TW202406438A - Electronic device and heat dissipation assembly thereof - Google Patents
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 157
- 230000004308 accommodation Effects 0.000 claims abstract description 31
- 239000007788 liquid Substances 0.000 claims description 76
- 238000002791 soaking Methods 0.000 claims description 26
- 238000007654 immersion Methods 0.000 claims description 23
- 238000002347 injection Methods 0.000 claims description 19
- 239000007924 injection Substances 0.000 claims description 19
- 238000001816 cooling Methods 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000010521 absorption reaction Methods 0.000 abstract description 3
- 239000002826 coolant Substances 0.000 description 74
- 239000000110 cooling liquid Substances 0.000 description 18
- 230000001105 regulatory effect Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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Abstract
Description
一種電子裝置,尤指一種具有散熱組件的電子裝置。An electronic device, especially an electronic device with a heat dissipation component.
隨著電子裝置的效能不斷提升,電子裝置內晶片之運算速度亦不斷地提升,然而,運算速度的提升附隨而來的功耗及產生的熱能也大幅增加。因此,電子裝置需要為晶片提供散熱對策,使晶片可以在合適的工作溫度條件下運行,進而延長晶片之壽命及穩定性。市面上為了可以對晶片進行有效的散熱,提出氣冷式散熱裝置及液冷式散熱裝置,其中,氣冷式散熱裝置係以空氣作為熱交換之媒介,對於高運算能力之晶片,並無法有效地降低晶片之溫低,而液冷式散熱裝置係以液體作為熱交換之媒介,相較於氣冷式散熱裝置,具有較佳的散熱效率,其中,市售的液冷式散熱裝置係透過管路流通冷卻液,並將管路接觸於晶片,使冷卻液透過管路吸收晶片所產生之熱能,然而,冷卻液通過管路的時間太短,導致冷卻液僅能吸收晶片之部分熱能。As the performance of electronic devices continues to improve, the computing speed of chips in the electronic devices also continues to increase. However, the increase in computing speed comes with a significant increase in power consumption and heat energy generated. Therefore, electronic devices need to provide heat dissipation strategies for the chip so that the chip can operate under appropriate operating temperature conditions, thereby extending the life and stability of the chip. In order to effectively dissipate heat for chips, air-cooled heat sinks and liquid-cooled heat sinks are proposed on the market. Among them, air-cooled heat sinks use air as the heat exchange medium and are not effective for chips with high computing power. It can effectively reduce the temperature of the chip, and the liquid-cooled heat sink uses liquid as the heat exchange medium. Compared with the air-cooled heat sink, it has better heat dissipation efficiency. Among them, the commercially available liquid-cooled heat sink uses The coolant flows through the pipeline and is in contact with the chip, allowing the coolant to absorb the heat energy generated by the chip through the pipeline. However, the time for the coolant to pass through the pipeline is too short, resulting in the coolant only absorbing part of the heat energy of the chip.
有鑒於此,在此提供一種電子裝置,電子裝置包括電路板、散熱組件及基座。電路板包括發熱源。散熱組件包括殼體、導熱管及散熱模組。殼體包括注液口、排液口及內部容置空間,注液口與排液口分別連通於內部容置空間。導熱管包括受熱區段與放熱區段,放熱區段位於內部容置空間中,受熱區段連接於放熱區段並位於殼體外部。散熱模組設置於內部容置空間中並接觸放熱區段,散熱模組包括彼此堆疊設置之第一鰭片組與第二鰭片組,第一鰭片組包括複數個第一散熱鰭片,各第一散熱鰭片以第一排列方向彼此間隔並排,第二鰭片組包括複數個第二散熱鰭片,各第二散熱鰭片以第二排列方向彼此間隔並排,其中,第一排列方向不同於第二排列方向。基座連接於受熱區段及電路板,使受熱區段接觸於發熱源。In view of this, an electronic device is provided here. The electronic device includes a circuit board, a heat dissipation component and a base. The circuit board includes a heat source. The heat dissipation components include the shell, the heat pipe and the heat dissipation module. The shell includes a liquid filling port, a liquid draining port and an internal accommodation space. The liquid filling port and the liquid draining port are respectively connected to the internal accommodation space. The heat conduction pipe includes a heating section and a heat releasing section. The heat releasing section is located in the internal accommodation space. The heating section is connected to the heat releasing section and is located outside the shell. The heat dissipation module is arranged in the internal accommodation space and contacts the heat dissipation section. The heat dissipation module includes a first fin group and a second fin group that are stacked on each other. The first fin group includes a plurality of first heat dissipation fins. Each first heat dissipation fin is spaced and arranged side by side in a first arrangement direction, the second fin group includes a plurality of second heat dissipation fins, and each second heat dissipation fin is spaced and arranged side by side in a second arrangement direction, wherein the first arrangement direction Different from the second alignment direction. The base is connected to the heated section and the circuit board, so that the heated section is in contact with the heat source.
在一些實施例中,提供一種散熱組件,包括殼體、導熱管及散熱模組。殼體包括注液口、排液口及內部容置空間,注液口與排液口分別連通於內部容置空間。導熱管包括受熱區段與放熱區段,放熱區段位於內部容置空間中,受熱區段連接於放熱區段並位於殼體外部。散熱模組設置於內部容置空間中並接觸放熱區段,散熱模組包括彼此堆疊設置之第一鰭片組與第二鰭片組,第一鰭片組包括複數個第一散熱鰭片,該些第一散熱鰭片以第一排列方向彼此間隔並排,第二鰭片組包括複數個第二散熱鰭片,該些第二散熱鰭片以第二排列方向彼此間隔並排,其中第一排列方向不同於第二排列方向。In some embodiments, a heat dissipation component is provided, including a housing, a heat pipe and a heat dissipation module. The shell includes a liquid filling port, a liquid draining port and an internal accommodation space. The liquid filling port and the liquid draining port are respectively connected to the internal accommodation space. The heat conduction pipe includes a heating section and a heat releasing section. The heat releasing section is located in the internal accommodation space. The heating section is connected to the heat releasing section and is located outside the shell. The heat dissipation module is arranged in the internal accommodation space and contacts the heat dissipation section. The heat dissipation module includes a first fin group and a second fin group that are stacked on each other. The first fin group includes a plurality of first heat dissipation fins. The first heat dissipation fins are spaced and arranged side by side in a first arrangement direction. The second fin group includes a plurality of second heat dissipation fins. The second heat dissipation fins are spaced and arranged side by side in a second arrangement direction, wherein the first arrangement The direction is different from the second arrangement direction.
綜上所述,透過本發明在一些實施例中所提供的散熱組件,當冷卻液經由注液口輸入散熱組件後,冷卻液會先接觸第一鰭片組,並通過第一鰭片組的各第一散熱鰭片,冷卻液在第一散熱鰭片具有良好的流動性,使冷卻液對第一熱散鰭片具有較佳的解熱效率,當冷卻液蓄積在散熱組件底部時,第二鰭片組係浸沒在冷卻液中,使冷卻液可充分地吸收第二散熱鰭片之熱能,當冷卻液位置達到排液口時,冷卻液即可從排液口輸出,並在散熱組件外完成熱交換後,再次將降溫後的冷卻液輸入至散熱組件,使發熱源可以維持在適當的工作溫度。In summary, through the heat dissipation component provided in some embodiments of the present invention, when the coolant is input into the heat dissipation component through the liquid injection port, the coolant will first contact the first fin group and pass through the first fin group. For each first heat dissipation fin, the coolant has good fluidity in the first heat dissipation fin, so that the coolant has better heat dissipation efficiency for the first heat dissipation fin. When the coolant is accumulated at the bottom of the heat dissipation component, the second heat dissipation component The fin assembly is immersed in the coolant, so that the coolant can fully absorb the heat energy of the second cooling fin. When the coolant reaches the drain port, the coolant can be output from the drain port and outside the heat sink assembly. After the heat exchange is completed, the cooled coolant is input to the heat dissipation component again so that the heat source can be maintained at an appropriate operating temperature.
以下提出各種實施例進行詳細說明,然而,實施例僅用以作為範例說明,並不會限縮本發明欲保護之範圍。此外,實施例中的圖式省略部份元件,以清楚顯示本發明的技術特點。在所有圖式中相同的標號將用於表示相同或相似的元件。Various embodiments are provided below for detailed description. However, the embodiments are only used as examples and do not limit the scope of the present invention. In addition, some components are omitted from the drawings in the embodiments to clearly illustrate the technical features of the present invention. The same reference numbers will be used throughout the drawings to refer to the same or similar elements.
請參閱圖1,圖1為根據本發明在一些實施例中,電子裝置的側視圖。如圖1所示的電子裝置1,包括一電路板11、一散熱組件12及一基座13。電路板11包括一發熱源111。電路板11的發熱源111可以是指在運作過程中會產生熱能的一電子元件,例如中央處理器(Central Processing Unit, CPU)、一固態硬碟或一記憶體。散熱組件12常態下係設置於電路板11並且與發熱源111相接觸,使散熱組件12可以吸收發熱源111在運作下所產生的一熱能,並且再將所吸收到的熱能進行散熱,以降低或維持發熱源111達到適當溫度。Please refer to FIG. 1 , which is a side view of an electronic device in some embodiments according to the present invention. The
請合併參閱圖1、圖2及圖3。圖2為根據本發明在一些實施例中,散熱組件的立體圖。圖3為根據本發明在一些實施例中,散熱組件的分解圖。散熱組件12包括一殼體121、一導熱管122及一散熱模組123。殼體121包括一注液口1211、一排液口1212及一內部容置空間1213,注液口1211與排液口1212分別連通於內部容置空間1213,於使用狀態下,一冷卻液(如圖5中所示的冷卻液C)可以由注液口1211輸入至內部容置空間1213,再由排液口1212輸出。其中,散熱組件12吸收發熱源111之熱能後,冷卻液在內部容置空間1213的流動過程中,冷卻液可以吸收散熱組件12之熱能,並且冷卻液在散熱組件12外部完成熱交換作業後,再次將相對低溫的冷卻液輸入於散熱組件12,以使冷卻液可以再次吸收散熱組件12之熱量(容後詳述)。其中,注液口1211與排液口1212可分別以複數條管線連接,使內部容置空間1213形成封閉的循環路徑,以確保冷卻液始終可以在內部容置空間1213流動及保存,並避免冷卻液外漏於電路板11。在一些實施例中,冷卻液可以是不導電液體(例如氟化液、礦物油或矽油)或水溶液,但凡可吸收熱能之液體皆可實施,並不以此為限。Please refer to Figure 1, Figure 2 and Figure 3 together. Figure 2 is a perspective view of a heat dissipation assembly in some embodiments according to the present invention. Figure 3 is an exploded view of a heat dissipation assembly in some embodiments according to the present invention. The
導熱管122包括一受熱區段1221與一放熱區段1222,放熱區段1222位於內部容置空間1213中,受熱區段1221連接於放熱區段1222並位於殼體121之外部,其中,導熱管122可以是具有良好導熱效果之材質製成(例如銅管),受熱區段1221與放熱區段1222可以是一體成型或互相連接而成,且受熱區段1221可以直接或間接接觸發熱源111,使受熱區段1221可以吸收發熱源111的熱能,並且將熱能傳導至放熱區段1222。The
請合併參閱圖1至圖4,圖4為圖2散熱裝置在A-A位置的剖視圖。散熱模組123設置於內部容置空間1213中並接觸放熱區段1222,散熱模組123包括彼此堆疊設置之一第一鰭片組124與一第二鰭片組125,第一鰭片組124包括複數個第一散熱鰭片1241,各第一散熱鰭片1241以一第一排列方向(如圖4中X軸方向)彼此間隔並排,第二鰭片組125包括複數個第二散熱鰭片1251,各第二散熱鰭片1251以一第二排列方向(如圖4中Y軸方向)彼此間隔並排,在一些實施例中,第一排列方向不同於第二排列方向。基座13連接於受熱區段1221及電路板11,使受熱區段1221接觸於發熱源111。在一些實施例中,基座13可以鎖固在電路板11或發熱源111,使散熱組件12(包括殼體121、導熱管122及散熱模組123)可以固定在電路板11或發熱源111。散熱組件12完成組裝後之態樣,即如圖2所示。前述「彼此間隔並排」可以是指各第一散熱鰭片1241(或第二散熱鰭片1251)彼此分別具有一分隔間距S,其中,各第一散熱鰭片1241彼此以分隔間距S隔開後,使得冷卻液可以由鄰近的兩第一散熱鰭片1241之間通過,因此第一鰭片組124與第二鰭片組125相比,冷卻液在第一鰭片組124的流動性大於第二鰭片組125,而各第二散熱鰭片1251彼此以分隔間距S隔開後,使得第二散熱鰭片1251浸沒於冷卻液時,各第二散熱鰭片1251之間皆可接觸到冷卻液,使冷卻液可以充分地吸收第二散熱鰭片1251之熱能。在一些實施例中,散熱模組123包括一導熱套管126,導熱套管126套設於放熱區段1222外部,各第一散熱鰭片1241與各第二散熱鰭片1251分別延伸自導熱套管126的外周。其中,導熱套管126可以由具有良好導熱特性之材質製成,且導熱套管126可以是直接接觸於放熱區段1222外部,使導熱套管126可將放熱區段1222的熱能,傳導到各第一散熱鰭片1241與各第二散熱鰭片1251。Please refer to FIGS. 1 to 4 together. FIG. 4 is a cross-sectional view of the heat dissipation device in FIG. 2 at position A-A. The
在一些實施例中,如圖4所示,殼體121包括一頂部1214與一底部1215,注液口1211位於頂部1214,排液口1212相對於注液口1211鄰近底部1215。前述「第一排列方向不同於第二排列方向」,可以是指第一排列方向與第二排列方向彼此垂直,具體而言,注液口1211具有一開口方向,開口方向為注液口1211的一中心軸延伸方向(即如圖4中Y軸方向),第一鰭片組124相對於第二鰭片組125鄰近注液口1211,且第一鰭片組124的第一排列方向垂直於開口方向,第二鰭片組125的第二排列方向平行於開口方向。再如圖4所示,內部容置空間1213包括一非浸泡區1216及一浸泡區1217,非浸泡區1216相對於浸泡區1217鄰近頂部1214,使得第一鰭片組124位於非浸泡區1216,第二鰭片組125位於浸泡區1217。在一些實施例中,注液口1211係連通於非浸泡區1216,排液口1212係位於非浸泡區1216與浸泡區1217之間。In some embodiments, as shown in FIG. 4 , the
請再參閱圖1至圖4,電子裝置1更包括一熱交換模組14,熱交換模組14以至少一第一導管141及至少一第二導管142連接於散熱組件12,以形成一冷卻迴路,其中,第一導管141可以是連接於注液口1211,第二導管142可以是連接於排液口1212。熱交換模組14可以是指水冷式散熱器,冷卻液於散熱組件12循環流動以吸收熱量後,冷卻液係經由第二導管142輸出於熱交換模組14外部,而冷卻液被輸送至熱交換模組14時,熱交換模組14可對此刻溫度較高的冷卻液進行熱交換,以降低冷卻液的溫度,使溫度較低的冷卻液再經由第一導管141輸入於散熱組件12。在一些實施例中,如圖4中所示,第一鰭片組124具有一第一高度D1,第二鰭片組125具有一第二高度D2,第一高度D1不同於第二高度D2,可以是指第一高度D1大於第二高度D2時,即非浸泡區1216大於浸泡區1217,依此,散熱組件12可提升冷卻液的流動性。反之,第二高度D2大於第一高度D1時,即浸泡區1217大於非浸泡區1216,依此,散熱組件12可提升冷卻液的散熱效果。Please refer to FIGS. 1 to 4 again. The
請合併參閱圖1至圖5,圖5為圖4之冷卻液在散熱組件的循環路徑示意圖。如圖5所示,電子裝置1運作狀態下,發熱源111所產生的一熱能H,與發熱源111相接觸的受熱區段1221可以吸收熱能H,並且將熱能H傳導至放熱區段1222,而第一鰭片組124與第二鰭片組125可自放熱區段1222吸收熱能。當冷卻液C以第一導管141由注液口1211輸入至內部容置空間1213時,冷卻液C會由非浸泡區1216流向浸泡區1217,在非浸泡區1216時,由於第一排列方向垂直於開口方向,冷卻液C可先流向第一鰭片組124,並且在各第一散熱鰭片1241之間流動,流動過程中,冷卻液C會吸收各第一散熱鰭片1241之熱能H,並且流向浸泡區1217,其中,冷卻液C在各第一散熱鰭片1241之間通過時,具有較高的流動性,因此冷卻液C在第一鰭片組124具有較佳的吸熱效率。當冷卻液C持續地流向浸泡區1217,冷卻液C會蓄積在浸泡區1217,使得第二散熱鰭片1251被浸沒在冷卻液C之中,由於第二排列方向平行於開口方向,使得第二散熱鰭片1251與冷卻液C具有較大的接觸面積,以使冷卻液C可以充分地吸收第二散熱鰭片1251之熱能H,需說明的是,當冷卻液C流動並蓄積在浸泡區1217時,冷卻液C可吸收第一散熱鰭片1241及第二散熱鰭片1251之熱能H,因此,在浸泡區1217中冷卻液C的溫度大於非浸泡區1216中冷卻液C的溫度。當冷卻液C蓄積位置達到排液口1212時,吸收了熱能H的冷卻液C會經由排液口1212輸出至散熱組件12外部,並經由第二導管142輸送至熱交換模組14,使熱交換模組14可對冷卻液C進行熱交換之處理,而經過熱交換處理後,溫度相對較低的冷卻液C會經由第一導管141再次輸送至注液口1211,讓冷卻液C不斷地在散熱組件12與熱交換模組14之間循環流動,以使發熱源111可以維持在適當的工作溫度。需說明的是,當冷卻液C在浸泡區1217時,由於浸泡區1217中冷卻液C與非浸泡區1216中冷卻液C具有溫差,因此溫度較低的冷卻液C會與溫度較高的冷卻液C形成熱對流,即溫度較低的冷卻液C會朝向底部1215流動,而溫度較高的冷卻液C會朝向頂部1214流動,以確保溫度較高的冷卻液C可由排液口1212排出,而溫度較低的冷卻液C可在浸泡區1217之中,持續吸收第二散熱鰭片1251之熱能H。在一些實施例中,電子裝置1更包括一分接管143,分接管143連接第一導管141或第二導管142,注液口1211或排液口1212為複數個時,熱交換模組14即可以分接管143連接至各注液口1211或各排液口1212,以將冷卻液C輸入或輸出至散熱組件12。在一些實施例中,電子裝置1更包括一流量調節閥144,流量調節閥144連接於第一導管141或第二導管142,流量調節閥144用以調節冷卻液C在散熱組件12的流速,以確保冷卻液C可有充足的時間吸收熱能H。Please refer to Figures 1 to 5 together. Figure 5 is a schematic diagram of the circulation path of the coolant in the heat dissipation component of Figure 4. As shown in Figure 5, when the
請合併參閱圖1至圖6。圖6為根據本發明在一些實施例中,排液口在底部的示意圖。如圖6所示,在本實施例中,注液口1211係位於頂部1214,排液口1212係位於在底部1215。冷卻液C由注液口1211注入於散熱組件12後,冷卻液C可以經過第一鰭片組124及第二鰭片組125後,再由排液口1212輸出。在本實施例中,二流量調節閥(144、144’)係分別連接於第一導管141及第二導管142,藉由調整兩流量調節閥(144、144’)的輸出流量,例如,調整流量調節閥144’的輸出流量小於流量調節閥144的輸出流量,如此,即使排液口1212位於底部1215,仍可使冷卻液C蓄積在浸泡區1217,使冷卻液C可以充分地吸收第二散熱鰭片1251之熱能H,再由排液口1212輸出。Please refer to Figure 1 to Figure 6 together. Figure 6 is a schematic diagram of the drain port at the bottom in some embodiments according to the present invention. As shown in FIG. 6 , in this embodiment, the
請合併參閱圖7及圖8,圖7為根據本發明在一些實施例中,電子裝置的側視圖(二)。圖8為圖7中散熱組件在Z軸方向的剖視圖。在一些實施例中,散熱組件12的注液口1211係鄰近於底部1215,例如注液口1211可以在底部1215或底部1215至浸泡區1217之間,而排液口1212係鄰近於頂部1214。依此,當熱交換模組14以第一導管141,將溫度較低的冷卻液C輸入於注液口1211時,冷卻液C會由底部1215流向頂部1214,當冷卻液C達到排液口1212之位置時,冷卻液C可從排液口1212排出,並經由第二導管142輸送至熱交換模組14,以形成另一態樣的冷卻迴路。其中,當冷卻液C不斷地蓄積在底部1215和頂部1214之間,由於第一散熱鰭片1241和第二散熱鰭片1251係完全浸沒於冷卻液C,冷卻液C可以接觸第一散熱鰭片1241和第二散熱鰭片1251的全部面積,以提高散熱組件12對發熱源111之散熱效率。Please refer to FIG. 7 and FIG. 8 together. FIG. 7 is a side view (2) of an electronic device according to some embodiments of the present invention. FIG. 8 is a cross-sectional view of the heat dissipation assembly in FIG. 7 in the Z-axis direction. In some embodiments, the
綜上所述,透過本發明在一些實施例中所提供的散熱組件,當冷卻液經由注液口輸入散熱組件後,冷卻液會先接觸第一鰭片組,並通過第一鰭片組的各第一散熱鰭片,冷卻液在第一散熱鰭片具有良好的流動性,使冷卻液對第一熱散鰭片具有較佳的解熱效率,當冷卻液蓄積在散熱組件底部時,第二鰭片組係浸沒在冷卻液中,使冷卻液可充分地吸收第二散熱鰭片之熱能,當冷卻液位置達到排液口時,冷卻液即可從排液口輸出,並在散熱組件外完成熱交換後,再次將降溫後的冷卻液輸入至散熱組件,使發熱源可以維持在適當的工作溫度。In summary, through the heat dissipation component provided in some embodiments of the present invention, when the coolant is input into the heat dissipation component through the liquid injection port, the coolant will first contact the first fin group and pass through the first fin group. For each first heat dissipation fin, the coolant has good fluidity in the first heat dissipation fin, so that the coolant has better heat dissipation efficiency for the first heat dissipation fin. When the coolant is accumulated at the bottom of the heat dissipation component, the second heat dissipation component The fin assembly is immersed in the coolant, so that the coolant can fully absorb the heat energy of the second cooling fin. When the coolant reaches the drain port, the coolant can be output from the drain port and outside the heat sink assembly. After the heat exchange is completed, the cooled coolant is input to the heat dissipation component again so that the heat source can be maintained at an appropriate operating temperature.
雖然本發明的技術內容已經以較佳實施例揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神所作些許之更動與潤飾,皆應涵蓋於本發明的範疇內,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the technical content of the present invention has been disclosed above in the form of preferred embodiments, it is not intended to limit the present invention. Any slight changes and modifications made by anyone skilled in the art without departing from the spirit of the present invention should be covered by the present invention. Within the scope of the present invention, the protection scope of the present invention shall be subject to the scope of the appended patent application.
1:電子裝置
11:電路板
111:發熱源
12:散熱組件
121:殼體
1211:注液口
1212:排液口
1213:內部容置空間
1214:頂部
1215:底部
1216:非浸泡區
1217:浸泡區
122:導熱管
1221:受熱區段
1222:放熱區段
123:散熱模組
124:第一鰭片組
1241:第一散熱鰭片
125:第二鰭片組
1251:第二散熱鰭片
126:導熱套管
13:基座
14:熱交換模組
141:第一導管
142:第二導管
143:分接管
144、144’:流量調節閥
C:冷卻液
D1:第一高度
D2:第二高度
H:熱能
S:分隔間距
1: Electronic devices
11:Circuit board
111: Heat source
12: Cooling components
121: Shell
1211: Liquid injection port
1212: Drain port
1213:Internal storage space
1214:Top
1215:bottom
1216: Non-soaking area
1217: Soaking area
122:Heat tube
1221: Heated section
1222: Heat release section
123: Cooling module
124:First fin group
1241:First cooling fin
125:Second fin group
1251:Second cooling fin
126: Thermal sleeve
13: base
14:Heat exchange module
141:First Conduit
142:Second catheter
143:
[圖1]為根據本發明在一些實施例中,電子裝置的側視圖。 [圖2]為根據本發明在一些實施例中,散熱組件的立體圖。 [圖3]為根據本發明在一些實施例中,散熱組件的分解圖。 [圖4]為圖2散熱裝置在A-A位置的剖視圖。 [圖5]為圖4之冷卻液在散熱組件的循環路徑示意圖。 [圖6]為根據本發明在一些實施例中,排液口在底部的示意圖。 [圖7]為根據本發明在一些實施例中,電子裝置的側視圖(二)。 [圖8]為圖7中散熱組件在Z軸方向的剖視圖。 [Fig. 1] is a side view of an electronic device according to some embodiments of the present invention. [Fig. 2] is a perspective view of a heat dissipation assembly in some embodiments according to the present invention. [Fig. 3] is an exploded view of a heat dissipation assembly in some embodiments according to the present invention. [Fig. 4] is a cross-sectional view of the heat dissipation device in Fig. 2 at position A-A. [Figure 5] is a schematic diagram of the circulation path of the coolant in the heat dissipation component of Figure 4. [Fig. 6] is a schematic diagram of the drain port at the bottom in some embodiments according to the present invention. [Fig. 7] is a side view (2) of an electronic device according to some embodiments of the present invention. [Fig. 8] is a cross-sectional view of the heat dissipation assembly in Fig. 7 in the Z-axis direction.
12:散熱組件 12: Cooling components
121:殼體 121: Shell
1211:注液口 1211: Liquid injection port
1212:排液口 1212: Drain port
1213:內部容置空間 1213:Internal storage space
1214:頂部 1214:Top
1215:底部 1215:bottom
122:導熱管 122:Heat tube
1221:受熱區段 1221: Heated section
1222:放熱區段 1222: Heat release section
123:散熱模組 123: Cooling module
124:第一鰭片組 124:First fin group
125:第二鰭片組 125:Second fin group
126:導熱套管 126: Thermal sleeve
13:基座 13: base
Claims (17)
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US8014150B2 (en) * | 2009-06-25 | 2011-09-06 | International Business Machines Corporation | Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling |
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