TW202412597A - Installation operation condition management device, parts mounting machine, installation operation condition management method, and recording medium - Google Patents

Abstract

The present invention manages a plurality of process recipe conditions R1 to R4 (mounting action conditions) that respectively define the actions of the part mounting machine 1 as management objects by means of the action condition management unit 813. The part mounting machine 1 produces a substrate on which parts are mounted by mounting the part Wp on the substrate B. The performance of the actions performed by the part mounting machine 1 based on the management object, i.e., the process recipe conditions R1 to R4, to produce a substrate on which parts are mounted is obtained as performance data Dp1 to Dp4. The performance data Dp1 to Dp4 are stored in correspondence with the process recipe conditions R1 to R4 when the performance data Dp1 to Dp4 are obtained. Furthermore, the performance data Dp1 to Dp4 saved by the performance saving process of step S303 are displayed on the display of UI12 in correspondence with the process recipe conditions R1 to R4 when the performance data Dp1 to Dp4 are obtained.

Description

Installation action condition management device, parts installation machine, installation action condition management method and recording medium

The present invention relates to a technology for managing mounting motion conditions that define the motion of a parts mounting machine, wherein the parts mounting machine produces a substrate on which parts are mounted by mounting parts on a substrate.

A part mounting machine is known, which mounts parts on a substrate by sucking parts supplied by a part supply device such as a belt feeder through a nozzle arranged on a mounting head. In the part mounting machine, when the action conditions of various actions performed to mount parts on a substrate are inappropriate, poor action such as failure to properly perform the action may occur. Therefore, in Japanese Patent Gazette No. 5007261, a technology for specifying a nozzle that causes a defect is disclosed. In addition, in Japanese Patent Gazette No. 2020-017554, a technology is disclosed, which determines whether the identification parameters are properly saved based on whether the identification of the parts sucked on the nozzle is successful or not based on specific identification parameters.

According to the technology of Japanese Patent Gazette No. 5007261, it is possible to identify a nozzle that causes poor installation. However, it is difficult for a user to grasp the best nozzle for suppressing the occurrence of poor installation. Furthermore, according to the technology of Japanese Patent Gazette No. 2020-017554, it is possible to avoid the situation where inappropriate identification parameters are saved and then used for part identification. However, it is difficult for a user to grasp the appropriate identification parameters for suppressing the failure of part identification. In this way, although it is possible to avoid the use of installation action conditions (nozzles, identification parameters) that will cause poor operation, it is difficult for a user to grasp the installation action conditions suitable for suppressing poor operation.

The present invention has been made in view of the above-mentioned problems, and its object is to provide a technology that allows users to easily grasp the installation operation conditions suitable for suppressing malfunction.

The mounting action condition management device of the present invention comprises: an action condition management unit, which manages a plurality of mounting action conditions that respectively define the actions of a part mounting machine as a management object, wherein the part mounting machine produces a substrate on which parts are mounted by mounting parts on a substrate; a performance acquisition unit, which acquires the performance of the actions performed by the part mounting machine based on the mounting action conditions as the management object to produce the substrate on which parts are mounted as performance data; and a UI control unit, which controls the user interface; and the action condition management unit executes the performance acquisition unit. The performance saving process is to save the performance data obtained by the performance acquisition part by establishing a correspondence with the installation action conditions when the performance data is obtained; in the performance saving process, the performance data is saved by establishing a correspondence with the type of the substrate on which the parts are mounted produced by the part mounting machine when the performance data is obtained; the UI control unit will establish a correspondence between the performance data of the substrate on which the parts of the same type are mounted and saved by the performance saving process, and the installation action conditions when the performance data is obtained, and present it to the user using the user interface.

The parts mounting machine of the present invention produces a substrate with parts mounted thereon by mounting parts on the substrate, and is provided with: an action condition management unit, which manages a plurality of mounting action conditions that respectively define the actions of the parts mounting machine as management objects; a performance acquisition unit, which acquires the performance of the actions performed by the parts mounting machine based on the mounting action conditions as management objects to produce the substrate with parts mounted thereon as performance data; and a UI control unit, which controls the user interface; and the action condition management unit executes performance saving processing, the The performance saving process is to save the performance data obtained by the performance acquisition department by establishing a correspondence with the installation action conditions when the performance data is obtained; in the performance saving process, the performance data is saved by establishing a correspondence with the type of the substrate on which the parts are mounted using the parts mounting machine when the performance data is obtained; the UI control unit will establish a correspondence between the performance data of the substrate on which the same type of parts are mounted and saved by the performance saving process and the installation action conditions when the performance data is obtained, and present it to the user using the user interface.

The mounting action condition management method of the present invention comprises the following steps: managing a plurality of mounting action conditions that respectively define the actions of a part mounting machine as a management object, wherein the part mounting machine produces a substrate on which parts are mounted by mounting parts on a substrate; obtaining the performance of the actions performed by the part mounting machine based on the mounting action conditions as the management object to produce the substrate on which parts are mounted as performance data; and executing The performance saving process is to save the performance data by establishing a correspondence with the installation action conditions when the performance data was obtained and the type of the substrate on which the parts produced by the part mounting machine have been installed; and the performance data of the substrate on which the parts of the same type have been installed, which is saved by the performance saving process, is established in correspondence with the installation action conditions when the performance data was obtained, and is presented to the user using the user interface.

The mounting action condition management program of the present invention enables a computer to execute the following process: managing a plurality of mounting action conditions that respectively define the actions of a part mounting machine as a management object, wherein the part mounting machine produces a substrate on which parts are mounted by mounting parts on a substrate; obtaining the performance of the actions performed by the part mounting machine based on the mounting action conditions as the management object to produce the substrate on which parts are mounted as an actual result; The performance data is stored by establishing a correspondence between the performance data, the installation action conditions when the performance data was obtained, and the type of the substrate on which the parts produced by the parts mounting machine have been installed; and the performance data of the substrate on which the parts of the same type have been installed, which is stored by the performance storage process, is established in correspondence with the installation action conditions when the performance data was obtained, and is presented to the user using the user interface.

The recording medium of the present invention records the above-mentioned installation action condition management program in a computer-readable manner.

In the present invention (installation action condition management device, part mounting machine, installation action condition management method, installation action condition management program and recording medium) thus constituted, a plurality of installation action conditions that respectively define the actions of the part mounting machine are managed as management objects, and the part mounting machine produces a substrate on which parts are mounted by mounting parts on the substrate. Furthermore, the performance of the actions performed by the part mounting machine based on the installation action conditions as the management object to produce the substrate on which parts are mounted is obtained as performance data. The performance data is saved in correspondence with the installation action conditions when the performance data was obtained (performance saving processing). Furthermore, in the performance saving process, the performance data is saved in correspondence with the type of the substrate on which the parts are mounted produced by the parts mounting machine when the performance data is obtained. In addition, the performance data of the substrate on which the parts of the same type are mounted and saved by the performance saving process is presented to the user using the user interface in correspondence with the installation action conditions when the performance data is obtained. Therefore, the user can use the user interface to confirm the performance data representing the performance of the action performed based on the installation action conditions. As a result, the user can easily grasp the installation action conditions suitable for suppressing poor action.

Furthermore, the mounting action condition management device may be configured such that, when the UI control unit confirms the user's operation of selecting a performance data from the performance data presented to the user using the user interface, the action condition management unit causes the parts mounting machine to execute an action for producing a substrate on which parts are mounted using the mounting action condition corresponding to the performance data. In this configuration, the user can cause the parts mounting machine to execute an action for producing a substrate on which parts are mounted using the mounting action condition determined to be appropriate while confirming the performance data.

Furthermore, the mounting action condition management device may be configured such that the mounting action condition is a combination of a plurality of action parameters that define actions performed by the parts mounting machine to produce a substrate on which parts are mounted. In this configuration, the user can use the user interface to confirm performance data indicating the performance of the actions performed based on the plurality of action parameters. As a result, the user can easily grasp the combination of the plurality of action parameters that is suitable for suppressing action defects.

Furthermore, the installation action condition management device may be configured such that the performance data includes a plurality of performance evaluation items for evaluating the actions performed by the parts mounting machine to produce a substrate on which parts are mounted. In this configuration, the user can conduct various studies based on the plurality of performance evaluation items. As a result, the user can easily and reliably grasp the installation action conditions suitable for suppressing bad actions.

Furthermore, various specific examples of performance evaluation items can be imagined. That is, the installation action condition management device can also be configured so that the performance data includes at least one of production efficiency, adsorption rate, error rate and installation accuracy as performance evaluation items. The above-mentioned production efficiency is an indicator related to the time required for the production of the substrate on which the parts are mounted. The above-mentioned adsorption rate is an indicator related to the ratio of the nozzle that adsorbs the parts to mount the parts on the substrate successfully adsorbs the parts. The above-mentioned error rate is an indicator related to the frequency of errors generated by the parts mounting machine. The above-mentioned installation accuracy is an indicator related to the position accuracy of the parts mounting machine when mounting the parts on the substrate.

Furthermore, the installation action condition management device may be configured such that the action condition management unit calculates a performance evaluation result of the installation action condition based on a plurality of performance evaluation items, and the UI control unit presents the performance evaluation result to the user using a user interface. In this configuration, the user can easily grasp the installation action condition suitable for suppressing action defects based on the performance evaluation result.

Furthermore, the UI control unit accepts the user's operation on the user interface for inputting the importance of each of the plurality of performance evaluation items, and the action condition management unit calculates the performance evaluation result while performing weighting corresponding to the importance. In this configuration, the user can judge whether the installation action condition is appropriate based on the performance evaluation result calculated according to the user's importance of each performance evaluation item. As a result, the user can easily grasp the installation action condition that meets his needs.

Furthermore, the mounting action condition management device may be configured such that the parts mounting machine performs an action for producing a substrate on which parts are mounted based on the mounting action condition set for the parts mounting machine, and when the mounting action condition set for the parts mounting machine is changed, the action condition management unit adds the changed mounting action condition to the management object. In this configuration, the user can understand whether each mounting action condition is appropriate while changing the mounting action condition.

Furthermore, the installation action condition management device may be configured such that the UI control unit presents the change time of the installation action condition set for the part installation machine and the performance data saved by the performance saving process before and after the change time to the user in a time series using the user interface. In this configuration, it is possible to grasp whether the installation action condition is appropriate while referring to the performance data before and after the change time of the installation action condition.

Furthermore, the installation action condition management device may be configured such that when the performance data acquired by the performance acquisition unit deviates from the allowable range, the action condition management unit starts the performance saving process. In this configuration, when the action of the parts mounting machine produces an undesirable tendency, the performance data is saved. Therefore, the user can study the appropriate installation action conditions to appropriately deal with the undesirable tendency.

According to the present invention, the user can easily grasp the installation operation conditions suitable for suppressing malfunction.

FIG. 1 is a block diagram showing an example of a part mounting system having a part mounting machine of the present invention. The part mounting system 9 has a part mounting machine 1, a substrate inspection machine 91, and a conveyor 92 for conveying a substrate B (FIG. 2) from the part mounting machine 1 to the substrate inspection machine 91. The part mounting machine 1 performs part mounting to mount a part Wp on a mounting target point of the substrate B, and the substrate inspection machine 91 performs mounting position inspection, that is, measures the positional deviation between the part Wp mounted on the substrate B and the mounting target point. In addition, the mounting position inspection result obtained by the substrate inspection machine 91, that is, the position measurement result I, is sent from the substrate inspection machine 91 to the part mounting machine 1.

Fig. 2 is a top view schematically showing an example of the component mounting machine of the present invention, and Fig. 3 is a block diagram showing the electrical structure of the component mounting machine of Fig. 1. Fig. 2 shows the X direction as a horizontal direction, the Y direction as a horizontal direction orthogonal to the X direction, and the Z direction as a vertical direction.

As shown in FIG3 , the part mounting machine 1 has a controller 8 for controlling various parts of the part mounting machine 1. The controller 8 has an operation processing unit 81 and a memory unit 82. The operation processing unit 81 is a processor such as a CPU (Central Processing Unit) that performs various operations. The memory unit 82 is a storage device such as an SSD (Solid State Drive) that stores the following management program Pp and database DB. In addition, the operation processing unit 81 controls the communication unit 11 and UI (User Interface) 12 of the part mounting machine 1. Here, the communication unit 11 performs communication with the substrate inspection machine 91. UI11 has input devices such as a mouse and a keyboard, and output devices such as a display. Furthermore, the input device and output device of UI11 do not need to be separately constructed, and can be integrated by a touch panel display. Correspondingly, the calculation processing unit 81 has a communication control unit 811 that controls the communication unit 11, and a UI control unit 812 that controls the UI12. The communication control unit 811 stores the position measurement result I received by the communication unit 11 from the substrate inspection machine 91 in the memory unit 82. In addition, the UI control unit 812 processes the input of the input device of UI12 and makes the output device of UI12 output information.

Furthermore, by executing the management program Pp in the calculation processing unit 81, a communication control unit 811 and a UI control unit 812 are constructed in the calculation processing unit 81. Also, along with the execution of the management program Pp, the following action condition management unit 813 and performance acquisition unit 814 are also constructed in the calculation processing unit 81. In addition, the management program Pp is stored in the memory unit 82. The management program Pp can be provided in the memory unit 82 (recording medium) when the part mounting machine 1 is shipped from the factory, or it can be downloaded from a memory device (recording medium) such as an Internet server and stored in the memory unit 82. Alternatively, the data may be read from a USB (Universal Serial Bus) memory (recording medium) and stored in the memory unit 82 .

The component mounting machine 1 mounts the component Wp on the substrate B carried in from the upstream side in the X direction (substrate conveying direction) and then carries it out to the downstream side in the X direction. A plurality of mounting target points are set on the substrate B, and the controller 8 mounts the component Wp on each mounting target point by controlling each part of the component mounting machine 1. Here, the component Wp is a bare chip of a cut wafer W, which is attached to an adhesive sheet Ws.

The part mounting machine 1 has a conveying section 2 for conveying a substrate B along the X direction. The conveying section 2 has an infeed conveyor 21, an installation conveyor 22, and an outfeed conveyor 23 arranged in sequence along the X direction, and these conveyors 21 to 23 cooperate to convey the substrate B along the X direction. Correspondingly, the controller 8 has a conveying control section 85 for controlling the conveying of the substrate B by the conveying section 2. The conveying control section 85 performs the following actions by controlling the infeed conveyor 21, the installation conveyor 22, and the outfeed conveyor 23. That is, the conveying control section 85 makes the substrate B brought in from the outside of the part mounting machine 1 by the infeed conveyor 21 stand by at the infeed standby position Li on the infeed conveyor 21. Furthermore, the transport control unit 85 stops the substrate B transported from the transport standby position Li on the transport conveyor 21 to the working position Lm on the installation conveyor 22 at the working position Lm. Furthermore, the transport control unit 85 makes the substrate B transported from the working position Lm on the installation conveyor 22 to the transport standby position Lo on the transport conveyor 23 standby at the transport standby position Lo. Furthermore, when the substrate B can be transported into the substrate inspection machine 91, the transport control unit 85 transports the substrate B from the transport standby position Lo on the transport conveyor 23 toward the substrate inspection machine 91.

In addition, the component mounting machine 1 has a component supply mechanism 3 for supplying components Wp. Accordingly, the controller 8 has a component supply control unit 86 for controlling the component supply mechanism 3. The component supply mechanism 3 has a wafer table 31 that supports the wafer W, and a component removal unit 35 that removes the component Wp from the wafer W supported by the wafer table 31. The component removal unit 35 has a removal head 36 that removes the component Wp from the wafer table 31, and the removal head 36 can be driven in the X direction and the Y direction.

That is, the component removal section 35 includes an X-axis track 351 that supports the removal head 36 so that it can move in the X direction, and an X-axis motor 352 that drives a ball screw that extends in the X direction and is mounted on the removal head 36. In addition, the component removal section 35 includes a Y-axis track 353 that supports the X-axis track 351 so that it can move in the Y direction, a ball screw 354 that extends in the Y direction and is mounted on the X-axis track 351, and a Y-axis motor 355 that drives the ball screw 354. Therefore, the parts supply control unit 86 can move the removal head 36 in the X direction by driving the ball screw using the X-axis motor 352, and can move the removal head 36 in the Y direction together with the X-axis rail 351 by driving the ball screw 354 using the Y-axis motor 355.

The removal head 36 has a bracket 361 extending in the X direction, and two lifting nozzles 362 supported by the bracket 361 and rotatable. Each lifting nozzle 362 is located at either a suction position facing downward or a handover position facing upward (the position in FIG. 2 ) by rotating around a rotation axis parallel to the X direction. In addition, the removal head 36 has a Z-axis motor 363 that drives the bracket 361 in the Z direction. The parts supply control unit 86 drives the bracket 361 with the Z-axis motor 363, so that the lifting nozzle 362 can move in the Z direction together with the bracket 361.

Furthermore, the parts supply mechanism 3 has an ejector pin that ejects the parts Wp to be sucked by the lifting nozzle 362 from the lower side of the sheet Ws, and an ejector motor 37 that drives the ejector pin in the Z direction. Therefore, the parts supply control unit 86 can move the ejector pin in the Z direction by driving the ejector motor 37 to drive the ejector pin.

The part supply control unit 86 that controls the part supply mechanism 3 makes the lifting nozzle 362 at the suction position face the part Wp on the wafer table 31 from above, so that the lifting nozzle 362 is lowered and contacts the part Wp. In addition, the part supply control unit 86 uses the ejection pin to lift the center of the part Wp, thereby separating the part Wp from the sheet Ws, and applies negative pressure to the lifting nozzle 362, so that the lifting nozzle 362 sucks the part Wp from the sheet Ws. Then, the part supply control unit 86 removes the part Wp from the wafer table 31 by raising the lifting nozzle 362. Furthermore, the part supply control unit 86 supplies the part Wp by positioning the lifting nozzle 362 at the handover position.

The part mounting machine 1 is provided with a part transfer unit 4, which transfers the part Wp supplied by the part supply mechanism 3 as described above to the substrate B stopped at the working position Lm. Accordingly, the controller 8 has a part transfer control unit 87 for controlling the part transfer unit 4. The part transfer unit 4 has: a support member 41, which can move along a fixed rail provided on the top wall of the part mounting machine 1 in the Y direction; and a mounting head 42, which is supported by the support member 41 and can move in the X direction; the mounting head 42 has two transfer nozzles 421 facing downward. Furthermore, the component transfer unit 4 has an X-axis motor 43 that drives the mounting head 42 in the X direction, a Y-axis motor 44 that drives the supporting member 41 and the mounting head 42 in the Y direction, and a Z-axis motor 45 that drives the transfer nozzle 421 in the Z direction. Therefore, the component transfer control unit 87 can move the mounting head 42 in the X direction by the X-axis motor 43 and move the mounting head 42 in the Y direction by the Y-axis motor 44. Furthermore, the component transfer control unit 87 can move the transfer nozzle 421 in the Z direction by the Z-axis motor 45.

The part transfer control unit 87 controls the part transfer unit 4 to move the mounting head 42 to the top of the removal head 36 when the part Wp is adsorbed and mounted, and when the transfer nozzle 421 faces the part Wp held by the lifting nozzle 362 at the handover position from above, the transfer nozzle 421 is lowered and contacts the part Wp. Subsequently, the part supply control unit 86 releases the negative pressure of the lifting nozzle 362, and at the same time, the part transfer control unit 87 applies negative pressure to the transfer nozzle 421 and raises the transfer nozzle 421. When the transfer nozzle 421 of the mounting head 42 is used to absorb the part Wp, the part transfer control unit 87 moves the mounting head 42 so that the part Wp absorbed by the transfer nozzle 421 faces the mounting target point of the substrate B stopped at the mounting position Pm from above. Furthermore, the part transfer control unit 87 lowers the transfer nozzle 421 so that the part Wp absorbed by the transfer nozzle 421 contacts the mounting target point of the substrate B. In this way, after the part Wp contacts the mounting target point of the substrate B, the part transfer control unit 87 releases the negative pressure of the transfer nozzle 421. In this way, the part Wp is transferred to the mounting target point of the substrate B.

Furthermore, the part mounting machine 1 has a part recognition camera 51 disposed upward. Accordingly, the controller 8 has an imaging control unit 88 for controlling the part recognition camera 51. The part recognition camera 51 photographs the part Wp adsorbed on the transfer nozzle 421 from below before transferring the part Wp to the substrate B. That is, the part transfer control unit 87 makes the part Wp face the part recognition camera 51 from above before making the part Wp face the mounting target point of the substrate B when the mounting head 42 adsorbs the part Wp through the transfer nozzle 421. Accordingly, the imaging control unit 88 irradiates the part Wp with illumination light from the part recognition camera 51 while making the part recognition camera 51 photograph the part Wp, thereby obtaining an image of the part Wp. Furthermore, the imaging control unit 88 recognizes the position of the part Wp adsorbed on the transfer nozzle 421 based on the result of binarizing the image of the part Wp with a specific threshold (part recognition). Subsequently, the part transfer control unit 87 controls the position of the transfer nozzle 421 according to the position of the part Wp recognized by the imaging control unit 88, and transfers the part Wp to the mounting target point of the substrate B.

FIG. 4 is a flow chart showing the actions in substrate production performed by the component mounting machine of FIG. 2 . In the substrate production, a component mounted substrate is produced by mounting a component Wp on a substrate B. When a plurality of components mounted substrates are produced, the substrate production of FIG. 4 is repeatedly performed. Furthermore, by repeatedly performing the substrate production of FIG. 4 while changing the type of the component mounted substrate, a specific number of components mounted substrates of different types can be produced successively. When the component mounted substrate to be produced is changed, at least one of the type of the substrate B carried into the component mounting machine 1 or the type of the component Wp mounted on the substrate B by the component mounting machine 1 is changed.

In step S101, the transport control unit 85 controls the transport unit 2 to transport the substrate B that has been transported to the transport standby position Li to the working position Lm, and stops the substrate B at the working position Lm. In step S102, the component supply control unit 86 controls the component removal unit 35 to supply the component Wp taken out from the wafer W by the lifting nozzle 362 to the mounting head 42. Correspondingly, the component transfer control unit 87 controls the component transfer unit 4 to use the transfer nozzle 421 to absorb the component Wp supplied by the lifting nozzle 362 (step S103).

In this way, when the adsorption of the part Wp is completed, the part supply control unit 86 controls the part transfer unit 4 so that the part Wp adsorbed by the transfer nozzle 421 faces the part recognition camera 51 from above. Then, the part recognition of step S104 is performed. That is, the camera control unit 88 obtains an image of the part Wp by photographing the part Wp using the part recognition camera 51. Then, the camera control unit 88 recognizes the position of the part Wp based on the image. Furthermore, in the case where the position recognition of the part Wp fails, steps S102 to S104 are re-executed. Steps S102 to S104 are re-executed until the identification is successful or the number of executions reaches a specified number of retries.

Thus, the position of the part Wp obtained by the imaging control unit 88 is sent to the part transfer control unit 87. The part transfer control unit 87 controls the part transfer unit 4 to adjust the position of the transfer nozzle 421 based on the position of the part Wp obtained from the imaging control unit 88, and aligns the part Wp with the part mounting point of the substrate B, thereby transferring the part Wp to the part mounting point of the substrate B (step S105). Then, steps S101 to S105 are repeatedly executed until the transfer of the part Wp to all the part mounting points of the substrate B is completed (until "YES" is obtained in step S106).

It is mentioned that the production of the substrate in FIG4 is performed based on various action parameters set for the part mounting machine 1. Next, the setting and management of the action parameters will be explained. The action parameters set for the part mounting machine 1 include: process recipe parameters, which change according to the type of the substrate on which the parts are mounted; and machine parameters, which are not set according to the type of the substrate on which the parts are mounted. That is, when the type of the substrate on which the parts are mounted produced by the part mounting machine 1 changes, the process recipe parameters set for the part mounting machine 1 change before and after the substrate type changes, and on the other hand, the machine parameters set for the part mounting machine 1 do not change before and after the substrate type changes. Therefore, the process recipe parameters are established in correspondence with the type of the substrate on which the parts are mounted and managed.

The following are examples of process recipe parameters: ・Ejector pin rise amount…During the part supply of step S102, the amount by which the ejector motor 37 raises the ejector pin in order to peel the part Wp from the sheet Ws ・Ejector pin rise speed…During the part supply of step S102, the speed at which the ejector motor 37 raises the ejector pin in order to peel the part Wp from the sheet Ws ・Lifting nozzle descent amount…During the part supply of step S102, the amount by which the lifting nozzle 362 is lowered toward the part Wp in order to absorb the part Wp ・Lifting nozzle descent speed…During the part supply of step S102, the speed at which the lifting nozzle 362 is lowered toward the part Wp in order to absorb the part Wp ・Illumination level…In the part recognition of step S104, the level of illumination light irradiated from the part recognition camera 51 to the part Wp ・Threshold…In the part recognition of step S104, the threshold used to binarize the image of the part Wp ・Tolerance…In the part recognition of step S104, the tolerance of the edge position detected by binarizing the image of the part Wp ・Part size…The size of the part to be recognized in step S104 ・Transfer height…In the part transfer of step S105, the height to which the transfer nozzle 421 is lowered in order to transfer the part Wp to the substrate B ・Transfer speed…the speed at which the transfer nozzle 421 is lowered in order to transfer the part Wp to the substrate B during the part transfer in step S105 ・Transfer load…the load applied by the transfer nozzle 421 to the part Wp in contact with the substrate B during the part transfer in step S105 ・Substrate thickness…the thickness of the substrate B to be produced The following are machine parameters: ・Substrate height…the height of the lower surface of the substrate B supported by the mounting conveyor 22 at the working position Lm ・Loading standby position…the position of the wafer W waiting to be loaded into the mounting conveyor 22 (loading standby position Li) ・Loading standby position…the position of the wafer W waiting to be loaded out of the component mounting machine 1 (loading standby position Lo) ・Number of retries…the number of retries of steps S102 to S104 when the component recognition fails in step S104.

Correspondingly, various process recipe parameters and machine parameters are pre-set for the part mounting machine 1. Here, setting the process recipe parameters refers to setting the values of the process recipe parameters for the part mounting machine 1. For example, when the process recipe parameter to be set is the thickness of the substrate, the controller 8 of the part mounting machine 1 sets the specific value of the thickness of the substrate B (for example, 1 mm) and saves it in the memory or storage unit 82 of the calculation processing unit 81. Thereby, the controller 8 executes the control required for the production of the substrate of Figure 4 under the condition that the thickness of the substrate B is the set value (for example, 1 mm). In addition, the setting of the machine parameters can also be performed in the same way. Incidentally, the user can set the process recipe parameters or machine parameters for the part mounting machine 1 by operating the UI12.

Furthermore, in this embodiment, a combination of a plurality of process recipe parameters is managed as a process recipe condition. In particular, performance data indicating the performance of the actions performed by the part mounting machine 1 for which the process recipe condition is set is collected in order to manage the process recipe condition.

FIG. 5 is a flowchart showing an example of a method for managing process recipe conditions, FIG. 6A is a flowchart showing an example of a method for collecting performance data, and FIG. 6B is a diagram schematically showing an example of an action performed according to the flowchart of FIG. 6A.

The process recipe condition management of FIG5 is performed by the action condition management unit 813 to manage the process recipe conditions stored in the database DB as the management object. In step S201, the action condition management unit 813 determines whether the process recipe conditions set for the part mounting machine 1, i.e., the set process recipe conditions, have been changed. That is, the user can change the process recipe conditions (set process recipe conditions) set for the part mounting machine 1 by operating the UI12. Incidentally, if at least one value of the plurality of process recipe parameters constituting the set process recipe conditions is changed, the action condition management unit 813 determines that the set process recipe conditions have been changed.

When the set process recipe condition has been changed (when the answer is "Yes" in step S201), the action condition management unit 813 determines whether the process recipe condition identical to the set process recipe condition is saved in the database DB as a management object (step S202). When the process recipe condition identical to the set process recipe condition is not saved, the set process recipe condition is determined to be a new condition ("Yes" in step S202), and the set process recipe condition is added to the database DB as a management object. Therefore, whenever the user sets a new process recipe condition that is not saved as a management object in the database DB for the part mounting machine 1, the process recipe condition saved as a management object is added. In this way, a plurality of process recipe conditions will be saved and managed in the database DB.

The performance data collection of Fig. 6A is performed by the performance acquisition unit 814 to collect performance data representing the performance of the operations performed by the component mounting machine 1 based on the set process recipe conditions. The performance data represents the values (performance values) of a plurality of performance evaluation items.

The following are examples of performance evaluation items: ・Production time (production efficiency)…The time required to produce a substrate with parts mounted ・Adsorption rate…The ratio of the transfer nozzle 421 that adsorbs parts Wp and mounts parts Wp on substrate B to successfully adsorb parts Wp (number of successful adsorption times/number of adsorption trials) ・Error generation rate…The frequency (number of times per unit time) of errors (such as abnormal stops of motors, etc.) in the parts mounting machine ・Mounting accuracy…The positional offset between the part Wp shown in the position measurement result I and the mounting target point.

The performance acquisition unit 814 monitors the actions performed by the part mounting machine 1 in executing substrate production (Figure 4), and acquires performance data representing the performance of the actions (step S301). Here, the so-called acquisition of performance data refers to obtaining the values of multiple performance evaluation items that constitute the performance data. Furthermore, the time point for obtaining the values of the performance evaluation items may vary depending on each performance evaluation item. After the performance acquisition unit 814 obtains the performance data, it confirms the process recipe conditions set for the part mounting machine 1 when obtaining the performance data (setting process recipe conditions) (step S302). Next, the performance data obtained in step S301 is established and saved in the database DB in correspondence with the process recipe conditions confirmed as setting process recipe conditions in step S302 (step S303). Furthermore, in step S303, the performance data is established and saved in the database DB in correspondence with the variety of the part mounting substrate produced by the part mounting machine 1 when the performance data is obtained. As a result, as shown in FIG6B, the performance data Dp1~Dp4 is saved in the database DB in correspondence with a plurality of different process recipe conditions R1~R4. Here, the table of FIG6B corresponds to one variety. Therefore, as substrates with multiple varieties of parts mounted are produced, the table is prepared for each variety and saved in the database DB.

Next, based on the performance data Dp1 to Dp4 of the process recipe conditions R1 to R4 stored in the database DB, the user is assisted in setting the process recipe conditions. FIG. 7 is a flowchart showing a first example of the process recipe condition setting assistance method, and FIG. 8 is a diagram schematically showing an example of a performance overview screen displayed according to the flowchart of FIG. 7 .

In step S401, the UI control unit 812 determines whether an instruction to display the performance summary screen S1 has been input. That is, the user can input the instruction by operating the UI 12. When the UI control unit 812 determines that the instruction has been input ("Yes" in step S401), the performance summary screen S1 (FIG. 8) is displayed on the display of the UI 12 (step S402).

That is, in the performance overview screen S1, the performance data Dp1 to Dp4 of the actions performed by the part mounting machine 1 based on the process recipe conditions R1 to R4 are displayed in correspondence with the process recipe conditions R1 to R4. Here, in the performance overview screen S1, the performance data Dp1 to Dp4 corresponding to the same type of part mounting substrates are shown. Whether to display the performance data Dp1 to Dp4 of a certain type is set according to the user's operation on UI12. By the way, in the example of Figure 8, UPH (Unit Per Hour), mounting accuracy, adsorption rate, error generation rate, production quantity (the number of substrates on which parts have been mounted) and date (update date of performance data) are displayed as performance data. Furthermore, the performance data displayed in the performance overview screen S1 may be the performance data stored in the database DB converted into data representing substantially the same content as the performance data. For example, as described above, the production interval time is obtained as the performance data in the database DB, and accordingly, the UPH converted from the production interval time is displayed in the performance overview screen S1. Furthermore, it is not necessary to display all the performance evaluation items managed in the database DB in the performance overview screen S1. It is also possible to display a part of the performance evaluation items managed in the database DB in the performance overview screen S1. Furthermore, in the performance overview screen S1, instead of displaying the respective process recipe parameters constituting the process recipe conditions R1 to R4, the names (R1 to R4) identifying the process recipe conditions R1 to R4 are displayed.

In step S403, the UI control unit 812 determines whether to select a process recipe condition (in other words, the performance data corresponding to the process recipe condition) from the multiple process recipe conditions R1 to R4 displayed on the performance overview screen S1. That is, the user can select a process recipe condition from the performance overview screen S1 by operating the UI12. Then, when a process recipe condition is selected ("Yes" in step S403), the action condition management unit 813 sets the selected process recipe condition for the part mounting machine 1 (step S404). Thereby, after step S404, the part mounting machine 1 executes substrate production according to the process recipe condition (Figure 4).

In the embodiment described above, the action condition management unit 813 manages a plurality of process recipe conditions R1 to R4 (installation action conditions) that respectively define the actions of the part mounting machine 1, which produces a substrate on which parts are mounted by mounting the part Wp on the substrate B. Then, the performance of the actions performed by the part mounting machine 1 based on the process recipe conditions R1 to R4 to produce the substrate on which parts are mounted is obtained as performance data Dp1 to Dp4 (FIG. 6A, FIG. 6B). The performance data Dp1 to Dp4 is saved in correspondence with the process recipe conditions R1 to R4 when the performance data Dp1 to Dp4 is obtained (step S303, performance saving processing). Furthermore, in the performance saving process, the performance data Dp1 to Dp4 are saved in correspondence with the type of the substrate on which the parts are mounted produced by the parts mounting machine 1 when the performance data Dp1 to Dp4 is obtained. Subsequently, the performance data Dp1 to Dp4 for the same type of substrate on which the parts are mounted and saved by the performance saving process of step S303 are displayed in correspondence with the process recipe conditions R1 to R4 when the performance data Dp1 to Dp4 is obtained on the display of UI12. Therefore, the user can use the display of UI12 to confirm the performance data Dp1 to Dp4 representing the performance of the actions executed based on the process recipe conditions R1 to R4. As a result, the user can easily grasp the process recipe conditions R1 to R4 suitable for suppressing malfunctions.

Furthermore, when the UI control unit 812 confirms the operation of the user selecting a performance data from the performance data Dp1 to Dp4 displayed on the display of the UI 12 (step S403), the action condition management unit 813 causes the part mounting machine 1 to execute the action for producing the substrate with the parts mounted thereon with the process recipe condition corresponding to the performance data (step S404). In this configuration, the user can make the part mounting machine 1 execute the action for producing the substrate with the parts mounted thereon with the process recipe condition determined to be appropriate while confirming the performance data Dp1 to Dr4.

Furthermore, the process recipe conditions R1 to R4 are a combination of a plurality of process recipe parameters, and the process recipes define the actions performed by the part mounting machine 1 to produce a substrate on which the parts are mounted. In this configuration, the user can use the display of the UI 12 to confirm the performance data Dp1 to Dp4 indicating the performance of the actions performed based on the plurality of process recipe parameters. As a result, the user can easily grasp the combination of a plurality of process recipe parameters (i.e., process recipe conditions) suitable for suppressing poor operation.

Furthermore, the performance data Dp1 to Dp4 include a plurality of performance evaluation items for evaluating the operation of the component mounting machine 1 for producing a substrate on which the component has been mounted. In this configuration, the user can conduct various studies based on the plurality of performance evaluation items. As a result, the user can easily and reliably grasp the process recipe conditions suitable for suppressing defective operation.

Furthermore, the parts mounting machine 1 performs an action for producing a substrate on which parts are mounted based on the process recipe conditions set for the parts mounting machine 1 (FIG. 4). Furthermore, when the process recipe conditions set for the parts mounting machine 1 (setting process recipe conditions) are changed (step S201), the action condition management unit 813 adds the changed process recipe conditions to the management object (steps S202, S203). In this configuration, the user can grasp whether each process recipe condition is appropriate while changing the process recipe conditions.

In the above-mentioned embodiment, in step S401 of FIG7 , the performance overview screen S1 is displayed on the display of UI12. In step S401, the performance time change screen S2 of FIG9 may be displayed together with or instead of the performance overview screen S1. Here, FIG9 schematically shows an example of a performance time change screen displayed according to the flow chart of FIG7 . FIG9 shows a curve chart showing the time change of performance data. Furthermore, FIG9 shows a curve chart showing the time change of the value of a performance evaluation item (specifically, installation accuracy) included in the performance data. However, the time changes of the values of multiple performance evaluation items included in the performance data can also be displayed in parallel.

In particular, in the example here, at the change time Tc in the substrate where the parts mounting machine 1 has completed the mounting of one type of parts, the process recipe condition is changed from the process recipe condition R3 to the process recipe condition R4. Correspondingly, in the performance time change screen S2, the change time Tc of the process recipe condition, the name (R3) for identifying the process recipe condition R3 before the change time Tc, and the name (R4) for identifying the process recipe condition R4 after the change time Tc are displayed. Furthermore, the time change of the performance data (mounting accuracy) before and after the change time Tc of the process recipe condition is shown.

That is, the UI control unit 812 displays the change time Tc of the process recipe condition set for the part mounting machine 1 in the substrate on which the part mounting machine 1 has completed the production of one type of parts, and the performance data saved by the performance saving process of step S303 before and after the change time Tc, in a time series on the display of the UI 12. In this configuration, the user can grasp whether the process recipe condition is appropriate while referring to the performance data before and after the change time Tc of the process recipe condition.

FIG. 10 is a flowchart showing a second example of the setting support method of the process recipe condition, and FIG. 11 is a diagram schematically showing an example of a performance evaluation screen displayed according to the flowchart of FIG. 10. In step S501, the UI control unit 812 determines whether an instruction for displaying the performance evaluation screen S3 has been input. That is, the user can input the instruction by operating the UI 12.

When the UI control unit 812 determines that the instruction is input ("Yes" in step S501), the action condition management unit 813 respectively calculates evaluation values V1 to V4 (performance evaluation results) obtained by evaluating the process recipe conditions R1 to R4 based on a plurality of performance evaluation items of the performance data (step S502). In particular, the action condition management unit 813 calculates the evaluation values V1 to V4 by weighting the performance evaluation items (UPH, mounting accuracy, error generation rate, adsorption rate) as weighted objects using the following evaluation formula.

The evaluation value is provided by the following formula: Evaluation value = (100 × UPH acquisition value / UPH allowable value) × W1 + (100 × installation accuracy allowable value / installation accuracy acquisition value) × W2 + (100 - (error generation rate acquisition value - error generation rate allowable value)) × W3 + (adsorption rate acquisition value - adsorption rate allowable value) × W4.

Here, the values of the items on the right side of the evaluation formula are expressed in percentage. In addition, the weighting coefficient CW1 is a weighting coefficient for UPH, the weighting coefficient CW2 is an allowable value for installation accuracy, the weighting coefficient CW3 is a weighting coefficient for error generation rate, and the weighting coefficient CW4 is a weighting coefficient for adsorption rate. In particular, in the performance evaluation screen S3, there are provided weighting coefficient setting parts Ow1, Ow2, Ow3, Ow4 for respectively setting the weighting coefficients CW1, W2, W3, W4, and the user can change the weighting coefficients CW1, W2, W3, W4 by operating the weighting coefficient setting parts Ow1, Ow2, Ow3, Ow4.

In step S503, the UI control unit 812 displays the performance evaluation screen S3 on the display of UI12, and the performance evaluation screen S3 includes the evaluation values V1 to V4 calculated by the action condition management unit 813. In step S504, the UI control unit 812 determines whether the user changes any of the weighting coefficients CW1 to CW4 by operating the weighting coefficient setting units Ow1 to Ow4. In addition, when any of the weighting coefficients CW1 to CW4 is changed (when it is "yes" in step S504), the evaluation value is calculated again in step S502, and the performance evaluation screen S3 is displayed in step S503.

On the other hand, when the change of the weighting coefficients CW1 to CW4 is not confirmed in step S504 (in the case of "NO"), the UI control unit 812 determines whether a process recipe condition is selected from the multiple process recipe conditions R1 to R4 displayed on the performance overview screen S1 (in other words, the performance data corresponding to the process recipe condition) (step S505). When it is confirmed that a process recipe condition is selected (in the case of "NO" in step S505), return to step S504. In addition, when a process recipe condition is selected (in the case of "YES" in step S505), the action condition management unit 813 sets the selected process recipe condition for the part mounting machine 1 (step S506). Thus, after step S506, the component mounting machine 1 performs substrate production according to the one process recipe condition (FIG. 4).

As described above, in the example of the setting assistance in FIG. 10 , the action condition management unit 813 calculates the evaluation values V1 to V4 (performance evaluation results) obtained by evaluating the process recipe conditions based on a plurality of performance evaluation items, and the UI control unit 812 displays the evaluation values V1 to V4 on the display (performance overview screen S1) of the UI 12. In this configuration, the user can easily grasp the process recipe conditions suitable for suppressing action defects based on the evaluation values V1 to V4.

Furthermore, the UI control unit 812 accepts the user's operation on the UI 12 for inputting the weighting coefficients CW1 to CW4 (importance) of each of the plurality of performance evaluation items. Furthermore, the action condition management unit 813 calculates the evaluation values V1 to V4 while performing weighting corresponding to the weighting coefficients CW1 to CW4 (step S502). In this configuration, the user can judge whether the process recipe conditions are appropriate based on the evaluation values V1 to V4 calculated according to the importance the user places on each performance evaluation item. As a result, the user can easily grasp the process recipe conditions that meet his needs.

Thus, in the above-mentioned embodiment, the part installation machine 1 is equivalent to an example of the "part installation machine" of the present invention, the UI 12 is equivalent to an example of the "user interface" of the present invention, the UI control unit 812 is equivalent to an example of the "UI control unit" of the present invention, the action condition management unit 813 is equivalent to an example of the "action condition management unit" of the present invention, the performance acquisition unit 814 is equivalent to an example of the "performance acquisition unit" of the present invention, the memory unit 82 is equivalent to an example of the "recording medium" of the present invention, and the calculation processing unit 81 and the memory unit 82 are equivalent to the "installation action" of the present invention. Condition management device" is an example, substrate B is equivalent to an example of "substrate" of the present invention, performance data Dp1~Dp4 are equivalent to an example of "performance data" of the present invention, management program Pp is equivalent to an example of "installation action condition management program" of the present invention, process recipe conditions R1~R4 are equivalent to an example of "installation action condition" of the present invention, evaluation values V1~V4 are equivalent to an example of "performance evaluation result" of the present invention, part Wp is equivalent to an example of "part" of the present invention, and step S303 is equivalent to an example of "performance preservation processing" of the present invention.

Furthermore, the present invention is not limited to the above-mentioned implementation method, and various changes can be added to the above-mentioned content without departing from the scope of its purpose. For example, the performance data collection of Figure 6A can be changed as follows, that is, when a specific starting condition is met, the step S303 (performance saving process) of saving the obtained performance data Dp1~Dp4 begins. In this variation, the action condition management unit 813 monitors whether the performance data Dp1~Dp4 obtained by the action condition management unit 813 is within the allowable range. Then, when it is determined that the performance data Dp1~Dp4 deviates from the allowable range, the performance saving process of saving the obtained performance data Dp1~Dp4 begins. In other words, when the performance data Dp1 to Dp4 are within the permissible range, the operation of saving the obtained performance data Dp1 to Dp4 in the database DB is not performed. Here, when at least one of the multiple performance evaluation items included in the performance data deviates from the permissible range, the performance data is determined to deviate from the permissible range.

That is, in this variation, when the performance data Dp1 to Dp4 acquired by the performance acquisition unit 814 deviates from the allowable range, the operation condition management unit 813 starts the performance saving process. In this configuration, when the operation of the parts mounting machine 1 produces an undesirable tendency, the performance data Dp1 to Dp4 starts to be saved. Therefore, the user can study the appropriate process recipe conditions to appropriately deal with the undesirable tendency.

In addition, the specific examples of the process recipe parameters are not limited to the above examples, and various changes can be made. For example, the descent amount or descent speed of the turntable of the parts mounting machine described in WO2018/154760 can also be set as the process recipe parameter.

Furthermore, the specific configuration of the parts mounting machine is not limited to the above example, and the above control can also be applied to a parts mounting machine for mounting parts having a package such as QFP (Quad Flat Package).

In addition, similar to the process recipe parameters described above, machine parameters can also be managed. In this case, the condition management of FIG. 5 or the performance data collection of FIG. 6A is performed with the machine parameters as the object.

Furthermore, UI12 can also be a terminal carried by the user and does not need to be installed in the component mounting machine 1.

Furthermore, the control shown in FIG. 4 and FIG. 5A etc. may be performed by a server computer etc. which is separately provided from the component mounting machine 1.

1: Parts mounter 2: Transport unit 3: Parts supply mechanism 4: Parts transfer unit 8: Controller 11: Communication unit 12: UI 21: Infeed conveyor 22: Installation conveyor 23: Outfeed conveyor 31: Wafer stage 35: Parts removal unit 36: Removal head 37: Ejection motor 41: Support member 42: Installation head 43: X-axis motor 44: Y-axis motor 45: Z-axis motor 51: Parts recognition camera 81: Calculation processing unit (installation action condition management device) 82: Memory unit (recording medium, installation action condition management device) 85: Transport control unit 86: Parts supply control unit 87: Parts transfer control unit 88: Camera control unit 91: Substrate inspection machine 92: Conveyor 351: X-axis track 352: X-axis motor 353: Y-axis track 354: Ball screw 355: Y-axis motor 361: Bracket 362: Lifting nozzle 363: Z-axis motor 421: Transfer nozzle 811: Communication control unit 812: UI control unit 813: Action condition management unit 814: Performance acquisition unit B: Substrate CW1~CW4: Weighting coefficient DB: Database Dp1: Performance data Dp2: Performance data Dp3: Performance data Dp4: Performance data I: Position measurement results Li: Loading standby position Lm: Working position Lo: Loading standby position Ow1~Ow4: Weighting coefficient setting section Pp: Management program (installation action condition management program) R1~R4: Process recipe conditions (installation action conditions) S1: Performance overview screen S2: Performance time change screen S3: Performance evaluation screen S101: Step S102: Step S103: Step S104: Step S105: Step S106: Step S201: Step S202: Step S203: Step S301: Step S302: Step S303: Step (Performance Saving Process) S401: Step S402: Step S403: Step S404: Step S501: Step S502: Step S503: Step S504: Step S505: Step S506: Step Tc: Change time V1~V4: Evaluation value (Performance Evaluation Result) W: Wafer Wp: Parts Ws: Sheet

FIG. 1 is a block diagram showing an example of a part mounting system having a part mounting machine of the present invention. FIG. 2 is a top view schematically showing an example of a part mounting machine of the present invention. FIG. 3 is a block diagram showing an electrical structure of the part mounting machine of FIG. 1. FIG. 4 is a flow chart showing an action in substrate production performed by the part mounting machine of FIG. 2. FIG. 5 is a flow chart showing an example of a method for managing process recipe conditions. FIG. 6A is a flow chart showing an example of a method for collecting performance data. FIG. 6B is a diagram schematically showing an example of an action performed according to the flowchart of FIG. 6A. FIG. 7 is a flow chart showing a first example of a method for assisting the setting of process recipe conditions. FIG. 8 is a diagram schematically showing an example of a performance overview screen displayed according to the flowchart of FIG. 7. FIG. 9 schematically shows an example of a performance time change screen displayed according to the flowchart of FIG. 7. FIG. 10 is a flowchart showing a second example of a setting support method for process recipe conditions. FIG. 11 schematically shows an example of a performance evaluation screen displayed according to the flowchart of FIG. 10.

S1: Performance overview screen

R1: Process formula conditions

R2: Process formula conditions

R3: Process formula conditions

R4: Process formula conditions

Dp1: Performance data

Dp2: Performance data

Dp3: Performance data

Dp4: Performance data

Claims (13)

A mounting action condition management device, comprising: an action condition management unit, which manages a plurality of mounting action conditions that respectively define the actions of a part mounting machine as management objects, wherein the part mounting machine produces a substrate with parts mounted thereon by mounting parts on the substrate; a performance acquisition unit, which acquires the performance of the actions performed by the part mounting machine based on the mounting action conditions as the management objects to produce the substrate with parts mounted thereon as performance data; and a UI control unit, which controls a user interface; and The action condition management unit executes a performance saving process, which is to save the performance data obtained by the performance acquisition unit in correspondence with the installation action condition when the performance data is obtained; In the performance saving process, the performance data is saved in correspondence with the type of the substrate on which the parts are installed produced by the parts installation machine when the performance data is obtained; The UI control unit saves the performance data of the substrate on which the parts of the same type are installed, which is saved by the performance saving process, in correspondence with the installation action condition when the performance data is obtained, and presents it to the user using the user interface. As in claim 1, when the UI control unit confirms the user's operation of selecting a performance data from the performance data presented to the user using the user interface, the action condition management unit causes the part mounting machine to execute an action for producing a substrate with the part mounted thereon using the installation action condition corresponding to the performance data. As in claim 1, the installation action condition management device, wherein the installation action condition is a combination of a plurality of action parameters, and the action parameters specify the actions performed by the part mounting machine in order to produce the substrate with the part mounted thereon. As in claim 1, the installation action condition management device, wherein the performance data includes a plurality of performance evaluation items, and the performance evaluation items are used to evaluate the actions performed by the part mounting machine to produce the substrate on which the parts are mounted. The installation action condition management device as claimed in claim 4, wherein the performance data includes at least one of production efficiency, adsorption rate, error generation rate and installation accuracy as the performance evaluation item, the production efficiency is an indicator related to the time required for producing the substrate on which the above-mentioned parts are mounted, the adsorption rate is an indicator related to the ratio of the nozzle that adsorbs the above-mentioned parts to successfully adsorb the above-mentioned parts to mount the above-mentioned parts on the above-mentioned substrate, the error generation rate is an indicator related to the frequency of errors generated by the above-mentioned parts mounting machine, and the installation accuracy is an indicator related to the position accuracy of the above-mentioned parts mounting machine when mounting the above-mentioned parts on the substrate. As in the installation action condition management device of claim 4 or 5, the action condition management unit calculates the performance evaluation result of the installation action condition based on the plurality of performance evaluation items, and the UI control unit presents the performance evaluation result to the user using the user interface. As in claim 6, the action condition management device is installed, wherein the UI control unit accepts the user's operation on the user interface for inputting the importance of each of the plurality of performance evaluation items, and the action condition management unit calculates the performance evaluation result while performing weighting corresponding to the importance. As in claim 1, the installation action condition management device, wherein the above-mentioned part installation machine performs an action for producing a substrate on which the above-mentioned part is installed based on the above-mentioned installation action condition set for the part installation machine, When the above-mentioned installation action condition set for the above-mentioned part installation machine is changed, the above-mentioned action condition management unit adds the above-mentioned installation action condition after the change to the above-mentioned management object. As in claim 8, the installation action condition management device, wherein the UI control unit changes the change time of the installation action condition set for the part installation machine, and the performance data saved by the performance saving process before and after the change time, and presents them to the user in a time series using the user interface. As in the installation action condition management device of claim 1, when the performance data obtained by the performance acquisition unit deviates from an allowable range, the action condition management unit starts the performance saving process. A parts mounting machine, which produces a substrate with parts mounted thereon by mounting parts on the substrate, and comprises: an action condition management unit, which manages a plurality of mounting action conditions that respectively define the actions of the parts mounting machine as management objects; a performance acquisition unit, which acquires the performance of the actions performed by the parts mounting machine based on the mounting action conditions as the management objects to produce the substrate with parts mounted thereon as performance data; and a UI control unit, which controls the user interface; and the action condition management unit executes a performance saving process, which saves the performance data acquired by the performance acquisition unit in correspondence with the mounting action conditions at the time of acquiring the performance data; In the above-mentioned performance saving process, the above-mentioned performance data is saved by establishing a correspondence with the type of the substrate on which the above-mentioned parts are mounted produced by the above-mentioned parts mounting machine when the above-mentioned performance data is obtained; The above-mentioned UI control unit will establish a correspondence between the above-mentioned performance data of the substrate on which the above-mentioned parts of the same type are mounted and saved by the above-mentioned performance saving process and the above-mentioned installation action conditions when the above-mentioned performance data is obtained, and present it to the user using the above-mentioned user interface. A method for managing installation action conditions, comprising the following steps: Managing a plurality of installation action conditions that respectively define the actions of a part installation machine as management objects, wherein the part installation machine produces a substrate with parts installed by installing parts on the substrate; Acquiring the performance of the actions performed by the part installation machine based on the installation action conditions as the management object to produce the substrate with parts installed as performance data; Performing performance preservation processing, wherein the performance preservation processing establishes a correspondence between the performance data and the installation action conditions at the time of obtaining the performance data and the type of the substrate with parts installed produced by the part installation machine; and The above performance data of the substrate on which the above parts of the same type have been installed, which is saved through the above performance saving process, is associated with the above installation action conditions when the above performance data is obtained, and is presented to the user using the user interface. A recording medium that records in a computer-readable manner an installation action condition management program that causes a computer to execute the following process, the above process refers to: Managing a plurality of installation action conditions that respectively specify the actions of a part mounting machine as management objects, the part mounting machine producing a substrate with parts mounted thereon by mounting parts on a substrate; Acquiring the performance of the actions executed by the above part mounting machine based on the above installation action conditions as the above management objects to produce the above substrate with parts mounted thereon as performance data; Execute performance saving processing, the performance saving processing is to establish a correspondence between the above performance data and the above installation action conditions when the above performance data is obtained and the type of the substrate on which the above parts are installed produced by the above parts installation machine; and The above performance data of the substrate on which the above parts of the same type are installed and saved by the above performance saving processing is established in correspondence with the above installation action conditions when the above performance data is obtained, and presented to the user using the user interface.