detailed description and the accompanying drawings are disclosed for the purpose of illustrative description. Therefore, the components described in the detailed description and the accompanying drawings may include components that are not essential when solving the problem. Therefore, it should not be immediately determined that these non-essential components are essential just because they are described in the detailed description and the accompanying drawings.

Furthermore, the above-mentioned embodiments are merely examples of the present invention in all points. The above-mentioned embodiments can be variously improved or modified within the scope of the present invention. That is, when implementing the present invention, a specific structure can be appropriately adopted corresponding to the embodiment.

[6. Notes] This manual discloses various technical ideas including at least the following technologies.

<Technique 1> (Construction) A cutting device is a cutting device for cutting a cutting object, wherein the device comprises: a platform that holds the cutting object; a cutting mechanism that cuts the cutting object held on the platform; and, a shooting device that shoots the cutting object held on the platform; the cutting object includes a plurality of marks formed in a shooting area of the shooting device; the cutting device further comprises: a storage unit that stores the image and coordinates of each of the plurality of marks as a reference; and, A display unit that displays, for each of the plurality of marks photographed by the photographing device, an offset of coordinates obtained by comparing the coordinates of the corresponding mark among the plurality of marks serving as a reference and stored in the storage unit.

(Effects, etc.) In this cutting device, for each of the plurality of marks photographed by the photographing device, the offset of the coordinates obtained by comparing the corresponding mark among the plurality of marks serving as the reference and stored in the memory unit is displayed. The operator of the cutting device can identify the warping of the object to be cut by confirming the offset of each displayed coordinate, for example. The warping of the object to be cut is related to the quality of the cut product, so the offset of each coordinate can be regarded as information that helps improve the quality of the cut product. Therefore, according to this cutting device, by displaying the offset of each coordinate on the display unit, it is possible to provide the operator with information that helps improve the quality of the cut product to be manufactured.

<Technique 2> (Construction) A cutting device as described in Technique 1, wherein the plurality of marks are composed of a plurality of groups, each of the plurality of groups is associated with a cutting line of the cutting object of the cutting mechanism, and the display unit displays the offset of the coordinates in units of each of the plurality of groups.

(Effects, etc.) In this cutting device, the offset of the coordinates of each mark photographed by the photographing device is displayed in group units. By confirming the offset of the coordinates displayed in group units, the operator can more easily recognize the warping of the cutting object, for example. Therefore, according to this cutting device, by displaying the offset of each coordinate in group units on the display unit, it is possible to provide the operator with information that helps improve the quality of the manufactured cut products.

<Technique 3> (Construction) The cutting device as described in Technique 2 further comprises a control unit, which determines the cutting line associated with each of the plurality of groups based on the coordinates of each of the plurality of marks photographed by the photographing device, and the display unit further displays the cutting line determined by the control unit.

(Effects, etc.) In this cutting device, the cutting line determined by the control unit is further displayed. The operator can confirm the cutting line of the cutting object by visually confirming the display unit. The cutting line of the cutting object can be said to be information that helps improve the quality of the cut product. Therefore, according to this cutting device, by further displaying the cutting line on the display unit, it is possible to provide the operator with information that helps improve the quality of the manufactured cut product.

<Technique 4> (Construction) A cutting device as described in Technique 3, wherein the control unit determines one or more candidates for cutting lines corresponding to the cutting line based on the coordinates of each of the plurality of marks photographed by the photographing device, and the display unit further displays the candidate for the one or more cutting lines determined by the control unit.

(Effects, etc.) In this cutting device, one or more candidates for cutting lines determined by the control unit are further displayed. The operator can confirm one or more candidates for cutting lines by visually confirming the display unit. Candidates for cutting lines can be information that helps improve the quality of cut products. Therefore, according to this cutting device, by displaying the candidates for cutting lines on the display unit, information that helps improve the quality of the cut products to be manufactured can be provided to the operator.

<Technique 5> (Construction) A cutting device as described in any one of Techniques 1 to 4, wherein the memory unit stores the offset of the coordinates associated with each of the plurality of marks for each of the plurality of cutting objects, The cutting device further comprises an input unit that receives an input for selecting any one of the plurality of cutting objects, The display unit displays the offset of the coordinates associated with the cutting object selected by the input unit.

(Effects, etc.) In this cutting device, the offset of the coordinates of each mark related to the cutting object selected by the operator is displayed. Therefore, according to this cutting device, it is possible to provide the operator with information showing the offset of the coordinates of each mark related to the cutting object selected by the operator.

<Technique 6> (Construction) A cutting device as described in any one of Techniques 1 to 5, wherein the object to be cut is a package substrate, and each of the plurality of marks is an alignment mark provided on the package substrate, a characteristic portion of the package substrate after cutting, or an internal mark provided on an electronic component after singulation by cutting the package substrate.

<Technique 7> (Structure) A cutting device as described in any one of Techniques 3 to 6, wherein the platform includes a holder that holds the object to be cut, the cutting mechanism cuts the object to be cut by a blade, and the display unit further displays the holder and the blade.

(Effects, etc.) In this cutting device, in addition to displaying the cutting line, the holder and the blade are further displayed. Therefore, according to this cutting device, it is possible to provide the operator with information showing the positional relationship between the cutting line, the holder, and the blade.

<Technique 8> (Construction) A method for manufacturing a cut product, which is a method for manufacturing a cut product using a cutting device described in any one of Techniques 1 to 7, wherein the method comprises the following steps: The cutting mechanism cuts the cutting object in accordance with a pre-set cutting rule, and displays the offset of the coordinates related to each of the plurality of marks photographed by the photographing device; The setting of the cutting rule is changed based on the displayed offset of the coordinates; and, The cutting object is cut in accordance with the changed cutting rule to thereby manufacture the cut product.

(Effects, etc.) In this method for manufacturing cut products, the setting of the cutting rule is changed based on the offset of the displayed coordinates. Therefore, according to this method for manufacturing cut products, the quality of the manufactured cut products can be improved by re-modifying the cutting rule.

1: Cutting device 3: Substrate supply unit 4: Positioning unit 4a: Track unit 5: Cutting platform 5a: Holding member 5b: Rotating mechanism 5c: Moving mechanism 5d: First position confirmation camera 5e: First cleaner 6: Spindle unit 6a: Blade 6b: Second position confirmation camera 6c: Rotating axis 7: Transport unit 7a: Second cleaner 11: Inspection platform 12: First optical inspection camera 13: Second optical inspection camera 14: Arrangement unit 15: Extraction unit 15a: Tray for good products 15b: Tray for bad products 20: Monitor 21,22,23,24,25,26,27,28,29: Display area 31: Main body of holding member 32: Clamp 33: Plate-shaped part 34: Rubber part 50: Computer 70: Control part 72: CPU 74: RAM 76: ROM 80: Memory part 81: Control program 90: Input/output I/F 95: Input part A1: Cutting module AL1: Alignment mark B1: Inspection/storage module BL1: Blade position information CG1: Cutting groove CL1,CL11,CL12,CL13: Cutting line CL21,CL22,CL23: Cutting line standby CS1: Cursor G1: Groove H1: Hole IM1: Image IN1: Internal Mark M1: Substrate Box MA1, MA2, MA3: Offset Information MK1: Mark MP1: Offset P1: Package Substrate PR1: Protrusion RA1: Rubber Position Information S1: Electronic Parts SL1: Baseline SP1: Space TB1, TB2: Data Platform

FIG. 1 is a schematic plan view of a cutting device. FIG. 2 is a schematic plan view of a retaining member. FIG. 3 is a schematic view of a III-III section of FIG. 2. FIG. 4 is a schematic view of an example of an alignment mark shown in a solder ball/lead surface of a package substrate. FIG. 5 is a schematic view of a hardware configuration of a computer. FIG. 6 is a schematic view of an example of an alignment mark used for alignment when a package substrate is cut along a long side direction. FIG. 7 is a schematic view of a data platform for managing data for a first alignment. FIG. 8 is a schematic view of an example of an alignment mark used for alignment when a package substrate is cut along a short side direction. FIG. 9 is a schematic view of a data platform for managing data for a second alignment. FIG. 10 is a diagram schematically showing an example of an image showing an offset calculated by the first alignment. FIG. 11 is a flowchart showing the preparation sequence of alignment. FIG. 12 is a flowchart showing the sequence of alignment and cutting. FIG. 13 is a flowchart showing the display sequence of the offset of the alignment mark. FIG. 14 is a diagram showing an example of an image displayed on the monitor in step S320 of FIG. 13. FIG. 15 is a flowchart showing the re-modification sequence of the manufacturing conditions of the electronic component. FIG. 16 is a diagram for explaining a first example of other information to be displayed additionally. FIG. 17 is a diagram for explaining a second example of other information to be displayed additionally. FIG. 18 is a diagram schematically showing an example of other images displayed on the monitor. FIG. 19 is a diagram schematically showing a first alternative example of a mark in which coordinates are pre-stored in a memory unit. FIG. 20 is a diagram schematically showing a second alternative example of a mark in which coordinates are pre-stored in a memory unit.

Domestic storage information (please note in the order of storage institution, date, and number) None Foreign storage information (please note in the order of storage country, institution, date, and number) None

1: Cutting device

3: Substrate supply unit

4: Positioning unit

4a: Track section

5: Cut off the platform

5a: Retaining components

5b: Rotating mechanism

5c: Mobile mechanism

5d: First position confirmation camera

5e: First Cleaner

6: Axis

6a: Blade

6b: Second location confirmation camera

6c: Rotation axis

7: Transportation Department

7a: Second cleaner

11: Check the platform

12: First optical inspection camera

13: Second optical inspection camera

14: Configuration Department

15: Extraction section

15a: tray for good products

15b: Tray for defective products

20: Monitor

50: Computer

A1: Cutting module

B1: Inspection/storage module

P1: packaging substrate

Claims (8)

A cutting device is a cutting device for cutting a cutting object, wherein the device comprises: a platform that holds the cutting object; a cutting mechanism that cuts the cutting object held on the platform; and, a photographing device that photographs the cutting object held on the platform; the cutting object includes a plurality of marks formed in a photographing area of the photographing device; the cutting device further comprises: a memory unit that stores the coordinates of each of the plurality of marks as a reference; and, A display unit that displays, for each of the plurality of marks photographed by the photographing device, an offset of coordinates obtained by comparing the coordinates of the corresponding mark among the plurality of marks serving as a reference and stored in the storage unit. A cutting device as described in claim 1, wherein the plurality of marks are composed of a plurality of groups, each of the plurality of groups is associated with a cutting line of the cutting object of the cutting mechanism, and the display unit displays the offset of the coordinates in units of each of the plurality of groups. The cutting device as described in claim 2 further comprises a control unit, which determines the cutting line based on the coordinates of each of the plurality of marks photographed by the photographing device, and the display unit further displays the cutting line determined by the control unit. The cutting device as described in claim 3, wherein the control unit determines one or more candidates for cutting lines corresponding to the cutting line based on the coordinates of each of the plurality of marks photographed by the photographing device, and the display unit further displays the candidate for the one or more cutting lines determined by the control unit. A cutting device as described in any one of claims 1 to 4, wherein the memory unit stores the offset of the coordinates associated with each of the plurality of marks for each of the plurality of cutting objects, the cutting device further comprises an input unit that receives an input for selecting any one of the plurality of cutting objects, the display unit displays the offset of the coordinates associated with the cutting object selected by the input unit. A cutting device as described in any one of claims 1 to 5, wherein the object to be cut is a package substrate, and each of the plurality of marks is an alignment mark provided on the package substrate, a characteristic portion of the package substrate after cutting, or an internal mark provided on an electronic component after singulation by cutting the package substrate. A cutting device as described in any one of claims 3 to 6, wherein the platform includes a holder that holds the object to be cut, the cutting mechanism cuts the object to be cut by a blade, and the display further displays the holder and the blade. A method for manufacturing a cut product, which is a method for manufacturing a cut product using the cutting device described in any one of claims 1 to 7, wherein the method comprises the following steps: The cutting mechanism cuts the cutting object according to a pre-set cutting rule, and displays the offset of the coordinates related to each of the plurality of marks photographed by the photographing device; The setting of the cutting rule is changed based on the displayed offset of the coordinates; and, The cutting object is cut according to the changed cutting rule to thereby manufacture the cut product.

Images