TW202410495A - Integrated sealing sheet, light-emitting electronic component and method of manufacturing light-emitting electronic component - Google Patents

Abstract

The present invention provides an integrated sealing sheet, light-emitting electronic component using the integrated sealing sheet, and method of manufacturing the light-emitting electronic component. The integrated sealing sheet can not only be filled with light-diffusion-resistant resin between multiple light-emitting elements through a single crimp, but also complete the sealing operation without blocking the light from the light-emitting elements to reach the observer's side. An integrated sealing sheet 1 which is crimped on a surface of a substrate with elements 10 with a plurality of light-emitting elements configured on a substrate 11 with said plurality of light-emitting elements, said integrated sealing sheet 1 being characterized by having a black curing resin layer 2, a transparent curing resin layer 3, a coated curing layer 4, and a hard-coating layer 5 which are laminated sequentially from the side configured to be connected to said substrate with elements 10 in the case of said crimping.

Description

Integrated sealing sheet, light-emitting electronic component, and method for manufacturing light-emitting electronic component

The present invention relates to an integrated sealing sheet, a light-emitting electronic component, and a method for manufacturing the light-emitting electronic component.

In recent years, display technologies called mini LED and micro LED, which use extremely small light-emitting diodes, have attracted attention.

There are two ways to use mini LED and micro LED. One is a technology that uses a plurality of LEDs arranged on a substrate to form a liquid crystal backlight, thereby enabling local control of the brightness of the backlight.

The other is a structure in which R (red), G (green), and B (blue) constituting pixels emit light with LEDs of respective colors, and the high-purity colors emitted by the LEDs of each color appear directly to the eyes.

Mini LEDs and micro LEDs use electronic components in which a plurality of light-emitting elements are arranged on a substrate. In such an electronic component, a dry film is used to fill spaces between a plurality of light-emitting elements with a light-diffusion-preventing resin (Patent Document 1).

The dry film is a resin film obtained by coating a curable resin composition on a protective film and drying it. It is pressed against the surface of the substrate on which the light-emitting elements are arranged, and the space between the light-emitting elements is filled. solidify.

When the dry film is pressure-bonded to the surface of the substrate on which the light-emitting elements are arranged, a light-diffusion preventing resin layer is inevitably formed not only between the light-emitting elements but also on the light-emitting elements.

If the light-diffusion-preventing resin layer formed on the light-emitting element is left as it is, not only the light between the light-emitting elements will be diffused, but also the light that should be emitted toward the viewer will be blocked.

Therefore, Patent Document 1 describes that after the dry film is pressed, the resin on the light-emitting element is removed by etching such as plasma treatment, and the exposed light-emitting element is covered with a light-transmitting sealing material.

patent documents

Patent Document 1: Japanese Patent Application Publication No. 2022-22562

In view of this, we, the inventors, have devoted ourselves to further research and development and improvement, hoping to find a better invention to solve the above problems. After continuous testing and modification, the present invention was finally born.

Problem to be solved by the invention

However, etching such as plasma processing takes a lot of time, which is a major factor in increasing manufacturing costs. In addition, it is difficult to completely remove the resin on the light-emitting element by etching, and it is difficult to completely prevent the light that should be emitted toward the viewer from spreading.

Furthermore, in order to provide a sealing material layer on the outermost surface, it is necessary to further laminate a dry film of sealing material.

In view of the above situation, the present invention provides an integrated sealing sheet, a light-emitting electronic component using the integrated sealing sheet, and a method for manufacturing the light-emitting electronic component. The integrated sealing sheet can not only fill a light-diffusion-preventing resin between multiple light-emitting elements through one-time pressing, but also complete the sealing operation, and does not hinder the light from the light-emitting element from reaching the observer side.

Means used to solve problems

The inventors of the present invention have repeatedly conducted in-depth research to achieve the above-mentioned problems, and as a result, have found that the above-mentioned problems can be solved by preparing an integrated sealing sheet having a black curable resin layer, a transparent curable resin layer, a coating curable layer and a hard coating layer stacked in sequence, thereby completing the present invention.

The present invention includes the following aspects.

[1] An integrated sealing sheet pressed against a surface of an element-mounted substrate on which a plurality of light-emitting elements are arranged, on which the plurality of light-emitting elements are arranged,

It is characterized in that it includes a black curable resin layer, a transparent curable resin layer, a coating cured layer, and a hard coat layer laminated in order from the side disposed in contact with the device-equipped substrate during the pressure bonding.

[2] The one-piece sealing sheet according to [1], wherein the black curable resin layer and the transparent curable resin layer are in an uncured state.

[3] The one-piece sealing sheet according to [1] or [2], wherein the storage modulus of the transparent curable resin layer in an uncured state is greater than the storage modulus of the black curable resin layer in an uncured state at 100°C.

[4] The one-piece sealing sheet according to any one of [1] to [3], wherein the storage modulus of the black curable resin layer in an uncured state at 100°C is 1.0×10 ² Pa or more and 1.0×10 ⁵ Pa or less.

[5] The one-piece sealing sheet according to any one of [1] to [4], wherein the storage modulus of the transparent curable resin layer in an uncured state at 100°C is 1.0×10 ⁴ Pa or more and 1.0×10 ⁷ Pa or less.

[6] The one-piece sealing sheet according to any one of [1] to [5], wherein the storage modulus of the coated cured layer is 1.0×10 ⁵ Pa or more and 1.0×10 ¹⁰ Pa or less at 100°C.

[7] The integrated sealing sheet according to any one of [1] to [6], wherein the Lab value of the black curable resin layer in a cured state is L: 3 to 15, a: -3 ~5, b: -3~10.

[8] The one-piece sealing sheet according to any one of [1] to [7], wherein the black curable resin layer contains a black pigment or a black dye.

[9] The one-piece sealing sheet according to any one of [1] to [8], wherein the total light transmittance of the transparent curable resin layer in a cured state is 30% to 99%.

[10] The integrated sealing sheet according to any one of [1] to [9], wherein at least one of the black curable resin layer and the transparent curable resin layer contains a ring selected from the group consisting of At least one resin and a curing agent selected from the group consisting of oxygen resin, acrylic resin, polyester resin and polyurethane resin.

[11] The one-piece sealing sheet according to any one of [1] to [10], wherein the black curable resin layer comprises at least one resin selected from epoxy resin, acrylic resin, polyester resin and polyurethane resin and a curing agent.

[12] The one-piece sealing sheet according to any one of [1] to [11], wherein the transparent curable resin layer comprises at least one resin selected from epoxy resin, acrylic resin, polyester resin and polyurethane resin and a curing agent.

[13] The one-piece sealing sheet according to any one of [1] to [12], wherein the total light transmittance of the coated cured layer is 30% to 99%.

[14] The one-piece sealing sheet according to any one of [1] to [13], wherein the coating cured layer comprises at least one resin selected from epoxy resin, acrylic resin, polyester resin and polyurethane resin.

[15] The integrated sealing sheet according to any one of [1] to [14], wherein the thickness of the coating cured layer is 10 μm to 250 μm .

[16] The one-piece sealing sheet according to any one of [1] to [15], wherein the hard coating layer comprises one or more selected from acrylic resin, polyurethane resin, organic silicone resin and melamine resin.

[17] The integrated sealing sheet according to any one of [1] to [16], wherein the hard coat layer has a total light transmittance of 30% to 99%.

[18] The one-piece sealing sheet according to any one of [1] to [17], wherein the pencil hardness of the surface of the hard coating layer is H or higher.

[19] The one-piece sealing sheet according to any one of [1] to [18], wherein the surface roughness Ra of the hard coating layer is 0.1 μm to 1 μm .

[20] The one-piece sealing sheet according to any one of [1] to [19], wherein the reflectivity of the hard coating layer side is 10% to 50%.

[21] The one-piece sealing sheet according to any one of [1] to [20], wherein the total light transmittance of the three layers of the transparent curable resin layer, the coating cured layer, and the hard coating layer is 30% to 95%.

[22] The integrated sealing sheet according to any one of [1] to [21], which has a protective film on the surface of any one or both of the curable resin layer and the hard coat layer.

[23] A light-emitting electronic component comprising a substrate with an element on which a plurality of light-emitting elements are arranged, and the one-piece sealing sheet according to any one of [1] to [22] which is press-bonded to a surface of the substrate with the plurality of light-emitting elements arranged thereon.

The black curable resin layer and the transparent curable resin layer are cured,

The black curable resin layer and a portion of the transparent curable resin layer are filled between the plurality of light emitting elements.

[24] A method of manufacturing a light-emitting electronic component, in which a surface of an element-mounted substrate on which a plurality of light-emitting elements are arranged is brought into contact with the black curable resin layer. Configure the integrated sealing sheet described in any one of [1] to [23],

The black curable resin layer and a part of the transparent curable resin layer are filled between the plurality of light-emitting elements by pressure bonding,

The black curable resin layer and the transparent curable resin layer are cured by heating.

[25] The method for manufacturing a light-emitting electronic component according to [24], wherein the thickness of the black curable resin layer before pressure bonding is 10% to 95% of the height of the light-emitting element.

[26] The method for manufacturing a light-emitting electronic component according to [24] or [25], wherein the thickness of the transparent curable resin layer before the pressing is 10% to 500% relative to the height of the light-emitting element.

[27] The method for manufacturing a light-emitting electronic component according to any one of [24] to [26], wherein the contact between the black curable resin layer and the transparent curable resin layer before pressure bonding is The total thickness is 110% to 550% relative to the height of the light-emitting element.

(Invention effect)

According to the one-piece sealing sheet of the present invention, a light diffusion preventing resin can be filled between a plurality of light-emitting elements by one-time pressing, and the sealing operation can be completed without hindering the light from the light-emitting element from reaching the observer side. In addition, according to the light-emitting electronic component and the manufacturing method of the light-emitting electronic component using the one-piece sealing sheet, a light-emitting electronic component with sufficient brightness can be easily obtained.

Regarding the technical means of our inventors, several preferred embodiments are described in detail below with reference to the drawings so that you can have a deeper understanding and recognize the present invention.

In this specification and patent application, the main component refers to a component that accounts for 50% by mass or more of all non-volatile components in the entire composition. A numerical range represented by "to" refers to a numerical range with the numerical values before and after "to" as the lower limit and upper limit.

＜Integrated sealing sheet＞

A one-piece sealing sheet 1 according to one embodiment of the present invention will be described with reference to Fig. 1 and Fig. 2. As shown in Fig. 1, the one-piece sealing sheet 1 is basically composed of a black curable resin layer 2, a transparent curable resin layer 3, a coating curable layer 4, and a hard coating layer 5 stacked on top of each other.

In order to facilitate handling, the integrated sealing sheet 1 of this embodiment may further have a protective film on the surface of any one or both of the black curable resin layer 2 and the hard coat layer 5 .

Fig. 1 shows an example in which protective films are provided on the surfaces of both the black curable resin layer 2 and the hard coating layer 5. Specifically, the black curable resin layer 2, the transparent curable resin layer 3, the coating curable layer 4, the hard coating layer 5, and the second protective film 7 are sequentially stacked on the first protective film 6.

As shown in Fig. 2, the one-piece sealing sheet 1 is used to fill in spaces between a plurality of light-emitting elements of a substrate with elements 10 in which a plurality of light-emitting elements (light-emitting element 12, light-emitting element 13, light-emitting element 14) are arranged on a substrate 11. The details of the substrate with elements 10 will be described later.

As shown in FIG. 2 , the integrated sealing sheet 1 is used in such a manner that the black curable resin layer 2 is in contact with the component-equipped substrate 10 during pressure bonding.

Until the pressure-bonding to the device-attached substrate 10 is completed, the black curable resin layer 2 and the transparent curable resin layer 3 of the one-piece sealing sheet 1 are in an uncured state.

A specific method for obtaining a light-emitting electronic component by press-bonding the one-piece sealing sheet 1 to the substrate with a device 10 will be described later.

＜Black curable resin layer＞

The black curable resin layer 2 is a layer that prevents light diffusion between light-emitting elements and improves the contrast of the display.

In addition, in the thermal compression bonding process, the space between the plurality of light-emitting elements arranged on the substrate with elements 10 is sufficiently filled, and this layer is used to prevent poor appearance caused by expansion of unfilled gaps in the thermal curing process and damage to the light-emitting elements caused by external factors in subsequent processes.

[Lab value]

The Lab value in the cured state of the black curable resin layer 2 is preferably L: 3 to 15, a: -3 to 5, b: -3 to 10, and more preferably L: 3 to 10, a: -2 to 4 , b: -2~5.

By making the Lab value in the cured state fall within the preferred range, light diffusion between light-emitting elements can be further prevented, thereby improving the contrast of the display.

[Total transmittance]

The total light transmittance of the black curable resin layer 2 in the cured state is low. Specifically, it is modulated so that the total light transmittance in the cured state is 0% to 50%. The black curable resin layer 2 is preferably prepared so that the total light transmittance in the cured state is 0% to 40%, more preferably 0% to 30%.

By setting the total light transmittance of the black curable resin layer 2 in a cured state to be below the upper limit value, light diffusion between light-emitting elements can be prevented.

The total light transmittance in this manual can be measured by a fog meter.

The total light transmittance in the cured state can be adjusted mainly according to the presence or absence of carbon black, or the blending amount. In addition, it can also be adjusted according to the thickness of the resin layer and the type of resin.

[Storage modulus]

The storage modulus of the black curable resin layer 2 in an uncured state is preferably smaller than the storage modulus of the transparent curable resin layer 3 in an uncured state.

The storage modulus of the black curable resin layer 2 in an uncured state at 100° C. is preferably 1.0×10 ⁵ Pa or less, more preferably 1.0×10 ² Pa or more and 1.0×10 ⁵ Pa or less, and further preferably 1.0×10 ³ Pa or more and 5.0×10 ⁴ Pa or less.

In the uncured state, by making the storage modulus of the black curable resin layer 2 at 100°C below the preferred upper limit value, sufficient fluidity is obtained when it is pressed onto the substrate 10 with elements, and it is possible to follow the projections and depressions of the substrate 10 with elements and fully fill the spaces between the multiple light-emitting elements.

By setting the storage elastic modulus of the black curable resin layer 2 at 100° C. to a preferable lower limit value or more in an uncured state, it is possible to prevent excessive pressure during thermocompression bonding and maintain a uniform appearance. In addition, resin can be prevented from flowing out of the range, and the film thickness after pressure bonding can be ensured.

[Curable resin composition]

The black curable resin layer 2 is composed of a curable resin composition. Examples of the curable resin composition include a curable resin composition containing at least one resin selected from epoxy resins, acrylic resins, polyester resins, and polyurethane resins and a curing agent.

Among them, epoxy resin compositions are preferred from the viewpoint of being able to achieve curing properties at low temperatures, heat resistance, and excellent reliability.

In this specification, the epoxy resin composition refers to a composition containing an epoxy resin as a main component, or a composition containing an epoxy resin and a curing agent as main components.

(epoxy resin)

In this specification and the scope of the patent application, epoxy resin refers to a compound with an epoxy group in the molecule. The epoxy resin used in the present invention is preferably an epoxy resin having two or more epoxy groups in one molecule. This is because the cured product can exhibit high heat resistance by forming a cross-linked structure by reaction with a modified resin having a functional group capable of reacting with an epoxy group. In addition, when an epoxy resin having two or more epoxy groups is used, the crosslinking degree of the curing agent having a functional group capable of reacting with the epoxy group is sufficient, and the cured product obtains sufficient heat resistance.

(epoxy resin)

Examples of the epoxy resin include bifunctional epoxy resins having two epoxy groups in the molecule, polyfunctional epoxy resins having three or more epoxy groups in the molecule, and high molecular weight epoxy having a weight average molecular weight of 10,000 or more. Resin etc. Alternatively, they may be hydrogenated epoxy resins.

It should be noted that in this specification and the scope of the patent application, regardless of the number of epoxy groups in the molecule, high molecular weight epoxy resins are not classified as bifunctional epoxy resins or multifunctional epoxy resins, but are classified as phenoxy resins. Base epoxy resin.

The weight average molecular weight of the epoxy resin is a molecular weight in terms of polystyrene measured by gel penetration chromatography.

Examples of epoxy resins include bisphenol A type epoxy resins, bisphenol F type epoxy resins, or phenoxy type epoxy resins obtained by increasing the molecular weight of these epoxy resins, and hydrogenated epoxy resins thereof; glycidyl phthalate, diglycidyl isophthalate, diglycidyl terephthalate, glycidyl p-hydroxybenzoate, diglycidyl tetrahydrophthalate, diglycidyl succinate, diglycidyl adipate, diglycidyl sebacate, triglycidyl trimellitate, and the like glycidyl ester epoxy resins; ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, and the like. Glyceryl ether epoxy resins such as alcohol diglycidyl ether, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, trihydroxymethylpropane triglycidyl ether, pentaerythritol tetraglycidyl ether, tetraphenylglycidyl ether ethane, triphenylglycidyl ether ethane, polyglycidyl ether of sorbitol, polyglycidyl ether of polyglycerol; glycidylamine epoxy resins such as triglycidyl isocyanurate and tetraglycidyl diaminodiphenylmethane; linear aliphatic epoxy resins such as epoxidized polybutadiene and epoxidized soybean oil, etc., but are not limited to these. In addition, novolac epoxy resins such as novolac epoxy resins containing a xylene structure, naphthol novolac epoxy resins, phenol novolac epoxy resins, o-cresol novolac epoxy resins, and bisphenol A novolac epoxy resins can also be used.

Furthermore, as examples of the epoxy resin, brominated bisphenol A type epoxy resin, phosphorus-containing epoxy resin, fluorine-containing epoxy resin, dicyclopentadiene skeleton-containing epoxy resin, naphthalene skeleton-containing epoxy resin can be used. Oxygen resin, anthracene-type epoxy resin, tert-butylcatechol-type epoxy resin, triphenylmethane-type epoxy resin, tetraphenylethane-type epoxy resin, biphenyl-type epoxy resin, bisphenol S type epoxy resin, etc.

As high molecular weight epoxy resins, phenoxy-type epoxy resins, epoxy-modified polybutadiene, copolymers of glycidyl methacrylate and methyl methacrylate can be used, and other resins can be epoxy-modified. And the obtained modified polymer, etc.

These epoxy resins may be used alone or in combination of two or more.

Among the above-mentioned epoxy resins, as the epoxy resin used for the black curable resin layer 2, a polyfunctional epoxy resin is preferred from the viewpoint of increasing the crosslinking density after curing. Among multifunctional epoxy resins, especially novolac-type epoxy resins, since they are epoxy resins that can properly introduce a soft skeleton and adjust the flexibility and softening point, the cured product is unlikely to undergo brittle fracture. The composition has improved performance stability for long-term use of the cured product, improved cross-linking density, and improved heat resistance, so it is more preferable.

Specific examples of novolac-type epoxy resins include "YX7700" manufactured by Mitsubishi Chemical Corporation, "NC7000L", "XD1000", and "EOCN-1020" manufactured by Nippon Kayaku Co., Ltd., "ESN485" manufactured by NIPPON STEEL Chemical & Material Co., Ltd., and "N-690", "N-695", and "HP-7200H" manufactured by DIC Corporation.

The blending amount of the multifunctional epoxy resin in the black curable resin layer 2 is preferably 10 to 99 mass%, and more preferably 40 to 95 mass% based on 100 mass% of the total resin non-volatile content of the black curable resin layer 2 , more preferably 60 to 90% by mass. If it is more than the said lower limit, the crosslinking density can be increased and chemical resistance and heat resistance can be provided. In addition, if it is the upper limit value or less, the storage elastic modulus during thermocompression bonding can be adjusted, and the fluidity of the black curable resin layer 2 can be ensured.

The black curable resin layer 2 does not contain the high molecular weight epoxy resin, or when it does contain it, it is preferably contained in a smaller amount than the transparent curable resin layer 3 . This makes it easy to ensure sufficient fluidity during thermocompression bonding.

The amount of the high molecular weight epoxy resin in the black curable resin layer 2 is preferably less than 50 mass %, more preferably less than 30 mass %, and further preferably less than 10 mass %, based on 100 mass % of the total resin non-volatile components of the black curable resin layer 2.

From the viewpoint of ensuring sufficient fluidity during thermocompression bonding, it is preferable that the black curable resin layer 2 contains an epoxy resin with a softening point or melting point of 100° C. or lower. From the viewpoint of handleability and heat resistance of the cured product, it is more preferable to include an epoxy resin having a softening point or melting point of 50°C to 95°C. By including an epoxy resin having a softening point or melting point within the above range, the storage modulus can be controlled.

The blending amount of the entire epoxy resin in the black curable resin layer 2 is preferably 10 to 100 mass%, and more preferably 20 to 99 mass%, based on 100 mass% of the total resin non-volatile content of the black curable resin layer 2. More preferably, it is 35-95 mass %. If it is within the above range, the storage modulus can be controlled and appropriate fluidity during thermocompression bonding can be ensured. Moreover, if it is the said lower limit value or more, the heat resistance after hardening can be improved.

(Elastic body)

The black curable resin layer 2 preferably contains an elastomer in addition to resins such as epoxy resin. By containing an elastomer, the storage modulus, that is, the fluidity can be easily controlled.

As the elastomer, a thermosetting elastomer called “rubber” is generally preferred from the viewpoint of obtaining excellent heat resistance. Examples of the thermosetting elastomer include acrylonitrile butadiene rubber (NBR) which is a random copolymer of butadiene and acrylonitrile, acrylic rubber, styrene butadiene rubber, vinyl acetate resin, silicone resin, etc. . Among them, it is preferred because it has good compatibility with epoxy resin, can control the fluidity of the black curable resin layer 2 at around 100° C., and has good adhesion to the transparent curable resin layer 3 and the component-equipped substrate 10 . NBR.

The weight average molecular weight of the elastomer is preferably 100,000 to 1,000,000, more preferably 120,000 to 500,000, and further preferably 150,000 to 300,000. If the weight average molecular weight of the elastomer is within the above range, the storage modulus of the black curable resin layer 2 can be controlled, and the fluidity during heat pressing can be ensured. If the weight average molecular weight of the elastomer is below the above upper limit, the compatibility with the epoxy resin is improved, and the fluidity during heat curing can be more effectively controlled.

Particularly when the black curable resin layer 2 is composed of an epoxy resin composition, it is preferable to include a modified elastomer having a functional group capable of reacting with an epoxy group. If it is a modified elastomer having a functional group capable of reacting with an epoxy group, it also functions as a curing agent for the epoxy resin. In addition, since it can react and bond with epoxy resin, the heat resistance and reliability against thermal shock are improved. Furthermore, the difference in polarity between the functional group capable of reacting with the epoxy resin and the resin skeleton effectively affects the dispersibility, and when the black curable resin layer 2 contains carbon black, good dispersibility can be obtained.

Examples of the functional group that can react with the epoxy group include acidic groups such as carboxyl group, sulfo group, nitro group, and phosphoric acid group, and their acid anhydride groups, hydroxyl groups, amino groups, and the like. Among these, an acid group or an acid anhydride group is preferable, and a carboxyl group or a carboxylic acid anhydride group is particularly preferable, since it can be cured at a low temperature and can ensure a usable life.

That is, when the black curable resin layer 2 is composed of an epoxy resin composition, it preferably contains an acid-modified elastomer having an acid group or an acid anhydride group, more preferably contains an acid-modified elastomer having a carboxyl group, and particularly preferably contains modified NBR having a carboxyl group.

As the modified NBR having a carboxyl group, carboxylated acrylonitrile rubber introduced with acrylic acid, methacrylic acid, maleic anhydride, etc. is preferred. Commercially available products of carboxylated acrylonitrile rubber include Nipol (registered trademark) NX775 and Nipol 1072CGJ manufactured by ZEON Corporation of Japan.

Two or more modified elastomers having a functional group capable of reacting with an epoxy group may be used in combination.

The amount of elastomer blended in the black curable resin layer 2 is preferably greater than that in the transparent curable resin layer 3. Thus, when a large amount of low molecular weight components such as a multifunctional epoxy is blended in the black curable resin layer 2, the storage modulus of the black curable resin layer 2 during heat pressing can be adjusted to a suitable range lower than that of the transparent curable resin layer 3, and the flow during heat curing can be suppressed. As a result, the black curable resin layer 2 can have sufficient fluidity during heat pressing and can be suppressed from flowing out during heat curing.

The blending amount of the elastomer in the black curable resin layer 2 is preferably 0.01 to 90 mass%, more preferably 1 to 80 mass%, and still more preferably 100 mass% of the total resin non-volatile content of the black curable resin layer 2 It is 5 to 65% by mass. If it is within the above range, the storage modulus can be controlled and appropriate fluidity during thermocompression bonding can be ensured. Moreover, when it is more than the said lower limit value, the dispersibility of carbon black becomes good. Furthermore, film-forming properties are improved, and the distribution of film thickness when the epoxy resin composition is applied to form a film can be narrowed.

(Curing agent)

When the black curable resin layer 2 is composed of an epoxy resin composition, it may contain a curing agent for epoxy resin other than the modified elastomer having a functional group capable of reacting with an epoxy group. Examples of the other curing agent include well-known curing agents such as phenolic curing agents, acid anhydride curing agents, and amine curing agents.

Two or more types of other curing agents may be used in combination.

(curing catalyst)

When the black curable resin layer 2 is composed of an epoxy resin composition, it may contain a curing catalyst that accelerates the curing reaction of the epoxy resin.

Examples of curing catalysts include imidazole-based, tertiary amine-based, and phosphorus compound-based catalysts. Among them, imidazole-based catalysts are preferred because they have good compatibility with epoxy resins and are less likely to cause yellowing.

Among imidazole-based curing catalysts, a curing catalyst having a cyanoethyl group is particularly preferred because it is easily dissolved in an epoxy resin.

The blending amount of the curing catalyst is preferably 0.01 to 5 parts by mass, more preferably 0.05 to 4 parts by mass, and even more preferably 0.1 to 3 parts by mass relative to 100 parts by mass of the total resin nonvolatile content of the black curable resin layer 2 . If it is within the above range, curing will proceed sufficiently and the usable life of the integrated sealing sheet 1 can be ensured.

Two or more curing catalysts may be used in combination.

(black pigment or black dye)

The black curable resin layer 2 is colored black. For coloring, it is preferable to contain a black pigment or a black dye, more preferably a black pigment, and even more preferably carbon black. By coloring it black, the light diffusion prevention property between the plurality of light-emitting elements of the element-equipped substrate 10 can be obtained.

The particle size of carbon black is preferably 10 nm to 500 nm, more preferably 10 nm to 300 nm, and particularly preferably 10 nm to 100 nm. It should be noted that the particle size refers to the average particle size, which can be obtained by a measuring device based on the dynamic light scattering method. As a measuring device using the dynamic light scattering method, NanotracWave II UT151 manufactured by MicrotracBEL can be cited.

As the carbon black, one or more of the known carbon blacks such as natural gas carbon black, channel carbon black, furnace carbon black, thermal carbon black, lamp black, etc. can be used. In addition, resin-coated carbon black can also be used. Furthermore, carbon nanofibers and carbon nanotubes can also be used.

Among them, natural gas carbon black is preferred because it has a large amount of surface functional groups, is highly dispersible, and exhibits a sufficient light diffusion preventing function by adding a small amount. In addition, when the black curable resin layer 2 contains a modified elastomer having a functional group capable of reacting with the epoxy resin, the surface functional groups of the natural gas carbon black and the modified elasticity having a functional group capable of reacting with the epoxy resin are The interaction of the functional groups of the body further improves the dispersion, ensuring good light diffusion prevention and coating liquid stability.

The blending amount of carbon black is preferably 0.1 to 15% by mass, more preferably 1.0 to 10% by mass, based on the total amount of nonvolatile components of the black curable resin layer 2 . If the blending amount of carbon black is more than the above-mentioned lower limit, sufficient light-shielding properties can be obtained. If the blending amount of carbon black exceeds the above upper limit, the thixotropy of the black curable resin layer 2 increases, the fluidity during thermocompression bonding decreases, and the space between the plurality of light-emitting elements of the device-equipped substrate 10 cannot be fully filled.

(Other ingredients)

In order to improve the flame retardancy, heat resistance and adjust the refractive index, the black curable resin layer 2 may contain inorganic fillers.

The black curable resin layer 2 may also use resins other than epoxy resin and elastomer, adhesion-imparting agents such as tackifiers, defoaming agents and/or leveling agents, coupling agents, and flame retardants as needed.

＜Transparent curable resin layer＞

The transparent curable resin layer 3 is a layer for sufficiently pressing the black curable resin layer 2 between the plurality of light emitting elements arranged on the substrate with element 10 in the thermal compression bonding process.

[Total light transmittance]

The transparent curable resin layer 3 is preferably prepared so that the total light transmittance in the cured state is 30% to 99%. The transparent curable resin layer 3 is more preferably prepared so that the total light transmittance in the cured state is 35% to 95%, and further preferably prepared so that the total light transmittance in the cured state is 40% to 90%.

By setting the total light transmittance in the cured state of the transparent curable resin layer 3 to be equal to or greater than the lower limit, even if the transparent curable resin layer 3 in the cured state remains on the light-emitting element, light will not be prevented from reaching the observer side.

[Energy storage modulus]

The storage modulus of the transparent curable resin layer 3 in an uncured state is preferably larger than the storage modulus of the black curable resin layer 2 in an uncured state.

At 100° C., the storage elastic modulus of the uncured state of the transparent curable resin layer 3 is preferably greater than the storage elastic modulus of the uncured state of the black curable resin layer 2 .

In addition, at 150° C., the storage elastic modulus of the transparent curable resin layer 3 in an uncured state is preferably greater than the storage elastic modulus of the black curable resin layer 2 in an uncured state.

The storage elastic modulus of the transparent curable resin layer 3 in an uncured state is preferably greater than the storage elastic modulus of the black curable resin layer 2 at 100°C to 150°C.

It should be noted that, when the energy storage modulus of the transparent curable resin layer 3 in the uncured state is greater than the energy storage modulus of the black curable resin layer 2 in the uncured state at 100°C and 150°C, the energy storage modulus of the transparent curable resin layer 3 in the uncured state is greater than the energy storage modulus of the black curable resin layer 2 in the uncured state generally within the entire range of 100°C to 150°C.

The storage elastic modulus in the uncured state of the transparent curable resin layer 3 is preferably greater than the storage elastic modulus in the uncured state of the black curable resin layer 2 .

The storage modulus of the transparent curable resin layer 3 in an uncured state at 100° C. is preferably 1.0×10 ⁵ Pa or less, more preferably 1.0×10 ⁴ Pa or more and 1.0×10 ⁷ Pa or less, and further preferably 5.0×10 ⁴ Pa or more and 5.0×10 ⁶ Pa or less.

By setting the storage elastic modulus of the transparent curable resin layer 3 at 100° C. to a preferable upper limit or less in an uncured state, it is possible to obtain a black curable resin layer that does not interfere with pressure bonding to the component-equipped substrate 10 . 2 has sufficient fluidity to follow the unevenness of the element-mounted substrate 10 of the plurality of light-emitting elements and fully fill the spaces between the plurality of light-emitting elements.

If the storage elastic modulus of the transparent curable resin layer 3 at 100° C. exceeds the preferred upper limit, the fluidity of the transparent curable resin layer 3 will be insufficient, and the black curable resin layer 2 cannot be fully pressed into the plurality of light-emitting elements. Furthermore, cracks may occur in the transparent curable resin layer 3 during thermocompression bonding, thereby easily causing crack-like defects.

In the uncured state, by setting the storage elastic modulus of the transparent curable resin layer 3 at 100° C. to be equal to or higher than the preferred lower limit, it is easy to avoid the fluidity of the transparent curable resin layer 3 being too high and causing the transparent curable resin layer 3 to be bonded after thermocompression bonding. The surface of the transparent curable resin layer 3 has an uneven shape due to the combination of the light-emitting elements, resulting in poor appearance, and poor appearance such as shrinkage cavities during thermal curing.

In an uncured state, the storage elastic modulus of the transparent curable resin layer 3 at 150°C is preferably 1.0×10 ⁴ Pa or more, more preferably 1.0×10 ⁴ to 5.0×10 ⁷ Pa, and even more preferably 1.0×10 ⁵ ~5.0×10 ⁶ Pa.

In an uncured state, if the storage elastic modulus of the transparent curable resin layer 3 at 150° C. exceeds the preferred upper limit, cracks due to curing shrinkage are likely to occur during thermal curing. By setting the storage elastic modulus of the transparent curable resin layer 3 at 150° C. to a preferable lower limit value or more in an uncured state, flow during thermal curing can be suppressed, and post-cured appearance defects such as shrinkage cavities can be suppressed. Furthermore, trouble is less likely to occur when etching is performed in a subsequent step.

In an uncured state, the storage modulus of the transparent curable resin layer 3 at 100°C is preferably 10 to 1000 times, more preferably 30 to 500 times, the storage modulus of the black curable resin layer 2. In an uncured state, the storage modulus of the transparent curable resin layer 3 at 150°C is preferably 5 to 10000 times, more preferably 10 to 1000 times, the storage modulus of the black curable resin layer 2. It should be noted that, when the energy storage modulus of the transparent curable resin layer 3 is greater than the energy storage modulus of the black curable resin layer 2 at 100°C and 150°C, the energy storage modulus of the transparent curable resin layer 3 is greater than the energy storage modulus of the black curable resin layer 2 generally within the entire range of 100°C to 150°C.

[Curing resin composition]

The transparent curable resin layer 3 is composed of a curable resin composition. Examples of the curable resin composition include, like the black curable resin layer 2 , a curable resin composition containing at least one resin selected from the group consisting of epoxy resin, acrylic resin, polyester resin, and polyurethane resin, and a curing agent. . Among them, an epoxy resin composition is preferable because it can achieve curability at low temperatures, heat resistance, and excellent reliability.

(Epoxy)

Examples of the epoxy resin used in the transparent curable resin layer 3 include the same type as the black curable resin layer 2 .

The transparent curable resin layer 3 preferably contains a high molecular weight epoxy resin having a weight average molecular weight of 10,000 to 100,000 from the viewpoint of providing the transparent curable resin layer 3 with an appropriate viscosity during compression. The transparent curable resin layer 3 preferably contains a high molecular weight epoxy resin having a weight average molecular weight of 10,000 to 35,000 from the viewpoint of having good compatibility with other resin components and being able to dissolve a high boiling point solvent that may remain on the dry film even without mixing after drying.

As the epoxy resin used for the transparent curable resin layer 3, by containing a high molecular weight epoxy resin with a weight average molecular weight of 10,000 to 100,000, it has a moderate viscosity when heated, so that the temperature of the transparent curable resin layer 3 can be reduced to 100°C. The storage modulus in the range of ~150°C is adjusted to a preferred range.

The high molecular weight epoxy resin used in the transparent curable resin layer 3 has good compatibility with other epoxy resins, and therefore a phenoxy type epoxy resin is preferred.

The phenoxy epoxy resin has a relatively large molecular weight among epoxy resins and has a moderate viscosity when heated, so the storage modulus of the transparent curable resin layer 3 in the range of 100°C to 150°C can be adjusted to a preferred range. In addition, unlike other thermoplastic resins such as polyester, the phenoxy epoxy resin can be cured as an epoxy resin, so the crosslinking density can be increased without impairing the heat resistance of the cured product and the reliability of performance in long-term use.

From the viewpoint of ensuring the elastic storage modulus of the black curable resin layer 2 pressed during heat compression bonding, the glass transition temperature of the phenoxy epoxy resin used in the transparent curable resin layer 3 is preferably 100°C or higher.

Specific examples of phenoxy-type epoxy resins include "1256", "YX7200", "YX8100" and "YX7180" manufactured by Mitsubishi Chemical Co., Ltd., and "YP-50" and "YP" manufactured by NIPPON STEEL Chemical & Material Co., Ltd. -50S" "YP-70", "N-690" manufactured by DIC Co., Ltd., "H-157" "EXA-192" manufactured by DIC Co., Ltd., etc.

The blending amount of the high molecular weight epoxy resin in the transparent curable resin layer 3 is preferably 30 to 80 mass%, and more preferably 40 to 70 mass% based on 100 mass% of the total resin non-volatile content of the transparent curable resin layer 3 , more preferably 45 to 60 mass%.

The preferred blending amount of the phenoxy epoxy resin in the transparent curable resin layer 3 is also the same.

If it is within the above range, the storage elastic modulus can be controlled, and the storage elastic modulus of the transparent curable resin layer 3 during press-fit thermocompression bonding can be ensured. In addition, flow during thermal curing can be suppressed, and appearance defects after curing such as shrinkage cavities are suppressed. Furthermore, it is less likely to cause trouble when etching is performed in subsequent steps. In addition, the toughness is improved and crack-like defects are less likely to occur during thermocompression bonding.

When it is equal to or less than the above upper limit, the crosslinking density of the transparent curable resin layer 3 in a cured state can be increased, thereby improving heat resistance and chemical resistance.

Furthermore, it is preferable that the epoxy resin used for the transparent curable resin layer 3 contains a polyfunctional epoxy resin. By increasing the crosslinking density of the multifunctional epoxy resin, the stability of the long-term performance of the cured product of the epoxy resin composition is further improved, and the heat resistance is also improved. In addition, since the viscosity in the range of 100°C to 150°C is lower than that of the phenoxy-type epoxy resin, the storage modulus of the transparent curable resin layer 3 can be adjusted by combining it with the phenoxy-type epoxy resin.

Specific examples of polyfunctional epoxy resins include "YX7700", "157S70" and "1032S60" manufactured by Mitsubishi Chemical Corporation, "NC7000L", "XD1000", "EOCN-1020" manufactured by Nippon Kayaku Co., Ltd., and NIPPON "ESN485" manufactured by STEEL Chemical & Material Co., Ltd., "N-690", "N-695", "HP-7200H" manufactured by DIC Co., Ltd., etc.

The blending amount of the multifunctional epoxy resin in the transparent curable resin layer 3 is preferably 90 mass% or less, more preferably 10 to 80 mass%, based on 100 mass% of the total resin non-volatile content of the transparent curable resin layer 3. Preferably, it is 35-70 mass %. If it is within the above range, the storage elastic modulus during thermocompression bonding of the transparent curable resin layer 3 can be controlled, and heat resistance and chemical resistance can be imparted in the cured state.

From the viewpoint of ensuring sufficient fluidity during heat compression bonding, it is preferred that the transparent curable resin layer 3 contain an epoxy resin having a softening point or melting point of 120°C or less. From the viewpoint of handling properties and heat resistance of the cured product, it is more preferred that the epoxy resin contain a softening point or melting point of 50°C to 105°C. By containing an epoxy resin having a softening point or melting point within the above range, the storage modulus can be controlled.

The blending amount of the entire epoxy resin in the transparent curable resin layer 3 is preferably 10 to 100 mass%, more preferably 30 to 99 mass%, based on 100 mass% of the total resin non-volatile content of the transparent curable resin layer 3. More preferably, it is 50-95 mass %. If it is within the above range, the storage elastic modulus can be controlled, and the storage elastic modulus of the black curable resin layer 2 during press-fit thermocompression bonding can be ensured. In addition, flow during thermal curing can be suppressed, and appearance defects after curing such as shrinkage cavities are suppressed. Furthermore, it is less likely to cause trouble when etching is performed in subsequent steps. Moreover, if it is more than the said lower limit value, heat resistance will improve in a cured state.

(Elastic body)

The transparent curable resin layer 3 preferably contains an elastomer in addition to a resin such as an epoxy resin. By containing an elastomer, the elastic modulus can be easily controlled.

As the elastomer, the same types as those for the black curable resin layer 2 can be cited. Among them, NBR is preferred because it has good compatibility with epoxy resin, improves the elastic modulus of the transparent curable resin layer 3 at around 150°C, and has good adhesion with the black curable resin layer 2. The preferred weight average molecular weight of the elastomer is also the same as that of the black curable resin layer 2.

In particular, when the transparent curable resin layer 3 is composed of an epoxy resin composition, it is preferred to include a modified elastomer having a functional group capable of reacting with an epoxy group. If it is a modified elastomer having a functional group capable of reacting with an epoxy group, it also acts as a curing agent for the epoxy resin. In addition, since it can react with the epoxy resin and bond, the heat resistance and reliability against thermal shock are improved. Furthermore, the difference in polarity between the functional group capable of reacting with the epoxy resin and the resin skeleton has a good effect on dispersibility, and when carbon black is contained in the black curable resin layer 3, good dispersibility can be obtained.

Examples of the functional group capable of reacting with the epoxy group include the same types as the black curable resin layer 2 . Among these, an acid group or an acid anhydride group is preferable, and a carboxyl group or a carboxylic acid anhydride group is particularly preferable, since it can be cured at low temperature and can ensure a usable life.

When the transparent curable resin layer 3 is composed of an epoxy resin composition, it is particularly preferable to contain modified NBR having a carboxyl group.

Examples of the modified NBR having a carboxyl group include the same type as the black curable resin layer 2 .

Two or more modified elastomers having a functional group capable of reacting with an epoxy group may be used in combination.

The blending amount of the elastomer in the transparent curable resin layer 3 is preferably 0 to 50 mass%, more preferably 1 to 70 mass%, and even more preferably 100 mass% of the total resin non-volatile content of the transparent curable resin layer 3. 5～50% by mass. If it is within the above range, the storage modulus can be controlled. Moreover, if it is the said upper limit value or less, the storage elastic modulus of the black curable resin layer during press-fit thermocompression bonding can be ensured. In addition, flow during thermal curing can be suppressed, and appearance defects after curing such as shrinkage cavities are suppressed. Furthermore, it is less likely to cause trouble when etching is performed in subsequent steps. Moreover, when it is more than the said lower limit value, the dispersibility of carbon black becomes good. Furthermore, film-forming properties are improved, and the distribution of film thickness when forming a film by applying the epoxy resin composition can be narrowed.

(curing agent)

When the transparent curable resin layer 3 is composed of an epoxy resin composition, it may contain a curing agent for epoxy resin other than the modified elastomer having a functional group capable of reacting with an epoxy group. As the other curing agent, the same curing agent as that for the black curable resin layer 2 can be cited. Two or more other curing agents may be used in combination.

(curing catalyst)

When the transparent curable resin layer 3 is composed of an epoxy resin composition, a curing catalyst for accelerating the curing reaction of the epoxy resin may be contained.

As the curing catalyst, the same curing catalyst as that for the transparent curable resin layer 3 can be cited, and the preferred embodiment is also the same.

The blending amount of the curing catalyst is preferably 0.01 to 5 parts by mass, more preferably 0.05 to 4 parts by mass, and still more preferably 0.1 to 3 parts by mass relative to 100 parts by mass of the total resin nonvolatile content of the transparent curable resin layer 3 . If it is within the above range, curing will proceed sufficiently and the usable life of the integrated sealing sheet 1 can be ensured.

Two or more curing catalysts may be used in combination.

(Other ingredients)

In order to suppress uneven luminescence and color, the transparent curable resin layer 3 may contain a black pigment or a black dye.

From the viewpoint of improving the total light transmittance, when the transparent curable resin layer 3 contains carbon black, its blending amount is preferably less than 5 parts by mass, more preferably 1 part by mass or less, and further preferably 0.1 parts by mass or less, relative to 100 parts by mass of the total resin non-volatile components. The transparent curable resin layer 3 may further contain resins other than epoxy resins and elastomers, adhesion-imparting agents such as tackifiers, defoaming agents and/or leveling agents, coupling agents, and flame retardants as needed.

＜Coating and curing layer＞

The coating and curing layer 4 is a layer for protecting the light-emitting element from external physical impact, humidity, water, etc.

[Total light transmittance]

The coating cured layer 4 is preferably prepared with a total light transmittance of 30% to 99%. The coating cured layer 4 is preferably prepared with a total light transmittance of 35% to 95%, more preferably 40% to 95%.

By setting the total light transmittance of the coating cured layer 4 to be equal to or higher than the lower limit, light is not prevented from reaching the observer side.

[Energy storage modulus]

The storage elastic modulus of the coating cured layer 4 is preferably 1.0×10 ⁵ Pa or more and 1.0×10 ¹⁰ Pa or less, more preferably 2.0×10 ⁵ Pa or more and 9.0×10 ⁹ Pa or less, and more preferably 3.0×10 ⁵ Pa Above and below 8.0×10 ⁹ Pa.

By setting the storage elastic modulus of the cured coating layer 4 at 100°C to be equal to or less than the preferred upper limit, appropriate flexibility that does not hinder the flow of the black curable resin layer 2 during pressure bonding to the substrate with components 10 can be obtained. , it is possible to follow the unevenness of the element-mounted substrate 10 of the plurality of light-emitting elements and fully fill the space between the plurality of light-emitting elements.

By setting the storage modulus of the coated cured layer 4 at 100°C to be above the preferred lower limit, pressure can be reliably transmitted to the curable resin layer without deformation during compression bonding to the substrate 10 with components, and defects such as cracks and deformation will not occur in the hard coating layer.

[Resin]

The coating cured layer 4 is composed of a cured product of a curable resin composition. As the curable resin composition, similar to the black curable resin layer 2 and the transparent curable resin layer 3, there can be cited a curable resin composition containing at least one resin selected from epoxy resin, acrylic resin, polyester resin and polyurethane resin, a curing agent, a photopolymerization initiator and the like. Among them, an epoxy resin composition is preferred from the perspective of excellent heat resistance and reliability, and a photocurable resin composition is preferred from the perspective of easy curing even when the thickness is thick.

By including these resins, deformation during crimping can be prevented.

In order to suppress uneven luminescence and color, the coated cured layer 4 may contain a black pigment or a black dye.

[Film thickness]

The thickness of the coated cured layer 4 is preferably 10 μm to 250 μm , more preferably 20 μm to 200 μm , and further preferably 25 μm to 150 μm .

By setting the thickness of the coating cured layer 4 to a preferable lower limit value or more, sufficient strength can be obtained to protect the element. By setting the thickness of the coating cured layer 4 to a preferable upper limit or less, visibility can be improved and costs can be suppressed.

＜Hard coat＞

[hardness]

The hard coat layer 5 is a layer for protecting the light-emitting electronic component from damage.

The pencil hardness of the surface of the hard coat layer 5 is preferably H or higher, more preferably 2H or higher, and even more preferably 3H or higher.

[Surface roughness]

The surface roughness Ra of the surface of the hard coating layer 5 is preferably 0.1 μm to 1 μm , more preferably 0.2 μm to 1 μm , and further preferably 0.3 μm to 1 μm .

By setting the surface roughness of the hard coating layer 5 to be equal to or greater than a preferred lower limit, it is possible to reduce the reflectance of the surface of the hard coating layer 5. By setting the surface roughness of the hard coating layer 5 to be equal to or less than a preferred upper limit, production becomes easy.

[Total transmittance]

The hard coating layer 5 is preferably prepared so that the total light transmittance is 30% to 99%, more preferably 50% to 99%, and even more preferably 60% to 99%.

By setting the total light transmittance of the hard coat layer 5 to be equal to or higher than the lower limit, light is not prevented from reaching the observer side.

[Thermosetting resin]

The hard coating layer 5 is preferably made of a thermosetting resin. Examples of the thermosetting resin constituting the hard coating layer 5 include acrylic resin, polyurethane resin, organic silicon resin, melamine resin, and the like, and one or more of these may be included.

[particle]

The hard coat layer 5 preferably contains fine particles. As the fine particles, one or both of inorganic fine particles and organic fine particles can be used.

Examples of inorganic fine particles include silicon dioxide fine particles and titanium fine particles, and examples of organic fine particles include polymethyl methacrylate resin (PMMA resin) and polyurethane resin.

Among them, silica fine particles are preferred. By containing fine particles, surface roughness can be adjusted and surface hardness can be improved.

[film thickness]

The thickness of the hard coat layer 5 is preferably 1 μm to 20 μm , more preferably 2 μm to 10 μm , and even more preferably 3 μm to 8 μm .

Sufficient hardness can be ensured by setting the thickness of the hard coat layer 5 to be equal to or greater than the preferred lower limit. By setting the thickness of the hard coat layer 5 to a preferable upper limit or less, problems such as curling will not occur.

＜Optical characteristics of three layers＞

[Total transmittance]

The total light transmittance of the three layers of the transparent curable resin layer 3, the coating cured layer 4, and the hard coat layer 5 is preferably 30% to 95%, more preferably 35% to 95%, and still more preferably 40% to 95%. .

By setting the total light transmittance of the three layers to be equal to or higher than the lower limit, light is not prevented from reaching the observer side.

[Reflectivity]

The reflectance measured by a gloss meter (JIS-Z-8741) on the 5 side of the hard coating layer is preferably 1% to 50%, more preferably 3% to 30%, and further preferably 5% to 25%.

When the reflectance of the hard coating layer 5 is equal to or greater than the lower limit, the manufacturing is easy. When the reflectance of the hard coating layer 5 is equal to or less than the preferred upper limit, the visibility of the display is improved.

＜First protective film＞

The first protective film 6 has a function of protecting the one-piece sealing sheet 1 and is a film on which a coating liquid of a curable resin composition for the black curable resin layer 2 is applied when the one-piece sealing sheet 1 is formed.

As the first protective film 6, for example, polyester films such as polyethylene terephthalate and polyethylene naphthalate, polyimide films, polyamide imide films, and polyethylene films can be used. , polytetrafluoroethylene film, polypropylene film, polystyrene film and other films made of thermoplastic resin, as well as surface-treated paper, etc.

Among them, polyester film can be preferably used from the viewpoints of heat resistance, mechanical strength, operability, etc. The thickness of the first protective film 6 is not particularly limited and can be appropriately selected in the range of about 10 μm to 150 μm according to the purpose. The surface of the first protective film 6 on which the resin layer is provided can also be subjected to a mold release treatment.

＜Second protective film＞

The second protective film 7 has a function of protecting the integrated sealing sheet 1 and is a film to which the coating liquid for the hard coat layer is applied when forming the integrated sealing sheet 1 .

As the second protective film 7, the same protective film as the first protective film 6 can be used.

Among them, a polyester film can be preferably used for the same reason as the first protective film 6 . The thickness of the second protective film 7 is not particularly limited, and can be appropriately selected depending on the application in the range of approximately 10 μm to 150 μm . The surface of the second protective film 7 on which the resin layer is provided may be subjected to a release process.

[Surface roughness]

The surface roughness Ra of the surface of the second protective film 7 is preferably 0.1 μm to 1 μm , more preferably 0.2 μm to 1 μm , and even more preferably 0.3 μm to 1 μm .

By setting the surface roughness of the second protective film 7 to be equal to or greater than a preferred lower limit, it is possible to reduce the reflectance of the surface of the hard coating layer 5. By setting the surface roughness of the second protective film 7 to be equal to or less than a preferred upper limit, the supply of the second protective film 7 becomes easy.

[Reflectivity]

The reflectance of the second protective film 7 measured with a gloss meter (JIS-Z-8741) is preferably 1% to 50%, more preferably 3% to 30%, and even more preferably 5% to 25%.

When the reflectance of the second protective film 7 is equal to or greater than the lower limit, it is easy to supply the second protective film 7. When the reflectance of the second protective film 7 is equal to or less than the preferred upper limit, the glossiness of the surface of the hard coating layer 5 after transfer is reduced, and the visibility of the display is improved.

＜Method for producing integrated sealing sheet＞

In order to obtain the one-piece sealing sheet 1, first, a coating material obtained by drying a curable resin composition for the black curable resin layer 2 is applied on the first protective film 6, and a hard coating layer 5 is formed on the second protective film 7, and a coating curable layer 4 is formed on the hard coating layer 5. Furthermore, a coating material obtained by drying a curable resin composition for the transparent curable resin layer 3 is prepared by applying a coating material obtained by drying a curable resin composition for the black curable resin layer 2 on the coating curable layer 4.

Then, they are overlapped and laminated in a manner such that the transparent curable resin layer 3 is in contact with the black curable resin layer 2, thereby obtaining a laminate having the first protective film 6, the black curable resin layer 2, the transparent curable resin layer 3, the coating curable layer 4, the hard coating layer 5, and the second protective film 7 stacked in sequence.

The hard coating layer 5 formed on the film layer 4 is obtained by applying a hard coating agent on the surface of the second protective film 7 subjected to a mold release treatment and curing the hard coating agent.

Examples of the coating method of the coating agent for the hard coat layer include a die coater, a gravure coater, a roll coater, a curtain coater, a spin coater, a bar coater, a reverse coater, and a dosing coater. Various coating machines such as spray coater, rod coater, air knife coater, blade coater, blade coater, cast coater, screen coater, etc.

As a curing method of the coating agent for hard coating, heat curing, ultraviolet curing, electron beam curing, etc. can be cited.

The coating liquid of the curable resin composition preferably contains an organic solvent in an amount having a viscosity that enables coating without trouble.

The organic solvent is not particularly limited, and examples thereof include ketones, aromatic hydrocarbons, glycol ethers, glycol ether acetates, esters, alcohols, aliphatic hydrocarbons, petroleum-based solvents, and the like. Specifically, examples thereof include ketones such as methyl ethyl ketone, cyclohexanone, methyl butyl ketone, and methyl isobutyl ketone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; glycol ethers such as solvents, methyl solvents, butyl solvents, carbitol, methyl carbitol, butyl carbitol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, and triethylene glycol monoethyl ether; and ethyl acetate, butyl acetate, isobutyl acetate, and the like. Esters such as ethylene glycol monoethyl ether acetate, dipropylene glycol methyl ether acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, and propylene glycol butyl ether acetate; alcohols such as ethanol, propanol, 2-methoxypropanol, n-butanol, isobutanol, isoamyl alcohol, ethylene glycol, and propylene glycol; aliphatic hydrocarbons such as octane and decane; petroleum solvents such as petroleum ether, naphtha, hydrogenated naphtha, and solvent naphtha; and N,N-dimethylformamide (DMF), tetrachloroethylene, and turpentine.

It should be noted that when blending carbon black into the coating liquid, carbon black powder or carbon black dispersion liquid may be added.

Examples of the method for applying the curable resin composition include various coating machines such as die coaters, gravure coaters, roll coaters, curtain coaters, rotary coaters, bar coaters, reverse coaters, kiss coaters, injection coaters, rod coaters, air knife coaters, scraper coaters, blade coaters, cast coaters, and screen coaters.

The drying temperature is preferably 60°C to 160°C, more preferably 80°C to 130°C, and more preferably 90°C to 120°C.

The temperature during lamination is preferably 20°C to 120°C, more preferably 30°C to 100°C, and still more preferably 40°C to 80°C. By setting the temperature during lamination to be equal to or higher than the preferred lower limit, handleable adhesion can be ensured even if the black curable resin layer 2 and the transparent curable resin layer 3 are not cured. In addition, by setting the temperature during lamination to a preferable upper limit or less, it is possible to prevent the entrapment of air bubbles and the occurrence of wrinkles.

Lamination can be performed using a roll laminator, a press, a vacuum press, or the like.

＜Substrate with components＞

As shown in Fig. 2 , the substrate with elements 10 has a plurality of light emitting elements arranged on a substrate 11. Fig. 2 and the like schematically show a portion where three light emitting elements (light emitting element 12, light emitting element 13, and light emitting element 14) are arranged.

The material of the substrate 11 is not limited, and a known printed circuit board can be preferably used. Well-known printed circuit boards include glass epoxy substrates, fluororesin substrates, ceramic substrates, and the like.

The light-emitting element is typically a light-emitting diode. The present invention is particularly suitable for applications where the light-emitting element is extremely small.

For example, a light-emitting diode having a height of 1000nm to 200 μm and a side of 0.001mm to 0.5mm can be used.

As the substrate 10 with a device for obtaining a mini LED or a micro LED, light emitting diodes of three colors of R, G, and B can be used as the light emitting element, or a blue light emitting diode can be used as the light emitting element.

＜Method for manufacturing light-emitting electronic component＞

The manufacturing method of a light-emitting electronic component of the present invention is a method of placing a surface of an element-mounted substrate on which a plurality of light-emitting elements are arranged so as to be in contact with the black curable resin layer 2 The integrated sealing sheet 1 of the present invention is arranged in a contact manner, pressure-bonded, and a part of the black curable resin layer 2 and the transparent curable resin layer 3 is filled between the plurality of light-emitting elements, and heated. The black curable resin layer 2 and the transparent curable resin layer 3 are cured.

Hereinafter, a method for manufacturing a light-emitting electronic component according to one embodiment of the present invention will be described with reference to FIGS. 2 to 4 .

In the manufacturing method of the present embodiment, first, as shown in FIG. 2 , on the surface of the substrate 10 with the elements on which the light-emitting elements 12, 13, and 14 are arranged, an integral sealing sheet 1 is arranged in contact with the black curable resin layer 2 by peeling off the first protective film 6 to expose the black curable resin layer 2.

At this time, that is, before pressure bonding, the thickness of the black curable resin layer 2 is preferably 10% to 95% relative to the height of the light-emitting element. The above-mentioned lower limit value is more preferably 15% or more, and further preferably 30% or more. In addition, the upper limit is more preferably 85% or less, further preferably 65% or less, and particularly preferably 55% or less.

If the thickness of the black curable resin layer 2 is 10% or more relative to the height of the light-emitting elements, the function of preventing light diffusion between the light-emitting elements becomes sufficient. In addition, if the storage elastic modulus of the black curable resin layer 2 is low and fluidity is ensured, resin can be fully filled between the light-emitting elements. If the thickness of the black curable resin layer 2 is less than 15% relative to the height of the light-emitting element, crack-like defects may occur on the surface when the fluidity of the transparent curable resin layer 3 is relatively low. If the thickness of the black curable resin layer 2 is 30% or more relative to the height of the light-emitting elements, the black curable resin layer 2 having a light diffusion preventing function can be appropriately filled between the light-emitting elements.

If the thickness of the black curable resin layer 2 is 95% or less relative to the height of the light-emitting element, the black curable resin layer can be prevented from leaking to the outside during heat pressing, and the light from the light-emitting element will not be hindered from reaching the observer side. If the thickness of the black curable resin layer 2 exceeds 85% relative to the height of the light-emitting element, the thickness of the black curable resin layer 2 flowing after pressurization may be uneven, and the black color may be seen in a darker or lighter color. If the thickness of the black curable resin layer 2 is 55% or less relative to the height of the light-emitting element, the black curable resin layer 2 having the function of preventing light diffusion can be appropriately filled between the light-emitting elements.

The thickness of the transparent curable resin layer 3 before compression bonding is preferably 10% to 500% of the height of the light-emitting element. The lower limit is more preferably 40% or more, and more preferably 50% or more. The upper limit is more preferably 200% or less, and more preferably 150% or less.

If the thickness of the transparent curable resin layer 3 is 10% or more relative to the height of the light-emitting element, it can easily function as a sealing layer covering the light-emitting element. In addition, when the storage modulus of the transparent curable resin layer 3 is relatively high and the fluidity is suppressed, the transparent curable resin layer 3 is suppressed from flowing together with the black curable resin layer 2 during thermal curing, so that appearance defects are less likely to occur on the surface. If the thickness of the transparent curable resin layer 3 is less than 40% relative to the height of the light-emitting element, the allowable flow range of the transparent curable resin layer 3 is insufficient, and crack-like defects may appear on the surface. If the thickness of the transparent curable resin layer 3 is 50% or more relative to the height of the light-emitting element, it can easily function as a sealing layer covering the light-emitting element. In addition, when the storage elastic modulus of the transparent curable resin layer 3 is relatively high and the fluidity is suppressed, the black curable resin layer 2 can be fully pressed into it.

The total thickness of the black curable resin layer 2 and the transparent curable resin layer 3 before compression bonding is preferably 110% to 550%, more preferably 120% to 400%, and more preferably 150% to 300% of the height of the light-emitting element.

When the total thickness of the black curable resin layer 2 and the transparent curable resin layer 3 relative to the height of the light emitting element is equal to or greater than the above lower limit, the one-piece sealing sheet 1 can be sufficiently buried between the light emitting elements.

If the total thickness of the black curable resin layer 2 and the transparent curable resin layer 3 relative to the height of the light-emitting element is below the upper limit, thickness unevenness is less likely to occur during pressure bonding and appearance defects are less likely to occur on the surface.

The ratio of the thickness of the black curable resin layer 2 before pressure bonding to the total thickness of the transparent curable resin layer 3 and the black curable resin layer 2 before pressure bonding is preferably 10% to 90%, and more preferably 15%. ~70%, more preferably 20% ~ 50%.

If the ratio of the thickness of the black curable resin layer 2 before pressure bonding to the total thickness of the transparent curable resin layer 3 and the black curable resin layer 2 is more than the above-mentioned lower limit, the blackness can be improved and the display can be fully improved. contrast. If it is below the above-mentioned upper limit, the black curable resin layer 2 will not easily remain on the light-emitting element during pressure bonding, and the brightness can be sufficiently improved.

In the state shown in FIG. 2 , heat-compression bonding is performed to embed a portion of the black curable resin layer 2 and the transparent curable resin layer 3 of the one-piece sealing sheet 1 between the light-emitting elements as shown in FIG. 3 .

At this time, if the storage modulus of the black curable resin layer 2 is low and fluidity is ensured, it is preferable because it can easily follow the unevenness of the light-emitting element and fill in the spaces between the light-emitting elements, and it is less likely to remain on the light-emitting element.

The temperature of the heat pressing is preferably 80°C to 120°C, more preferably 90°C to 110°C. By setting the temperature of the heat pressing to 80°C or higher, the fluidity of the one-piece sealing sheet 1 can be easily ensured. In addition, by setting the temperature of the heat pressing to 120°C or lower, it is difficult to damage the light-emitting element. By setting the temperature of the heat pressing to 90°C to 110°C, the fluidity can be more precisely controlled, and the generation of unevenness and crack-like defects can be suppressed.

The pressure of thermocompression bonding is preferably 0.05MPa to 1.0MPa, more preferably 0.1MPa to 0.5MPa. By setting the thermocompression bonding pressure to be equal to or higher than the preferable lower limit, the black curable resin layer 2 will not remain on the light-emitting element, and the light from the light-emitting element will not be prevented from reaching the observer side. By setting it below the preferable upper limit, damage to the light-emitting element is less likely to occur.

The heat pressing is preferably performed using a vacuum press machine capable of forming in a vacuum state. This makes it easy to avoid defects caused by air mixing into the obtained light-emitting electronic component.

As shown in FIG4, after the compression bonding, the second protective film 7 is peeled off and then thermally cured, and as shown in FIG5, the black curable resin layer 2 of the one-piece sealing sheet 1 is made into a black curable resin cured product 22 (black curable resin layer 2 in a cured state), and the transparent curable resin layer 3 is made into a transparent curable resin cured product 23 (transparent curable resin layer 3 in a cured state). Thus, a light-emitting electronic component 30 is obtained.

The curing temperature is 100°C to 160°C, preferably 120°C to 150°C. By setting the curing temperature to 100°C or higher, the one-piece sealing sheet 1 can be cured. By setting the curing temperature to 120°C or higher, the curing time of the one-piece sealing sheet 1 can be shortened. In addition, by setting the curing temperature to be below the upper limit temperature, it is difficult to damage the light-emitting element.

The curing time depends on the curing temperature, preferably 30 minutes to 360 minutes, more preferably 45 minutes to 180 minutes.

At the curing temperature, if the elastic modulus of the transparent curable resin layer 3 is relatively high and the fluidity is suppressed, the appearance defect after curing can be suppressed, which is preferred.

Thus, a light-emitting electronic component 30 is obtained in which the one-piece sealing sheet 1 is pressure-bonded to the surface of the substrate with element 10 on which the light-emitting elements are arranged, wherein a plurality of light-emitting elements are arranged on the substrate 11 .

In the obtained light-emitting electronic component 30, the black curable resin layer 2 and the transparent curable resin layer 3 are cured, and a portion of the black curable resin layer 2 and the transparent curable resin layer 3 is filled between the plurality of light-emitting elements.

[Example]

Hereinafter, although an Example is shown and this invention is demonstrated in more detail, the scope of this invention is not limited to these Examples.

＜Raw materials＞

Details of the raw materials used in each Example and Comparative Example are as follows.

[Epoxy resin]

·jER 1032H60: Made by Mitsubishi Chemical Corporation, high-purity multifunctional epoxy resin (solid), softening point 62°C, epoxy equivalent 168g/eq.

·HP-7200H: Made by DIC, cyclopentadiene novolac type multifunctional epoxy resin (solid), softening point 82°C, epoxy equivalent 227g/eq.

·jER YX7200B35: Made by Mitsubishi Chemical Corporation, phenoxy-type epoxy resin (MEK solution, non-volatile content 35% by mass), glass transition temperature 150°C, epoxy equivalent 8781g/eq., weight average molecular weight 35,000.

·jER 828EL: Made by Mitsubishi Chemical Co., Ltd., bisphenol A type bifunctional epoxy resin (liquid), epoxy equivalent weight 186 g/eq.

NC-3000H: Made by Nippon Kayaku Co., Ltd., biphenyl novolac type multifunctional epoxy resin (solid), softening point 71°C, epoxy equivalent 290g/eq.

8ME-8016E: manufactured by Taisei Fine Chemical Co., Ltd., aliphatic epoxy-introduced acrylic polymer, epoxy equivalent weight 414 g/eq.

[Elastic body]

NX775: manufactured by Zeon Co., Ltd., Japan, carboxyl-modified nitrile rubber, weight-average molecular weight 208,000.

TeisanResinSG-80H: Made by Nagase ChemteX, acrylate copolymer resin (functional groups: epoxy, amide), MEK cut product, non-volatile content 18% by mass, weight average molecular weight 850,000.

[Resin]

·HF-1M: HF-1M, phenol novolac resin manufactured by Meiwa Kasei Co., Ltd.

[Curing catalyst]

·2PZ-CN: 1-cyanoethyl-2-phenylimidazole manufactured by Shikoku Chemicals Co., Ltd.

·2E4MZ: 2-ethyl-4-methylimidazole manufactured by Shikoku Chemicals Co., Ltd.

[Photopolymerization initiator]

·Irgacure TPO H: manufactured by BASF, a photo-free radical generator.

·WPI170: Photocationic polymerization initiator manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.

·Ommirad127: a photoradical generator manufactured by IGM Resins B.V.

[carbon black]

·Special Black 4: Natural gas carbon black manufactured by ORION ENGINEERED CARBONS.

[Additive]

·KBM-403: Made by Shin-Etsu Silicone Co., Ltd., epoxy silane coupling agent.

[Solvent]

·MEK: Manufactured by Pure Chemical Co., Ltd., methyl ethyl ketone.

·PGM: Propylene glycol monomethyl ether, manufactured by Pure Chemical Co.

[Second protective film]

ND-1: manufactured by the company, demoulding PETND-1, thickness 50 μm , surface roughness Ra=0.61 μm , Rz=3.9 μm , RSm=0.03Mm.

[First protective film]

·1-TRE: Made by NIPPA, 1-TRE, thickness 50 μm .

[Resin for hard coat]

8KX-078: ACRIT8KX-078 (non-volatile content 40%) manufactured by Taisei Fine Chemical Co., Ltd.

[particle]

· Silica particles: manufactured by Tosoh Silicon Co., Ltd., silica particles, trade name “Nipsil SS50B”, average particle size 2000 nm (2 μm ).

·Organic fine particles: Spherical PMMA fine particles [average particle diameter 4.5 μm , refractive index 1.49] manufactured by Sekisui Chemicals Industry Co., Ltd.

<Example 1>

[Preparation of membrane with hard coating]

A coating agent for a hard coating obtained by uniformly mixing 250 parts by mass of 8KX-078, 1 part by mass of Irgacure TPO H, and 1 part by mass of Ommirad 127 was applied to one side of ND-1 in a thickness of 10 μm , and cured by irradiating ultraviolet rays at 2000 mJ/cm ² to obtain a film 1 with a hard coating layer.

[Formation of coating cured layer]

The raw materials 1 of the formulation shown in [Table 1] were mixed to prepare a coating liquid 1 having a non-volatile component concentration of 100 mass %.

The obtained coating liquid 1 was applied to the hard coat layer of the film 1 with a hard coat layer using a bar coater so that the film thickness became 50 μm , and was cured by irradiation with ultraviolet rays of 2000 mJ/cm ² . It was further aged at 90° C. for 12 hours to obtain a laminated sheet 1 in which the applied cured layer was laminated on the film 1 with the hard coat layer.

[Formation of transparent curable resin layer]

The raw materials 11 of the formula shown in [Table 2] were mixed in a solvent of MEK/PGM=80/20 to prepare a coating liquid 2 with a non-volatile content concentration of 25% by mass. That is, the total compounding amount of the compounded raw materials 11 shown in [Table 2] (in terms of nonvolatile components) was set to 25 mass % with respect to the entire coating liquid obtained.

The obtained coating liquid 2 was applied to the coated cured layer of the laminated sheet 1 using a bar coater so that the dry film thickness became 40 μm , and dried at 120° C. for 5 minutes to obtain a transparent curable resin layer laminated on the coated Laminated sheet 1 on cured layer.

[Formation of black curable resin layer]

The raw materials 12 of the formula shown in [Table 2] were mixed in a solvent of MEK/PGM=80/20 to prepare a coating liquid 3 with a non-volatile content concentration of 25% by mass. That is, the total compounding amount of the compounded raw materials 12 shown in [Table 2] (in terms of nonvolatile components) was set to 25 mass % with respect to the entire coating liquid obtained.

The obtained coating liquid 3 was applied to the release surface of 1-TRE using a bar coater so that the dry film thickness became 40 μm , and dried at 120° C. for 5 minutes to obtain a black curable resin layer protected by the first Membrane supported laminated sheet 2.

[Preparation of integrated sealing sheet]

The laminated sheet 1 and the laminated sheet 2 were laminated so that the transparent curable resin layer and the black curable resin layer were in contact with each other, and were laminated using a roller laminator at 60° C. to produce a first protective film, a black curable resin layer, and a black curable resin layer laminated in this order. The integrated sealing sheet 1 includes a curable resin layer, a transparent curable resin layer, a coated cured layer, a hard coat layer, and a second protective film.

[Manufacturing of light-emitting electronic components]

The obtained one-piece sealing sheet 1 was arranged on a substrate with a light-emitting element (50 μm in height, 100 μm in length, and 200 μm in width) mounted on the substrate so as to be in contact with the black curable resin layer from which the first protective film was peeled.

In this state, lamination was performed using a vacuum laminator MVLP-500 (manufactured by Meiji Seisakusho) at a temperature of 80°C to 110°C and a pressure of 0.3MPa. Next, the second protective film was peeled off, and the curable resin layer was cured in a hot air circulation drying oven at 150° C. for 60 minutes to obtain a light-emitting electronic component.

<Example 2>

[Formation of coating cured layer]

The raw materials 2 of the formulation shown in [Table 1] were mixed to prepare a coating liquid 4 having a non-volatile component concentration of 100 mass %.

The obtained coating liquid 4 was applied to the hard coat layer of the film 1 with a hard coat layer using a bar coater so that the film thickness became 50 μm , and was cured by irradiation with ultraviolet rays of 2000 mJ/cm ² . It was further aged at 90° C. for 12 hours to obtain a laminated sheet 3 in which the applied cured layer was laminated on the film 1 with the hard coat layer.

[Formation of transparent curable resin layer]

The raw material 13 of the formula shown in [Table 2] was mixed in a solvent of MEK/PGM=80/20 to prepare a coating liquid 5 with a non-volatile content concentration of 25% by mass. That is, the total compounding amount of the compounded raw materials 13 shown in [Table 2] (in terms of nonvolatile components) was set to 25 mass % with respect to the entire coating liquid obtained.

The obtained coating liquid 5 was applied to the coating cured layer of the laminated sheet 3 using a bar coater in a manner such that the dry film thickness was 40 μm , and dried at 120° C. for 5 minutes to obtain a laminated sheet 3 in which transparent curable resin was laminated on the coating cured layer.

[Formation of black curable resin layer]

The raw materials 14 of the formula shown in [Table 2] were mixed in a solvent of MEK/PGM=80/20 to prepare a coating liquid 6 with a non-volatile content concentration of 25% by mass. That is, the total compounding amount of the compounded raw materials 14 shown in [Table 2] (in terms of nonvolatile components) was set to 25 mass % with respect to the entire coating liquid obtained.

The obtained coating liquid 6 was applied to the release surface of 1-TRE using a bar coater in such a manner that the dry film thickness became 40 μm , and dried at 120° C. for 5 minutes to obtain a laminated sheet 4 in which the black curable resin layer was supported by the first protective film.

[Preparation of integrated sealing sheet]

The stacking sheets 3 and 4 are stacked in a manner such that the transparent curable resin layer is in contact with the black curable resin layer, and are laminated using a 60°C roller laminating machine to produce an integrated sealing sheet 2 having a first protective film, a black curable resin layer, a transparent curable resin layer, a coating curing layer, a hard coating layer, and a second protective film laminated in sequence.

[Manufacturing of light-emitting electronic components]

A light-emitting electronic component was obtained in the same manner as in Example 1 except that the obtained integrated sealing sheet 2 was used.

<Example 3>

[Formation of coating cured layer]

The coating liquid 1 is applied on the hard coating layer of the film 1 with a hard coating layer in the same manner as in Example 1, thereby obtaining a laminated sheet 1 in which the coating and cured layers are laminated on the film 1 with a hard coating layer.

[Formation of transparent curable resin layer]

In the same manner as in Example 1, the coating liquid 2 is applied on the coated and cured layer of the laminated sheet 1 to obtain a laminated sheet 1 in which transparent curable resin is laminated on the coated and cured layer.

[Formation of black curable resin layer]

Except that the coating amount of the coating liquid 3 is set to a dry film thickness of 50 μm , the same operation is performed as in Example 1 to apply the coating liquid 3 on the release surface of the protective film to obtain a black curable resin layer protected by the first Film supported laminate sheet 5.

[Preparation of integrated sealing sheet]

The laminated sheet 1 and the laminated sheet 5 were laminated so that the transparent curable resin layer and the black curable resin layer were in contact with each other, and were laminated using a roller laminator at 60° C. to produce a first protective film, a black curable resin layer, and a black curable resin layer laminated in this order. The integrated sealing sheet 3 includes a curable resin layer, a transparent curable resin layer, a coated cured layer, a hard coat layer, and a second protective film.

[Manufacturing of light-emitting electronic components]

A light-emitting electronic component was obtained in the same manner as in Example 1 except that the obtained integrated sealing sheet 3 was used.

<Example 4>

[Formation of coating cured layer]

The coating liquid 1 is applied on the hard coating layer of the film 1 with a hard coating layer in the same manner as in Example 1, thereby obtaining a laminated sheet 1 in which the coating liquid 1 is laminated layer by layer on the film 1 with a hard coating layer.

[Formation of transparent curable resin layer]

In the same manner as in Example 1, the coating liquid 2 was applied to the applied cured layer of the laminated sheet 1 to obtain the laminated sheet 1 in which a transparent curable resin layer was laminated on the applied cured layer.

[Formation of black curable resin layer]

Except that the coating amount of the coating liquid 3 was adjusted to a dry film thickness of 60 μm , the coating liquid 3 was applied on the release surface of the protective film in the same manner as in Example 1 to obtain a black curable resin layer supported by the first protective film. of laminated sheets 6.

[Preparation of integrated sealing sheet]

The laminated sheet 1 and the laminated sheet 6 were laminated so that the transparent curable resin layer and the black curable resin layer were in contact with each other, and were laminated using a roller laminator at 60° C. to produce a first protective film, a black curable resin layer, and a black curable resin layer laminated in this order. The integrated sealing sheet 4 includes a curable resin layer, a transparent curable resin layer, a coated cured layer, a hard coat layer, and a second protective film.

[Manufacturing of light-emitting electronic components]

A light-emitting electronic component was obtained in the same manner as in Example 1 except that the obtained integrated sealing sheet 4 was used.

[Table 1] (Unit: mass parts) Raw material 1 Raw material 2 Raw material composition Epoxy 8ME-8016E 100 100 Photopolymerization initiator WPI170 2 2 Ommirad127 1 1 Carbon Black Special Black4 - 0.05

[Table 2] (Unit: mass parts) Raw material 11 Raw material 12 Raw material 13 Raw material 14 Raw material composition Epoxy jER1032H60 40 - 40 - HP-7200H - 70 - 50 jER YX7200B35 50 - 40 - Elastic body NX775 10 30 20 50 Curing catalyst 2PZ-CN 3 - 3 - 2E4M - 1 - 1 Carbon Black Special Black4 - 4 - 4

＜Evaluation＞

[Total transmittance]

The total light transmittance of each layer was measured using a haze meter (NDH5000) manufactured by Nippon Denshoku Industries Co., Ltd. in accordance with JIS K7136. The results are shown in [Table 3].

[Lab]

The Lab of the black curable resin layer in a cured state is obtained by curing the black curable resin layer supported by a protective film at 150° C. for 1 hour and then determining the Lab using a spectrophotometer.

[Storage modulus]

The storage modulus at 100°C before curing of the coating films in the laminated sheets 1 to 4 was measured using a viscoelasticity measuring device (RSA-G2 manufactured by TA Instruments) at a measuring frequency of 1 Hz and a heating rate of 5°C/min in accordance with JIS K7244. The results are shown in [Table 3].

[Reflectivity]

The reflectance of the hard coat surface was determined with a gloss meter (VG8000, JIS-Z-8741 manufactured by Nippon Denshoku Industries Co., Ltd.). The results are shown in [Table 3].

[Pencil hardness]

The pencil hardness of the hard coating surface was determined using a pencil hardness tester (JIS-K5600-5-4). The results are shown in [Table 3].

[Surface roughness]

The surface roughness of the hard coating layer surface was determined using a laser microscope (LEXT OLS4000, manufactured by Olympus Corporation, JIS-B-0601). The results are shown in [Table 3].

[Black curing resin layer residue on the component]

The surface after curing was observed and evaluated according to the following criteria. The results are shown in [Table 3].

◎: No residue of the black curable resin layer is visible on the light-emitting element.

○: Although some residue of the black curable resin layer can be seen on the light-emitting element, there is almost no residue left.

×: Residues of the black curable resin layer are visible on the light-emitting element.

[table 3] Embodiment 1 Embodiment 2 Embodiment 3 Embodiment 4 Total light transmittance after curing (%) Hard coating 99.7 99.7 99.7 99.7 Apply the curing layer 90.1 69.5 90.1 90.1 Transparent curable resin layer 84.1 80.0 84.1 84.1 Three-layer overall 51.6 66.1 51.6 51.6 Lab after curing the black curable resin layer L 14.8 10.8 13.6 11.5 a 1.52 0.31 1.35 0.82 b 2.31 1.88 2.11 1.35 Energy storage modulus (Pa) Apply the curing layer 1.56×10 ⁹ 1.84×10 ⁹ 1.56×10 ⁹ 1.56×10 ⁹ Transparent curable resin layer 1.03×10 ⁶ 4.70×10 ⁵ 1.10×10 ⁶ 1.10×10 ⁶ Black curable resin layer 5.63×10 ³ 3.68×10 ⁴ 5.63×10 ³ 5.63×10 ³ Reflectivity of hard coating surface (%) 14 14 14 14 Pencil hardness of hard coating surface 2H 2H 2H 2H Surface roughness of hard coating surface (μm) 0.60 0.60 0.60 0.60 Residue of black curing resin layer on components Reviews ◎ ◎ ○ △

Through the above-mentioned examples, it can be confirmed that not only can the light diffusion-preventing resin be filled between a plurality of light-emitting elements with a single press-bonding operation, but also the sealing operation can be completed without preventing the light from the light-emitting elements from reaching the observer side. A light-emitting electronic component with sufficient surface hardness was obtained.

In addition, it was confirmed that the thickness of the black curable resin layer is preferably smaller than the height of the light-emitting element.

In summary, the technical means disclosed in the present invention can indeed effectively solve the problems of conventional knowledge and achieve the expected purposes and effects. They have not been published in publications or publicly used before the application and are of long-term progress. They are truly worthy of the title. The invention described in the Patent Law is correct, and I submit the application in accordance with the law. I sincerely pray that Jun will review it carefully and grant an invention patent. I am deeply grateful.

However, the above are only several preferred embodiments of the present invention, and should not be used to limit the scope of implementation of the present invention. In other words, all equivalent changes and modifications made according to the scope of the patent application of the present invention and the contents of the invention specification should still fall within the scope of the present invention patent.

[The present invention] 1: One-piece sealing sheet 10: Substrate with element 11: Substrate 12: Light-emitting element 13: Light-emitting element 14: Light-emitting element 2: Black curable resin layer 22: Black curable resin cured product 23: Transparent curable resin cured product 3: Transparent curable resin layer 30: Light-emitting electronic component. 4: Coating cured layer 5: Hard coating layer 6: First protective film 7: Second protective film

[Fig. 1] is a schematic cross-sectional view of an integrated sealing sheet according to one embodiment of the present invention; [Fig. 2] is a schematic explanatory diagram of a method for manufacturing a light-emitting electronic component according to one embodiment of the present invention; [Fig. 3] is a schematic explanatory diagram of a method for manufacturing a light-emitting electronic component according to one embodiment of the present invention; [Fig. 4] is a schematic explanatory diagram of a method for manufacturing a light-emitting electronic component according to one embodiment of the present invention; [Fig. 5] is a schematic explanatory diagram of a method of manufacturing a light-emitting electronic component according to one embodiment of the present invention.

1: One-piece sealing sheet

2: Black curable resin layer

3: Transparent curable resin layer

4: Apply the curing layer

5:Hard coating

7: Second protective film

10: Substrate with components

11:Substrate

12:Light-emitting components

13:Light-emitting components

14: Light-emitting element

Claims (10)

An integrated sealing sheet pressed against a surface of an element-mounted substrate on which a plurality of light-emitting elements are arranged, on which the plurality of light-emitting elements are arranged, It is characterized in that it includes a black curable resin layer, a transparent curable resin layer, a coating cured layer, and a hard coat layer laminated in order from the side disposed in contact with the device-equipped substrate during the pressure bonding. The one-piece sealing sheet as described in claim 1, wherein the black curable resin layer and the transparent curable resin layer are in an uncured state. The one-type sealing sheet according to claim 1 or 2, wherein at 100° C., the storage modulus of the transparent curable resin layer in an uncured state is greater than that of the black curable resin layer in an uncured state. The storage modulus is large. The one-piece sealing sheet according to claim 1 or 2, wherein the storage modulus of the black curable resin layer in an uncured state at 100°C is 1.0×10 ² Pa or more and 1.0×10 ⁵ Pa or less. The one-piece sealing sheet according to claim 1 or 2, wherein the storage modulus of the transparent curable resin layer in an uncured state is 1.0×10 ⁴ Pa or more and 1.0×10 ⁷ at 100°C. Pa below. The one-piece sealing sheet according to claim 1 or 2, wherein the storage modulus of the coating cured layer is 1.0×10 ⁵ Pa or more and 1.0×10 ¹⁰ Pa or less at 100°C. The one-piece sealing sheet according to claim 1 or 2, wherein the total light transmittance of the coating cured layer is 30% to 99%. A light-emitting electronic component, characterized in that it includes a substrate with an element on which a plurality of light-emitting elements are arranged, and a surface of the substrate with an element in which the plurality of light-emitting elements are arranged is pressed against the claim 1 or The one-type sealing sheet described in 2, The black curable resin layer and the transparent curable resin layer are cured, The black curable resin layer and a part of the transparent curable resin layer are filled between the plurality of light emitting elements. A method for manufacturing a light-emitting electronic component, characterized in that a one-piece sealing sheet as described in claim 1 or 2 is arranged on a surface of a substrate with a plurality of light-emitting elements arranged thereon so as to be in contact with the black curable resin layer, the black curable resin layer and a portion of the transparent curable resin layer are filled between the plurality of light-emitting elements by pressurized compression, and the black curable resin layer and the transparent curable resin layer are cured by heating. The manufacturing method of a light-emitting electronic component according to claim 9, wherein the thickness of the black curable resin layer before pressure bonding is 10% to 95% relative to the height of the light-emitting device, The total thickness of the black curable resin layer and the transparent curable resin layer before pressure bonding is 110% to 550% with respect to the height of the light emitting element.