TW202344701A - Feeder, film deposition apparatus and holding member - Google Patents

Abstract

To provide a feeder capable of collectively exposing some of a lot of electronic components for film deposition by a simple mechanism; a film deposition apparatus; and a holding member. A feeder 2 for supplying electronic components C to a deposition processing part 3 of a film deposition apparatus 1 for depositing a film on the electronic component C includes: a mask 240 including a mask hole 242 covering a part of the electronic components C and supplied to the deposition processing part in a state of penetrating and holding the electronic components C in the mask hole 242; a first cradle 250 holding one surface of the mask 240 and contacting the one end of the electronic component C penetrating the mask hole 242; a second cradle 250 holding the other surface of the mask 240 and contacting the other end of the electronic component C penetrating the mask hole 242; and a reversal mechanism 500 for reversing the mask 240 in a state of sandwiching the mask 240 by the first cradle 250 and the second cradle 250.

Description

Supply device, film forming device and holding member

The present invention relates to a supply device, a film forming device and a holding member.

Currently, as wafer-shaped electronic components used in various electronic circuits, electronic components having external electrodes formed on both ends are very popular. For example, a chip capacitor is formed by dividing a block obtained by laminating dielectric sheets on which internal electrodes are formed into individual rectangular parallelepiped-shaped pieces. Furthermore, external electrodes are formed by a conductive material covering both side surfaces of this rectangular parallelepiped element and connected to the internal electrodes.

As a method of forming an external electrode, as shown in Patent Document 1, the following steps are performed: inserting and holding a tape for covering a part of an electronic component into a through hole, and using a press-in pin of a component press machine to insert the electronic component into the through-hole. By moving apart in the hole, a part of the electronic component is exposed (the head is exposed), and the conductive material paste is adhered (film-formed) to the exposed part to form an external electrode. [Prior art documents] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. 09-22846

[Problem to be solved by the invention] However, in the method as described above, the protruding length (the length of the exposed portion) of the head portion of each electronic component is determined based on the amount of press-fitting of the press-fit pin or the like. Therefore, in order to form external electrodes while suppressing variation for each electronic component, it is necessary to align the protrusion lengths of all electronic components within a certain range. However, it is very difficult to adjust the movement amount of the press-in pin of the parts press machine. Since most electronic parts are very small, the mask used as a member to cover part of them must be very thin. Therefore, there is a possibility that the mask will be deflected and deformed by pressing, and the relative positions of the electronic components and the press-fit pins in the respective mask holes, which are through holes, will easily vary. Therefore, it is necessary to change the movement amount of the press-in pin according to the deformation part, and the adjustment becomes complicated. This situation becomes a further problem when a large number of electronic components are inserted into the mask holes, supplied to the film forming device, and the film forming process is performed uniformly.

Embodiments of the present invention are proposed in order to solve the problems of the prior art as described above, and an object thereof is to provide a supply device that can uniformly expose part of a large number of electronic components from a mask for film formation using a simple mechanism. Film forming device and holding member. [Technical means to solve problems]

In order to achieve the object, an embodiment provides a supply device that supplies electronic components to a film forming processing section of a film forming apparatus that forms a film of electronic components, the supply device including a mask having a cover that covers the electronic components. A part of the mask hole of the component is supplied to the film forming processing section in a state where the electronic component is inserted through the mask hole and held therein; a first receiving table holds one side of the mask and passes through it. One end of the electronic component of the mask hole is in contact with it; a second receiving platform holds the other side of the mask and the other end of the electronic component that penetrates the mask hole is in contact with it; and reverse A mechanism is provided to reverse the cover in a state where the cover is sandwiched between the first receiving platform and the second receiving platform.

Furthermore, the film forming apparatus of the embodiment includes: the supply device; and a film forming processing unit, and forms a film on the electronic component.

Furthermore, an embodiment is a holding member for holding an electronic component by forming a film on a part of the electronic component by sputtering, the holding member including a mask having a plurality of masks covering a part of the electronic component. a hole to allow the electronic component to penetrate through the mask hole and hold it; and a receiving platform to hold the mask and make the end of the electronic component that penetrates the mask hole come into contact with it, the mask hole It is the inner diameter through which the electronic component can pass, and the length in the axial direction is the same as the length of the non-sputtering area of the electronic component. [Effects of the invention]

According to the embodiment of the present invention, it is possible to provide a supply device, a film forming device, and a holding member that can expose a part of a large number of electronic components for film formation with a simple mechanism.

An embodiment of the present invention (hereinafter referred to as the present embodiment) will be described in detail with reference to the drawings.

[Electronic parts] As shown in FIG. 1(A) , the electronic component C formed into a film according to this embodiment is a wafer-shaped electronic component C in which electrodes E using a conductive material are formed at both ends. In this way, the electronic component C has one end and the other end forming the electrode E. For example, components such as capacitors, resistors, coils, and inductors are included in the electronic component C. The electronic component C has an outer shape of a rectangular parallelepiped, a cube, or a thin plate, and the electrodes E are formed in close contact with each other so as to cover a region including a pair of opposite side surfaces in a box shape. The region where the electrode E is formed is referred to as the electrode formation region R.

FIG. 1(B) is a cross-sectional view when the electronic component C is a multilayer ceramic capacitor in which dielectric sheets on which internal electrodes En are formed are laminated. The pair of electrodes E formed on the outer surface of the electronic component C has a multilayer structure in which a plurality of layers of conductive materials are overlapped, and is electrically connected to the internal electrode En of the electronic component C. In this embodiment, copper (Cu) as a seed layer of the electrode E is formed on titanium (Ti) as a base layer for improving adhesion. Thereafter, using the seed crystal layer as a seed crystal, copper (Cu) is adhered to the electrode formation region R by electrolytic plating, thereby completing the electronic component C in which the electrode E is formed. Since the base layer or the seed layer also becomes a part of the electrode E, in the following description of this embodiment, the film formation of these layers is also expressed as "forming the electrode E."

In addition, in the following description, the straight line passing through the center of a pair of both side surfaces covered by the electrode E will be called the axis Axc of the electronic component C. In this embodiment, for example, as the electronic component C, the length in the axis Axc direction is 0.6 mm, the length of the electrode E in the axis Axc direction is 0.2 mm, and the cross section orthogonal to the axis Axc of the electrode E is 0.3 mm×0.3 mm rectangular size is very small electronic parts as objects. However, the present invention can be applied to any electronic component C that is smaller than the electronic component or a larger electronic component C.

[summary] As shown in FIG. 2 , the film forming apparatus 1 of this embodiment includes a supply device 2 , a film forming processing unit 3 , and a control device 4 . As shown in FIG. 1(C) , the supply device 2 inserts the electronic component C into the mask hole 242 and supplies the electronic component C to the film formation processing unit 3 in a state where the area other than one of the electrode formation areas R is masked. The film formation processing unit 3 forms a film of electrode material in the electrode formation region R that is not blocked but exposed. In the following description, the horizontal arrangement direction of the supply device 2 and the film forming processing unit 3 is referred to as the Y direction, the horizontal direction orthogonal thereto is referred to as the X direction, and the vertical direction is referred to as the Z direction. The electronic component C is inserted into the mask hole 242 with the axis Axc along the Z direction. Additionally, as described below, mask holes 242 are provided in the mask 240 .

[Supply device] As shown in FIGS. 2, 3(A), 3(B), 4(A), and 4(B), the supply device 2 includes a receiving portion 210 accommodated in the housing 2a, a sliding Groove 220, vibration mechanism 230, cover 240, receiving table 250, interval adjustment part 260, moving mechanism 270, transfer mechanism 280, conveying mechanism 290, receiving table moving mechanism 400, reversing mechanism 500, discharge mechanism 600, detection mechanism 700. Hereinafter, the conveyance mechanism 290 which conveys the mask 240 etc. to each structural part is demonstrated, and then other structural parts are demonstrated.

(Transportation mechanism) As shown in FIGS. 2 , 3(A) and 3(B) , the conveyance mechanism 290 conveys the mask with the electronic component C inserted in the mask hole 242 between the supply device 2 and the film forming processing unit 3 . Cover 240 mechanism. The conveyance mechanism 290 of this embodiment includes the rotation table 292 which is rotated intermittently by the motor 291. The rotation shaft 291 a of the motor 291 has a hollow cylindrical shape (see (A) to (D) of FIG. 8 ). A plurality of holding holes 292 a serving as through holes are formed in the turntable 292 at equal intervals. The receiving table 250 is held by the holding hole 292a. For example, each holding hole 292a is arranged in a direction parallel to the tangent of the circle in the circumferential direction of the turntable 292, and is provided at equal intervals in the circumferential direction. In addition, in the present embodiment, eight holding holes 292 a are provided, so eight masks 240 are held on the rotating table 292 at intervals of 45°. A step is formed on the inner edge of the holding hole 292 a to hold the receiving base 250 on which the mask 240 is mounted (see (B) of FIG. 3 ).

Furthermore, as described below, a temporary stand 293 is provided at the center of the turntable 292. The temporary stand 293 is a stand that temporarily places the receiving stand 250A or the receiving stand 250B on which the mask 240 is placed. As shown in FIGS. 8(A) to 8(D) , the temporary stand 293 is a circular plate-shaped body and is supported and fixed horizontally by pillars 293 a. The support column 293a is erected independently of the rotation shaft 291a so as to pass through the inside of the rotation shaft 291a. Therefore, even if the rotation table 292 rotates, the temporary stand 293 does not rotate.

As shown in FIG. 2 , the supply device 2 is provided with a transfer station P1, a supply station P2, a table placement station P3, a reversing station P4, a table removal station P5, a discharge station P6, and an inspection station. Workstation P7. Each of the stations P1 to P7 is a station in the supply device 2 that performs various processes on the mask holding the electronic component C before or after film formation by the film formation processing unit 3 . The turntable 292 repeats intermittent rotation of rotating and stopping so that each holding hole 292a of the turntable 292 is located at each station. In the case of this embodiment, the rotation is clockwise in Figure 2 . Next, each of the stations P1 to P7 will be described.

The transfer station P1 is a station in which a transfer mechanism 280 described below is disposed and the electronic components C are transferred between the accommodating portion 210 that accommodates the electronic components C before film formation and the chute 220 .

The supply station P2 is a station that transfers the electronic components C between the film formation processing unit 3 and the supply device 2 . That is, the supply station P2 is a station that supplies the electronic components C from the supply device 2 to the film formation processing unit 3 or returns the electronic components C that have been film-formed by the film formation processing unit 3 to the supply device 2 .

The table placement station P3 is a process for placing the table placing part 410 of the table moving mechanism 400 described below, and placing the table 250B placed on the temporary table 293 on the cover 240 of the rotating table 292 . Bit.

The reversal station P4 is a station in which a reversal mechanism 500 described below is arranged to invert the cover 240 in which the electronic component C is inserted in a state held between the two receiving tables 250A and 250B. The reversal station P4 is provided with a pusher 295 that moves the receiving base 250A and the receiving base 250B holding the mask 240 between the holding hole 292 a of the rotating table 292 and the reversing mechanism 500 (see (A) of FIG. 9 ~(G) of Figure 9).

The platform disassembly station P5 is a station where the platform disassembly section 420 of the platform moving mechanism 400 described below is disposed, and the platform 250A that has been inverted to the upper side is detached from the cover 240 and placed on the temporary platform 293 .

The discharge station P6 is a station in which a discharge mechanism 600 described below is disposed, and the film-formed electronic component C is taken out from the mask 240 and discharged. The discharge station P6 is provided with a pusher 296 that moves the receiving table 250 carrying the mask 240 between the holding hole 292 a of the rotating table 292 and the discharge mechanism 600 (refer to FIGS. 11(A) to 11(C ) )).

The inspection station P7 is a station that is equipped with a detection mechanism 700 described below to detect the presence or absence of electronic components C that have not been discharged by the discharge mechanism 600 and remain in the mask 240 (see (A) of FIG. 12 and (A) of FIG. 12 B)).

Next, the mechanism arranged in each of the stations P1 to P7 of the supply device 2 will be described. First, the transfer station P1 and the accommodating part 210, the chute 220, the vibration mechanism 230, the interval adjustment part 260, the moving mechanism 270, and The transfer mechanism 280 will be explained.

(Containment Department) The accommodating part 210 stores a plurality of electronic components C before the electrodes E are formed, that is, before film formation. The receiving part 210 includes a container 211 and a support stand 212 . The container 211 is a box-shaped body with an upper part open, and a plurality of partitions 211a serving as recesses are provided at the horizontal inner bottom. The plurality of partitions 211a are arranged in a matrix, and each partition 211a accommodates a plurality of electronic components C put in advance. A part of the inner surface of the container 211 has a structure such that it becomes an inclined surface 211b inclined toward the inner bottom, and the electronic component C inserted from the upper edge of the container 211 slides down toward the inner bottom. The support base 212 is a base that supports the container 211 in the horizontal direction. As shown in FIG. 3(B) , the support base 212 is installed on the installation surface of the supply device 2 with four legs 212 a.

(Chute) The chute 220 guides the plurality of electronic components C transferred from the accommodating part 210 to each of the plurality of mask holes 242 . As shown in FIGS. 5(A) and 5(B) , the chute 220 includes a plate body 221 , a chute hole 222 , and a partition wall 223 . The plate body 221 is a rectangular plate-shaped body. The chute holes 222 are a plurality of holes through which the electronic components C can pass one by one. Each chute hole 222 penetrates in a direction orthogonal to the surface of the plate body 221 to guide the passed electronic component C to the cover hole 242 . The chute hole 222 has a quadrangular frustum shape that expands toward the side into which the electronic component C is inserted, that is, the upper end side, so that the electronic component C can easily enter. In addition, let a straight line in the Z direction passing through the center of the chute hole 222 be the axis Axs.

The partition walls 223 are erected on the surface of the plate body 221 in a grid shape. A plurality of rectangular areas surrounded by partition walls 223 constitute a plurality of partitions 225 arranged in a matrix. A plurality of chute holes 222 are formed in each partition 225 in a matrix. That is, the partition wall 223 includes a plurality of chute holes 222 and forms a partition 225 into which the electronic components C are supplied. The position of each partition 225 corresponds to the position of each partition 211a of the accommodation part 210 in a one-to-one correspondence.

The interior of the chute 220 is divided into a plurality of partitions 225 by the partition wall 223. Therefore, when the electronic component C is guided to the mask hole 242, as described below, even if the chute 220 vibrates, the electrons supplied to each partition 225 are Part C is also blocked from moving to other partitions 225 by the partition wall 223 and enters the chute hole 222 in each partition 225 . Therefore, when the chute 220 vibrates, it is possible to suppress the electronic components C from moving to other areas and becoming unevenly distributed.

Furthermore, in order to supply and arrange a large amount of electronic components C at once, the plate body 221 of the chute 220 has a large area, and may be deflected, bent, or strained. If deflection, bending, or strain occurs, the electronic component C moves toward a specific portion of the plate body 221 and cannot be uniformly supplied to the mask hole 242 . The partition wall 223 is provided across the area of the plate body 221 where the electronic components C are supplied, thereby functioning as a beam, thereby increasing the strength of the plate body 221 and preventing deflection, bending, and strain.

Furthermore, the position of each partition 225 of the chute 220 corresponds to the position of each partition 211a of the receiving part 210 one-to-one. In addition, a plurality of electronic components C are quantitatively allocated to each partition 211a of the storage part 210 for storage in advance, and the stored electronic components C are adsorbed according to each partition 211a and moved to the corresponding partition 225 of the chute 220, so that it can A plurality of electronic components C are evenly distributed within the surface of the chute 220 .

(vibration mechanism) The vibration mechanism 230 promotes the insertion of the electronic component C into the cover hole 242 by vibrating the chute 220 or the cover 240 described below. As shown in FIGS. 3(A) and 3(B) , the vibration mechanism 230 includes a vibration table 231 and a base 232 . The vibration table 231 is a horizontal plate-shaped body. The base 232 is provided on the installation surface of the supply device 2 and supports the vibration table 231 at a position shifted in the X direction from the chute 220 . That is, they are arranged in line with the conveyance mechanism 290 described below. Furthermore, the vibration table 231 supports the other end of the vibration table 231 on the base 232 so that one end thereof overlaps the mask 240 transported by the transport mechanism 290 in a plan view. A receiving hole 231b into which the mask 240 and the receiving platform 250 described below are inserted is provided in a portion of the vibrating table 231 that overlaps the mask 240 transported by the transport mechanism 290 in a plan view. The chute 220 is supported on the vibration table 231 along the horizontal direction so as to be located at the upper part of the receiving hole 231b.

The vibrating table 231 is installed so that it can vibrate by operating the oscillating body built in the base 232 . Thereby, the chute 220 supported by the vibration table 231 vibrates together with the vibration table 231 . Furthermore, the vibration is transmitted to the cover 240 and the receiving platform 250 that are in contact with the chute 220 and vibrates. As the oscillator, for example, an electromagnetic coil, a motor, or a piezoelectric element is used. The vibration direction and vibration intensity can be set appropriately.

(mask) As shown in FIGS. 6(A) and 6(B) , the mask 240 includes a plate body 241 , a mask hole 242 , a restriction hole 243 , and a beam part 244 . The plate body 241 is a circular plate-shaped member. The mask holes 242 are a plurality of holes in which the electronic components C are inserted one by one through the chute holes 222 overlapping the chute 220 of the mask 240 and cover a part of the electronic components C. Each mask hole 242 has a rectangular prism shape that penetrates in a direction orthogonal to the surface of the plate body 241 and the axis Axc of the inserted electronic component C coincides with the vertical direction. Let a straight line in the vertical direction pass through the center of the mask hole 242 be the axis Axm. The length of the mask hole 242 in the axis Axm direction is shorter than the length of the electronic component C in the axis Axc direction. More specifically, the length of the mask hole 242 in the axis Axm direction is the same as the length in the axis Axc direction of the electronic component C except for one of the electrode formation regions R. That is, the length of the mask hole 242 in the axis Axm direction is the same as the length of the non-sputtering region of the electronic component C in the axis Axc direction (see (C) of FIG. 1 ).

The size of the cross section orthogonal to the axis Axm of the mask hole 242 may be such that the electronic component C is inserted due to its own weight when dropped, and the axis Axc becomes the vertical direction. That is, the inner diameter of the mask hole 242 has an inner diameter through which the electronic component C can pass. The cross section orthogonal to the axis Axm of the mask hole 242 is slightly larger than the cross section orthogonal to the axis Axc of the electronic component C and smaller than the axis Axc. A size that is inserted obliquely relative to the vertical direction. But set it to a size larger than the size that needs to be pushed.

Furthermore, when the electrode E is formed by sputtering as described below, the size of the cross section orthogonal to the axis Axm of the mask hole 242 is preferably smaller than the size of the film-forming material formed between the mask hole 242 and the electronic component C. The size of the gap entry.

The mask hole 242 of this embodiment is in contact with the receiving base 250 through the lower end of the inserted electronic component C, and covers other regions with only the electrode formation region R on the upper end side exposed (see (C) of FIG. 1 ). A plurality of mask holes 242 are provided in a matrix shape in a plurality of partitions 245 arranged in a matrix shape. The position of each partition 245 is consistent with the position of the partition 225 of the overlapping chute 220. The position of the mask hole 242 in each partition 245 is consistent with the position of the chute hole 222 of each partition 225. That is, the axis Axm of the mask hole 242 coincides with the axis Axs of the chute hole 222 , and the opening of the lower end of the mask hole 242 coincides with the opening of the upper end of the chute hole 222 without any deviation in the horizontal direction (XY direction, θ direction). move so electronic part C can pass through.

The restricting hole 243 is a through hole for positioning the mask 240 with respect to the receiving stand 250 and preventing positional deviation by inserting a restricting portion 253 of the receiving stand 250 described below. The restriction hole 243 of this embodiment has a cylindrical shape corresponding to the shape of the restriction portion 253 . The beam portion 244 is a thin plate fixed to the lower surface of the plate body 241 such that the area other than the partition 245 becomes thicker, thereby increasing the strength of the plate body 241 and preventing bending or straining.

(bearing platform) The receiving platform 250 is a platform that holds one or the other surface of the mask 240 and is connected to one or the other end of the electronic component C inserted into the mask hole 242 . In this embodiment, since the electronic component C is inserted into the mask hole 242 in the vertical direction, one end of the electronic component C in contact with the receiving base 250 is downward, and the other end on the opposite side is upward. In the following description, one end of the electronic component C and the end corresponding to the mask hole 242 are called the lower end, and the other end of the electronic component C and the end corresponding to the mask hole 242 are called the upper end. Furthermore, one side of the mask 240 held by the receiving base 250 from below is called a lower surface, and the other side on the opposite side is called an upper surface. However, the directions of the electronic component C, the mask 240, and the mask hole 242 are not limited to this. Furthermore, there is a possibility that either end of the electronic component C becomes one end (lower end) or the other end (upper end) due to insertion into the mask hole 242 . There is a possibility that one of the two surfaces of the mask 240 may become one (lower surface) and the other (upper surface) due to inversion.

In this embodiment, as described below, when the mask 240 is inverted, a pair of receiving bases 250A and 250B are used to hold the mask 240 (see FIGS. 20(A) to 20B). (C)). The pair of receiving bases 250A and 250B can switch between the following states: facing the lower surface of the mask 240 and contacting the lower end of the electronic component C penetrating the mask hole 242; and facing the upper surface of the mask 240 and penetrating the shield hole 242. The upper end of the electronic component C of the mask hole 242 is in contact with it.

The receiving bases 250A and 250B that serve as the first receiving base 250 and the second receiving base 250 have the same shape. In the following description, when the receiving base 250A and the receiving base 250B are not distinguished, they are referred to as the receiving base 250 . The receiving base 250 of this embodiment has a common size and shape, and the function will be the same if any one is replaced. However, in order to easily understand the reversal operation, in FIGS. 10(A) to 10(D) and 21(A) to 21(H) , the receiving base 250A is shown with a hatched circle and a painted circle. The black circle represents the receiving platform 250B.

In addition, the electronic component C penetrates the mask hole 242 , as shown in FIG. 1(C) , as long as the lower end surface of the electronic component C inserted into the mask hole 242 is at least flush with the surface of the mask 240 . That is, the lower end surface of the electronic component C does not necessarily protrude from the mask hole 242 .

As shown in FIGS. 7(A) and 7(B) , the receiving platform 250 includes a plate body 251 , a supporting part 252 , and a restricting part 253 . The plate body 251 is a circular plate-shaped member with the same diameter as the mask 240 . The support part 252 is a rectangular plate-shaped body fixed to one surface of the plate body 251 . The support portion 252 is provided at a position that blocks the lower end of the mask hole 242 in each partition 245 when the mask 240 is placed on the receiving base 250 . In addition, the support portion 252 is provided at a position where the cover 240 does not overlap the beam portion 244 .

The restriction part 253 restricts (prescribes) the distance between the overlapping receiving base 250A and the receiving base 250B (see FIG. 20(A) and FIG. 20(B) ). The restriction part 253 of this embodiment is provided so that it may protrude from the mutually facing surfaces of the overlapping receiving bases 250A and 250B, and has the same height as each other. More specifically, the restriction portion 253 is a cylindrical pin protruding in the same direction as the support portion 252 fixed to one surface of the plate body 251 . The restriction portions 253 of the receiving base 250A and the receiving base 250B are in contact with each other in a state where the receiving base 250A and the receiving base 250B sandwich the mask 240 with the electronic component C inserted into the mask hole 242 . The heights of the front ends of the protruding pins in the restricting portions 253 of the receiving bases 250A and 250B from the supporting portions 252 are the same height as each other. Furthermore, the restricting portion 253 is provided at a position corresponding to the restricting hole 243 of the cover 240. By inserting the restricting hole 243, the base 250 and the cover 240 are aligned during movement and position deviation is prevented.

In addition, the holding member H is formed by any one of the receiving base 250A and the receiving base 250B and the cover 240 supported by the receiving base 250A. That is, with the electronic component C inserted into the mask hole 242 of the mask 240 of the holding member H, a film is formed in the film formation processing unit 3 on the electrode formation region R exposed from the mask hole 242 .

(Gap adjustment part) The distance adjustment part 260 (see FIG. 3(B) ) adjusts the distance between the mutually facing surfaces of the chute 220 and the cover 240 . Specifically, as described below, the position where the cover 240 and the chute 220 are in contact (the first position), the position when the chute 220 and the cover 240 are moved relatively horizontally (the second position), and the cover is 240 and the receiving platform 250 are held at the position of the holding hole 292a (the third position), and the distance between the slide groove 220 and the cover 240 is adjusted. That is, the distance adjustment part 260 of this embodiment is a lifting mechanism that lifts the base 250 and the cover 240 between the first position, the second position, and the third position.

Moreover, the first position is a position where the electronic component C is inserted into the cover 240 from the chute 220 by vibration (refer to FIGS. 9(A) to 9(G) ), and the second position is a position where the cover 240 is spaced apart by the distance Dz. The position where the upper end of the electronic component C inserted into the cover 240 does not interfere with the chute 220 (a position where the chute 220 and the cover 240 can relatively move horizontally) is far away from the chute 220 (refer to () of FIG. 10 A) to (D) of FIG. 10 ), the third position is a position where the chute 220 and the cover 240 are separated and ready (see (B) of FIG. 18 ).

In addition, in order to prevent the upper end of the electronic component C in the second position from interfering with the chute 220, the gap adjustment portion 260 is used to move the chute 220 and the cover 240 along the vertical direction (Z direction, slide direction). The movement distance (distance Dz) when the slot 222 relatively moves in the direction of axis Axs is not less than the length of the electrode formation region R in the direction of axis Axc and not more than the length of the electronic component C in the direction of axis Axc (see FIG. 17 (A), (D) of Figure 19).

The electrode formation region R is a region where the electrode E is formed, and is therefore formed corresponding to a pair of electrodes. Therefore, the + and - separated regions of the two electrodes E are required between the pair of electrode formation regions R. Therefore, the electrode formation region R is a region in which gaps for achieving such polar separation remain. For example, one of the electrodes E may be formed only on the lower end surface F (see FIG. 1(C) ), a gap may be provided at the corner portion of the side surface where the surface F is connected, and the other parts may be used as another electrode. E. That is, based on the film formation area (electrode formation area R), the distance Dz does not exceed the length of the electronic component C in the axis Axc direction. It is preferable to set the position as close as possible to the length of the electrode formation region R in the axis Axc direction in consideration of positioning errors during movement. In addition, it is preferable that the distance Dz is a distance that can prevent the electronic component C accommodated in the mask hole 242 from being sucked when sucked from above.

The distance adjustment unit 260 includes a propeller 261 and a drive source 262 . The pusher 261 includes a mounting base 261a on which the receiving base 250 is mounted, and a shaft 261b that supports the mounting base 261a. The drive source 262 is a motor that raises and lowers the shaft 261b.

(mobile agency) The moving mechanism 270 moves the chute 220 along with the cover 240 in such a way that the axis Axs of the chute hole 222 deviates from the axis Axm of the cover hole 242 without interference between the upper end of the electronic component C and the chute 220 . A mechanism that moves relatively in the horizontal direction (see Figure 17 (B) and Figure 19 (E)). The moving mechanism 270 of this embodiment is provided between the mounting base 261a and the shaft 261b, and moves the mounting base 261a to move the receiving base 250 and the cover 240 in the X direction. The moving mechanism 270 may be, for example, a cylinder.

In order to realize such movement, a support part 261c, a guide 261d, and a movable body 261e are further provided between the mounting table 261a and the shaft 261b (see FIGS. 15(A) to 17(B) ). The support part 261c is a plate-shaped member connected to the shaft 261b so as to face the mounting table 261a. The guide 261d is a rod-shaped member fixed to the support part 261c so as to extend along the X direction. The movable body 261e is a member having a recess slidably fitted into the guide 261d. The recessed part of the movable body 261e is fitted into the guide 261d, and the part on the opposite side of the recessed part is fixed to the mounting base 261a.

The air cylinder as the moving mechanism 270 is fixed to the support part 261c at a position capable of pressing the movable body 261e. By pressing the movable body 261e with the moving mechanism 270, the movable body 261e and the mounting table 261a connected thereto move along the guide 261d. For example, the moving mechanism 270 moves a movement distance Dx that is approximately half the length of the mask hole 242 in the horizontal direction, so that the axis Axs of the chute hole 222 and the axis Axm of the mask hole 242 are shifted.

(Transfer mechanism) The transfer mechanism 280 is a mechanism that transfers the electronic component C between the accommodating part 210 and the chute 220 . The transfer mechanism 280 is also a removal mechanism that removes electronic components C other than the electronic components C inserted into the mask hole 242 from the chute 220 . As shown in FIGS. 3(A), 3(B), 4(A), and 4(B), the transfer mechanism 280 includes a pickup mechanism 281 and a guide mechanism 282.

The pickup mechanism 281 is a mechanism that picks up the electronic components C from the accommodating portion 210 or the chute 220 . The pickup mechanism 281 includes a moving body 283, an adsorption part 284, and an adsorption force imparting part 285. The moving body 283 moves between the receiving part 210 and the chute 220 . The moving body 283 has a shape of a corner prism on a sector-shaped pyramid, and is a base member on which the adsorption part 284 and the adsorption force imparting part 285 are mounted. The moving body 283 is provided so as to be movable between the accommodating part 210 and the chute 220 via the guide mechanism 282 .

The adsorption part 284 is a unit part for adsorbing the electronic component C in order to pick up the electronic component C. The adsorption part 284 includes an adsorption plate 284a, a support plate 284b, and a support column 284c. The adsorption plate 284a is a member that adsorbs the electronic components C. The adsorption plates 284a are rectangular plate-shaped bodies arranged at positions corresponding to the respective partitions 225 of the chute 220, and attract the electronic components C by applying magnetic force from an adsorption force imparting portion 285 described below. The size of the horizontal surface of the adsorption plate 284a is smaller than the area surrounded by the partition wall 223, so as to be close to the chute hole 222 of each partition 225. In addition, the position of each adsorption plate 284a also corresponds to each partition 211a of the container 211.

The support plate 284b is a rectangular plate-shaped body to which the suction plate 284a is mounted. The support plate 284b has a size that covers the entire area where the chute hole 222 of the chute 220 is formed. The adsorption plate 284a and the support plate 284b are formed to have a thickness that allows magnetic force to pass therethrough. The materials of the adsorption plate 284a and the support plate 284b are not particularly limited and may be metal or non-metal such as resin. For example, stainless steel is used as the adsorption plate 284a and the support plate 284b. The pillar 284c is a pillar that fixes the support plate 284b to the moving body 283. The upper end of the pillar 284c is fixed to the bottom of the moving body 283, and the lower end is fixed to the support plate 284b. Thereby, the support plate 284b is supported in the horizontal direction at a distance from the bottom surface of the moving body 283.

The adsorption force imparting part 285 imparts adsorption force to the adsorption plate 284a. The attraction force imparting part 285 imparts magnetic force for attracting the electronic component C to the surface of the attraction plate 284a facing the accommodating part 210 via the support plate 284b. The attraction force imparting part 285 includes a magnetic member 285a, a holding plate 285b, and a contact/separation mechanism 285c. The magnetic member 285a is a permanent magnet, for example. The size of the horizontal surface of the magnetic member 285a is approximately the same as that of the adsorption plate 284a. The holding plate 285b is approximately the same size as the support plate 284b of the adsorption part 284, and is arranged between the support plate 284b and the bottom of the moving body 283. On the holding plate 285b, the magnetic members 285a are respectively attached to positions corresponding to the adsorption plates 284a via the support plate 284b.

The contact/separation mechanism 285c performs adsorption and release of the electronic component C by relatively moving the magnetic member 285a and the adsorption plate 284a. The connection/separation mechanism 285c of this embodiment is provided at the bottom of the moving body 283, and supports the magnetic member 285a in a liftable manner. For example, a cylinder is used as the connecting/separating mechanism 285c. The contact/separation mechanism 285c supports the holding plate 285b in the horizontal direction and lowers the magnetic member 285a to contact the support plate 284b, thereby causing the adsorption plate 284a to exert magnetic attraction force via the support plate 284b. Furthermore, the contact/separation mechanism 285c causes the magnetic member 285a to rise and separate from the support plate 284b, thereby losing the attraction force due to the magnetic force in the attraction plate 284a.

The guide mechanism 282 is a mechanism that moves the moving body 283 between the accommodating part 210 and the chute 220 . The guide mechanism 282 includes a support portion 286, an arm portion 287, and a guide portion 288. The support part 286 is a pair of corner column members standing on the support base 212 of the accommodating part 210. The arm portion 287 is a horizontal corner column member supported by the support portion 286 , and extends from a position above the container 211 to a position above the receiving hole 231 b of the vibration table 231 . The guide part 288 is a biaxial movement mechanism that combines linear guides in the X direction and the Z direction, and is provided on the arm part 287 . The movable body 283 is supported on the guide part 288 via a slider. Thereby, the guide mechanism 282 can transfer the electronic component C adsorbed by the adsorption part 284 between the accommodating part 210 and the chute 220 .

Furthermore, the supply device 2 includes a transport unit that transports the mask 240 holding the electronic component C to the film formation processing unit 3 . As shown in FIGS. 14(A) to 14(D) , this embodiment includes a propeller 294 as a transfer unit. That is, the supply station P2 is provided with the pusher 294 which moves the receiving table 250A carrying the mask 240 between the holding hole 292a of the turntable 292 and the loading/unloading part 360 described below.

As shown in FIGS. 14(A) to 14(D) , the pusher 294 includes an elevating mechanism (not shown), and moves the receiving platform 250 carrying the mask 240 to the ascending position of the loading and unloading unit 360 (Fig. 14 (A)) and the retracted position ((B) to (D) of FIG. 14 ) that is retracted below the holding hole 292 a of the rotary table 292 .

The platform moving mechanism 400 in which the platform is arranged at the mounting station P3 and the platform dismounting station P5 will be mainly described using (A) to (D) of FIG. 8 . (bearing table moving mechanism) The stand moving mechanism 400 is a mechanism that moves the other stand 250 from the temporary stand 293 and places it on the stand 250 on which the cover 240 is mounted. That is, the receiving base moving mechanism 400 is in a state where the two receiving bases 250 sandwich the mask 240 and overlap the receiving bases 250 vertically. Furthermore, the receiving platform moving mechanism 400 inverts a pair of upper and lower receiving platforms 250 by a reversing mechanism 500 described below, and then moves the upper receiving platform 250 of the pair of receiving platforms 250 to the temporary holding platform 293 of institutions. As shown in FIG. 2 , the platform moving mechanism 400 includes a platform placement part 410 and a platform removal part 420 .

The base mounting part 410 is disposed at a position where the base 250 can be moved between the base mounting station P3 and the temporary placement base 293 . (A) of FIG. 8 shows a state in which the table 250 (250B) on the temporary table 293 is held by the table placing part 410, and (B) of FIG. 8 shows the table placed in the table placing station P3. 250 (the state in which the base 250B is placed on the base 250A through the mask 240).

As described above, as shown in FIGS. 8(A) and 8(B) , the base placing part 410 moves the base 250 from the temporary base 293 and places it on the base 240 on which the inverted mask 240 is mounted. Bear on the platform 250. As a result, the mask 240 is sandwiched between the pair of stands 250 at the stand placement station P3. The base placement part 410 includes a support 411, an arm 412, and a holding part 413. The support 411 is a member standing in the vertical direction near the turntable 292 in the table placement station P3. The arm 412 is a horizontal member having one end supported by the support 411 and the other end extending to the temporary stand 293 . The holding part 413 is a robot arm that is provided so as to be movable in the horizontal direction along the arm 412 and is provided so as to be able to move up and down. The holding part 413 includes a suction mechanism that holds and releases the receiving table 250 from above. In addition to the suction mechanism using negative pressure, the mechanism for holding the receiving base 250 in the holding part 413 may also be an adsorption mechanism using electrostatic force or magnetic force, or a mechanical holding mechanism.

The receiving table detaching part 420 is disposed at a position where the receiving table 250 can be moved between the receiving table detaching station P5 and the temporary setting table 293 . (C) of FIG. 8 is a partial cross-sectional side view showing a state in which the upper receiving table 250 (250A) in the receiving table disassembly station P5 is detached by the receiving table detaching part 420. (D) of FIG. 8 is a partial cross-sectional side view showing how the receiving table is removed. 250 (250A) is a partial cross-sectional side view of the state placed on the temporary stand 293.

As shown in FIGS. 8(C) and 8(D) , the receiving platform detaching unit 420 inverts the overlapping pair of receiving platforms 250 and then moves the upper receiving platform 250 of the pair of receiving platforms 250 to the temporary position. Set stage 293. Thereby, at the receiving table disassembly station P5, the cover 240 is mounted on the receiving table 250 different from the receiving table 250 mounted before the reversal. For example, the mask 240 into which the electronic components mounted on the pedestal 250A are inserted is inverted and mounted on the pedestal 250B. The stand removal part 420 includes a support 421, an arm 422, and a holding part 423. The support column 421 is a member standing in the vertical direction near the turntable 292 in the receiving table disassembly station P5. The arm 422 is a horizontal member having one end supported by the support 421 and the other end extending to the temporary stand 293 . The holding part 423 is a robot arm that is provided so as to be movable in the horizontal direction along the arm 422 and is provided so as to be able to move up and down. The holding part 423 includes a suction mechanism that holds and releases the receiving table 250 from above. The holding mechanism of the holding part 423 may be an adsorption mechanism or a holding mechanism, similarly to the holding part 413 .

The reversing mechanism 500 arranged in the reversing station P4 will be mainly described using FIGS. 9(A) to 9(G) . (Reversal mechanism) The reversal mechanism 500 is a mechanism for reversing the mask 240 in a state where the mask 240 is held between the pair of receiving stands 250 . As shown in FIGS. 9(A) to 9(G) , the inversion mechanism 500 includes a support base 510 , a drive source 520 , a rotation shaft 530 , a conductive part 540 , and a holding mechanism 550 . The support base 510 is a member standing in the vicinity of the turntable 292 in the reversal station P4. The drive source 520 is a motor that is supported by the support base 510 and rotates a horizontal axis. The rotation shaft 530 is a shaft rotatably supported in the horizontal direction by the upper end of the support base 510 .

The transmission part 540 transmits the rotation of the shaft of the drive source 520 to the rotation shaft 530 . The transmission part 540 is a belt transmission mechanism that transmits power through belts mounted on pulleys respectively attached to the shaft of the drive source 520 and the rotation shaft 530 . In addition, the driving source 520 may be a motor directly connected to the rotating shaft 530, that is, the rotating shaft 530 is rotated through direct driving. In this case, the conductive portion 540 may be omitted.

As shown in FIGS. 10(A) to 10(D) , the holding mechanism 550 is a mechanism that holds a pair of receiving stands 250 holding the mask 240 . The holding mechanism 550 includes a pair of holding arms 551, a shaft 551a, and a driving part 552.

The pair of holding arms 551 move relatively through the shaft 551a and the driving part 552 in the direction of contact/separation from the edges of the pair of receiving stands 250, so that the pair of receiving stands 250 holding the mask 240 can be held and held. release. The holding arm 551 has a first contact surface in contact with the upper surface of the upper receiving platform 250 and a second contact surface in contact with the lower surface of the lower receiving platform 250 among the pair of receiving platforms 250. The first contact surface is The edges of the pair of receiving stands 250 are held from top to bottom with the second contact surface.

The shafts 551a are respectively installed between the pair of holding arms 551 and connected to the driving part 552. The driving part 552 includes a pressure cylinder, a compression spring, etc., and can move a pair of shafts 551a respectively mounted on a pair of holding arms 551 along their axial directions to adjust the distance between the pair of holding arms 551.

Thereby, the pair of holding arms 551 relatively moves in the direction of contact/separation from the edge portions of the pair of receiving bases 250 , for example, so as to be able to hold the receiving bases 250 in the holding position ( FIG. 10(B), FIG. 10 (C)) and the release position ((A) of FIG. 10 , (D) of FIG. 10 ) where it is separated from the receiving base 250 and released. In addition, the holding position of the receiving base 250 on the holding arm 551 of the rotating table 292 is the same as the position h in the Z-axis direction (height direction) of the release position, and the movement of the receiving base 250 between the rotating table 292 and the position h is as follows As shown in FIGS. 9(A) and 9(B) , the receiving platform 250 is raised and lowered using the propeller 295 .

The discharge mechanism 600 arranged in the discharge station P6 will be mainly described using FIGS. 11(A) to 11(C) . (discharge mechanism) The discharge mechanism 600 is a mechanism that discharges and collects the film-formed electronic components C from the mask holes 242 . As shown in FIG. 11(A), FIG. 11(B), and FIG. 11(C), the discharge mechanism 600 includes a pickup mechanism 601, a guide mechanism 602, and a recovery container 610. The film-formed electronic components C are recovered into the recovery container 610 . The pick-up mechanism 601 uses the mask 240 to suck and hold the electronic component C that has been film-formed and picks it up, and uses the recovery container 610 to release the suction and hold and open it. The guide mechanism 602 moves the pickup mechanism 601 between the cover 240 and the recovery container 610 located at the discharge station P6. The pickup mechanism 601 includes a moving body 603, an adsorption part 604, and an adsorption force imparting part 605. In addition, the discharge mechanism 600 has basically the same structure as the transfer mechanism 280 . That is, the pickup mechanism 601 and the guide mechanism 602 have the same structure as the pickup mechanism 281 and the guide mechanism 282 , and the moving body 603 , the adsorption part 604 , and the adsorption force imparting part 605 have the same structure as the moving body 283 and the adsorption part of the transfer mechanism 280 284. The adsorption force imparting part 285 has the same structure.

The movable body 603 is provided so as to be movable between the cover 240 and the recovery container 610 located on the receiving table 250 of the discharge station P6 via the guide mechanism 602 . The recovery container 610 is a box-shaped body with an upper part open. The adsorption part 604 includes an adsorption plate 604a, a support plate 604b, and a support column 604c. The adsorption plate 604a is provided corresponding to each partition 245 of the mask 240. The attraction force imparting part 605 includes a magnetic member 605a, a holding plate 605b, and a contact/separation mechanism 605c. The adsorption plate 604a, the support plate 604b, and the pillar 604c have the same structure as the adsorption plate 284a, the support plate 284b, and the pillar 284e. The magnetic member 605a, the holding plate 605b, and the contact/separation mechanism 605c have the same structure as the magnetic member 295a, the holding plate 285b, and the contact/separation mechanism 285e.

The guide mechanism 602 includes the support part 606 , the arm part 607 , and the guide part 608 which are the same as the support part 286 , the arm part 287 , and the guide part 288 . The guide mechanism 602 can transfer the electronic component C adsorbed by the adsorption part 604 between the cover 240 and the recovery container 610 .

The detection mechanism 700 arranged in the inspection station P7 will be mainly described using FIG. 12(A) and FIG. 12(B) . (Testing agency) The detection mechanism 700 detects whether electronic components C remain on the mask 240 through which the electronic components C are discharged by the discharge mechanism 600 . As shown in FIGS. 12(A) and 12(B) , the detection mechanism 700 includes a support frame 710 extending from the vicinity of the turntable 292 to above the holding hole 292 a, and an imaging unit 720 supported by the support frame 710 . The imaging unit 720 is a camera set so as to face downward and form a field of view that can capture the entire area in which the mask hole 242 of the mask 240 is formed.

Next, the film formation processing unit 3 will be described using FIGS. 2 and 13 . In addition, for the sake of easy understanding and convenience, FIG. 13 illustrates the preprocessing unit 33 , the film forming unit 34 , and the film forming unit 35 shown in FIG. 2 arranged in an array.

[Film Formation Processing Department] The film formation processing unit 3 is a device that forms a film using plasma on the portion exposed from the mask hole 242 of the electronic component C, that is, the electrode formation region R. As shown in FIGS. 2 and 13 , the film forming processing unit 3 includes a chamber 31 , a conveying unit 32 , a preprocessing unit 33 , a film forming unit 34 , and a film forming unit 35 . The chamber 31 is a container whose interior can be made into a vacuum by exhaust gas from the exhaust unit 311 . The exhaust unit 311 includes a pipe (not shown) and an exhaust circuit connected to an exhaust port. The conveyance unit 32 includes a rotary table 321, a drive source 322, a sealing body 323, and a propeller 324.

The rotating table 321 is a circular table that intermittently rotates the receiving table 250 carried into the chamber 31 and moves it to the preprocessing section 33 , the film forming section 34 , the film forming section 35 , and the load lock section described below. The sealing body 323 is a member for sealing each part and isolating it from the chamber 31 . The sealing body 323 is placed on the receiving base 250 and held by holding holes provided at equal intervals in the rotating base 321 . The propeller 324 raises and lowers the sealing body 323 to a position corresponding to each part of the film formation processing unit 3 .

The pretreatment unit 33 performs surface treatment on the electrode formation region R with plasma. The surface treatment is, for example, an ion bombardment treatment in which the surface of the electrode forming region R is cleaned by ions generated by plasma in a process gas. The pretreatment part 33 includes a treatment chamber 331 which is provided on the top side of the chamber 31 and is sealed by a rising sealing body 323 to perform surface treatment on the electrode formation region R exposed from the mask 240 .

The film forming part 34 and the film forming part 35 perform a film forming process on the electrode formation region R of the electronic component C by sputtering. Sputtering is a process in which the film-forming material ejected from the targets 342 and 352 is deposited on the surface of the electrode formation region R using ions generated by plasma in the sputtering gas. The film forming parts 34 and 35 include a film forming chamber 341 and a film forming chamber 351. The film forming chamber 341 and the film forming chamber 351 are provided on the top side of the chamber 31 and are sealed by the rising sealing body 323. The electrode formation region R exposed from the mask 240 is subjected to film formation processing.

Targets 342 and 352 containing film-forming materials are provided in the film-forming chambers 341 and 351 . The targets 342 and 352 are members formed of a film-forming material deposited on the electronic component C by sputtering to form a film. The targets 342 and 352 are held by a backing plate (not shown) and are connected to a power source via electrodes. As the film-forming material of the base layer, for example, Ti is used, and as the seed layer of the electrode E, for example, Cu, Au, Ag, etc. are used. However, various materials can be applied as long as the film can be formed by sputtering. In addition, in this embodiment, the base layer is formed in the film forming unit 34 and the seed layer of the electrode E is formed in the film forming unit 35 . As the material of the base layer, for example, titanium (Ti) is used, and as the material of the seed layer of the electrode E, for example, copper (Cu) is used.

Furthermore, in this embodiment, two film forming units 34 and 35 are provided to form the two layers of the base layer and the seed layer. However, if the base layer is not required, only one film forming unit may be provided. department. Furthermore, if more layers of film formation are required, two or more film formation units may be provided.

Furthermore, as shown in FIG. 2 and FIG. 14(A) to FIG. 14(D) , the film formation processing unit 3 includes a load lock vacuum chamber 370 that maintains the mask mounted thereon. 240, the loading and unloading portion 360 for loading and unloading the receiving table 250 into and out of the chamber 31 realizes loading and unloading of the receiving table 250 equipped with the mask 240 in a vacuum state within the chamber 31.

The loading and unloading unit 360 includes an arm 361 and a holding body 362 . The arm 361 is a long member provided between the supply device 2 and the chamber 31 in a direction parallel to the plane of the turntable 321 . The arm 361 is provided so that it can rotate intermittently in units of 180° about an axis parallel to the rotation axis of the turntable 321 by a drive mechanism (not shown) and move along the axis.

The holding body 362 is provided at both ends of the arm 361 and holds the receiving base 250 . The holding body 362 holds the receiving platform 250 through a holding mechanism such as a vacuum suction cup, an electrostatic suction cup, or a mechanical suction cup. The holding body 362 also functions as a lid of the open/close load lock vacuum chamber 370 . That is, the holding body 362 is provided with a sealing material such as an O ring for sealing the load lock vacuum chamber 370 .

The load lock vacuum chamber 370 realizes loading and unloading of the receiving table 250 while maintaining the vacuum in the chamber 31 . The load lock vacuum chamber 370 is a space that can be closed by being surrounded by the through hole of the chamber 31 , the holding body 362 of the loading and unloading part 360 , and the inner surface of the sealing body 323 of the chamber 31 . A propeller 371 is provided in the chamber 31 to raise and lower the sealing body 323 to a position corresponding to the load lock vacuum chamber 370 .

In addition, although not shown in the figure, the load lock vacuum chamber 370 is provided with an exhaust line connected to the air pressure circuit and serving as a path for depressurizing the sealed load lock vacuum chamber 370 , and a valve connected to the load lock vacuum chamber 370 . The ventilation line used to perform vacuum breaking of the load interlock vacuum chamber 370 is used.

[Control device] The control device 4 is a device that controls each part of the film forming apparatus 1 (see FIG. 2 ). The control device 4 may include, for example, a computer running a predetermined program. The control device 4 is executed by a processing device such as a programmable logic controller (Programmable Logic Controller, PLC) or a central processing unit (Central Processing Unit, CPU).

For example, the control device 4 controls the vibration of the vibrating table 231 caused by the vibrating mechanism 230, the lifting and lowering of the receiving platform 250 and the cover 240 using the interval adjusting part 260, and the movement of the chute 220 using the moving mechanism 270, by using the above-mentioned program. Insertion and removal of electronic components C by the transfer mechanism 280, transportation of the receiving table 250 by the transport mechanism 290, loading and unloading of the receiving table 250 into and out of the chamber 31 by the loading and unloading part 360 and the load lock vacuum chamber 370, Plasma processing by the pretreatment unit 33 , film formation processing by the film formation unit 35 , transportation of the receiving table 250 by the transportation unit 32 , and the like.

Furthermore, the control device 4 controls the movement of the platform 250 using the platform moving mechanism 400 , the reversal of the mask 240 using the reversing mechanism 500 , the ejection of the electronic components C using the ejection mechanism 600 , and the ejection of the electronic components using the detection mechanism 700 Detection of presence or absence of C, etc.

[action] In addition to the above-described FIGS. 1(A) to 14(D) , refer to the explanatory diagrams of FIGS. 15(A) to 21(H) to describe the pair of film forming apparatuses 1 according to the present embodiment as described above. The electronic component C is subjected to a film forming process and will be described below. In addition, as a prerequisite for explanation, as shown in FIG. 4(A) , a plurality of electronic components C are put into the container 211 of the storage unit 210 in advance, and the plurality of electronic components C are stored in each partition 211 a. The number of electronic components C accommodated in each partition 211 a is greater than the number of chute holes 222 in each partition 225 in the chute 220 and the number of mask holes 242 in each partition 245 in the mask 240 . Furthermore, by grinding with a flat plate or the like, the positions of the electronic components C accommodated in each partition 211a can be averaged so that they can be evenly approached within each partition 211a.

Furthermore, as shown in FIG. 15(A) , the receiving base 250 on which the shield 240 is mounted is placed on the mounting base 261 a of the propeller 261 . At this time, by inserting the restricting portion 253 of the receiving platform 250 into the restricting hole 243 of the mask 240, the mask 240 and the receiving platform 250 are aligned and offset is prevented. And as shown in (B) of FIG. 15 , the mounting table 261 a is raised by the propeller 261 at the transfer station P1 , thereby setting the cover 240 in the first position in contact with the lower surface of the chute 220 . At this time, the lower end of the chute hole 222 matches the upper end of the mask hole 242 . Furthermore, at this time, the area in which the chute hole 222 and the mask hole 242 overlap is larger than the area of the surface F in the direction orthogonal to the axis Axc of the electronic component C (see FIG. 1(C) ).

21(A) to 21(H) are explanatory diagrams illustrating the procedure of mounting and detaching the receiving table 250. More specifically, they are explanatory diagrams for mounting and holding electronic components C that have completed film formation. The figure explains the flow of conveying the receiving table 250 of the mask 240 from the supply station P2 via the reversing station P4 to the discharge station P6. 21(A) to 21(H) focus on the flow of a certain mask 240. In the supply device 2 of this embodiment, all the masks 240 are mounted on the holding holes of the turntable 292. In the state of 292a, the rotary table 292 is stopped (positioned) at each station P1 to station P7, and performs rotational transportation by repeatedly rotating.

First, the operation of supplying the electronic components C to the mask 240 will be described. As shown in FIG. 4(A) , the moving body 283 of the pickup mechanism 281 moves horizontally through the guide mechanism 282 and is positioned above the container 211 . At this time, the holding plate 285b is lowered by the contact/separation mechanism 285c, and the magnetic member 285a is in contact with the support plate 284b. Thereby, the adsorption force due to magnetic force acts on the adsorption plate 284a via the support plate 284b.

The holding hole 292a is positioned just below the receiving hole 231b of the vibrating table 231 every time the rotating table 292 stops due to intermittent rotation. 3(A) and 3(B) show a state in which the receiving base 250 mounted with the cover 240 into which the electronic component C is inserted is held by the holding hole 292a and positioned directly below the accommodation hole 231b. In this state, as shown in FIG. 4(A) , the pusher 261 of the interval adjustment part 260 moves the receiving base 250 carrying the cover 240 between the holding hole 292 a and the receiving hole 231 b of the rotating base 292 . Thereby, the approach chute 220 and the cover 240 are in substantially contact state.

Next, the moving body 283 of the pickup mechanism 281 is lowered by the guide mechanism 282, so that each adsorption plate 284a approaches each partition 211a of the container 211. Thereby, each adsorption plate 284a attracts and holds the plurality of electronic components C by magnetic force. Then, the moving body 283 of the pickup mechanism 281 is raised by the guide mechanism 282, and the electronic component C is picked up from the container 211. Thereafter, the moving body 283 moves horizontally through the guide mechanism 282 and is positioned above the chute 220 . Furthermore, as shown in (B) of FIG. 4 , (A) of FIG. 16 , and (A) of FIG. 19 , the moving body 283 descends and the suction plate 284 a approaches each section 225 of the chute 220 .

Thereafter, as shown in FIGS. 16(B) and 19(B) , the holding plate 285b is raised by the contact/separation mechanism 285c, and the magnetic member 285a is separated from the support plate 284b, thereby acting on each adsorption plate 284a. The magnetism is released. Therefore, the electronic components C adsorbed by each adsorption plate 284 a fall to each partition 225 of the chute 220 . Then, the moving body 283 is raised by the guide mechanism 282, whereby the suction plate 284a is retracted from each section 225 of the chute 220. In this way, the electronic components C are supplied to the chute 220 . Thereafter, the holding plate 285b is lowered by the contact/separation mechanism 285c, and the magnetic member 285a is brought into contact with the support plate 284b, thereby returning to the state where the magnetic force acts on each adsorption plate 284a.

Then, the vibrating table 231 is vibrated by the vibrating mechanism 230, thereby vibrating the chute 220, the cover 240 and the receiving table 250. In this way, as shown in (C) of FIG. 19 , the electronic components C accommodated in each partition 225 of the chute 220 enter from the upper end side of the chute hole 222 one by one, and move along the axis Axc while passing through the chute hole 222 . It is guided in the vertical direction and dropped to the mask hole 242 .

The electronic component C that has entered the mask hole 242 is in contact with the support portion 252 of the receiving base 250 through its lower end, and only the electrode formation region R on the upper end side is exposed from the mask hole 242 . However, the electrode formation region R exposed from the mask hole 242 enters the chute hole 222 . Moreover, sometimes the electronic components C that enter the chute hole 222 are also loaded on the electronic components C that enter the mask hole 242 .

Next, as shown in (A) of FIG. 17 and (D) of FIG. 19 , the mounting base 261 a is lowered by the distance adjusting portion 260 , thereby causing the cover 240 to be separated from the lower surface of the chute 220 and set to the second position. The distance Dz at this time is set to be equal to the height of the electrode formation region R exposed from the mask hole 242 . Therefore, the boundary between the electronic components C entering the chute hole 222 and the electronic components C entering the cover hole 242 is on the same plane as the lower surface of the chute 220 , and the chute 220 can move in the horizontal direction.

Then, as shown in FIGS. 17(B) and 19(E) , the base 250 on which the mask 240 is mounted is moved by the movement distance Dx in the X direction by the moving mechanism 270 . The movement distance Dx is approximately half the length of the mask hole 242 in the horizontal direction. In this way, by staggering the axis Axs of the chute hole 222 and the axis Axm of the mask hole 242, the electronic component C entering the mask hole 242 is prevented from falling, and the electronic component C entering the mask hole 242 is prevented from falling, and the electronic component C entering the mask hole 242 is prevented from falling. The bottom surface of the groove 220 is used to limit the up and down movement of the electronic component C entering the mask hole 242 .

In addition, the movement distance Dx is not limited to a distance approximately half of the length of the mask hole 242 in the horizontal direction. As long as it can prevent the electronic component C from falling from the chute hole 222 and restrict the up and down movement of the electronic component C entering the cover hole 242. In order to prevent the electronic component C from moving between the chute hole 222 and the cover hole 242, it is only necessary to The distance is sufficient to move to a position where the area of the surface where the chute hole 222 and the mask hole 242 overlap is smaller than the area of the surface F in the direction orthogonal to the axis Axc of the electronic component C.

In this state, as shown in FIGS. 18(A) and 19(F) , the guide mechanism 282 causes the movable body 283 to move above the chute 220 and then descend. As a result, the adsorption plate 284 a descends and approaches. Sections 225 of the chute 220 . Thereby, each adsorption plate 284a attracts and holds the electronic component C in each partition 225 by magnetic force. At this time, the magnetic force to be attracted not only acts on the electronic component C entering the chute hole 222 , but also acts on the electronic component C entering the mask hole 242 . However, the electronic component C entering the mask hole 242 is not adsorbed because its movement is restricted by the chute 220 . Then, the moving body 283 is raised by the guide mechanism 282, and the electronic component C is picked up from the chute 220 and removed. Thereafter, the moving body 283 moves horizontally through the guide mechanism 282 and moves horizontally above the container 211 . Furthermore, the moving body 283 descends, and the adsorption plate 284a approaches each partition 211a of the container 211 (see FIG. 4(B) and FIG. 4(A) ).

Thereafter, the holding plate 285b is raised by the contact/separation mechanism 285c, and the magnetic member 285a is separated from the support plate 284b, thereby releasing the magnetic force acting on each adsorption plate 284a. Therefore, the electronic components C adsorbed by each adsorption plate 284a fall to each partition 211a of the container 211. Furthermore, the movable body 283 is raised by the guide mechanism 282, thereby retracting the suction plate 284a from each section 211a of the container 211. In this way, the electronic component C is removed from the chute 220 .

Next, as shown in FIGS. 18(B) and 19(G) , the mounting base 261a of the pusher 261 is lowered, and the receiving base 250 on which the mask 240 is mounted is lowered to form the holding hole 292a of the rotating base 292. Maintain the third position of the platform 250. Thereby, the mask 240 with the electronic component C inserted into the mask hole 242 is supplied to the turntable 292 together with the receiving base 250 . In addition, the moving mechanism 270 returns the base 250 on which the mask 240 is placed to the initial position.

Then, the propeller 261 descends to retreat from the receiving platform 250 and the rotating platform 292 . Furthermore, by intermittently rotating the rotating table 292, the receiving table 250 held by the holding hole 292a is positioned at the supply station P2. The loading and unloading unit 360 carries the receiving table 250 positioned at the supply station P2 and on which the mask 240 holding the electronic component C is mounted, into the chamber 31 via the load lock vacuum chamber 370 . The loaded receiving table 250 is held on the rotating table 321 in a state of being mounted on the sealing body 323 .

Specifically, when the receiving table 250 on which the mask 240 holding the electronic component C is placed is loaded, as shown in FIG. 14(A) , in the chamber 31 of the film formation processing unit 3 , The sealing body 323 urged by the pusher 371 seals the lower end of the load-lock vacuum chamber 370 . Furthermore, the inside of the chamber 31 becomes a vacuum by the exhaust process of the pneumatic circuit. Furthermore, the loading and unloading part 360 positions the holders 362 provided at both ends of the arm 361 between the upper part of the load lock vacuum chamber 370 and the supply station P2.

In the supply station P2, the pusher 294 urges the receiving table 250 on which the cover 240 holding the electronic component C is placed to rise, and the receiving table 250 is pushed up to the position where it is conveyed to the loading and unloading unit 360. The raised position is transferred to the holding body 362 of the loading and unloading unit 360 . The holding body 362 holds the transferred receiving table 250 . After the receiving table 250 is transferred to the loading and unloading part 360 , the pusher 294 descends and is retracted to a retracted position below the holding hole 292 a of the turntable 292 ( FIG. 14(B) to FIG. 14(D) ).

As shown in FIG. 14(B) , by rotating the arm 361 of the loading/unloading unit 360 , the receiving table 250 is positioned at a position facing the opening of the upper part of the load lock vacuum chamber 370 . Then, as shown in FIG. 14(C) , the arm 361 is lowered, and the holding body 362 seals the upper end of the load lock vacuum chamber 370 . Thereby, the load lock vacuum chamber 370 is sealed by the sealing body 323 and the holding body 362 .

In this state, the load lock vacuum chamber 370 is depressurized to the same level as the inside of the chamber 31 by exhausting air from the exhaust line through an air pressure circuit (not shown). The holding body 362 releases the holding of the receiving table 250 and places the receiving table 250 on the sealing body 323 that seals the load lock vacuum chamber 370 . Furthermore, as shown in FIG. 14(D) , the pusher 371 is lowered, so that the receiving base 250 is mounted on the holding hole of the rotation table 321 .

In this way, the receiving table 250 on which the mask 240 holding the electronic component C is placed is moved into the chamber 31 of the film formation processing unit 3 .

As shown in FIG. 13 , the rotary table 321 transports the receiving table 250 to the preprocessing unit 33 and raises the sealing body 323 using the propeller 324 to accommodate the receiving table 250 mounted with the mask 240 in which the electronic component C is inserted. to processing chamber 331 and sealed. In the processing chamber 331 , the electrode formation region R of the electronic component C exposed from the mask hole 242 is subjected to surface treatment.

Furthermore, the rotary table 321 sequentially conveys the receiving table 250 to the film forming part 34 and the film forming part 35. In the same manner as described above, the sealing body 323 is raised by the propeller 324 to seal, and the sealing body 323 is sealed in the film forming chamber 341 and the film forming chamber. The electrode formation region R is film-formed in 351 . In this embodiment, titanium is formed into a film in the film forming section 34 , and copper is formed into a film in the film forming section 35 .

Thereafter, the rotary table 321 transports the receiving table 250 on which the mask 240 holding the film-formed electronic component C is mounted to the loading and unloading position corresponding to the load lock vacuum chamber 370, and by the operation opposite to the above-mentioned loading, The loading and unloading unit 360 carries the receiving table 250 out of the chamber 31 via the load lock vacuum chamber 370 (see (D) of FIG. 14 → (C) of FIG. 14 → (B) of FIG. 14 → (A) of FIG. 14 )). The carried-out receiving table 250 is held by the holding hole 292a of the rotation table 292 positioned at the supply station P2 of the supply device 2 . At this time, in the following description, the receiving base 250 held by the holding hole 292a is called the receiving base 250A.

Next, as shown in FIG. 21(A) , the base 250A is positioned at the base placement station P3 by the rotation table 292 . Then, as shown in FIGS. 8(A) , 8(B) , and 21(B) , the stand 250B placed in advance on the temporary stand 293 is held by the holding part 413 of the stand placement part 410 , overlapped on the mask 240 on the receiving platform 250A.

FIG. 20(A) is a diagram illustrating a state in which the base 250 is stacked on the cover 240 mounted on the base 250A via the base mounting portion 410 . As shown in FIG. 20(A) , the mask 240 is sandwiched between the pair of receiving stands 250A and 250B. The restricting portion 253 of the newly overlapped receiving platform 250B enters the restricting hole 243 of the mask 240 for positioning and prevents deviation. Furthermore, the distance between the two receiving bases 250 is defined by interfering with the restricting portion 253 of the receiving base 250A on the opposite side.

The distance between the two overlapping supports 250 is set to be the same as or slightly larger than the length of the electronic component C in the axial direction. The two bearing platforms 250 are of the same shape and size. Therefore, the protruding amount of the restricting portion 253 of each receiving base 250 is the same. Furthermore, the protrusion amount of the support portion 252 of each receiving base 250 is the same. Therefore, twice the difference in the protrusion amounts of the restricting portion 253 and the supporting portion 252 is set to be the same as or slightly larger than the length of the electronic component C in the axial direction. That is, the difference in the protrusion amount of the restricting portion 253 and the supporting portion 252 is set to be half the length that is the same as or slightly larger than the length in the axial direction of the electronic component C. Moreover, the thickness of the plate body 241 of the mask 240 is thicker than the difference in the protrusion amount of the restriction part 253 and the support part 252, and is thinner than twice the difference in the protrusion amount of the restriction part 253 and the support part 252. And it is the thickness by which the electrode formation region R of the electronic component C is exposed when it is overlapped on the support part 252 . By setting such a dimensional relationship, the restricting portion 253 of the other receiving stand 250 can be inserted into the restricting hole 243 provided in the plate body 241 of the cover 240 placed on one of the receiving stands 250 . Furthermore, even if the two overlapping holders 250 are inverted (turned over) as a whole, the electrode formation region R at the other end of the electronic component C where one end is in contact with the other holder 250 remains the same as the exposed amount before the inversion.

As shown in FIG. 9(A) and FIG. 21(C) , a pair of receiving tables 250A and 250B holding the mask 240 are positioned at the reversal station P4 by the rotating table 292 . Then, as shown in FIG. 9(B) , the pusher 295 raises the pair of receiving bases 250A and 250B holding the mask 240 so that the distance between the pusher 295 and the holding mechanism 550 becomes transportable. The pusher 295 moves upward so that the distance between the receiving base 250A and the receiving base 250B (the distance at which the pusher 295 contacts the lower receiving base 250B), that is, position h. Next, the pair of holding arms 551 of the holding mechanism 550 holds the pair of receiving stands 250A and 250B. That is, the pair of holding arms 551 moves from the open position shown in FIG. 10(A) to the holding position shown in FIG. 10(B) . Then, as shown in FIG. 9(C) , the propeller 295 moves downward so that the distance between the propeller 295 and the holding mechanism 550 becomes a distance at which the pair of receiving stands 250A and 250B can be reversed.

Next, as shown in FIGS. 9(D), 9(E), 10(C), and 21(D), the holding arm 551 is rotated 180° to move the pair of receiving bases 250A and 250A. 250B inversion. FIG. 20(B) is a diagram showing the state of the inverted mask 240 and the receiving bases 250A and 250B at this time. Due to the inversion, the mask 240 is also inverted. Therefore, as shown in FIG. 20(B) , the mask 240 descends due to its own weight and comes into contact with the lower receiving base 250 (receiving base 250B). As a result, the electrode formation region R on the opposite side to the film-formed side of the electronic component C is exposed from the upper end of the mask hole 242 .

Then, as shown in FIG. 9(F) , the distance between the pusher 295 and the holding mechanism 550 becomes a distance that can transport the receiving base 250A and the receiving base 250B (the distance at which the pusher 295 comes into contact with the lower receiving base 250B). ), that is, positioned at position h, the propeller 295 moves upward. Next, as shown in FIG. 10(D) , the pair of holding arms 551 of the holding mechanism 550 releases the pair of receiving bases 250A and 250B, and as shown in FIG. 9(G) , the pusher 295 The pair of receiving bases 250A and 250B holding the mask 240 are lowered and returned to the holding hole 292a of the rotating base 292.

As shown in (E) of FIG. 21 , a pair of receiving stands 250A and 250B holding the mask 240 are positioned at the receiving stand disassembly station P5 via the rotating table 292 . Then, as shown in FIGS. 8(C) and 21(F) , the upper receiving base 250A is held by the holding part 423 of the receiving base detaching part 420 and detached, as shown in FIG. 8(D) and FIG. 21 As shown in (G), it is moved to the temporary placement platform 293 and placed.

(C) of FIG. 20 is a diagram showing a state in which the receiving platform 250A is detached from the cover 240 mounted on the receiving platform 250B by the receiving platform detaching part 420 at this time. As shown in FIG. 20(C) , the mask 240 is mounted on the receiving base 250B which is a different receiving base from the receiving base 250A mounted before the inversion.

Furthermore, as shown in the supply station P2 of FIG. 21(F) , the receiving table 250B equipped with the inverted mask 240 is passed through the discharge station P6, the inspection station P7, and the transfer station via the rotary table 292. P1, and located at the supply station P2.

Then, at the supply station P2, as described above, the receiving table 250B mounting the inverted mask 240 is carried into the chamber 31 of the film formation processing unit 3 via the load-lock vacuum chamber 370 through the loading and unloading unit 360. within. In the chamber 31, as described above, the exposed electrode formation region R is subjected to a film formation process. That is, the film formation process is performed on the electrode formation area R at the end of the both ends of the electronic component C that is opposite to the electrode formation area R at the end where the film formation process has been completed. Thereby, the electrodes E are formed in the electrode formation regions R at both ends of the electronic component C. Thereafter, it is returned to the holding hole 292a of the turntable 292 in the supply station P2 via the load-lock vacuum chamber 370 through the loading and unloading unit 360 .

Furthermore, the rotating table 292 causes the receiving table 250B, which is mounted with the mask 240 holding the electronic component C that has been film-formed to hold the pair of electrode formation regions R at both ends, to pass through the receiving table placement station while being intermittently rotated. P3, reversal station P4, receiving platform disassembly station P5, and positioned at the discharge station P6.

At the discharge station P6, the electronic components C are discharged from the mask 240 through the discharge mechanism 600. That is, as shown in FIG. 11(B) , the moving body 603 of the pickup mechanism 601 waits at the discharge station P6. The magnetic member 605a is brought into contact with the support plate 604b by the contact/separation mechanism 605c, so that the adsorption force due to the magnetic force acts on the adsorption plate 604a. In this state, the cover 240 is raised together with the receiving platform 250B by the pusher 261 at the discharge station P6 and approaches the adsorption plate 604a. Thereby, each adsorption plate 604a attracts and holds the plurality of electronic components C by magnetic force.

Then, the mask 240 is lowered by the propeller 261 and returned to the rotating table 292, thereby picking up the electronic component C from the mask 240. As the cover 240 descends, the moving body 603 starts horizontal movement without changing its height through the guide mechanism 602 . At this time, in order that the electronic components C held by the suction plate 604 a can pass through without colliding, the upper surface of the recovery container 610 is at approximately the same height as the upper surface of the stage 292 . In this way, when the electronic components C are ejected, the time required to raise the movable body 603 to pick up the electronic components C is no longer required, and the takt time is suppressed. Furthermore, by returning the mask 240 to the turntable 292 while performing this pickup operation, the turntable 292 can move to the next rotation operation, so there is no need to wait for the operation of collecting the moving body 603 into the recovery container 610 .

As shown in FIG. 11(C) , the moving body 603 stops above the recovery container 610 and then descends to enter the recovery container 601 . The adsorption plate 604 a stops at a position close to the bottom of the recovery container 610 . The holding plate 605b is raised by the contact/separation mechanism 605c, and the magnetic force acting on each adsorption plate 604a is released, so that the electronic component C adsorbed by each adsorption plate 604a falls into the recovery container 610. In this way, the electronic parts C are released at a position close to the bottom of the recycling container 610, thereby reducing damage to the electronic parts C. The mobile body 603 that has released the electronic component C rises, moves horizontally above the discharge station P6, and waits. At the same time that the moving body 603 returns to the discharge station P6, the mask 240 can be moved to the discharge station P6 by the rotary table 292, so no unnecessary waiting time is required.

Next, the receiving table 250B equipped with the mask 240 is positioned at the inspection station P7 through the rotating table 292 . At the inspection station P7, as shown in FIGS. 12(A) and 12(B) , the imaging unit 720 of the detection mechanism 700 photographs the mask 240 . When the control device 4 can extract the electronic component C from the image, the electronic component C remains, the device is stopped, and the operator takes out the electronic component C. Furthermore, the operator may recognize the presence or absence of the electronic component C based on the image displayed on the display device. When the electronic component C does not remain, the rotary table 292 positions the receiving table 250B at the transfer station P1. Thereafter, in the same manner as described above, the electronic component C is transferred to the chute 220 by the transfer mechanism 280 . In addition, when the processing state in each part of the turntable 292 is a state in which the turntable 292 can rotate, the turntable 292 can be reversed, so that the electrons considered to be remaining during the inspection can be discharged again by the discharge mechanism 600 at the discharge station P6. Part C is discharged.

[Effect] (1) This embodiment is a supply device 2 that supplies electronic components C to the film formation processing section 3 of the film formation apparatus 1 that forms a film of electronic components C. The supply device 2 includes a mask 240, It has a mask hole 242 covering a part of the electronic component C, so that the electronic component C is inserted into the mask hole 242 and supplied to the film forming processing unit 3 while being held; the first receiving table 250 holds one side of the mask 240 , and one end of the electronic component C that penetrates the mask hole 242 is in contact with it; the second receiving platform 250 holds the other side of the mask 240, and the other end of the electronic component C that penetrates the mask hole 242 is in contact with it; and a reversing mechanism 500, reverse the mask 240 in a state where the mask 240 is sandwiched between the first receiving platform 250 and the second supporting platform 250.

The film forming apparatus 1 of this embodiment includes a supply device 2 and a film forming processing unit 3 that forms a film on the electronic component C.

Therefore, it is possible to provide the supply device 2, the film forming device 1, and the holding member H that can expose a part of a large number of electronic components C for film formation with a simple mechanism. Specifically, the protruding length of the head portion of the electrode formation region R from the mask hole 242 at the upper end of the electronic component C can be defined by the receiving base 250 in contact with the lower end of the electronic component C. Therefore, it is easy to adjust with a simple mechanism. Location. This is effective when part of a large number of electronic components C are uniformly exposed from the mask 240 for film formation. Furthermore, by clamping and inverting the mask 240 using the receiving base 250, it is possible to switch which end of the electronic component C the electrode formation region R is to protrude without replacing the electronic component C in the mask hole 242. Therefore, film formation on both ends of the electronic component C becomes easy. Furthermore, since the film-formed surface of the electronic component C is not extruded and the opposite surface protrudes, it is possible to prevent the film-formed surface of the electronic component C from being damaged when replacing the electronic component C.

(2) The first receiving platform 250 and the second receiving platform 250 have the same shape. Therefore, there is no need to distinguish between the upper receiving platform 250 and the lower receiving platform 250, and there is no need to prepare different receiving platforms 250. Therefore, the receiving platforms 250 can be placed in a common position, thereby suppressing the expansion of the installation area of the device and the receiving Management of the Taiwan 250 also becomes easy. In particular, the upper surface of the receiving table 250 is covered by the mask 240 during film formation, so there is little adhesion of the film forming material, and there is no need to distinguish between used and unused.

(3) When the mask 240 is reversed, the distance between the first receiving platform 250 and the second receiving platform 250 that is in contact with the electronic component C is the same as or slightly larger than the length of the electronic component C in the axis Axc direction. . Therefore, not only the lower end but also the upper end of the film-formed electronic component C can be brought into contact with the receiving base 250 or be reversed with a slight gap. Therefore, the upper end can be prevented from strongly colliding with the receiving base 250 during the reversal. It can prevent friction or damage to the film-forming surface due to collision.

(4) The first receiving base 250 and the second receiving base 250 include a restricting portion 253 that is in contact with each other with the cover 240 sandwiched between them, thereby regulating the distance between the positions in contact with the electronic component C. Restrictions (regulations). Therefore, the first supporting platform 250 and the second supporting platform 250 and the cover 240 can be positioned to prevent deviation. Furthermore, there is no need to adjust the distance between the first receiving platform 250 and the second receiving platform 250 . By overlapping each other to form a certain distance, the distance can be maintained during movement. In addition, if the interval restricted by the restricting portion 253 is larger than the length of the electronic component C in the axis Axc direction, the electronic component C will not come into contact with the receiving base 250 , so damage due to friction will be small.

(5) The restriction portions 253 of the first receiving platform 250 and the second receiving platform 250 are provided to protrude from the mutually facing surfaces of the first receiving platform 250 and the second receiving platform 250 , and have the same height. Therefore, a pair of receiving stands 250 including the restricting portions 253 having the same protruding amount can be used as the first receiving stand 250 and the second receiving stand 250 by being reversed.

(6) The supply device 2 includes: a temporary platform 293 to temporarily place the first receiving platform 250 or the second supporting platform 250; and a supporting platform moving mechanism 400 to move the first supporting platform 250 or the second supporting platform 250 from the temporary supporting platform. 293 moves to the inverted mask 240 and overlaps it. After the inversion, the upper one of the first receiving base 250 and the second receiving base 250 is moved to the temporary holding base 293 .

Therefore, by handling the new support stand 250 and the old support stand 250 via the common temporary stand 293, the movement path of the support stand 250 can be shortened, and operations related to reversal can be performed efficiently. In addition, in this embodiment, the temporary stand 293 is disposed in the center of the turntable 292 to prevent the space from expanding.

(7) The holding member H of this embodiment holds the electronic component C in order to form a film on a part of the electronic component C by sputtering. The holding member H includes a mask 240 and has a plurality of masks 240 covering a part of the electronic component C. The mask hole 242 allows the electronic component C to penetrate through the mask hole 242 and hold it; and the receiving platform 250 holds the mask 240 so that the end of the electronic component C penetrating the mask hole 242 contacts it. The mask hole 242 is an electronic component. The inner diameter through which part C can pass, the length in the axis Axm direction is the same as the length of the non-sputtering area of electronic part C.

Therefore, by inserting the electronic component C into the mask hole 242 and bringing the end portion of the electronic component C into contact with the receiving base 250 holding the mask 240, the electronic component C can be held in the mask hole 242 and the electronic component C can be held in the mask hole 242. The height is set to a certain value. Furthermore, since the length of the mask hole 242 in the axis Axm direction is the same as the length of the electronic component C other than the electrode formation area R in the axis Axc direction, the electrode formation area R of the electronic component C is exposed to the head outside the mask hole 242 It becomes easy to expose the whole body. Thereby, a large number of electronic components C can be exposed at the same time using a simple mechanism.

[Modification] This embodiment also considers modifications such as the following.

(1) The receiving platform 250 may not include the supporting part 252 and may be a flat surface. Furthermore, the cover 240 may include only the plate body 241 without including the beam portion 244, and may be a flat surface. The receiving platform 250 and the cover 240 can be fixed or integrated.

The restriction part 253 may be a member such as a pin as described above, or may be a wall surrounding the cover 240 . Furthermore, the restriction part 253 may be omitted and the distance between the receiving bases 250 may be restricted by the electronic component C. In this case, the other receiving base 250 is placed on one of the receiving bases 250 and is inverted, so that the receiving base 250 is supported by both ends of the electronic component C. Since there is no need to provide the restricting portion 253, the structure can be simplified.

(2) In the above-mentioned form, the platform moving mechanism 400 includes two platforms: the platform placement portion 410 and the platform detachment portion 420 . However, the platform moving mechanism 400 may also be configured to move the platform from the temporary platform 293 . The stage 250 is a device for moving the receiving stage 250 on the mask 240 to the temporary holding stage 293 .

(3) In the above-described form, permanent magnets are used as the magnetic members 285a and 605a of the attraction force imparting portion 285 and the attraction force imparting portion 605, but electromagnets may also be used. In this case, there is no need to provide a mechanism for connecting/separating the magnetic member 285a and the magnetic member 605a, and the presence or absence of the attraction force due to the magnetic force can be switched by switching the current. Furthermore, even if the magnetic member 285a is an electromagnet, it may be combined with a mechanism for connecting/separating the magnetic member 285a and the magnetic member 605a. In this case, the influence of the magnetic force can be reliably blocked by the mechanism for connecting/separating the magnetic members 285a, and even the small and lightweight electronic component C can be reliably released from the adsorption hold.

(4) The suction unit may include a suction port that holds the electronic component C by negative pressure suction, and a suction piping that supplies negative pressure to the suction port. In this case, the suction force imparting unit is a negative pressure generating circuit that applies suction force by negative pressure, and is connected to the suction pipe. Accordingly, even electronic components C of materials or shapes that are difficult to be attracted by magnetic force can be adsorbed and held by negative pressure, and the adsorption can be released by stopping the negative pressure, so that the electronic components C can be supplied. The opening area of the suction port is set to be equal to or less than the smallest surface area of the electronic component C. The suction port may be a large number of holes formed in the adsorption plate, or the suction port may be covered with a breathable porous material. Thereby, the suction opening can be narrowed, and the electronic component C can be suppressed from being sucked into the suction pipe.

(5) The moving mechanism 270 only needs to move the cover 240 and the receiving platform 250 relative to the chute 220 . In the present embodiment, the moving mechanism 270 is provided in the interval adjusting portion 260 to move the cover 240 and the receiving base 250. However, the moving mechanism 270 may also be configured to move the chute 220. In this case, the chute 220 is relatively movably supported by the vibration table 231 of the vibration mechanism 230 . Furthermore, the moving mechanism 270 is provided between the vibrating table 231 and the chute 220 . The moving mechanism 270 may use a cylinder, for example, to move the chute 220 in the X direction by moving the chute 220 relative to the vibrating table 231 . Therefore, the chute 220 can be configured to move relative to the cover 240 .

(6) The film forming processing unit 3 is not limited to a device that forms a film by sputtering. The electrode E may be formed by applying a conductive material to the electrode formation region R exposed from the mask hole 242 of the mask 240 , or the electrode E may be formed by immersing the electrode formation region R in the conductive material. device.

(7) There only needs to be at least one partition 225 of the chute 220 . That is, it may be one or multiple. There only needs to be at least one partition 245 of the mask 240 and a partition 211a of the receiving portion 210 . That is, it may be one or multiple.

(8) The electrode formation region R may be a region of at least one end of the electronic component C as long as it is a region on the outer surface of the electronic component C that is electrically connected to the internal electrode En. For example, the electrode formation region R may be a region at both ends or only one end of the electronic component C in the axis Axc direction. That is, the film formation processing unit 3 only needs to be capable of forming a film on at least one end of the electronic component C.

Moreover, the electrode formation region R only needs to be a part of the electronic component C. For example, it may be a box-shaped region including the surface F in the axis Axc direction of the electronic component C, or it may be only the surface F in the axis Axc direction of the electronic component C. (Refer to Fig. 1 (A) to Fig. 1 (C)). That is, the mask hole 242 only needs to cover a part of the electronic component C, and particularly includes a form of covering part or all of the side surface (the surface along the axis Axc) of the electronic component C. When the mask hole 242 covers the entire side surface of the electronic component C, the electronic component C is held by the mask hole 242 in a state where only the surface F in the direction orthogonal to the axis Axc is exposed.

(9) In the above embodiment, during the reversal in FIG. 9(E) , the propeller 295 is retracted so that the distance between the propeller 295 and the holding mechanism 550 becomes a reversible distance ( The description has been made of the case where the retractor moves downward) to a position below the position h, but the retraction position may also be below the turntable 292 . Even during the reversing operation, the rotary table 292 can be rotated as necessary. Of course, if the above-mentioned need is not assumed, as shown in FIGS. 9(A) to 9(G) , the retraction position can be made as close as possible to the holding mechanism 550 . This can shorten the reception time. Furthermore, a lifting mechanism may be provided in the reversing mechanism 500 to retract (raise) the holding mechanism 550 to a position above the position h. In this case, during the period from (C) to (F) of FIG. 9 , the propeller 295 stays at the position h, the holding mechanism 550 rises in (C) of FIG. 9 , and (F) of FIG. 9 medium decline. Furthermore, the propeller 295 and the reversal mechanism 500 may be cooperated to form a distance required for reversal. This can shorten the time required for reversal.

[Other embodiments] The embodiments and modifications of each part of the present invention have been described above. However, the embodiments and modifications of each part are presented as examples and are not intended to limit the scope of the invention. The novel embodiments described above can be implemented in various other forms, and various omissions, substitutions, combinations, and changes can be made without departing from the spirit of the invention. These embodiments or modifications thereof are included in the scope or gist of the invention, and are also included in the invention described in the claims.

1: Film forming device 2: Supply device 2a: Shell 3: Film forming processing department 4:Control device 31: Chamber 32:Transportation Department 33: Preprocessing Department 34, 35: Film forming department 210: Containment Department 211:Container 211a, 225, 245: Partition 211b: Inclined surface 212, 510: Support platform 212a:Feet 220:Chute 221, 241, 251: plate body 222:Chute hole 223: partition wall 230:Vibration mechanism 231:Shaking table 231b:Containment hole 232:Abutment 240:Mask 242: Mask hole 243:Restricted hole 244:Liangbu 250, 250A, 250B: receiving platform 252, 261c: Support part 253:Restriction Department 260: Interval adjustment part 261, 294, 295, 296, 324, 371: thruster 261a: Carrying platform 261b, 551a, Axc, Axm, Axs: axis 261d: guide 261e: Movable body 262, 322, 520: drive source 270:Mobile mechanism 280:Transfer mechanism 281, 601: Picking mechanism 282, 602: Guidance mechanism 283, 603: Moving body 284, 604: Adsorption department 284a, 604a: adsorption plate 284b, 604b: Support plate 284c, 293a, 411, 421, 604c: Pillars 285, 605: Adsorption force imparting part 285a, 605a: Magnetic components 285b, 605b: retaining plate 285c, 605c: connection/separation mechanism 286, 606: Pillar Department 287, 607: Arm 288, 608: Guidance Department 290:Transportation mechanism 291:Motor 291a, 530: Rotation axis 292, 321: Rotary table 292a: Retaining hole 293: Temporary setting 311:Exhaust part 323:Sealed body 331:Processing room 341, 351: Film forming room 342, 352: target 360: Moving in and out department 361, 412, 422: arm 362:Maintenance body 370:Loading Interlock Vacuum Chamber 400: Bearing table moving mechanism 410: Bearing platform mounting part 413, 423: Maintenance Department 420: Bearing platform disassembly part 500:Reversal mechanism 540:Conduction Department 550: Maintain agency 551:Retaining arm 552:Drive Department 600: Discharge mechanism 610:Recycling container 700:Testing agency 710:Supporting frame 720:Photography Department C: Electronic parts Dx: moving distance Dz: interval E:Electrode En: internal electrode F: noodles H: keep component h: position P1: Transfer position P2: supply position P3: Bearing platform mounting position P4: reverse position P5: Bearing platform disassembly position P6: Discharge position P7: Check location R: electrode formation area X, Y, Z: direction

1 is a perspective view (A), a cross-sectional view (B), and a perspective view (C) showing a state in which the electronic component to be supplied in the embodiment has entered the mask hole. FIG. 2 is a partial perspective plane showing the structure of the film forming apparatus according to the embodiment. 3 is a plan view (A) and a partially cross-sectional side view (B) showing the supply device according to the embodiment. 4 is a partial cross-sectional side view (A) showing the electronic components of FIGS. 3(A) and 3(B) when being accommodated, and a partial cross-sectional side view (B) showing the time of supplying the electronic components. 5 is a plan view (A) and an A-A arrow cross-sectional view (B) showing the chute. 6 is a plan view (A) and a B-B arrow cross-sectional view (B) showing the mask. 7 is a plan view (A) showing the receiving platform and a C-C arrow cross-sectional view (B). Figure 8 shows a state (A) in which the platform is held on a temporary stand by the platform placement unit, a state in which the held platform is placed on the platform in the platform placement station (B), and a state in which the platform is placed on the temporary platform (B). Partial cross-sectional side view of a state (C) in which the table disassembly section has disassembled the upper receiving table in the receiving table disassembly station, and a state (D) in which the disassembled receiving table is placed on the temporary stand. Figure 9 shows the standby state of the reversal mechanism (A), the state in which the receiving platform is transferred from the propeller to the reversing mechanism (B), the retracted state of the propeller (C), and the state in which the receiving platform is in reverse rotation (D ), partial cross-sectional side view of the state in which the reversal is completed (E), the state in which the receiving platform is transferred from the reversing mechanism to the thruster (F), and the state in which the thruster places the receiving platform on the rotating table (G). 10 is a plan view showing the released state (A), the holding state (B), the reversed state (C), and the released state (D) of the receiving platform using the reversing mechanism. 11 is a plan view showing a standby state (A) of the ejection mechanism, a partial cross-sectional side view (B) showing an adsorption state of electronic components, and a partial cross-sectional side view (C) showing a release state of electronic components. Fig. 12 is a plan view (A) and a partially cross-sectional side view (B) showing the inspection device. FIG. 13 shows a cross-sectional view of the preprocessing section and the film forming section of the film forming apparatus. 14(A) to 14(D) are explanatory diagrams illustrating the operation of loading and unloading electronic components into and out of the film forming unit via the load-lock vacuum chamber using the loading and unloading unit. 15 is a cross-sectional view showing a standby state (A) of the mask and a state (B) in which the mask is mounted on the chute. 16 is a cross-sectional view showing a state (A) in which the suction portion is positioned on the cover and a state (B) in which the electronic components are dropped. 17 is a cross-sectional view showing a state (A) in which the mask is separated from the chute and a state (B) in which the chute is moved in the horizontal direction. 18 is a cross-sectional view showing a state (A) in which excess electronic components are adsorbed and a state (B) in which the pusher is lowered and the receiving base 250 is held in the holding hole. 19(A) to 19(G) are explanatory diagrams showing the procedure of supplying electronic components to the mask. 20(A) to 20(C) are explanatory diagrams showing the procedure of inverting the mask. 21(A) to 21(H) are explanatory diagrams illustrating the procedure of mounting and removing the receiving platform.

1: Film forming device

2: Supply device

2a: Shell

3: Film forming processing department

4:Control device

31: Chamber

33: Preprocessing Department

34, 35: Film forming department

210: Containment Department

211:Container

212:Support platform

220:Chute

230:Vibration mechanism

231:Shaking table

280:Transfer mechanism

281:Pick-up mechanism

282: Guidance mechanism

290:Transportation mechanism

292, 321: Rotary table

292a: Retaining hole

293: Temporary setting

360: Moving in and out department

361:arm

362:Maintenance body

370:Loading Interlock Vacuum Chamber

400: Bearing table moving mechanism

410: Bearing platform mounting part

420: Bearing platform disassembly part

500:Reversal mechanism

600: Discharge mechanism

610:Recycling container

700:Testing agency

P1: Transfer position

P2: supply position

P3: Bearing platform mounting position

P4: reverse position

P5: Bearing platform disassembly position

P6: Discharge position

P7: Check location

X, Y, Z: direction

Claims (7)

A supply device that supplies electronic components to a film-forming processing section of a film-forming device that forms a film on electronic components, and includes: A mask having a mask hole that covers a part of the electronic component, so that the electronic component is supplied to the film forming processing section in a state where the electronic component penetrates the mask hole and is retained; A first receiving platform holds one side of the mask and contacts one end of the electronic component that penetrates the mask hole; A second support platform holds the other side of the mask and contacts the other end of the electronic component that penetrates the mask hole; and A reversal mechanism reverses the mask in a state where the mask is sandwiched between the first receiving base and the second receiving base. The supply device according to claim 1, wherein The first supporting platform and the second supporting platform have the same shape. The supply device according to claim 1, wherein The first receiving base and the second receiving base include restricting portions that are in contact with each other in a state of sandwiching the cover, thereby defining a distance between positions in contact with the electronic components. The supply device according to claim 3, wherein The restriction portions of the first receiving platform and the second receiving platform are provided to protrude from the mutually facing surfaces of the first receiving platform and the second receiving platform, and have the same height. The supply device as described in claim 1 includes: a temporary platform to temporarily place the first supporting platform or the second supporting platform; and The receiving platform moving mechanism moves the first supporting platform or the second supporting platform from the temporary platform to the inverted cover and overlaps it. After the inversion, the first supporting platform and the The upper part of the second receiving platform is moved to the temporary setting platform. A film forming device including: The supply device according to any one of claims 1 to 5; and The film forming processing unit forms a film on the electronic component. A holding member for holding an electronic component to form a film on a part of the electronic component by sputtering, and includes: A mask having a plurality of mask holes covering a part of the electronic component so that the electronic component penetrates and retains the mask hole; and a receiving platform that holds the mask and has the end of the electronic component penetrating the mask hole in contact with it, The mask hole is an inner diameter through which the electronic component can pass, and the length in the axial direction is the same as the length of the non-sputtering area of the electronic component.