TW202346388A - 黏著帶及加工方法 - Google Patents

黏著帶及加工方法 Download PDF

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Publication number
TW202346388A
TW202346388A TW112110638A TW112110638A TW202346388A TW 202346388 A TW202346388 A TW 202346388A TW 112110638 A TW112110638 A TW 112110638A TW 112110638 A TW112110638 A TW 112110638A TW 202346388 A TW202346388 A TW 202346388A
Authority
TW
Taiwan
Prior art keywords
adhesive tape
meth
adhesive
adhesive layer
acrylic polymer
Prior art date
Application number
TW112110638A
Other languages
English (en)
Chinese (zh)
Inventor
木元裕紀
田中秀
野上浩子
蓮見水貴
Original Assignee
日商電化股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商電化股份有限公司 filed Critical 日商電化股份有限公司
Publication of TW202346388A publication Critical patent/TW202346388A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW112110638A 2022-03-31 2023-03-22 黏著帶及加工方法 TW202346388A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-060324 2022-03-31
JP2022060324 2022-03-31

Publications (1)

Publication Number Publication Date
TW202346388A true TW202346388A (zh) 2023-12-01

Family

ID=88200705

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112110638A TW202346388A (zh) 2022-03-31 2023-03-22 黏著帶及加工方法

Country Status (3)

Country Link
JP (1) JPWO2023188714A1 (https=)
TW (1) TW202346388A (https=)
WO (1) WO2023188714A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4506146B2 (ja) * 2003-03-20 2010-07-21 東洋インキ製造株式会社 粘着剤組成物および粘着シート
JP4748518B2 (ja) * 2005-07-20 2011-08-17 古河電気工業株式会社 ダイシングダイボンドテープおよびダイシングテープ
CN101191041B (zh) * 2006-11-29 2010-04-14 上海康达化工有限公司 丙烯酸酯胶粘剂
JP2010129865A (ja) * 2008-11-28 2010-06-10 Furukawa Electric Co Ltd:The ダイシング用粘着テープ
JP5416081B2 (ja) * 2010-12-27 2014-02-12 古河電気工業株式会社 ウエハ貼着用粘着シート、ウエハの個片化方法、およびチップの製造方法
JP6482818B2 (ja) * 2013-10-23 2019-03-13 リンテック株式会社 ダイシングシート
KR101642555B1 (ko) * 2013-11-22 2016-07-25 주식회사 엘지화학 점착제 조성물
JP5718515B1 (ja) * 2014-01-23 2015-05-13 古河電気工業株式会社 半導体ウエハ表面保護用粘着テープおよび半導体ウエハの加工方法
JP7560345B2 (ja) * 2020-12-16 2024-10-02 マクセル株式会社 ダイシングテープ

Also Published As

Publication number Publication date
JPWO2023188714A1 (https=) 2023-10-05
WO2023188714A1 (ja) 2023-10-05

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