TW202347845A - 顯示裝置 - Google Patents

顯示裝置 Download PDF

Info

Publication number
TW202347845A
TW202347845A TW112114352A TW112114352A TW202347845A TW 202347845 A TW202347845 A TW 202347845A TW 112114352 A TW112114352 A TW 112114352A TW 112114352 A TW112114352 A TW 112114352A TW 202347845 A TW202347845 A TW 202347845A
Authority
TW
Taiwan
Prior art keywords
light
cured film
display device
wiring
resin
Prior art date
Application number
TW112114352A
Other languages
English (en)
Chinese (zh)
Inventor
橋本啓華
増田有希
Original Assignee
日商東麗股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東麗股份有限公司 filed Critical 日商東麗股份有限公司
Publication of TW202347845A publication Critical patent/TW202347845A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
  • Led Device Packages (AREA)
TW112114352A 2022-04-20 2023-04-18 顯示裝置 TW202347845A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022069293 2022-04-20
JP2022-069293 2022-04-20

Publications (1)

Publication Number Publication Date
TW202347845A true TW202347845A (zh) 2023-12-01

Family

ID=88419783

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112114352A TW202347845A (zh) 2022-04-20 2023-04-18 顯示裝置

Country Status (5)

Country Link
JP (1) JPWO2023204155A1 (https=)
KR (1) KR20250002104A (https=)
CN (1) CN118613857A (https=)
TW (1) TW202347845A (https=)
WO (1) WO2023204155A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI901018B (zh) * 2024-02-27 2025-10-11 誠美材料科技股份有限公司 顯影型封裝膠組成及發光二極體封裝件

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117577761A (zh) * 2023-11-29 2024-02-20 湖北芯映光电有限公司 一种led发光器件结构及其制作方法
CN121970101A (zh) * 2023-12-25 2026-05-01 东丽株式会社 显示装置
KR20260018439A (ko) * 2024-07-31 2026-02-09 주식회사 헤라켐테크놀러지 감광성 수지 조성물 및 이를 이용하여 패턴을 형성하는 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003012884A1 (en) * 2001-08-01 2003-02-13 Nam-Young Kim Display system
JP4882273B2 (ja) * 2005-05-09 2012-02-22 ソニー株式会社 素子実装基板、不良素子の修復方法及び画像表示装置
JP4479827B2 (ja) * 2008-05-12 2010-06-09 ソニー株式会社 発光ダイオード表示装置及びその製造方法
TWI573185B (zh) * 2009-05-12 2017-03-01 美國伊利諾大學理事會 用於可變形及半透明顯示器之超薄微刻度無機發光二極體之印刷總成
JP2014108986A (ja) * 2012-12-03 2014-06-12 Fujifilm Corp 分散組成物、感光性樹脂組成物、硬化物及びその製造方法、樹脂パターン製造方法、硬化膜、有機ｅｌ表示装置、液晶表示装置、並びに、タッチパネル表示装置
EP3384530A1 (en) 2016-02-18 2018-10-10 Apple Inc. Backplane structure and process for microdriver and micro led
WO2019160199A1 (ko) 2018-02-13 2019-08-22 주식회사 루멘스 다층 연성 회로 기판을 갖는 마이크로 엘이디 모듈
JP6811353B2 (ja) * 2018-02-28 2021-01-13 京セラ株式会社 表示装置、ガラス基板およびガラス基板の製造方法
JP2020068313A (ja) 2018-10-25 2020-04-30 株式会社ブイ・テクノロジー 発光素子および表示装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI901018B (zh) * 2024-02-27 2025-10-11 誠美材料科技股份有限公司 顯影型封裝膠組成及發光二極體封裝件

Also Published As

Publication number Publication date
JPWO2023204155A1 (https=) 2023-10-26
KR20250002104A (ko) 2025-01-07
CN118613857A (zh) 2024-09-06
WO2023204155A1 (ja) 2023-10-26

Similar Documents

Publication Publication Date Title
TWI884323B (zh) 顯示裝置及顯示裝置的製造方法
TWI797112B (zh) 負型感光性樹脂組成物、硬化膜、具備硬化膜之元件及有機ｅｌ顯示器、以及其製造方法
TW202347845A (zh) 顯示裝置
JP7767925B2 (ja) 表示装置および表示装置の製造方法
JP7547727B2 (ja) 樹脂組成物、樹脂シート、硬化膜、硬化膜の製造方法、半導体装置および表示装置
WO2019065902A1 (ja) 感光性樹脂組成物、硬化膜、硬化膜を具備する素子及び有機ｅｌディスプレイ、並びに有機ｅｌディスプレイの製造方法
JP7707920B2 (ja) 表示装置および表示装置の製造方法
JP7835160B2 (ja) 表示装置
CN118077312B (zh) 有机el显示装置
TW202409994A (zh) 顯示裝置
TWI914427B (zh) 顯示裝置及顯示裝置的製造方法
TWI916553B (zh) 顯示裝置
JP2022069416A (ja) 表示装置および表示装置の製造方法
WO2025142626A1 (ja) 表示装置
WO2020175150A1 (ja) 樹脂組成物、黒色樹脂膜、積層体および表示装置
WO2024034333A1 (ja) 発光装置