JP2015082496A - Translucent substrate, and illumination device with surface-light source - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide: a translucent substrate having excellent incombustibility and light transmissivity; and a reliable illumination device with a surface-light source which has such a translucent substrate.SOLUTION: A translucent substrate A comprises: a brominated resin; and a glass filler. The translucent substrate has a combustion rate of 75 mm/minute or less in UL94 horizontal combustion test, or a self-extinguishing property. The translucent substrate has a total light transmittance of 70% or more for 400 nm. In addition, the brominated resin is preferably a brominated epoxy resin; and the glass filler is preferably a glass fiber.

Description

  The present invention relates to a translucent substrate and surface light source illumination.

  A glass plate is widely used for a substrate for surface light source illumination such as organic EL illumination and inorganic EL illumination because it has both excellent translucency and strength. However, the glass plate has problems such as being easily broken, not being bent, and not suitable for weight reduction.

  In addition, for conventional surface light source illumination, a surface light source is usually produced on a glass plate and a light diffusion sheet is separately attached to achieve uniform light diffusivity. Since it is required separately, there is a problem of cost increase due to the cost of members and the yield at the time of bonding.

  On the other hand, since the resin film used for the diffusion sheet usually has low heat resistance and a high coefficient of linear expansion, it is difficult to directly produce a surface light source on the diffusion sheet. Furthermore, since the substrate for surface light source illumination is indispensable for flame retardancy, it is difficult to impart flame retardancy with conventional diffusion sheets based on polyester or the like (for example, patents) Reference 1).

  Therefore, development of a resin film (translucent substrate) having excellent flame retardancy and translucency is required.

JP 2007-249185 A

  An object of the present invention is to provide a translucent substrate having excellent flame retardancy and translucency, and a reliable surface light source illumination including such a translucent substrate.

Such an object is achieved by the present invention described in the following (1) to (14).
(1) A translucent substrate containing a brominated resin, having a burning rate of 75 mm / min or less or self-extinguishing property in a UL94 horizontal combustion test, and having a total light transmittance of 70% or more at 400 nm. .

  (2) The translucent substrate according to (1), wherein the brominated resin is a brominated epoxy resin.

(3) The translucent board | substrate as described in said (1) or (2) containing a glass filler.
(4) The translucent substrate according to (3), wherein the glass filler is glass fiber.

(5) The brominated resin is included as a constituent material of the resin composition,
The translucent substrate according to (3) or (4), wherein the content of the brominated resin in the resin composition is 0.1 wt% or more and 20 wt% or less.

  (6) The translucency according to any one of (1) to (5) above, wherein the average roughness (Rz) of the surface ten points on at least one surface of the translucent substrate is 1 μm or more and 30 μm or less. Substrate.

  (7) The translucent substrate according to (6), wherein an average interval (Sm) between the concaves and convexes constituting the average roughness of the surface 10 points is 0.1 μm or more and 30 μm or less.

  (8) The translucent board | substrate in any one of said (1) thru | or (7) whose average linear expansion coefficient in 30 degreeC-130 degreeC is 0-40 ppm / K.

  (9) The translucent substrate according to any one of (1) to (8), wherein the average thickness is 5 to 1000 μm or less.

  (10) The translucent substrate according to any one of (1) to (9), wherein the haze value is 70% or more.

  (11) The translucent substrate according to any one of (1) to (10), wherein the glass transition temperature is 130 ° C. or higher.

  (12) The translucent substrate according to any one of (1) to (11), wherein the elastic modulus at 250 ° C. is 1 GPa or more.

  (13) The translucent substrate according to any one of (1) to (12), which is used for a surface light source substrate.

  (14) A surface light source illumination comprising the translucent substrate according to any one of (1) to (13).

  According to the present invention, by containing a brominated resin, a translucent property having a burning rate of 75 mm / min or less or self-extinguishing property in a UL94 horizontal combustion test, and a total light transmittance at 400 nm of 70% or more. It can be set as the board | substrate, ie, the translucent board | substrate which has the outstanding flame retardance and translucency. Therefore, the surface light source illumination provided with such a translucent substrate can have excellent reliability.

It is a top view which shows embodiment of an organic electroluminescent illuminating device provided with the translucent board | substrate of this invention. It is the sectional view on the AA line of the organic electroluminescent illuminating device shown in FIG. It is a figure which shows the translucent board | substrate with which the organic electroluminescent illuminating device shown in FIG. 1 is provided. It is a longitudinal cross-sectional view for demonstrating the method of forming a convex part on the surface of a translucent board | substrate.

  Hereinafter, the translucent board | substrate and surface light source illumination of this invention are demonstrated in detail based on suitable embodiment shown to an accompanying drawing.

  First, prior to describing the translucent substrate of the present invention, an organic electroluminescence illumination device (organic EL illumination device) provided with the translucent substrate of the present invention, that is, organic as an example of the surface light source illumination of the present invention. The EL lighting device will be described.

<Organic EL lighting device>
FIG. 1 is a plan view showing an embodiment of an organic electroluminescence illumination device (surface light source illumination) including the translucent substrate of the present invention, and FIG. 2 is a cross-sectional view taken along line AA of the organic electroluminescence illumination device shown in FIG. FIG. In the following description, the front side in FIG. 1 is referred to as “up”, the back side in FIG. 1 is referred to as “down”, the upper side in FIG.

  The organic EL lighting device 1 shown in FIGS. 1 and 2 includes a translucent substrate A, a plurality of light emitting elements C, and a sealing portion B.

  In the organic EL lighting device 1, a casing in which a closed space is defined by a translucent substrate (surface light source substrate) A and a sealing portion B is configured, and the light emitting element C is provided in the closed space. ing. Thereby, the airtightness of the light emitting element C is ensured, and intrusion of oxygen and moisture can be prevented.

  In the present embodiment, nine light emitting elements (organic EL elements) C having a square shape in plan view are transparent at equal intervals in a closed space so as to form a lattice shape (3 × 3 matrix shape). It is provided on the optical substrate A.

  As shown in FIG. 2, the organic EL lighting device 1 having such a configuration is a lighting device having a structure in which, when the light emitting element C emits light, the light is extracted (transmitted) from the translucent substrate A side.

  On the translucent substrate A, as described above, the plurality of light emitting elements C are provided in a lattice shape.

  In this embodiment, each of the light emitting elements C includes an anode 302 and a cathode 306, and a hole transport layer 303, a light emitting layer 304, and an electron transport layer 305, which are laminated from the anode 302 side therebetween. Prepare in this order.

  With the organic EL lighting device 1 having such a configuration, the light emitted from the light emitting element C is transmitted through the translucent substrate A and taken out to the outside of the organic EL lighting device 1, thereby the target object. Is illuminated. Moreover, the organic EL lighting device 1 emits a desired color by appropriately combining the types of light emitting materials included in the light emitting layer 304 included in each light emitting element C.

  In the organic EL lighting device 1 having such a configuration, the light emitted from the light emitting element C is taken out of the organic EL lighting device 1 through the translucent substrate A as described above, and the light emitting element C emits light. Since it generates heat at the same time, in order to make the organic EL lighting device 1 have excellent reliability, it is required to have excellent flame retardancy and translucency.

  Therefore, in the present invention, the translucent substrate A contains a brominated resin, and thus has a burning rate of 75 mm / min or less or self-extinguishing property in the UL94 horizontal combustion test, and has a total light transmittance at 400 nm. 70% or more.

<Translucent substrate>
In the present embodiment, the translucent substrate A is composed of a composite layer having a glass cloth 20 composed of an aggregate of glass fibers and a resin material (resin composition) 10 impregnated in the glass cloth 20. Has been. Hereinafter, the translucent substrate A will be described in detail.

  FIG. 3 is a diagram (FIG. 3A is a plan view and FIG. 3B is a longitudinal sectional view) showing a translucent substrate provided in the organic electroluminescence lighting device shown in FIG.

<Glass cloth>
The glass cloth 20 is included to impart excellent flexibility and translucency to the translucent substrate A.

  This glass cloth 20 is an aggregate of glass fibers. In this embodiment, as shown in FIG. 3, the glass cloth 20 is composed of a longitudinal glass yarn (warp) 2a and a transverse glass yarn (weft) 2b. The directional glass yarn 2a and the lateral glass yarn 2b are substantially orthogonal and are plain woven. Note that the longitudinal glass yarn 2a and the transverse glass yarn 2b may be woven by Nanako weaving, satin weaving, twill weaving or the like in addition to plain weaving.

  The glass fiber is composed of an inorganic glass material. Examples of the inorganic glass material include E glass, C glass, A glass, S glass, T glass, D glass, NE glass, quartz, low dielectric constant glass, Examples thereof include high dielectric constant glass. Among these, S glass or T glass having an average linear expansion coefficient of 5 ppm or less at 30 ° C. to 250 ° C. is preferably used, and E glass is more preferably used because it is easily available.

  The average diameter of the glass fibers contained in the glass cloth 20 is preferably about 2 to 15 μm, more preferably about 3 to 12 μm, and still more preferably about 3 to 10 μm. Thereby, the translucent board | substrate A which can make mechanical characteristics, an optical characteristic, and the smoothness of a surface highly compatible is obtained. In addition, the average diameter of glass fiber is calculated | required as an average value of the diameter of 100 glass fibers measured from an observation image, observing the cross section of the translucent board | substrate A with various microscopes.

  On the other hand, the average thickness of the glass cloth 20 is preferably about 10 to 200 μm, and more preferably about 20 to 120 μm. By making the average thickness of the glass cloth 20 within the above range, the translucent substrate A can be made thin, and sufficient flexibility and translucency can be secured, while suppressing the deterioration of mechanical properties. Can do.

  In addition, when weaving a bundle of glass fibers (glass yarn) to make a woven fabric (glass cloth), it is preferable that the glass yarn contains about 30 to 300 single fibers of glass fiber, More preferably, about 50 to 250 are included. Thereby, the translucent board | substrate A which can make mechanical characteristics, an optical characteristic, and the smoothness of a surface highly compatible is obtained.

  Such a glass cloth 20 is preferably subjected to fiber opening treatment in advance. By the fiber opening process, the glass yarn is widened and the cross section is formed into a flat shape. In addition, a so-called basket hole formed in the glass cloth 20 is also reduced. As a result, the smoothness of the glass cloth 20 increases, and the smoothness of the surface of the translucent substrate A also increases. Examples of the opening process include a process of spraying a water jet, a process of spraying an air jet, and a process of performing needle punching.

  Moreover, you may make it provide a coupling agent to the surface of glass fiber as needed. Examples of the coupling agent include a silane coupling agent and a titanium coupling agent, and a silane coupling agent is particularly preferably used. As the silane coupling agent, those containing an epoxy group, a (meth) acryloyl group, a vinyl group, an isocyanate group, an amide group or the like as a functional group are preferably used.

  The content of such a coupling agent is preferably about 0.01 to 5 parts by mass, more preferably about 0.02 to 1 part by mass with respect to 100 parts by mass of the glass cloth 20. The amount is more preferably about 0.02 to 0.5 parts by mass. If the content rate of a coupling agent is in the said range, the optical characteristic of the translucent board | substrate A can be improved. Thereby, for example, a translucent substrate A suitable as a display element substrate is obtained.

  Further, in this glass cloth (woven fabric) 20, when the second ratio of the glass fiber in the cross section of the transverse glass yarn (second glass fiber bundle) 2b per unit width is “1”, the unit per unit width The ratio (relative value) of the first ratio of the glass fibers in the cross section of the longitudinal glass yarn (first glass fiber bundle) 2a is 0.81 or more and 1.44 or less, and 1.04 or more and 1.40 or less. Is more preferably 1.21 or more and 1.39 or less, and further preferably 1.25 or more and 1.35 or less. Thereby, in the translucent board | substrate A, while achieving the uniformity of the linear expansion coefficient of a vertical direction and the linear expansion coefficient of a horizontal direction, the further improvement of the light transmittance of the translucent board | substrate A can be aimed at.

  Further, when the longitudinal glass yarn 2a and the lateral glass yarn 2b are the same glass yarn, that is, when the first ratio and the second ratio are substantially equal, the lateral glass yarn per unit width (first When the number of (2 glass fiber bundles) is “1”, the ratio (relative value) of the number of longitudinal glass yarns (first glass fiber bundles) per unit width is 0.9 or more and 1.2 or less. It is preferably from 0.02 to 1.18, more preferably from 1.10 to 1.18, and even more preferably from 1.12 to 1.16. Thereby, in the translucent board | substrate A, while achieving the uniformity of the linear expansion coefficient of a vertical direction and the linear expansion coefficient of a horizontal direction, the further improvement of the light transmittance of the translucent board | substrate A can be aimed at.

  The twist numbers of the longitudinal glass yarn (first glass fiber bundle) 2a and the transverse glass yarn (second glass fiber bundle) 2b are each preferably 0.2 to 2.0 / inch. More preferably, it is 3 to 1.6 / inch. When the number of twists of the glass fiber bundle is within this range, the translucency is improved.

  In addition, when the machine flow direction at the time of glass cloth manufacture is the vertical direction, and the direction perpendicular to this is the horizontal direction, the vertical direction is the MD direction and the horizontal direction is the TD direction.

  In the present embodiment, the glass cloth 20 is included in the translucent substrate A as an aggregate of glass fibers. However, the present invention is not limited to this, and the glass fibers 20 are simply bundled or woven including glass fibers. The translucent substrate A may include a cloth such as a cloth or a non-woven fabric. Further, the glass filler is not limited to a glass fiber, but may be a glass filler having a pellet shape, a granule shape, or a particle shape.

<Resin material>
The resin material (resin composition) 10 is impregnated into the glass cloth 20, and thereby the translucent substrate A is included in order to maintain a flat (sheet-like) shape.

  In the present invention, the resin material 10 contains a brominated resin. Thereby, the translucent board | substrate A shall exhibit the outstanding flame retardance, maintaining the outstanding translucency.

  Specifically, the translucent substrate A can have a burning rate of 75 mm / min or less or self-extinguishing property in a UL94 horizontal burning test, and a total light transmittance at 400 nm of 70% or more. .

  Here, in the present invention, a UL94 horizontal combustion test is performed using a transparent substrate A (film sample) for testing, which is 13 mm wide × 125 mm long and is marked at 25 mm and 100 mm from the tip. Prepare and ignite from the tip side. At this time, the film sample is placed in the support so that the length of the film sample is horizontal and the width is an angle of 45 degrees. The tip is ignited and a flame is applied for 30 seconds or until the flame front reaches the 25 mm mark. Thereafter, a timer is started when the flame front reaches the 25 mm mark, and the time until the flame reaches the 100 mm mark is measured. When the burning rate at this time is 75 mm / min or less, or combustion stops before the 100 mm mark (has self-extinguishing properties), it is evaluated as having flame retardancy.

(Brominated resin)
The brominated resin may be either a thermoplastic resin or a curable resin, but is preferably a curable resin. Thereby, the translucent board | substrate A which contains brominated resin as a resin material can be made more excellent in a flame retardance and heat resistance.

  Although it does not specifically limit as brominated curable resin, For example, brominated substances, such as an epoxy resin, a phenol resin, a urea resin, a melamine resin, a polyester (unsaturated polyester) resin, a polyimide resin, a silicone resin, a polyurethane resin, are mentioned. These can be used alone or in combination of two or more. Among these, it is preferable that it is a brominated epoxy resin brominated (bromine substituted) by substituting at least one of the hydrogen atoms included in the epoxy resin with a bromine atom. Thereby, the translucent board | substrate A which contains the brominated epoxy resin after hardening as a resin material can be made especially excellent in a flame retardance and heat resistance.

  The brominated epoxy resin is not particularly limited. For example, brominated bisphenol A type epoxy resin, brominated bisphenol type epoxy resin such as brominated bisphenol F type epoxy resin, brominated hydantoin type epoxy resin, brominated alicyclic ring. An epoxy resin, a brominated biphenyl type epoxy resin, a brominated phenol novolac type epoxy resin and the like can be mentioned, and one or more of these can be used in combination. Among these, it is preferable that it is a brominated bisphenol type epoxy resin. Brominated bisphenol type epoxy resin is easily available and easy to handle, and further, translucent substrate A formed using such brominated bisphenol type epoxy resin is more excellent in translucency and heat resistance, Since it can make a refractive index high, it is preferably used as a brominated epoxy resin.

  Examples of such brominated bisphenol-type epoxy resins include brominated bisphenol A-type epoxy resins having a repeating unit represented by the following general formula (I).

（ただし、式中、ｎは、１以上の整数を表す。）

(In the formula, n represents an integer of 1 or more.)

  In addition, the resin material may contain a resin other than the brominated resin described above, and examples of the resin include a heat and / or photocrosslinkable resin having no bromine atom. , Epoxy resin, oxetane resin, isocyanate resin, acrylic resin, olefin resin, cycloolefin resin, diallyl phthalate resin, polycarbonate resin, diallyl carbonate resin, urethane resin, melamine resin, polyimide resin , Aromatic polyamide-based resin, polystyrene-based resin, polyphenylene-based resin, polysulfone-based resin, polyphenylene oxide-based resin, silsesquioxane-based compound, etc., and one or more of these may be used in combination Can do. Among these, an epoxy resin or an acrylic resin is preferably used.

(Epoxy resin)
Examples of the epoxy resin include a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a bisphenol S type epoxy resin, or a hydrogenated product thereof, an epoxy resin having a dicyclopentadiene skeleton, and an epoxy resin having a triglycidyl isocyanurate skeleton. An epoxy resin having a cardo skeleton, an epoxy resin having a polysiloxane structure, an alicyclic polyfunctional epoxy resin, an alicyclic epoxy resin having a hydrogenated biphenyl skeleton, an alicyclic epoxy resin having a hydrogenated bisphenol A skeleton, etc. 1 type, or 2 or more types of these epoxy resins can be used.

  In addition, in the resin material (resin composition) before hardening, the precursor (resin precursor) of the epoxy resin may be contained.

  Specific examples of such glycidyl type epoxy resins or resin precursors include, for example, novolak type epoxy resins such as phenol novolak type epoxy and cresol novolak type epoxy, bisphenol type epoxy resins such as bisphenol A type epoxy and bisphenol F type epoxy, N, Aromatic glycidylamine type epoxy resins such as N-diglycidylaniline, N, N-diglycidyltoluidine, diaminodiphenylmethane type glycidylamine, aminophenol type glycidylamine, hydroquinone type epoxy, biphenyl type epoxy, stilbene type epoxy, triphenol Methane-type epoxy, triphenolpropane-type epoxy, alkyl-modified triphenolmethane-type epoxy, triazine nucleus-containing epoxy, dicyclopentadiene-modified An epoxy resin such as an enolic epoxy, a naphthol epoxy, a naphthalene epoxy, a phenol aralkyl epoxy having a phenylene and / or biphenylene skeleton, an aralkyl epoxy such as a naphthol aralkyl epoxy having a phenylene and / or biphenylene skeleton, and a fluorene skeleton Examples thereof include monofunctional epoxy resins such as glycidyl type epoxy resin, n-butyl glycidyl ether, versatic acid glycidyl ester, styrene oxide, ethylhexyl glycidyl ether, phenyl glycidyl ether, cresyl glycidyl ether, and butyl phenyl glycidyl ether.

  Specific examples of the alicyclic epoxy resin or resin precursor include 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexenecarboxylate, 3,4-epoxy-6-methylcyclohexylmethyl-3, 4-epoxy-6-methylcyclohexanecarboxylate, 2- (3,4-epoxy) cyclohexyl-5,5-spiro- (3,4-epoxy) cyclohexane-m-dioxane, 1,2: 8,9-di Epoxy limonene, dicyclopentadiene dioxide, cyclooctene dioxide, acetal diepoxyside, vinylcyclohexane dioxide, vinylcyclohexylene monooxide 1,2-epoxy-4-vinylcyclohexane, bis (3,4-epoxycyclohexylmethyl) adipate , Screw (3 4-epoxy-6-methylcyclohexylmethyl) adipate, exo-exobis (2,3-epoxycyclopentyl) ether, 2,2-bis (4- (2,3-epoxypropyl) cyclohexyl) propane, 2,6- Bis (2,3-epoxypropoxycyclohexyl-p-dioxane), 2,6-bis (2,3-epoxypropoxy) norbornene, diglycidyl ether of linoleic acid dimer, limonene dioxide, 2,2-bis ( 3,4-epoxycyclohexyl) propane, o- (2,3-epoxy) cyclopentylphenyl-2,3-epoxypropyl ether, 1,2-bis [5- (1,2-epoxy) -4,7-hexa Hydromethanoindanxyl] ethane, cyclohexanediol diglycidyl ether and diglycol Jill hexahydrophthalate, .epsilon.-caprolactone which each end of the oligomer of 3,4-epoxycyclohexyl methanol and 3,4-epoxycyclohexyl carboxylate ester-linked, hexahydrophthalate benzyl alcohol or the like which is epoxidized and the like.

  In addition, as a bifunctional alicyclic epoxy resin precursor, the alicyclic epoxy structure precursor shown by following Chemical formula (1), (2) or (3) is mentioned.

［上記式（１）中、−Ｘ−は−Ｏ−、−Ｓ−、−ＳＯ−、−ＳＯ_２−、−ＣＨ_２−、−ＣＨ（ＣＨ_３）−、または−Ｃ（ＣＨ_３）_２−を表す。］

[In the above formula (1), -X- is _{-O -, - S -, -} SO -, - SO 2 -, - CH 2 -, - CH (CH 3) -, or -C _{(CH 3) 2} -Represents. ]

  On the other hand, examples of the alicyclic epoxy resin precursor having one epoxycyclohexane ring in the molecule include alicyclic epoxy resins represented by the following chemical formulas (4) and (5).

  In addition, in the resin material 10 of the translucent board | substrate A, the hardened | cured material obtained by polymerizing said epoxy resin or a resin precursor and completing reaction is contained.

  The resin material may be a mixture of two or more of the resins and resin precursors exemplified above.

  Moreover, you may use a silsesquioxane type | system | group compound for a resin material with an alicyclic epoxy resin. Examples of such a silsesquioxane compound having an oxetanyl group include OX-SQ, OX-SQ-H, OX-SQ-F (all manufactured by Toagosei Co., Ltd.) and the like.

(acrylic resin)
Examples of the alicyclic acrylic resin include tricyclodecanyl diacrylate, a hydrogenated product thereof, dicyclopentanyl diacrylate, isobornyl diacrylate, hydrogenated bisphenol A diacrylate, cyclohexane-1,4- Examples include dimethanol diacrylate, and specifically, Hitachi Chemical's Optretz series, Daicel Cytec's acrylate monomer, and the like.

  Furthermore, when the curable resin as described above is included in the resin material (resin composition), the resin material includes additives such as a reaction initiator, an antioxidant, a flame retardant, and an ultraviolet absorber. It is preferable. Thereby, curable resin can be hardened reliably and the translucent board | substrate A can be made excellent in a flame retardance and heat resistance.

(Reaction initiator)
Examples include reaction initiators, cationic reaction initiators, anionic reaction initiators, crosslinking agents such as acid anhydrides and aliphatic amines, radical reaction initiators, and the like, one or more of these reaction initiators A mixture of

  Cationic reaction initiators that release substances that initiate cationic polymerization upon heating, such as onium salt cationic reaction initiators or aluminum chelate cationic reaction initiators, or substances that initiate cationic polymerization with active energy rays Such as an onium salt-based cationic reaction initiator or a mixture thereof.

  The photocationic reaction initiator is not particularly limited as long as it can react the polyfunctional cation polymerizable compound and the monofunctional cation polymerizable compound by photocationic polymerization. For example, Lewis acid diazonium salt, Lewis acid iodonium salt, Examples include onium salts such as sulfonium salts of Lewis acids. Specific examples of the photocationic initiator include phenyldiazonium salt of boron tetrafluoride, diphenyliodonium salt of phosphorus hexafluoride, diphenyliodonium salt of antimony hexafluoride, tri-4-methylphenyl of arsenic hexafluoride Examples thereof include sulfonium salts, tri-4-methylphenylsulfonium salts of antimony tetrafluoride, and mixtures thereof.

  Depending on the type of curable resin contained in the resin material, a photo radical reaction initiator such as Irgacure series (manufactured by Ciba Japan Co., Ltd.) or the like is also used.

  On the other hand, examples of the thermal cationic reaction initiator include aromatic sulfonium salts, aromatic iodonium salts, ammonium salts, aluminum chelates, boron trifluoride amine complexes, and mixtures thereof. Moreover, you may mix the said photocationic reaction initiator and a thermal cationic reaction initiator.

  The content of such a cationic reaction initiator is not particularly limited, but is preferably about 0.1 to 5 parts by mass with respect to 100 parts by mass of the resin material excluding the cationic reaction initiator. 5 to 3 parts by weight are preferred. If the content is less than the lower limit, the curability of the resin material may be reduced, and if the content exceeds the upper limit, the translucent substrate A may become brittle.

  When photoreacting, in order to accelerate the curing reaction of the resin material, a sensitizer, an acid proliferating agent, and the like can be used as necessary.

  Examples of the anionic reaction initiator (anionic catalyst) include amine-based reaction initiators. When an epoxy resin is included as the curable resin, the molecular weight is particularly suitable if it contains two or more primary amines or secondary amines capable of forming a covalent bond with an epoxy group in the epoxy resin. The structure is not limited. Examples of such amine reaction initiators include diethylenetriamine, triethylenetetraamine, tetraethylenepentamine, m-xylenediamine, trimethylhexamethylenediamine, 2-methylpentamethylenediamine aliphatic polyamine, isophoronediamine, 1 , 3-bisaminomethylcyclohexane, bis (4-aminocyclohexyl) methane, norbornenediamine, 1,2-diaminocyclohexane and other alicyclic polyamines, N-aminoethylpiperazine, 1,4-bis (2-amino-2) -Methylpropyl) piperazine-type polyamines such as piperazine, diaminodiphenylmethane, m-phenylenediamine, diaminodiphenylsulfone, diethyltoluenediamine, trimethylenebis (4-aminobenzoate) Polytetramethylene oxide - aromatic polyamines such as di -P- aminobenzoate and the like. These reaction initiators may be used alone or in combination of two or more kinds of reaction initiators. In addition, use of an imidazole compound alone or in combination with an amine-based reaction initiator may also be mentioned. Examples of the imidazole compound include 2-methylimidazole, 2-ethylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, and 2-phenyl-4. 2,4-diamino-6- {2-methylimidazole- (1) to which a general imidazole such as 2,5-dihydroxymethylimidazole, 2-C11H23-imidazole, triazine or isocyanuric acid is added to give storage stability } -Ethyl-S-triazine and its isocyanate adduct, and the like, and these can be used alone or in combination.

  Examples of the acid anhydride include phthalic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, maleic anhydride, succinic anhydride, dodecinyl succinic anhydride, dichlorosuccinic anhydride, and methyl nadic anhydride. , Pyromellitic anhydride, methylhexahydrophthalic anhydride, methylcyclohexene dicarboxylic acid anhydride, endomethylenetetrahydrophthalic anhydride, methylendomethylenetetrahydrophthalic anhydride, methylbutenyltetrahydrophthalic anhydride, alkylstyrene-maleic anhydride Examples include polymers, tetrabromophthalic anhydride, polyazelineic anhydride, chlorendic anhydride, benzophenone tetracarboxylic anhydride, and the like. These may be used alone or in combination. In addition, use of an imidazole compound in combination with an acid anhydride-based reaction initiator can also be mentioned. Examples of the imidazole compound include those described above.

(Antioxidant)
As the antioxidant, for example, a phenol-based antioxidant, a phosphorus-based antioxidant, a sulfur-based antioxidant, and the like are used, and a hindered phenol-based antioxidant is particularly preferably used.

  Examples of the hindered phenol antioxidant include BHT and 2,2'-methylenebis (4-methyl-6-tert-butylphenol).

  The content of the antioxidant in the resin material is preferably 0.01% by mass or more and 5% by mass or less, and more preferably about 0.1% by mass or more and 3% by mass or less. By setting the content of the antioxidant within the above range, a light-transmitting substrate A having a low optical anisotropy can be obtained, and in a reliability test, a light transmission with a small degree of deterioration of the optical anisotropy can be achieved. The optical substrate A can be obtained.

  Moreover, it is preferable that the weight average molecular weight of antioxidant is 200-2000, It is more preferable that it is 500-1500, It is further more preferable that it is 1000-1400. When the weight average molecular weight of the antioxidant is within the above range, volatilization of the antioxidant is suppressed and compatibility with the resin material is ensured. Such an antioxidant should remain in the light-transmitting substrate A even after a reliability test such as wet heat treatment to realize a light-transmitting substrate A that can suppress deterioration of optical anisotropy. Can do.

  Examples of phenolic antioxidants other than hindered phenolic antioxidants include, for example, semi-hindered phenolic antioxidants in which one of the substituents located so as to sandwich the hydroxyl group is substituted with a methyl group or the like. And a hindered phenolic antioxidant in which both of two substituents sandwiching a hydroxyl group are substituted with a methyl group or the like. These are added to the resin material in an amount less than that of the hindered phenol antioxidant.

  Examples of phosphorus antioxidants include tridecyl phosphite and diphenyl decyl phosphite.

  In addition, the synergistic effect is exhibited by using together a hindered phenolic antioxidant and phosphorus antioxidant. Thereby, the oxidation prevention of the resin material and the suppression of the deterioration of the optical anisotropy of the translucent substrate A become more remarkable. This is because the hindered phenolic antioxidant and the phosphorus antioxidant differ in the antioxidant mechanism of the resin material, so that they work independently and have a synergistic effect. it is conceivable that.

  The addition amount of antioxidants (particularly phosphorus antioxidants) other than such hindered phenolic antioxidants is preferably about 30 to 300 parts by mass with respect to 100 parts by mass of hindered phenolic antioxidants. And more preferably about 50 to 200 parts by mass. Thereby, a hindered phenolic antioxidant and other antioxidants can exhibit each effect without burying (cancelling), and can bring about a synergistic effect.

  In addition, the resin material may contain a thermoplastic resin or the like as necessary as long as the characteristics are not impaired.

  Further, when the resin material contains a resin or additive other than the brominated resin as described above, the content of the brominated resin in the resin material is preferably 0.1 wt% or more and 20 wt% or less. Preferably they are 1.0 wt% or more and 17.5 wt% or less, More preferably, they are 2.0 wt% or more and 15 wt% or less, Most preferably, they are 3.0 wt% or more and 10 wt% or less. If the amount is less than the lower limit value, the flame-retardant effect cannot be sufficiently exhibited depending on the type of brominated resin, and if the amount exceeds the upper limit value, coloring may occur depending on the type of brominated resin.

(Filler)
In addition to the brominated resin described above, the resin material may further include a filler made of a material different from the glass cloth 20. Thus, by setting it as the structure containing a filler, the haze value of the translucent board | substrate A can be raised, or an unevenness | corrugation can be formed in the surface. Therefore, when light is transmitted through the light-transmitting substrate A, the diffusibility of the light in the light-transmitting substrate A is improved, so that light is accurately prevented from leaking from the end of the light-transmitting substrate A. Or, since it can be prevented, the light extraction efficiency is excellent.

  When using the filler, the refractive index difference between the filler and the resin material is preferably 0.01 or more and 3.0 or less. By setting this refractive index difference within such a range, the haze value of the translucent substrate A can be reliably increased.

  Examples of the material used for the filler include inorganic materials, organic materials, and mixtures thereof. Examples of the inorganic material include zinc oxide, zirconium oxide, aluminum oxide, calcium oxide, titanium oxide, silica, and the like. And the like. Examples of the organic material include those using acrylic, styrene, or a mixture thereof. Examples of the shape of the filler include a spherical shape, a rod shape, and a planar shape.

  The content of the filler is preferably about 1 to 90 parts by mass, more preferably about 3 to 70 parts by mass with respect to 100 parts by mass of the glass cloth 20.

  In addition, when a filler is particle | grains, it is preferable that the conversion particle diameter is 0.1 to 100 micrometer. If the thickness is less than 0.1 μm or more than 100 μm, there is a problem that the diffusion function cannot be sufficiently exhibited.

  In this embodiment, as shown in FIG. 3B, the resin material 10 having such a configuration has a flat surface on the side where the light emitting element C is formed, and a surface on the side where the light emitting element C is formed. The surface on the opposite side is constituted by a concavo-convex surface provided with a convex portion 11. Thus, when the resin material 10 is configured to have an uneven surface, that is, the translucent substrate A is configured to have an uneven surface, when light passes through the translucent substrate A, Since the diffusibility of the light in the translucent substrate A is improved, it is possible to accurately suppress or prevent light from leaking from the end of the translucent substrate A, so that the light extraction efficiency is excellent.

  The average roughness (Rz) of the surface ten points on this uneven surface is preferably 1 μm or more and 30 μm or less, and more preferably 5 μm or more and 20 μm or less. Further, the average interval (Sm) of the unevenness, that is, the average distance between the adjacent convex portions 11 is preferably 0.1 μm or more and 30 μm or less, and more preferably 5 μm or more and 20 μm or less. By setting the average roughness (Rz) and the average interval (Sm) within the above ranges, the diffusibility of light transmitted through the translucent substrate A can be improved more reliably.

  The translucent substrate A configured as described above contains a brominated resin, has a burning rate of 75 mm / min or less or self-extinguishing in a UL94 horizontal combustion test, and has a total light transmittance of 70% or more at 400 nm. The glass cloth 20 may be omitted, or the addition of constituent materials other than the brominated resin contained in the resin material (resin composition) may be omitted.

  Further, the burning rate in the UL94 horizontal burning test may be 75 mm / min or less, but is preferably 65 mm / min or less, more preferably 55 mm / min or less, and further has self-extinguishing properties. preferable. Furthermore, the total light transmittance at 400 nm may be 70% or more, but is preferably set to 80% or more, more preferably 90% or more. By setting the burning rate in the UL94 horizontal combustion test and the total light transmittance at 400 nm within the above range, it can be said that the translucent substrate A has excellent flame retardancy and translucency, The organic EL lighting device 1 including the translucent substrate A has excellent reliability.

  Furthermore, the resin material 10, that is, the translucent substrate A, preferably has a glass transition temperature of 130 ° C. or higher, more preferably 150 ° C. or higher, further preferably 170 ° C. or higher, and 180 ° C. The above is particularly preferable. Thereby, even if various heat treatments are performed after manufacturing the translucent substrate A into a surface light source illumination, it is possible to prevent the translucent substrate A from being warped or deformed. it can.

  The difference in refractive index between the resin material 10 and the glass cloth 20 is preferably more than 0.01, and more preferably 0.02 or more and 1 or less. Thereby, the translucent board | substrate A with high diffusibility is obtained. Therefore, since it is possible to accurately suppress or prevent light from leaking from the end portion of the translucent substrate A, the translucent substrate A has excellent light extraction efficiency.

  Furthermore, although the average thickness of the translucent board | substrate A is not specifically limited, It is preferable that it is about 5-1000 micrometers, It is more preferable that it is about 10-500 micrometers, It is further more preferable that it is about 15-200 micrometers. When the thickness exceeds the upper limit, depending on the type of the resin material 10 and the like, there is a possibility that sufficient light transmission may not be obtained. When the thickness is smaller than the lower limit, depending on the type of the resin material 10 and the like, as a substrate May not function properly.

  Moreover, it is preferable that the haze value of the translucent board | substrate A is 70% or more, It is more preferable that it is 80% or more, It is further more preferable that it is 90% or more. When the haze value is equal to or higher than the lower limit value, the diffusing function can be more fully exhibited. Therefore, the translucent substrate A is more excellent in light extraction efficiency when light passes through the translucent substrate A. It can be said that there is.

  Further, the translucent substrate A has an average linear expansion coefficient at 30 ° C. to 130 ° C. of preferably 0 to 40 ppm / K, more preferably 0 to 30 ppm / K, and further preferably 0 to 20 ppm / K or less. The translucent substrate A having such an average linear expansion coefficient has a sufficiently small dimensional change due to a temperature change, and therefore can reduce distortion applied to the light emitting element C formed on the translucent substrate A. Various problems such as warpage of the optical substrate A and disconnection of electrodes of the light emitting element C are unlikely to occur.

  The translucent substrate A preferably has an elastic modulus at 250 ° C. of 1 GPa or more. If it is less than 1 GPa, the translucent substrate A cannot sufficiently retain the shape of the substrate depending on the size and number of the light-emitting elements C formed on the translucent substrate A. There is a risk that it cannot be formed sufficiently.

  The translucent board | substrate A of the above structures can be manufactured as follows, for example.

<Method for producing translucent substrate>
As described above, the translucent substrate A is obtained by impregnating the glass cloth 20 with a liquid resin material, and forming (shaping) the resin material into a plate shape in this state, and then solidifying (or curing) the resin material. Is.

  Specifically, the translucent substrate A is obtained by impregnating the resin cloth varnish into the glass cloth 20 and then solidifying (or curing) the resin varnish while molding (shaping) the resin material 10 and the glass cloth 20. Manufactured through a step of obtaining a composed composite layer.

Hereinafter, this manufacturing method will be sequentially described.
FIG. 4 is a longitudinal sectional view for explaining a method of forming a convex portion on the surface of the translucent substrate. In the following description, the upper side in FIG. 4 is referred to as “upper” and the lower side is referred to as “lower”.

[1] First, a glass cloth 20 is prepared.
Moreover, the surface treatment which provides a coupling agent to the glass cloth 20 is performed as needed. The coupling agent is applied by, for example, a method of immersing the glass cloth 20 in a liquid containing the coupling agent, a method of applying the liquid to the glass cloth 20, a method of spraying the liquid on the glass cloth 20, or the like. .

[2] Next, a liquid material containing a resin material, that is, a resin varnish is prepared.
The resin varnish can be prepared by dissolving or dispersing the above-described resin material in an organic solvent as necessary.

  The organic solvent is not particularly limited. For example, cresol, N, N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidinone (NMP), dimethyl sulfoxide (DMSO), 1,3-dimethyl-imidazolidinone (DMI), N, N-dimethylformamide (DMF) and the like can be mentioned, and these can be used as a single solvent or a mixed solvent obtained by mixing them.

[3] Next, the obtained resin varnish is impregnated into the glass cloth 20.
When the glass cloth 20 is impregnated with the resin varnish, for example, a method of immersing the glass cloth 20 in the resin varnish, a method of applying the resin varnish to the glass cloth 20 or the like is used.

  Alternatively, after impregnating the glass cloth 20 with the resin varnish, the resin varnish may be applied in a liquid state or after the resin varnish is solidified (or cured).

  Thereafter, if necessary, the resin varnish is subjected to defoaming treatment. Furthermore, the resin varnish is dried as necessary.

  [4] Next, the glass cloth 20 impregnated with the resin varnish is heated while being formed into a plate shape. Thereby, the resin varnish is solidified (or cured) to obtain a light-transmitting substrate A composed of a composite layer including the glass cloth 20 and the resin material 10.

  As heating conditions, the heating temperature is preferably about 50 to 300 ° C. and the heating time is about 0.5 to 10 hours, more preferably the heating temperature is about 170 to 270 ° C. and the heating time is about 1 to 5 hours. Is done.

  Moreover, you may make it change heating temperature on the way. For example, initially (initial), the resin varnish may be heated at about 50 to 100 ° C. for about 0.5 to 3 hours, and then heated at about 200 to 300 ° C. for about 0.5 to 3 hours. .

  In this embodiment, when the glass cloth 20 impregnated with the resin varnish is formed into a plate shape, the convex portion 11 is formed on the surface on which the light emitting element C is formed, so that the surface is an uneven surface. Configure.

  The method of providing the convex portion 11 is not particularly limited. For example, I) The convex portion 11 is formed by bringing a transfer mold having irregularities on the surface thereof into contact with a glass cloth 20 impregnated with a resin varnish, and transferring the shape. Or II) a method of forming the convex portion 11 by fixing the filler to the surface, etc., and the method of I) is preferably used. According to the method I), the convex portion 11 having excellent dimensional accuracy can be easily formed.

Hereinafter, the method I) will be described in detail as a representative.
(Method using transfer mold)
As for the transfer mold for transferring the surface irregularities, the convex portions 11 are formed on the surface of the glass cloth 20 impregnated with the resin varnish as in the transfer molds 5 and 6 shown in FIG. 4A or 4B. However, the material is not particularly limited, but is preferably a resin material or a metal material from the viewpoint of repeated use.

  In addition, as a method of performing uneven | corrugated processing on the transfer mold | types 5 and 6, surface filler fixation, mat processing (sand blasting), embossing etc. are mentioned, The optimal method can be used timely. Also, a method of transferring the embossed shape to the surface of the mold transfer mold subjected to embossing or the like can be employed.

  One method is to prepare a substrate on an embossed mold, cure the substrate, remove the mold, and transfer the unevenness of the mold.

  As another method, a method for preparing a transfer mold by immobilizing particles on the surface of a transfer mold substrate will be described.

  The simplest and simplest method for providing irregularities on the transfer-type substrate surface is to immobilize particles on the transfer-type substrate surface. For example, a method in which a filler is dispersed in a solvent, applied to the surface of the transfer mold substrate, dried to fix the filler to the surface of the transfer mold substrate, a filler is applied to the surface of the transfer mold substrate, and then pressed and fixed. And a method of fixing the filler by providing an adhesive layer on the surface of the transfer type substrate.

  In addition, as a method of providing unevenness on the surface of the transfer mold substrate by mat processing, sandblasting that physically forms unevenness by hitting an abrasive such as sand on the film surface, or chemically using acid, alkali, solvent, etc. For example, a method of forming irregularities by exposing the surface.

  The shape of the transfer mold is not particularly limited, and may be a flat plate shape shown in FIG. 4B or a roll shape shown in FIG.

  4A is suitable for continuous production because the glass cloth 20 impregnated with the resin varnish can be continuously pressed.

  Specifically, in the roll-shaped transfer mold 5, it is preferable that the surface of a resin or metal processed into a roll shape is provided with irregularities 7 on the surface by mat processing (sand blasting), embossing, or mechanical processing.

  In addition, as one form of a method of bonding a transfer type substrate obtained by processing a resin into a roll and a glass cloth 20 impregnated with a resin varnish, and transferring irregularities, a feeding unit, a bonding unit, a peeling unit, And a transfer method using an apparatus equipped with the above. The feeding section feeds the glass cloth 20 impregnated with the resin varnish in one direction. The laminating section bonds the transfer type substrate to the glass cloth 20 impregnated with the resin varnish. A roll or the like is used for bonding. Then, it is preferable to further provide a peeling part in this method. The peeling portion is disposed on the downstream side in the feeding direction of the glass cloth 20 impregnated with the resin varnish, and peels off the transfer type substrate from the glass cloth 20 impregnated with the resin varnish. And at the time of peeling, the glass cloth 20 impregnated with the resin varnish holds the state where the convex portion 11 is provided on the surface by the transfer type substrate. Therefore, the convex part 11 can be effectively provided on the surface of the glass cloth 20 impregnated with the resin varnish.

  In addition, when curable resin is contained in the resin material 10, you may further provide a photocuring part between a bonding part and a peeling part. Thereby, the unevenness | corrugation of the transcription | transfer type board | substrate bonded by the bonding part can be efficiently transcribe | transferred to the glass cloth 20 impregnated with the resin varnish.

In the case of performing continuously, it is possible to produce unevenness on the surface of the substrate with good reproducibility by using a transfer mold subjected to surface unevenness processing as a mold, which is suitable for mass production.
It is also possible to produce the translucent substrate A on a transfer mold that has been subjected to surface unevenness processing.

  In addition, when omitting formation of the convex part 11, a polyester film, a polyimide film, etc. are used for shaping | molding of a resin varnish, for example. And the surface of a resin varnish can be smooth | blunted and planarized by pressing a film from both sides so that the glass cloth 20 impregnated with the resin varnish may be pinched | interposed. Furthermore, after the resin varnish is solidified (or cured), the translucent substrate A can be obtained by peeling the sandwiched film.

  Moreover, when the glass cloth 20 impregnated with the resin varnish has a long shape, the respective steps can be carried out continuously. In this case, some of the steps may be performed continuously. By doing so, continuous production of the translucent substrate A becomes possible.

  In the case where the resin varnish contains a photocurable resin material, the resin material (resin varnish) is cured by irradiating ultraviolet rays or the like having a wavelength of about 200 to 400 nm.

Light energy applied (integrated quantity of light) is preferably at 5 mJ / cm ² or more 3000 mJ / cm ² or less, more preferably 10 mJ / cm ² or more 2000 mJ / cm ² or less. If the integrated light quantity is within the above range, the resin material can be cured uniformly and reliably without unevenness.

  As mentioned above, although the manufacturing method of the translucent board | substrate based on this invention was described, it is not necessarily restricted to this, It manufactures using the method optimal in a timely manner with the material etc. to combine.

  Moreover, the organic electroluminescent illuminating device 1 can be manufactured as follows using the translucent board | substrate A of this structure.

<Method for Manufacturing Organic EL Lighting Device 1>
[1] First, a translucent substrate A is prepared.

  [2] Next, on the translucent substrate A, nine (plural) light emitting elements (electronic elements) C are formed so as to form a lattice.

  [2-A] First, the anode (individual electrode) 302 is formed on the translucent substrate A so as to form a lattice.

  [2-B] Next, a hole transport layer 303 is formed so as to cover each anode 302 correspondingly.

  [2-C] Next, a light emitting layer 304 is formed corresponding to each hole so as to cover each hole transport layer 303.

  [2-D] Next, the electron transport layer 305 is formed corresponding to each of the light emitting layers 304 so as to cover them.

  [2-E] Next, a cathode 306 is formed corresponding to each electron transport layer 305 so as to cover each electron transport layer 305.

  The layers formed in the steps [2-A] to [2-E] are, for example, vapor phase film formation methods such as sputtering, vacuum vapor deposition, and CVD, ink jet, spin coating, and casting. It can form using the liquid phase film-forming methods, such as.

  [3] Next, a sealed portion B is prepared, and a sealed space is defined by providing the sealed portion B on the translucent substrate A so as to cover each light emitting element C with the sealed portion B. Then, the light emitting element C is sealed with the translucent substrate A and the sealing portion B.

  In addition, such sealing by the translucent substrate A and the sealing part B is performed by interposing an adhesive between the translucent substrate A and the sealing part B and then drying the adhesive. It can be carried out.

  Moreover, as this sealing part B, gas barrier layers, such as an inorganic substance, an organic film, or a hybrid film of both, are mentioned.

  Through the steps [1] to [3] as described above, the organic EL lighting device 1 including the translucent substrate A, the light emitting element C, and the sealing portion B is formed.

  Since the translucent substrate A is excellent in thermal properties such as flame retardancy, heat resistance and dimensional stability, and optical properties such as light diffusivity due to the physical properties described above, the organic EL lighting device 1 as described above. Can be used as a surface light source substrate. Moreover, the surface light source illumination with favorable light diffusibility can be produced by applying the translucent substrate A to the surface light source substrate provided in the organic EL lighting device 1.

  In the present embodiment, the planar view shape (light emitting region) of the light emitting element C is a quadrangle. However, the shape is not limited to this, and may be an arbitrary shape, for example, a polygon such as a triangle or a hexagon. It may be a circle such as a perfect circle or an ellipse.

  As mentioned above, although the translucent board | substrate and surface light source illumination of this invention were demonstrated based on embodiment, this invention is not limited to these.

  For example, in the translucent board | substrate and surface light source illumination of this invention, each structure can be substituted with the arbitrary things which can exhibit the same function, or the thing of arbitrary structures can be added.

  Furthermore, in the said embodiment, although the surface light source illumination of this invention was applied to the organic EL illumination apparatus provided with the organic EL element as a light emitting element, it is not limited to this, For example, inorganic EL element provided with an inorganic EL element as a light emitting element The present invention can be applied to a lighting device, a light emitting diode lighting device including a light emitting diode as a light emitting element, and the like.

Hereinafter, based on an Example, this invention is demonstrated more concretely.
1. Formation of Translucent Substrate [Example 1]
First, brominated bisphenol A type epoxy resin (epoxy) having a repeating unit represented by the above general formula (I) as brominated epoxy resin with respect to 90 parts by weight of epoxy resin jER828 (refractive index: 1.573, Mitsubishi Chemical). 10 parts by weight of an equivalent of 360 g / eq and a bromine content of 48.0 wt% were mixed. To this mixed resin, 3 phr of an antioxidant (IRGANOX1010 BASF Japan) and 2 phr of a photoreaction initiator (SP-170 ADEKA) were added and stirred sufficiently to prepare a varnish.

  Next, the impregnated E glass cloth which was degassed in vacuum, the transfer material PET on one side, and the PP film of 25 μm on the other side (Trefan # 25-YM17S: manufactured by Toray, the surface roughness of the matte film Rz: 22.3 μm, Sm: 8.3 [mu] m) and laminated with a laminator heated to 70 [deg.] C. and then cured with UV light.

  Thereafter, the transfer material was peeled off and removed. The substrate after UV curing was annealed under nitrogen at 250 ° C. for 1 h while being pulled under a load in a nitrogen oven to obtain a glass cloth composite substrate. This was used as the translucent substrate of Example 1.

[Example 2]
A translucent substrate of Example 2 was obtained in the same manner as in Example 1 except that the following varnish used for obtaining the translucent substrate was used.

  Brominated bisphenol A type epoxy resin (epoxy equivalent 360 g) having a repeating unit represented by the above general formula (I) as brominated epoxy resin with respect to 80 parts by weight of epoxy resin jER828 (refractive index: 1.573, Mitsubishi Chemical) / eq, bromine content 48.0 wt%) was mixed with 20 parts by weight. To this mixed resin, 3 phr of an antioxidant (IRGANOX1010 BASF Japan) and 2 phr of a photoreaction initiator (SP-170 ADEKA) were added and stirred sufficiently to prepare a varnish.

Example 3
A translucent substrate of Example 3 was obtained in the same manner as in Example 1 except that the following varnish used for obtaining the translucent substrate was used.

  Brominated bisphenol A type epoxy resin (epoxy equivalent 360 g) having a repeating unit represented by the above general formula (I) as brominated epoxy resin with respect to 92 parts by weight of epoxy resin jER828 (refractive index: 1.573, Mitsubishi Chemical) / eq, bromine content 48.0 wt%) was mixed. To this mixed resin, 3 phr of an antioxidant (IRGANOX1010 BASF Japan) and 2 phr of a photoreaction initiator (SP-170 ADEKA) were added and stirred sufficiently to prepare a varnish.

[Comparative Example 1]
A translucent substrate of Comparative Example 1 was obtained in the same manner as in Example 1 except that the addition of brominated epoxy resin was omitted.

2. Evaluation The translucent substrates of each Example and Comparative Example were evaluated by the following methods.
<UL94 horizontal combustion test>
First, as a translucent substrate A (film sample) for testing, a substrate having a width of 13 mm × a length of 125 mm and marked at positions of 25 mm and 100 mm from the tip was prepared. Then, the film sample was placed in the support so that the length of the film sample was horizontal and the width was an angle of 45 degrees. After that, after igniting the tip and applying the flame for 30 seconds or until the flame front reaches the 25 mm mark, a timer is started when the flame front reaches the 25 mm mark, and the time until the flame reaches the 100 mm mark is set. It was measured.

<Measurement of total light transmittance and haze value>
Based on JIS-K-7361, the total light transmittance of the material was measured using a haze meter NDH: 2000 (manufactured by Nippon Denshoku Industries Co., Ltd.).

<Measurement of average linear expansion coefficient (CTE)>
Using a TMA / SS120C type thermal stress strain measuring device manufactured by Seiko Instruments Inc., the temperature is raised from 30 ° C. to 230 ° C. at a rate of 5 ° C. per minute in a nitrogen atmosphere and held for 20 minutes, and then 5 ° C. per minute. The average linear expansion coefficient of 130 ° C. to 30 ° C. was obtained when it was cooled to 230 ° C. to 30 ° C. The measurement was performed in a tensile mode with a load of 5 g.
Measurement was performed in both the MD direction and the TD direction.

<10 average surface roughness (Rz), average spacing of irregularities (Sm)>
From the image obtained by observing the surface of the substrate with a 50 × objective lens with a laser microscope (KEYENCE VK9710), 10 points of 50 μm long line roughness were measured, the average roughness (Rz) of the surface 10 points, and unevenness The average interval (Sm) was calculated according to JIS B0601: 1994, and the average value at 10 locations was obtained.

  The evaluation results in the translucent substrates of the examples and comparative examples obtained as described above are shown in Table 1 below.

  As shown in Table 1, in the translucent substrate in each example, due to the inclusion of brominated resin in the translucent substrate, the burning rate was 75 mm / min or less in the UL94 horizontal combustion test or self It had fire extinguishing properties, and the total light transmittance at 400 nm was 70% or more. On the other hand, in the translucent board | substrate in a comparative example, brominated resin was not included but the result which satisfy | fills these was not able to be obtained.

1 Organic EL lighting device 2a Longitudinal glass yarn (first glass fiber bundle)
2b Transverse glass yarn (second glass fiber bundle)
5, 6 Transfer type 7 Concavity and convexity 10 Resin material 11 Convex part 20 Glass cloth 302 Anode 303 Hole transport layer 304 Light emitting layer 305 Electron transport layer 306 Cathode A Translucent substrate B Sealing part C Light emitting element

Claims (14)

  A translucent substrate comprising a brominated resin, having a burning rate of 75 mm / min or less or self-extinguishing property in a UL94 horizontal combustion test, and a total light transmittance at 400 nm of 70% or more.   The translucent substrate according to claim 1, wherein the brominated resin is a brominated epoxy resin.   The translucent board | substrate of Claim 1 or 2 containing a glass filler.   The translucent substrate according to claim 3, wherein the glass filler is a glass fiber. The brominated resin is included as a constituent material of the resin composition,
The translucent substrate according to claim 3 or 4, wherein the content of the brominated resin in the resin composition is 0.1 wt% or more and 20 wt% or less.   6. The translucent substrate according to claim 1, wherein an average roughness (Rz) of ten surface points on at least one surface of the translucent substrate is 1 μm or more and 30 μm or less.   The translucent board | substrate of Claim 6 whose average space | interval (Sm) of the unevenness | corrugation which comprises the average roughness of the said surface 10 points | pieces is 0.1 micrometer or more and 30 micrometers or less.   The translucent substrate according to any one of claims 1 to 7, wherein an average linear expansion coefficient at 30 ° C to 130 ° C is 0 to 40 ppm / K.   The translucent substrate according to any one of claims 1 to 8, wherein the average thickness is 5 to 1000 µm or less.   The translucent substrate according to any one of claims 1 to 9, wherein a haze value is 70% or more.   The translucent substrate according to claim 1, wherein the glass transition temperature is 130 ° C. or higher.   The translucent substrate according to any one of claims 1 to 11, wherein an elastic modulus at 250 ° C is 1 GPa or more.   The translucent board | substrate of any one of Claim 1 thru | or 12 used for the board | substrate for surface light sources.   A surface light source illumination comprising the translucent substrate according to any one of claims 1 to 13.

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