TW202403933A - A die ejector and a die bonding apparatus including it - Google Patents

Abstract

The invention provides a die ejector in which the power portion and a driving shaft are separated to prevent the driving shaft from buckling, and the straightness is improved, a method of separating dies using the die ejector, and a die bonding apparatus including the same. In one embodiment, the die ejector includes: an ejector component for ejecting dies on the dicing tape; a hood in close contact with a lower portion surface of the dicing tape and including vacuum holes for sucking the dicing tape and an opening through which the ejector component passes; an ejector body connected to the hood and including a driving shaft extending along a vertical direction therein for lifting and descending the ejector component and an air pipe in communication with the opening; and a power portion disposed below the driving shaft and in contact with the driving shaft to lift and descend the driving shaft along the vertical direction.

Description

Wafer separator and die bonding device including the same

The present invention relates to a wafer separator that separates a power part from a drive shaft, prevents buckling of the drive shaft, and improves straightness, and a die bonding device including the wafer separator.

The semiconductor device manufacturing process is completed by repeatedly executing a unit process consisting of various processes such as exposure and development, etching, diffusion, deposition, and metal processing on a wafer. The wafer forming the semiconductor device is divided into multiple wafers through a cutting process, and the wafers are bonded to the substrate through a bonding process.

The device for performing the die bonding process may include: a pickup device that picks up the wafer for separation; and a bonding module that attaches the picked wafer to the substrate. The pickup module may include: a stage unit supporting the wafer; a wafer separator installed movably in a vertical direction to selectively separate the wafer from the wafer supported by the stage unit; the pickup unit, The wafer is picked up from the wafer and attached to the substrate.

The wafer separator may include: a cover body formed with a vacuum hole for adsorbing the lower surface of the dicing tape; a separator unit disposed in the cover body and moving in a vertical direction through an upper part of the cover body to remove the dicing tape The wafer is separated from the dicing tape.

Recently, as the thickness of the wafer becomes thinner, there may be a problem that the wafer is damaged or not picked up by the pickup unit during the wafer separation process, thereby requiring a method that can accurately peel off the wafer.

FIG. 1 is a schematic front view of a conventional wafer separator 20 .

As shown in FIG. 1 , the cover 21 of the wafer separator 20 is provided with a plurality of separator components 22 , and inside the separator main body combined with the cover 21 , there are multiple components for lifting and lowering the separator components 22 . A driving part 23. At this time, the lower side of the driving parts 23 is combined with the power part 24 and rises together with the power part 24 in the vertical direction to lift and lower the separator parts 22 to peel off the wafer attached to the dicing tape 12 2. In addition, since the plurality of driving parts 23 are connected to each other, it is impossible to lift each separator member 22 individually. The outer separator member 22 can only be sequentially lifted toward the inner separator member 22, or the inner separator member 22 can be separated toward the outer side. The device parts 22 are lowered in sequence. Furthermore, due to the conflict between the tensile force of the cutting tape 12 and the force of lifting the separator component 22, the driving parts 23 may buckle. At this time, there arises a problem that the wafer separator 20 needs to be repaired by separating the driving part 23 and the power part 24 .

existing technical documents

(Patent Document 1) Korean Application No. KR10-1585316.

(Patent Document 2) Korean Application No. KR10-1627906.

Technical issues to be solved

An object of the present invention is to provide a wafer separator that overcomes the above problems, separates the power part from the drive shaft, prevents buckling of the drive shaft, and improves straightness, and a die bonding device including the wafer separator.

means of solving problems

In order to achieve the object of the present invention, the following wafer separator and a die bonding device including the wafer separator are provided.

In one embodiment of the present invention, a wafer separator is provided, including: a separator component used to separate wafers on a dicing tape; a cover body used to adhere to the lower surface of the dicing tape and have a structure for the separator component to pass the opening; the separator body, which is connected to the cover and includes a driving shaft extending in the vertical direction; a power part, which is provided separately from the driving shaft and is used to lift and lower the driving shaft; and a pressurizing component, connected to the driving shaft And when the power part lifts and lowers the drive shaft, external pressure is applied in a downward direction.

In one embodiment, the power part may include a cantilever-shaped drive transmission block, and the drive transmission block has a contact surface on an upper surface that contacts the drive shaft.

In one embodiment, the lower end of the driving shaft may have a curved surface, and the lower end is in point contact with the contact surface.

In one embodiment, the contact surface may be perpendicular to the extending direction of the drive shaft.

In one embodiment, the wafer separator may further include a shaft guide disposed inside the separator body and surrounding the drive shaft.

In one embodiment, the wafer separator may further include a push rod guide disposed inside the cover. The push rod guide connects the upper end of the drive shaft and a side surface of the separator component to guide the separation. The parts move vertically.

In one embodiment of the present invention, a wafer separator is provided, including: a plurality of separator components for separating wafers on a dicing tape; a plurality of drive shafts for lifting and lowering the separator components; a plurality of drive transmission blocks, and the The driving shafts are separately arranged and lift the driving shafts respectively; and a plurality of pressurizing components are connected to the driving shafts and apply external pressure in the downward direction when lifting; wherein, the separator components, the plurality of driving shafts , multiple drive transmission blocks and multiple pressurizing components are each connected one-to-one.

In one embodiment of the present invention, a die bonding device is provided, including: a wafer separator that pushes the wafer upward to lift it, thereby separating the wafer attached to the dicing tape from the dicing film; and a die bonding module. , the wafer separated by the wafer separator is joined to the substrate; wherein, the wafer separator includes: a plurality of separator components, which are arranged in a stacked form and separate the wafers on the cutting tape; a cover body, which is close to the The lower surface of the cutting film is provided with a vacuum hole for vacuum adsorbing the cutting tape and an opening for the separator components to pass; the separator main body is connected to the cover body and has internal components extending in a vertical direction and lifting and lowering respectively. A plurality of drive shafts of the separator component and an air pipeline connected to the opening; a plurality of drive transmission blocks are provided at the lower portions of the drive shafts and are each in contact with the drive shafts to lift and lower the drives in the vertical direction. a shaft; a pressurizing component, which is disposed inside the separator body and is composed of an elastomer each surrounding the drive shafts, and exerts pressure on the drive shaft through the drive transmission block; a shaft guide, which is disposed inside the separator body a shaft guide that is internal and surrounds each of the drive shafts; and a push rod guide that is disposed inside the cover and connects the respective upper ends of the drive shafts and the different single sides of the separator components, and along the The vertical direction guides the separator part.

beneficial effects

The present invention can provide a wafer separator in which the power part and the drive shaft are separated, the buckling of the drive shaft is prevented, and the straightness is improved, and a die bonding device including the wafer separator.

Below, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings to help those with ordinary knowledge in the technical field to which the invention belongs better understand the present invention. However, during the detailed description of the preferred embodiments of the present invention, if the detailed description of related known configurations or functions is considered to obscure the gist of the present invention, the detailed description will be omitted. In addition, the same reference numerals are used throughout the drawings for components that have similar functions and effects. In addition, in this specification, terms such as "upper", "upper part", "upper surface", "lower", "lower part", "lower surface", "side", etc. are based on the drawings, but in actual situations, Can vary depending on the orientation of components and structures.

In addition, throughout the specification, when it is said that a certain part is "connected" to other parts, it includes not only the case of "direct connection", but also the case of "indirect connection" through other parts. In addition, "including" a certain constituent element means that other constituent elements can be further included, rather than excluding other constituent elements, unless otherwise stated to the contrary.

FIG. 2 is a schematic top view illustrating the die bonding device 10 according to an embodiment of the present invention; FIG. 3 is a schematic three-dimensional view of the wafer separator 100 according to an embodiment of the present invention; A schematic cross-sectional view of a wafer pickup device 200 according to an embodiment of the invention. Description will be made below with reference to Figures 2 to 4.

The die bonding device 10 can be used to pick up the wafer 2 from the wafer 1 containing the wafer 2 independently separated by the cutting process and bond the wafer 2 to the substrate 3 . The die bonding device 10 may also include: a wafer boat loading port 6 for placing the wafer boat 5 for receiving the wafer 1; a wafer guide rail 7 for guiding the transfer of the wafer 1; and a wafer transfer unit 8 , used to transfer the wafer 1 from the wafer boat 5 to the wafer stage 13 .

The wafer 1 can be provided in a state of being attached to a dicing tape 12 , and the dicing tape 12 can be mounted on a substantially annular mounting frame 15 . At this time, the die bonding device 10 includes a stage unit 11 for supporting the wafer 1, and the stage unit 11 may include: a wafer stage 13 that can move in a horizontal direction; an expansion ring 14 that is disposed on the wafer 1. a round stage 13 for supporting the edge of the cutting tape 12; and a clamp for extending the cutting tape 12 by lowering the mounting frame 15.

Further, the die bonding device 10 may include: a wafer separator 100 for selectively separating the wafer 2 from the dicing tape 12; and a wafer pickup device 200 for picking up the wafer 2 from the dicing tape 12 through the wafer separator 100. At least partially separated wafer 2 . At this time, the wafer pickup device 200 may include: a pickup 210, a pickup driving part 220 for moving the pickup 210, and the like. At the same time, above the wafer stage 13, a camera unit 230 for detecting the wafer 2 to be picked up from the wafer 2 can be provided.

The picker 210 can be disposed above the wafer 1 and can use vacuum pressure to pick up the wafer 2 . In addition, the pickup 210 may be configured to move in vertical and horizontal directions through the pickup driving part 220, and may be rotated to adjust the angle of the wafer 2 picked up by the pickup 210. The pickup driving part 220 can move in horizontal and vertical directions to move the pickup 200 that has picked up the wafers 2 one by one to the wafer stage 1517 . At this time, the wafer separator 100 can push up the wafer 2 to be picked up to separate it from the dicing tape 12 for picking.

Therefore, as shown in FIG. 2 , the picked wafer 2 can be transferred to the wafer stage 1517 through the wafer pickup device 200 , and the die bonding module 16 can pick up the wafer 2 on the wafer stage 1517 and bond it to the substrate. 3 on. The substrate 3 is transferred from the first slot 4a to the substrate stage 3s, the position of the substrate 3 is adjusted on the substrate stage 3s to complete the die bonding process, and then the substrate 3 is transferred to the second slot 4b.

5 to 8 illustrate a wafer separator 100 according to an embodiment of the present invention. Specifically, FIG. 5 is a partially exploded schematic view of the wafer separator 100 according to an embodiment of the present invention; FIG. 6 is a cross-sectional schematic view of the wafer separator 100 according to an embodiment of the present invention; FIG. 7 is a schematic cross-sectional view of the wafer separator 100 according to an embodiment of the present invention. FIG. 8 is a partially enlarged schematic diagram of the lower part of the wafer separator 100 according to an embodiment of the present invention. Detailed description will be given below with reference to FIGS. 5 to 8 .

As shown in FIGS. 5 and 6 , a wafer separator 100 according to an embodiment of the present invention includes a cover 110 , a separator body 120 combined with the cover 110 , and a power part 130 disposed at the lower part of the separator body 120 . A separator part 101 may be provided inside the cover 110 in a rectangular shape with holes of different sizes, arranged in a stack (like a telescope) and used to separate the wafers 2 on the dicing tape 12 (see Figure 4). The cover 110 is close to the lower surface of the cutting tape 12 (see FIG. 4 ) and has a vacuum hole 111 for vacuum adsorbing the cutting tape 12 and an opening 112 for the separator component 101 to pass through. A driving shaft 121 is provided inside the separator body 120 , and the driving shaft 121 extends along the vertical direction inside the separator body 120 to vertically move the separator components 101 respectively. In addition, the separator body 120 may be provided with an air pipe 124 communicating with the opening 112 inside. In addition, although the shape of the separator member 101 is shown as a rectangular pin with a hole formed inside, it may also be formed in the shape of a rectangular block, and the present invention is not limited thereto.

The separator components 101 may include a first separator component 101a disposed on the innermost side, a second separator component 101b disposed adjacent to the outer side of the first separator component 101a, and a second separator component 101b disposed adjacent to the second separator component 101a. The third separator component 101c on the outer side of the component 101b and the fourth separator component 101d disposed on the outermost side, and a plurality of the separator components 101a, 101b, 101c, 101d can be arranged in a stacked form with the upper surface having a rectangular shape. In addition, the driving shaft 121 may have multiple, for example, may include a first driving shaft 121a that lifts and lowers the first separator component 101a along the vertical direction, and a second driving shaft that lifts and lowers the second separator component 101b along the vertical direction. The shaft 121b, the third driving shaft 121c that lifts and lowers the third separator part 101c along the vertical direction, and the fourth driving shaft 121d that lifts and lowers the fourth separator part 101d along the vertical direction. At this time, a plurality of the driving shafts 121a, 121b, 121c, and 121d can be disposed one-to-one on different single sides of the separator component 101. At the same time, the air pipe 124 can be disposed between the driving shafts 121a, 121b, 121c, and 121d, and can extend in a vertical direction to be aligned with the driving shaft 121.

Therefore, when the first drive shaft 121a moves along the vertical direction, the first separator component 101a can be raised and lowered, and when the second drive shaft 121b moves along the vertical direction, the second separator component 101a can be raised and lowered. The third separator component 101b can be raised and lowered when the third driving shaft 121c moves along the vertical direction, and when the fourth driving shaft 121d moves along the vertical direction, the third separator component 101c can be raised and lowered. Fourth separator component 101d. That is, according to the lifting and lowering of each drive shaft 121, the separator component 101 can be moved up and down simultaneously. At this time, the number of the separator components 101 and the driving shafts 121 can be variously changed, and can be changed according to the size of the wafer 2 bonded to the substrate, and the scope of the present invention is not affected by this change.

Further, the drive shaft 121 may include a pressurizing member 122 . The pressurizing member 122 may be configured to surround the driving shaft 121 between a step portion protruding toward the inside of the separator body 120 and a lower end portion of the driving shaft 121 . The pressurizing component 122 may be respectively disposed on the drive shafts 121a, 121b, 121c, and 121d, and may include a first pressurizing component 122a disposed on the first drive shaft 121a, a third pressurizing component 122a disposed on the second drive shaft 121b. The two pressing members 122b, the third pressing member 122c provided on the third driving shaft 121c, and the fourth pressing member 122d provided on the fourth driving shaft 121d. In this case, the pressurizing components 122a, 122b, 122c, and 122d may apply downward external pressure to the driving shafts 121a, 121b, 121c, and 121d. In other words, when the pressurizing component 122 applies external pressure to the power part 130, the driving shaft 121 can rise or fall along the vertical direction while contacting the power part 130. Specifically, the pressurizing part 122 External pressure can be applied to the drive transmission block 132, which will be described later. In this case, as shown in FIG. 6 , the pressurizing member 122 may be made of elastic body, but is not limited thereto, as long as it can apply external pressure to the power part 130 .

In this case, the power part 130 can be disposed adjacent to the lower part of the driving shaft 121 and can lift the driving shaft 121 in a vertical direction. The separator body 120 is connected to the power part 130 , and the power part 130 may include a support part 131 formed with a body hole 131 h corresponding to the size of the separator body 120 . Therefore, the separator body 120 can be inserted into the body hole 131h, and the protruding portion 123 provided around the outside of the separator body 120 can be coupled to and supported by the supporting portion 131 . That is, the separator body 120 is detachably coupled to the supporting part 131 , so that the driving shaft 121 can be managed separately from the power part 130 , and can be easily assembled and managed separately from the power part 130 . In addition, the power part 130 can contact the driving shaft 121 to lift the driving shaft 121 in a vertical direction.

In this case, there may be a plurality of power parts 130, and may include, for example, a first power part 130a adjacent to the lower end of the first drive shaft 121a, and a lower end adjacent to the second drive shaft 121b. The second power part 130b is provided, the third power part 130c is provided adjacent to the lower end of the third driving shaft 121c, and the fourth power part 130d is provided adjacent to the lower end of the fourth driving shaft 121d. At this time, the number of the power part 130 can be the same as the number of the separator part 101 and the drive shaft 121. Therefore, when the number of the separator part 101 and the drive shaft 121 changes, the number of the power part 130 can also be changed. Modifications may occur together, but the scope of the present invention is not limited to the above modifications.

The power part 130 may further include a cantilever-shaped drive transmission block 132. The drive transmission block 132 has a contact surface 133 on its upper surface that contacts the drive shaft 121. The drive transmission block 132 may have multiple, for example, It may include a first drive transmission block 132a provided on the first power part 130a, a second drive transmission block 132b provided on the second power part 130b, a third drive transmission block 132c provided on the third power part 130c, and The fourth drive transmission block 132d is provided in the fourth power part 130d.

In addition, the power part 130 may also include a motor 135, a ball screw 136 and a ball nut 137 for lifting and lowering the drive transmission block 132 in the vertical direction. That is, the drive transmission block 132 moves in the vertical direction through the motor 135, and the drive shaft 121 is lifted and lowered by the force in the vertical direction from contact with the drive transmission block 132. Similarly, the motor 135 may be provided in plurality, and each may be connected to a plurality of the drive transmission blocks 132a, 132b, 132c, and 132d to be driven independently. Therefore, a plurality of the drive shafts 121a, 121b, 121c, and 121d can be raised and lowered individually. Therefore, in the wafer separator 100 according to an embodiment of the present invention, the separator components 101a, 101b, 101c, 101d, the plurality of drive shafts 121a, 121b, 121c, 121d, the plurality of drive transmission blocks 132a, 132b, 132c, 132d and the plurality of pressurizing members 122a, 122b, 122c, 122d can each be connected one to one.

In this case, as shown in FIGS. 6 and 7 , the lower end of the drive shaft 121 may have a curved surface, and the lower end may be in point contact with the contact surface 133 of the drive transmission block 132 . Therefore, even if the drive transmission block 132 is curved or inclined relative to the vertical direction, power can be transmitted along the vertical direction from the point where the lower end of the drive shaft 121 contacts the contact surface 133 . For example, even if the drive transmission block 132 is bent in a vertical direction, the drive shaft 121 can transmit a force in the vertical direction from the contact point of the lower end.

Further, the wafer separator 100 according to the first embodiment of the present invention may further include a shaft guide 140. The shaft guide 140 may be disposed inside the separator body 120 and configured to surround the drive shaft 121 . In addition, the shaft guide 140 may be provided at both ends along the length direction of the drive shaft 121 , and the shaft guide 140 may include an upper end shaft guide 141 located at an upper end and a lower end shaft guide 142 located at a lower end. . In this case, the shaft guide 140 is formed to extend along the vertical direction, and the drive shaft 121 can be driven up and down in the shaft guide 140. Therefore, the shaft guide 140 can improve the vertical direction of the drive shaft 121. sports. In addition, the shaft guide 140 can be individually provided on each driving shaft 121 to individually guide a plurality of the driving shafts 121a, 121b, 121c, and 121d.

In addition, the wafer separator 100 according to the first embodiment of the present invention may further include a push rod guide 150 . The push rod guide 150 is disposed inside the cover 110 and connects the upper end of the drive shaft 121 and one side of the separator component 101 . The push rod guide 150 can be connected side by side with the drive shaft along the vertical direction and can be connected to the drive shafts 121a, 121b, 121c, 121d. For example, it can include a first push rod connected to the first drive shaft 121a. The guide member 150a, the second push rod guide 150b connected to the second drive shaft 121b, the third push rod guide 150c connected to the third drive shaft 121c and the fourth push rod guide connected to the fourth drive shaft 121d. Rod guide 150d. That is, the push rod guides 150a, 150b, 150c, and 150d can be connected to the upper ends of the drive shafts 121a, 121b, 121c, and 121d in a one-to-one manner.

Furthermore, the push rod guides 150a, 150b, 150c, and 150d can each be connected to the separator parts 101a, 101b, 101c, and 101d in a one-to-one manner and can be respectively disposed on different single sides of the separator part 101, Therefore, as shown in FIG. 8 , the push rod guides 150a, 150b, 150c, and 150d can be centered on the separator component 101, and are each arranged on a different single side.

According to the above structure of the wafer separator 100 according to an embodiment of the present invention, since the power part 130 and the drive shaft 121 are separated, it is easy to assemble and manage, and it is easy to align the power part 130 and the drive shaft 121 along the vertical direction. . In addition, because the drive shaft 121 is in point contact with the drive transmission block 132, it can move up and down in the vertical direction without being affected by the outside. The shaft guide 140 and the push rod guide 150 enhance the rigidity of the drive shaft 121, thereby preventing the The drive shaft 121 is bent or deflected to one side to improve the straightness, and because the separator parts 101a, 101b, 101c, 101d, the plurality of drive shafts 121a, 121b, 121c, 121d and the plurality of drive transmission blocks 132a, 132b, 132c and 132d are respectively connected and moved in pairs, so that each pair can be raised and lowered individually.

Therefore, unlike the existing multi-stage method in which the outer separator part is raised in stages toward the inner separator part, or the inner separator part is lowered in stages, the separator parts can be raised and lowered individually. 101a, 101b, 101c, and 101d, thereby enabling precise control, and because they can be lifted and lowered individually according to time differences, the incidence of cracks generated in the separation process of thin wafers can be reduced.

Furthermore, the wafer separator 100 according to an embodiment of the present invention may further include a control part (not shown), which is connected to the power part 130 and can individually control a plurality of the drive transmission blocks 132a. , 132b, 132c, 132d move up and down. Therefore, the control part (not shown) can individually lift at least one of the plurality of drive transmission blocks 132a, 132b, 132c, and 132d combined with the separator component 101, so as to individually lift and lower the wafer 2 by detecting the size of the wafer 2. A separator member 101 is provided on the lower surface of the wafer 2 . Furthermore, the air pipeline 124 is connected to the opening 112 and can adsorb the wafer 2 lifted by the separator part 101 onto the dicing tape, thereby preventing the wafer 2 from floating during the peeling process, thereby making it easy to Peeling for precise peeling.

Please refer to FIG. 4 again. A wafer pickup device 200 according to an embodiment of the present invention includes a wafer separator 100 that pushes the wafer 2 upward to lift it, thereby removing the wafer 2 attached to the dicing tape 12 from the dicing film. 12 for separation; and a vacuum picker 210 to pick up the wafer 2 separated by the wafer separator 100; as shown in Figures 5 to 8, wherein the wafer separator 100 includes: a plurality of separator components 101a, 101b, 101c, and 101d are arranged in a stacked form to separate the wafer 2 on the cutting tape 12; the cover 110 is close to the lower surface of the cutting tape 12, and has a vacuum hole 111 for vacuum adsorbing the cutting tape 12 and a vacuum hole 111 for vacuum adsorption of the cutting tape 12. The openings 112 through which the separator components 101a, 101b, 101c, and 101d pass; the separator body 120 is connected to the cover 110 and has internally provided with the separator components 101a, 101b, 101c, 101a, 101b, 101c, The plurality of drive shafts 121a, 121b, 121c, 121d of 101d are connected to the air pipe 124 of the opening 112; the plurality of drive transmission blocks 132a, 132b, 132c, 132d are provided on the drive shafts 121a, 121b, 121c, 121d, and each contacts the driving shafts 121a, 121b, 121c, and 121d to lift and lower the driving shafts 121a, 121b, 121c, and 121d in the vertical direction; the pressurizing component 122 is disposed inside the separator body 120 And it is composed of elastic bodies surrounding the drive shafts 121a, 121b, 121c, and 121d respectively, and pressurizes the drive shafts 121a, 121b, 121c, and 121d to the drive transmission block 132; the shaft guide 140 is provided in the separator. Shaft guides inside the main body 120 and surrounding the driving shafts 121a, 121b, 121c, 121d; and a plurality of push rod guides 150a, 150b, 150c, 150d, which are arranged inside the cover 110 and connected to the driving shafts The respective upper ends of 121a, 121b, 121c, and 121d and the different single side surfaces of the separator components 101a, 101b, 101c, and 101d, and guide the separator components 101a, 101b, 101c, and 101d along the vertical direction. .

9 to 10 are schematic diagrams comparing a wafer separator 100 according to an embodiment of the present invention and an existing wafer separator 20 (please refer to FIG. 1 ). Next, description will be made with reference to FIGS. 9 to 10 . Specifically, FIG. 9(a) and FIG. 9(b) are schematic diagrams comparing the degree of straightness improvement in the wafer separator 100 according to an embodiment of the present invention. Figure 9(a) shows the degree of bending of the driving part 23 of the conventional wafer separator 20 (see Figure 1) of Figure 1, and Figure 9(b) shows the degree of bending of the driving shaft 121 of the wafer separator 100 according to an embodiment of the present invention. degree of buckling. Please refer to Figure 9 (a) and Figure 9 (b). The conventional driving part 23 is biased to one side from the vertical direction by the tension of the cutting tape 12 (see Figure 1). However, on the contrary, according to an embodiment of the present invention, The drive shaft 121 of this example has its rigidity enhanced by the shaft guide 140 and does not bend to one side, and is in point contact with the drive transmission block 132, thereby improving the straightness.

In addition, FIG. 10(a) and FIG. 10(b) show a comparison of the flatness of each separator component when there is a load. FIG. 10( a ) is a schematic diagram showing the height difference between the existing wafer separator 20 (see FIG. 1 ) and the wafer separator 100 (see FIG. 6 ) according to an embodiment of the present invention at positions 1 to 4. As shown in FIG. 10(a), in the case of the existing wafer separator 20 (see FIG. 1), a maximum height difference equivalent to a is generated between the 2 position and the 4 position, while in the case of the present invention In the case of the wafer separator 100 of the embodiment (see FIG. 6 ), a maximum height difference occurs between the 2 position and the 4 position. Figure 10(b) shows the difference in the results according to Figure 10(a). As shown in Figure 10(b), in the case of the existing wafer separator 20, the distance between the wafer 2 and the pickup 210 is not fixed. , during the process of picking up the wafer 2, the picking is unstable or causes damage to the wafer 2. In contrast, in the case of the wafer separator 100 according to an embodiment of the present invention, the unity between the wafer 2 and the picker 210 can be ensured. spacing, wafer 2 can be picked up stably.

FIG. 11 shows a schematic cross-sectional view of a wafer separator 100 according to another embodiment of the present invention. The following parts that are repeated with the wafer separator 100 according to the previous embodiment of the present invention are omitted, and the differences are emphasized.

As shown in FIG. 11 , in the wafer separator 100 according to another embodiment of the present invention, the drive transmission block 132 may have a curved surface, and the curved surface may be in point contact with the drive shaft 121 . In other words, the contact surface 133 formed on the upper surface of the drive transmission block 132 may be a curved surface protruding toward the drive shaft 121 side, and may be in point contact with the lower end of the drive shaft 121 . At this time, the drive transmission block 132 may be a spherical lifting component in a cantilever shape and adjacent to one end of the drive shaft 121 . Therefore, even if the drive transmission block 132 is bent or tilted relative to the vertical direction, the drive shaft 121 can be raised or lowered along the vertical direction.

Furthermore, the cover 110 may also include an adsorption part 113 . The adsorption part 113 is coupled to one side of the cover 110 and can communicate with the vacuum hole 111 formed in the cover 110 , and can adsorb the wafer 2 placed outside the separator component 101 . Therefore, during the separation process of the wafer 2, the wafer 2 placed outside the separator part 101 can be adsorbed without being affected.

FIG. 12 is a flow chart of a wafer peeling method (S100) according to an embodiment of the present invention, which will be described with reference to the wafer separator 100 of FIG. 6 .

As shown in Figure 12, the wafer peeling method (S100) according to an embodiment of the present invention includes: the step of setting the wafer 2 on the dicing tape 12 (S110); and closely separating the lower surface of the dicing tape 12 where the wafer 2 is set. The step of lifting the separator unit 101 (S120); the step of raising and lowering the drive transmission block 132 provided at the lower part of the drive shaft 121 of the separator unit 101 (S130); and the step of peeling off the wafer 2 by the separator unit 101 coupled to the drive shaft 121. (S140).

At this time, in the step of raising and lowering the drive transmission block 132 ( S130 ), the drive transmission block 132 can be raised and lowered while the drive shaft 121 is pressed against the drive transmission block 132 by the pressing member 122 connected to the drive shaft 121 . . Further, in the step of raising and lowering the drive transmission block 132 ( S130 ), the drive transmission block 132 may be raised and lowered in a state of point contact with the lower end of the drive shaft 121 . Therefore, the drive shaft 121 can rise or fall together with the drive transmission block 132 , and the point contact between the drive transmission block 132 and the drive shaft 121 can be stably maintained by the pressure of the pressurizing member 122 . Furthermore, the wafer peeling method (S100) according to an embodiment of the present invention can accurately control the lifting degree of the drive transmission block 132 through the pressurizing component 122, and can continuously adjust the lifting height or speed. Therefore, the separation can be accurately controlled by The device component 101 makes it easy to peel off the thin wafer 2. At the same time, when the drive transmission block 132 descends, the pressing member 122 can also press the drive shaft 121 to move through the drive transmission block 132 .

Furthermore, in the step of raising and lowering the drive transmission block 132 (S130), each of the plurality of drive transmission blocks 132a, 132b, 132c, and 132d can be controlled individually, and a plurality of the drive transmission blocks 132 can be continuously controlled. Furthermore, in the step of raising and lowering the drive transmission block 132 ( S130 ), the operation of raising part of the drive transmission block 132 and lowering the remaining part may be performed in a mixed manner. Therefore, in addition to the existing peeling method of ascending in steps from the outermost separator member to the inner side or descending in stages from the inner side to the outermost part, any of the drive transmission blocks 132 can be raised or lowered without any time difference, so as to Achieve continuous and accurate wafer 2 debonding. In addition, since the driving transmission blocks 132 are continuously raised or lowered, the occurrence rate of cracks in the wafer 2 can be reduced and stable peeling can be achieved.

In addition, in the step of peeling off the wafer 2 ( S140 ), the adsorption part 113 connected to the cover 110 can adsorb the wafer 2 located outside the separator component 101 . Therefore, when the wafers 2 are separated, the wafers 2 located outside the separator member 101 can be prevented from floating, and only the wafers 2 at the positions where the separator member 101 is in close contact can be targeted for peeling.

The above embodiments are only used to illustrate the present invention and not to limit it. Those of ordinary skill in the technical field to which the invention belongs should understand that the present invention can be modified, deformed or equivalently substituted without departing from the spirit and scope of the present invention. All of them should be covered by this invention. Within the scope of patent applications for inventions.

1:wafer 2:wafer 3:Substrate 3s: Substrate carrier 4a: First card slot 4b: Second card slot 5:Jingzhou 6: Crystal boat loading port 7: Wafer guide 8: Wafer transfer unit 10:Crystal bonding device 11: Carrier unit 12: Cutting tape 13:Wafer carrier 14:Extended ring 15:Installation frame 16:Crystal bonding module 17:wafer stage 20: Existing wafer separator 21: Cover body 22:Separator parts 23:Drive Department 24:Power Department 100:wafer separator 101, 101a, 101b, 101c, 101d: separator parts 110: cover body 111: Vacuum hole 112:Open your mouth 113:Adsorption part 120:Separator body 121, 121a, 121b, 121c, 121d: drive shaft 122, 122a, 122b, 122c, 122d: Pressurized parts 123:Protrusion 124:Air pipeline 130, 130a, 130b, 130c, 130d: Power department 131: Support part 131h: Main body hole 132, 132a, 132b, 132c, 132d: drive transfer block 133:Contact surface 135: Motor 136: Ball screw 137:Ball nut 140: Shaft guide 141:Upper end shaft guide 142:Lower end shaft guide 150, 150a, 150b, 150c, 150d: push rod guide 200: Wafer pick-up device 210: Pickup 220: Pickup drive unit 230:Camera unit

Figure 1 is a schematic cross-sectional view of a conventional wafer separator; Figure 2 is a schematic top view of a die bonding device according to an embodiment of the present invention; Figure 3 is a perspective view of a wafer separator according to an embodiment of the present invention; Figure 4 is a schematic cross-sectional view of a wafer pickup device according to an embodiment of the present invention; Figure 5 is a partially exploded schematic view of a wafer separator according to an embodiment of the present invention; Figure 6 is a schematic cross-sectional view of a wafer separator according to an embodiment of the present invention; Figure 7 is a partial enlarged view of the drive transmission block according to an embodiment of the present invention; Figure 8 is a partial enlarged view of a push rod guide according to an embodiment of the present invention; 9(a) and 9(b) are schematic diagrams comparing the straightness of the drive shaft in the existing wafer separator and the wafer separator according to an embodiment of the present invention, wherein FIG. 9(a) represents the existing wafer separator in FIG. 1 The degree of buckling of the driving part of the wafer separator. Figure 9(b) shows the degree of buckling of the driving shaft of the wafer separator according to an embodiment of the present invention; 10(a) and 10(b) are schematic comparisons of the flatness of an existing wafer separator and a wafer separator according to an embodiment of the present invention, wherein FIG. 10(a) represents the existing wafer separator of FIG. 1 Schematic diagram of the height difference between positions 1 to 4 of the wafer separator (before improvement) and according to an embodiment of the present invention (after improvement). Figure 10(b) shows that the results according to Figure 10(a) are reflected when picking up wafers. Schematic diagram of the difference in flatness; Figure 11 is a schematic cross-sectional view of a wafer separator according to another embodiment of the present invention; Figure 12 is a flow chart of a wafer separation method according to an embodiment of the present invention.

2:wafer

12: Cutting tape

101, 101a, 101b, 101c, 101d: separator parts

110: cover body

111: Vacuum hole

112:Open your mouth

120:Separator body

121b, 121c: drive shaft

122b, 122c: Pressurized parts

123:Protrusion

124:Air pipeline

130, 130b, 130c: Power department

131: Support part

132b, 132c: Drive transfer block

133:Contact surface

136: Ball screw

137:Ball nut

140: Shaft guide

141:Upper end shaft guide

142:Lower end shaft guide

150b, 150c: Push rod guide

Claims (20)

A wafer separator including: a separator component for separating a wafer on a dicing tape; A cover body, used to adhere to the lower surface of the cutting tape and provided with an opening for the separator component to pass; a separator body connected to the cover and internally including a drive shaft extending in a vertical direction; A power part, which is provided separately from the drive shaft and is used to lift the drive shaft; and A pressurizing component is connected to the drive shaft and applies an external pressure in a downward direction when the power part lifts and lowers the drive shaft. The wafer separator according to claim 1, wherein the power part includes a cantilever-shaped drive transmission block, and the drive transmission block has a contact surface on an upper surface that is in contact with the drive shaft. The wafer separator according to claim 2, wherein the contact surface is perpendicular to an extending direction of the driving shaft. The wafer separator according to claim 3, wherein the lower end of the driving shaft has a curved surface, and the lower end is in point contact with the contact surface. The wafer separator according to claim 4, wherein the pressing member is an elastic body and is configured to surround the drive between a step portion protruding toward the inside of the separator body and the lower end of the drive shaft. axis. The wafer separator of claim 5, wherein the wafer separator includes a shaft guide disposed inside the separator body and surrounding the driving shaft. The wafer separator of claim 6, wherein the shaft guide includes an upper end shaft guide and a lower end shaft guide surrounding both ends of the driving shaft. The wafer separator of claim 7, wherein the wafer separator further includes a push rod connecting an upper end of the drive shaft and a side surface of the separator component and guiding the separator component in a vertical direction. guide. The wafer separator according to claim 8, wherein the separator body further includes an air pipeline connected to the opening. The wafer separator of claim 9, wherein the cover includes a vacuum hole for adsorbing the dicing tape. The wafer separator of claim 10, wherein the power part further includes a support part having a body hole for inserting the separator body; and the separator body is detachably coupled to the support part. The wafer separator according to claim 2, wherein the contact surface is a curved surface protruding toward one side of the driving shaft and in point contact with the lower end surface of the driving shaft. The wafer separator of claim 2, wherein the cover includes an adsorption portion coupled to the cover and used to adsorb a wafer located on an outside of the separator component. A wafer separator including: a plurality of separator components for separating a wafer on a dicing tape; A plurality of drive shafts for lifting and lowering the separator components; A plurality of drive transmission blocks, provided separately from the drive shafts and used to lift the drive shafts respectively; and A plurality of pressurizing components connected to the drive shafts and applying an external pressure in a downward direction when lifting; The separator components, the drive shafts, the drive transmission blocks and the pressurizing components are each connected one to one. The wafer separator according to claim 14, wherein each upper end of the drive shafts further includes push rod guides connected one to one. The wafer separator of claim 15, wherein the separator components are arranged in a stacked form with upper surfaces in a rectangular shape; and the drive shafts and push rod guides are located on different single sides of the separator component. Set each one to one. The wafer separator of claim 14, wherein the wafer separator further includes an air pipeline disposed between the driving shafts and extending in a direction parallel to the driving shafts. The wafer separator according to claim 14, wherein the wafer separator further includes a control part connected to the drive transmission blocks; and the control part controls a lifting degree of the drive transmission blocks. The wafer separator as claimed in claim 18, wherein the control part controls the drive transmission blocks individually. A crystal bonding device including: a wafer separator that pushes upward to separate a wafer attached to a dicing tape from the dicing film; and A die bonding module for bonding the wafer separated by the wafer separator to a substrate; The wafer separator includes: A plurality of separator components, arranged in a stack and used to separate the wafer on the dicing tape; A cover body, used to adhere to the lower surface of the cutting film, and has a vacuum hole for vacuum adsorption of the cutting tape and an opening for the separator components to pass; A separator body connected to the cover and having a plurality of drive shafts extending in a vertical direction and respectively lifting and lowering the separator components and an air pipeline connected to the opening; A plurality of drive transmission blocks are arranged below the drive shafts and are each in contact with the drive shafts to lift and lower the drive shafts in the vertical direction; A pressurizing component is provided inside the separator body and is composed of an elastic body surrounding the drive shafts respectively, and applies pressure to the drive shaft through the drive transmission block; A shaft guide is disposed inside the separator body and surrounds the drive shafts respectively; and A push rod guide is disposed inside the cover body and connects the upper ends of the drive shafts and different single sides of the separator components, and guides the separator components in the vertical direction.