JPWO2023204155A1 - - Google Patents
Info
- Publication number
- JPWO2023204155A1 JPWO2023204155A1 JP2023524874A JP2023524874A JPWO2023204155A1 JP WO2023204155 A1 JPWO2023204155 A1 JP WO2023204155A1 JP 2023524874 A JP2023524874 A JP 2023524874A JP 2023524874 A JP2023524874 A JP 2023524874A JP WO2023204155 A1 JPWO2023204155 A1 JP WO2023204155A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022069293 | 2022-04-20 | ||
| PCT/JP2023/015207 WO2023204155A1 (ja) | 2022-04-20 | 2023-04-14 | 表示装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023204155A1 true JPWO2023204155A1 (https=) | 2023-10-26 |
| JPWO2023204155A5 JPWO2023204155A5 (https=) | 2026-04-20 |
Family
ID=88419783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023524874A Pending JPWO2023204155A1 (https=) | 2022-04-20 | 2023-04-14 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2023204155A1 (https=) |
| KR (1) | KR20250002104A (https=) |
| CN (1) | CN118613857A (https=) |
| TW (1) | TW202347845A (https=) |
| WO (1) | WO2023204155A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117577761A (zh) * | 2023-11-29 | 2024-02-20 | 湖北芯映光电有限公司 | 一种led发光器件结构及其制作方法 |
| CN121970101A (zh) * | 2023-12-25 | 2026-05-01 | 东丽株式会社 | 显示装置 |
| TWI901018B (zh) * | 2024-02-27 | 2025-10-11 | 誠美材料科技股份有限公司 | 顯影型封裝膠組成及發光二極體封裝件 |
| KR20260018439A (ko) * | 2024-07-31 | 2026-02-09 | 주식회사 헤라켐테크놀러지 | 감광성 수지 조성물 및 이를 이용하여 패턴을 형성하는 방법 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003012884A1 (en) * | 2001-08-01 | 2003-02-13 | Nam-Young Kim | Display system |
| JP4882273B2 (ja) * | 2005-05-09 | 2012-02-22 | ソニー株式会社 | 素子実装基板、不良素子の修復方法及び画像表示装置 |
| JP4479827B2 (ja) * | 2008-05-12 | 2010-06-09 | ソニー株式会社 | 発光ダイオード表示装置及びその製造方法 |
| TWI573185B (zh) * | 2009-05-12 | 2017-03-01 | 美國伊利諾大學理事會 | 用於可變形及半透明顯示器之超薄微刻度無機發光二極體之印刷總成 |
| JP2014108986A (ja) * | 2012-12-03 | 2014-06-12 | Fujifilm Corp | 分散組成物、感光性樹脂組成物、硬化物及びその製造方法、樹脂パターン製造方法、硬化膜、有機ｅｌ表示装置、液晶表示装置、並びに、タッチパネル表示装置 |
| EP3384530A1 (en) | 2016-02-18 | 2018-10-10 | Apple Inc. | Backplane structure and process for microdriver and micro led |
| WO2019160199A1 (ko) | 2018-02-13 | 2019-08-22 | 주식회사 루멘스 | 다층 연성 회로 기판을 갖는 마이크로 엘이디 모듈 |
| JP6811353B2 (ja) * | 2018-02-28 | 2021-01-13 | 京セラ株式会社 | 表示装置、ガラス基板およびガラス基板の製造方法 |
| JP2020068313A (ja) | 2018-10-25 | 2020-04-30 | 株式会社ブイ・テクノロジー | 発光素子および表示装置の製造方法 |
-
2023
- 2023-04-14 JP JP2023524874A patent/JPWO2023204155A1/ja active Pending
- 2023-04-14 CN CN202380017821.3A patent/CN118613857A/zh active Pending
- 2023-04-14 WO PCT/JP2023/015207 patent/WO2023204155A1/ja not_active Ceased
- 2023-04-14 KR KR1020247023008A patent/KR20250002104A/ko active Pending
- 2023-04-18 TW TW112114352A patent/TW202347845A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20250002104A (ko) | 2025-01-07 |
| CN118613857A (zh) | 2024-09-06 |
| TW202347845A (zh) | 2023-12-01 |
| WO2023204155A1 (ja) | 2023-10-26 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20260410 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260410 |