TW202345976A - 分配器系統 - Google Patents

分配器系統 Download PDF

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Publication number
TW202345976A
TW202345976A TW112106181A TW112106181A TW202345976A TW 202345976 A TW202345976 A TW 202345976A TW 112106181 A TW112106181 A TW 112106181A TW 112106181 A TW112106181 A TW 112106181A TW 202345976 A TW202345976 A TW 202345976A
Authority
TW
Taiwan
Prior art keywords
parameter
coating
suction
parameters
fluid
Prior art date
Application number
TW112106181A
Other languages
English (en)
Chinese (zh)
Inventor
東岸修一
青木中尚
榊原教晃
Original Assignee
日商兵神裝備股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商兵神裝備股份有限公司 filed Critical 日商兵神裝備股份有限公司
Publication of TW202345976A publication Critical patent/TW202345976A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B49/00—Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00
    • F04B49/06—Control using electricity

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  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Detergent Compositions (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
  • Control Of Positive-Displacement Pumps (AREA)
TW112106181A 2022-03-10 2023-02-20 分配器系統 TW202345976A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022037637A JP2023132372A (ja) 2022-03-10 2022-03-10 ディスペンサシステム
JP2022-037637 2022-03-10

Publications (1)

Publication Number Publication Date
TW202345976A true TW202345976A (zh) 2023-12-01

Family

ID=87935132

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112106181A TW202345976A (zh) 2022-03-10 2023-02-20 分配器系統

Country Status (4)

Country Link
JP (1) JP2023132372A (ja)
CN (1) CN118632747A (ja)
TW (1) TW202345976A (ja)
WO (1) WO2023171419A1 (ja)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3307980B2 (ja) * 1992-04-15 2002-07-29 株式会社日立製作所 半導体装置の製造方法
JP2003154301A (ja) * 2001-11-21 2003-05-27 Seiko Epson Corp 塗布装置及び塗布方法
JP2009154073A (ja) * 2007-12-26 2009-07-16 Heishin Engineering & Equipment Co Ltd 流体吐出装置および流体供給システム
JP2013132596A (ja) * 2011-12-27 2013-07-08 Dainippon Screen Mfg Co Ltd パターン形成装置およびパターン形成方法
JP6304617B2 (ja) * 2013-09-09 2018-04-04 兵神装備株式会社 流体塗布システムおよび流体塗布方法
JP6332095B2 (ja) * 2015-03-20 2018-05-30 東京エレクトロン株式会社 薬液供給装置の調整方法、記憶媒体及び薬液供給装置
JP7220446B2 (ja) * 2018-06-05 2023-02-10 兵神装備株式会社 吐出システム

Also Published As

Publication number Publication date
WO2023171419A1 (ja) 2023-09-14
CN118632747A (zh) 2024-09-10
JP2023132372A (ja) 2023-09-22

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