TWI823679B - Supply device and film forming device - Google Patents

Abstract

The present invention provides a supply device and a film forming device that suppress the supply of electronic components exceeding a predetermined amount. The supply device (2) of the embodiment has: a chute (220) having a plurality of chute holes (222) through which electronic components (C) can pass one by one; a mask (240) having an overlapping chute (220), and a cover hole (242) for electronic components (C) to be inserted through the chute hole (222) to cover a part of the electronic components (C); a receiving portion (210) to accommodate multiple electronic components (C); and transfer The mechanism (280) transfers electronic components (C) between the receiving part (210) and the chute (220). The transfer mechanism (280) has: a moving body (283), between the receiving part (210) and the chute (220). (220); and the adsorption part (284) is provided on the moving body (283), corresponding to the area in the chute (220) where the electronic component (C) is supplied, and exerts adsorption in the planarly expanded area. The electronic components are attracted by the force (C), and the electronic components are released by releasing the adsorption force (C).

Description

Supply device and film forming device

The present invention relates to a supply device and a film forming device.

Currently, as wafer-shaped electronic components used in various electronic circuits, electronic components having external electrodes formed on both ends are very common. For example, a chip capacitor is formed by dividing a block obtained by laminating dielectric sheets on which internal electrodes are formed into individual rectangular parallelepiped-shaped pieces. Furthermore, external electrodes are formed by a conductive material covering both side surfaces of this rectangular parallelepiped element and connected to the internal electrodes.

As a method of forming an external electrode, as shown in Patent Document 1, the following steps are performed: one end of the electronic component is exposed, and the other end is inserted into a through hole of the tape to cover the exposed portion and attach the exposed portion. Slurry of conductive materials. In this case, a certain amount of electronic components is put into a hopper and supplied from the supply port to the guide hole of the guide plate, and the posture is changed in the guide hole. Then, by moving the guide plate, the guide hole is aligned with the through hole of the belt body, the electronic component in the guide hole is pushed, and the electronic component is inserted into the through hole of the belt body.

As a method of supplying a certain amount of such electronic components to the guide plate, the following method is considered. (1) Measure the total mass of multiple electronic parts, adjust and supply them so that they have a constant mass (2) Measure the total volume of multiple electronic components, adjust and supply them so that they become a constant volume (3) Supply each set of multiple electronic parts dropped from the funnel-shaped container within a certain period of time [Prior art documents] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. 09-22846

[Problem to be solved by the invention] However, the method (1) requires a measuring mechanism for mass, the method (2) requires a measuring mechanism for volume, and the method (3) requires a measuring mechanism for time. Furthermore, these methods require measurement results based on each measuring mechanism. The agency that stops the supply. Furthermore, the method (3) also has a mechanical problem of clogging of the funnel.

Moreover, the methods (1) to (3) can supply a certain amount of electronic components. However, it is difficult to distribute the supplied electronic components uniformly throughout the supply port and the guide hole. For example, if an excessive amount of electronic components is supplied into the hopper, a gap cannot be formed to change the posture, and the probability of entering the supply port and the guide hole is reduced. Furthermore, even if electronic parts are supplied locally and concentrated, the probability of entering the supply port and guide hole is reduced. That is, it is necessary to supply electronic components uniformly throughout the entire hopper without excessive or insufficient supply, but this method is difficult.

The present invention has been proposed in order to solve the above-described problems of the prior art, and an object thereof is to provide a supply device and a film forming device that can uniformly supply a fixed amount of electronic components with a simple mechanism. [Technical means to solve problems]

In order to achieve the above object, a supply device of an embodiment has: a chute having a plurality of chute holes through which electronic components can pass one by one; and a cover having a chute overlapping the chute and allowing the electronic components to pass through the chute. The slot hole is inserted into a mask hole that covers a part of the electronic components; a receiving portion is used to store a plurality of the electronic components; and a transfer mechanism is used to transfer the electronic components between the receiving portion and the chute. , the transfer mechanism has: a moving body that moves between the accommodating part and the chute; and an adsorption part provided on the moving body corresponding to the electronic parts supplied in the chute. The electronic components are adsorbed by exerting an adsorption force in a planarly expanded area, and the electronic components are released by releasing the adsorption force.

Furthermore, the film forming apparatus of the embodiment includes the supply device and a film forming processing unit that forms a film on the electronic component. [Effects of the invention]

According to the present invention, it is possible to provide a supply device and a film forming device that can uniformly supply a fixed amount of electronic components with a simple mechanism.

An embodiment of the present invention (hereinafter referred to as the present embodiment) will be specifically described with reference to the drawings.

[Electronic parts] As shown in FIG. 1(A) , the electronic component C formed into a film according to this embodiment is a wafer-shaped electronic component C in which electrodes E using a conductive material are formed at both ends. In this way, the electronic component C has one end and the other end forming the electrode E. For example, components such as capacitors, resistors, coils, and inductors are included in the electronic component C. The electronic component C has an outer shape of a rectangular parallelepiped, a cube, or a thin plate, and electrodes E are formed in close contact with each other so as to cover a region including a pair of opposite side surfaces in a box shape. The area where the electrode E is formed is referred to as an electrode formation area R.

FIG. 1(B) is a cross-sectional view of a multilayer ceramic capacitor obtained by laminating dielectric sheets on which internal electrodes En are formed as the electronic component C. The pair of electrodes E formed on the outer surface of the electronic component C has a multilayer structure in which a plurality of layers of conductive materials are overlapped, and is electrically connected to the internal electrode En of the electronic component C. In this embodiment, copper (Cu) as a seed layer of the electrode E is formed on titanium (Ti) as a base layer for improving adhesion. Subsequently, using the seed crystal layer as a seed crystal, copper (Cu) is adhered to the electrode formation region R by electrolytic plating, thereby completing the electronic component C in which the electrode E is formed. Since the base layer and the seed layer also become part of the electrode E, in the following description of this embodiment, the film formation of these layers is also expressed as "forming the electrode E."

In addition, in the following description, the straight line passing through the center of a pair of both side surfaces covered by the electrode E will be called the axis Axc of the electronic component C. In this embodiment, for example, as the electronic component C, the length in the axis Axc direction is 0.6 mm, the length of the electrode E in the axis Axc direction is 0.2 mm, and the cross section orthogonal to the axis Axc of the electrode E is 0.3 mm × 0.3 mm rectangular size is very small electronic parts as objects. Among them, the present invention can be applied to electronic components C that are smaller than this or larger than this.

[summary] As shown in FIG. 2 , the film forming apparatus 1 of this embodiment includes a supply device 2 , a film forming processing unit 3 , and a control device 4 . As shown in FIG. 1(C) , the supply device 2 inserts the electronic component C into the mask hole 242 and supplies the electronic component C to the film formation processing unit 3 in a state where the area other than one of the electrode formation areas R is masked. The film formation processing unit 3 forms a film of electrode material in the electrode formation region R that is not blocked but exposed. In addition, in the following description, the horizontal arrangement direction of the supply device 2 and the film forming processing unit 3 is referred to as the X direction, the horizontal direction orthogonal thereto is referred to as the Y direction, and the vertical direction is referred to as the Z direction. The electronic component C is inserted into the mask hole 242 with the axis Axc along the Z direction. In addition, as will be described later, the mask hole 242 is provided in the mask 240 .

[Supply device] As shown in FIG. 3(A), FIG. 3(B), FIG. 4(A), and FIG. 4(B), the supply device 2 has a receiving part 210, a chute 220, a vibration mechanism 230, and a cover 240. , receiving platform 250, distance adjustment part 260, moving mechanism 270, transfer mechanism 280, and conveying mechanism 290.

(Containment Department) The accommodating part 210 stores a plurality of electronic components C before the electrodes E are formed, that is, before film formation. The accommodating part 210 has a container 211 and a support base 212. The container 211 is a box-shaped body with an open top, and a plurality of partitions 211a serving as recesses are provided on the horizontal inner bottom. The plurality of partitions 211a are arranged in a matrix, and each partition 211a accommodates a plurality of electronic components C put in advance. A part of the inner surface of the container 211 has a structure such that it becomes an inclined surface 211b inclined toward the inner bottom, and the electronic component C inserted from the upper edge of the container 211 slides down toward the inner bottom. The support base 212 is a base that supports the container 211 in the horizontal direction. As shown in FIG. 3(B) , the support base 212 is installed on the installation surface of the supply device 2 via four legs 212 a.

(Chute) The chute 220 guides the plurality of electronic components C transferred from the accommodating part 210 to each of the plurality of mask holes 242 . As shown in FIGS. 5(A) and 5(B) , the chute 220 has a plate body 221 , a chute hole 222 , and a partition wall 223 . The plate body 221 is a rectangular plate-shaped body. The chute holes 222 are a plurality of holes through which the electronic components C can pass one by one. Each chute hole 222 penetrates in a direction orthogonal to the surface of the plate body 221 and guides the passing electronic component C to the mask hole 242 . The chute hole 222 has a quadrangular frustum shape that expands toward the side into which the electronic component C is inserted, that is, the upper end side, so that the electronic component C can easily enter. In addition, let a straight line in the Z direction passing through the center of the chute hole 222 be the axis Axs.

The partition walls 223 are erected on the surface of the plate body 221 in a grid shape. A plurality of rectangular areas surrounded by partition walls 223 constitute a plurality of partitions 225 arranged in a matrix. A plurality of chute holes 222 are formed in each partition 225 in a matrix shape. That is, the partition wall 223 includes a plurality of chute holes 222 and forms a partition 225 into which the electronic components C are supplied. The position of each partition 225 corresponds to the position of each partition 211a of the storage unit 210 one-to-one.

Since the inside of the chute 220 is divided into a plurality of partitions 225 by the partition wall 223, when the electronic components C are guided to the mask hole 242, as will be described later, even if the chute 220 vibrates, the electronic components supplied to each partition 225 C will also be prevented from moving to other partitions 225 by the partition wall 223 and entering the chute hole 222 in each partition 225. Therefore, when the chute 220 vibrates, the electronic components C can be prevented from moving to other areas and becoming unevenly distributed.

Furthermore, since a large amount of electronic components C are supplied and arranged at one time, the plate body 221 of the chute 220 has a large area, and deflection, bending, and strain may occur. If deflection, bending, or strain occurs, the electronic components C tend to move to a specific portion of the plate body 221 and cannot be uniformly supplied to the mask holes 242 . Since the partition walls 223 are provided throughout the area of the plate body 221 where the electronic components C are supplied, they function as beams to increase the strength of the plate body 221 and prevent deflection, bending, and strain.

Furthermore, the position of each partition 225 of the chute 220 corresponds to the position of each partition 211a of the receiving part 210 one-to-one. Furthermore, by quantitatively allocating and storing a plurality of electronic components C in each partition 211a of the storage part 210 in advance, the stored electronic components C are attracted according to each partition 211a and moved to the corresponding partition 225 of the chute 220, so that the electronic components C can be stored in the chute 220 Evenly distribute multiple electronic parts C within the plane.

(vibration mechanism) The vibration mechanism 230 vibrates the chute 220 or the cover 240 described below, thereby promoting the insertion of the electronic component C into the cover hole 242 . As shown in FIGS. 3(A) and 3(B) , the vibration mechanism 230 has a vibration table 231 and a base 232 . The vibration table 231 is a horizontal plate-shaped body. The base 232 is provided on the installation surface of the supply device 2 and supports the vibration table 231 at a position shifted in the X direction from the chute 220 . That is, they are arranged in line with the conveyance mechanism 290 described below. Furthermore, the vibration table 231 supports the other end of the vibration table 231 on the base 232 so that one end thereof overlaps the mask 240 transported by the transport mechanism 290 in a plan view. The portion of the vibrating table 231 that overlaps the mask 240 transported by the transport mechanism 290 in plan view is provided with a receiving hole 231 b into which the mask 240 and a receiving base 250 described below are inserted. The chute 220 is supported on the vibration table 231 in the horizontal direction so as to be located at the upper part of the receiving hole 231b.

The vibrating table 231 is installed in a vibrable state by operating the oscillating body built in the base 232 . Thereby, the chute 220 supported by the vibration table 231 vibrates together with the vibration table 231. Furthermore, the vibration is transmitted to the cover 240 and the receiving platform 250 that are in contact with the chute 220, and vibrates. As the oscillator, for example, an electromagnetic coil, a motor, or a piezoelectric element is used. The vibration direction and vibration intensity can be set appropriately.

(mask) As shown in FIGS. 6(A) and 6(B) , the mask 240 has a plate body 241 , a mask hole 242 , a restriction hole 243 , and a beam part 244 . The plate body 241 is a circular plate-shaped member. The mask holes 242 are a plurality of holes in which the electronic components C are inserted one by one through the chute holes 222 overlapping the chute 220 of the mask 240 and cover a part of the electronic components C. Each mask hole 242 is penetrating in a direction orthogonal to the surface of the plate body 241 and has a rectangular prism shape in which the axis Axc of the inserted electronic component C is aligned in the vertical direction. Let a straight line in the vertical direction pass through the center of the mask hole 242 be an axis Axm. The length of the mask hole 242 in the axis Axm direction is shorter than the length of the electronic component C in the axis Axc direction. More specifically, the length of the mask hole 242 in the axis Axm direction is the same as the length in the axis Axc direction of the electronic component C except for one of the electrode formation regions R. That is, the length of the mask hole 242 in the axis Axm direction is the same as the length of the non-sputtered region of the electronic component C in the axis Axc direction (see (C) of FIG. 1 ).

The size of the cross section orthogonal to the axis Axm of the mask hole 242 may be such that the axis Axc becomes vertical when the electronic component C is dropped due to its own weight and inserted. That is, the inner diameter of the mask hole 242 has an inner diameter through which the electronic component C can pass, and the cross section orthogonal to the axis Axm of the mask hole 242 is slightly larger than the cross section orthogonal to the axis Axc of the electronic component C and smaller than the resulting axis Axc The size of the insertion is tilted relative to the vertical direction. But set it larger than the size that needs to be pressed.

Furthermore, when the electrode E is formed by sputtering to be described later, the size of the cross section orthogonal to the axis Axm of the mask hole 242 is preferably smaller than the gap formed between the mask hole 242 and the electronic component C by the film-forming material. Enter the size.

The mask hole 242 of this embodiment contacts the receiving base 250 with the lower end of the inserted electronic component C, thereby covering the other areas with only the electrode formation area R on the upper end side exposed (see (C) of FIG. 1 ). A plurality of mask holes 242 are provided in a matrix shape in each of the plurality of partitions 245 arranged in a matrix shape. The position of each partition 245 is consistent with the position of the partition 225 of the overlapping chute 220. The position of the mask hole 242 in each partition 245 is consistent with the position of the chute hole 222 of each partition 225. That is, the axis Axm of the mask hole 242 coincides with the axis Axs of the chute hole 222 , and the opening of the lower end of the mask hole 242 coincides with the opening of the upper end of the chute hole 222 without any horizontal direction (XY direction, θ direction). offset so electronic part C can pass.

The restriction hole 243 is a through hole for positioning the mask 240 with respect to the reception platform 250 and preventing positional deviation by inserting the restriction portion 253 of the reception platform 250 described below. The restriction hole 243 of this embodiment has a cylindrical shape corresponding to the shape of the restriction portion 253 . The beam portion 244 is a thin plate fixed to the lower surface of the plate body 241 such that the area other than the partition 245 becomes thicker, thereby increasing the strength of the plate body 241 and preventing bending or straining.

(bearing platform) The receiving base 250 holds the mask 240 and is in contact with one end of the electronic component C inserted into the mask hole 242 . In the present embodiment, the electronic component C is inserted into the mask hole 242 in the vertical direction. Therefore, one end of the electronic component C that is in contact with the receiving base 250 is downward, and the other end on the opposite side is upward. In the following description, one end of the electronic component C and the end corresponding to the mask hole 242 are called the lower end, and the other end of the electronic component C and the end corresponding to the mask hole 242 are called the upper end. However, the directions of the electronic component C and the mask hole 242 are not limited to this. Furthermore, there is a possibility that both ends of the electronic component C are one end (lower end) and the other end (upper end).

As shown in FIGS. 7(A) and 7(B) , the receiving base 250 has a plate body 251 , a support part 252 , and a restriction part 253 . The plate body 251 is a circular plate-shaped member with the same diameter as the mask 240 . The support part 252 is a rectangular plate-shaped body fixed to one surface of the plate body 251 . The support portion 252 is provided at a position in each partition 245 that blocks the lower end of the mask hole 242 when the mask 240 is overlapped on the receiving platform 250 . In addition, the support portion 252 is provided at a position not overlapping the beam portion 244 of the cover 240 .

The restricting portion 253 is a cylindrical pin. The restricting portion 253 is provided at a position corresponding to the restricting hole 243 of the cover 240. By being inserted into the restricting hole 243, the receiving base 250 and the cover 240 are aligned and position deviation is prevented.

(Gap adjustment part) The distance adjustment part 260 (see FIG. 3(B) ) adjusts the distance between the mutually facing surfaces of the chute 220 and the cover 240 . Specifically, as will be described later, the distance between the chute 220 and the cover 240 is adjusted so that the cover 240 contacts the chute 220 (the first position), so that the chute 220 and the cover 240 move relatively horizontally. position (second position), and a position (third position) in which the cover 240 and the receiving base 250 are held in the holding hole 292a. That is, the distance adjustment part 260 of this embodiment is a lifting mechanism which lifts the receiving base 250 and the cover 240 between a 1st position, a 2nd position, and a 3rd position.

Furthermore, the first position is a position where the electronic component C is inserted into the cover 240 from the chute 220 by vibration (refer to FIGS. 9(A) and 9(B) ), and the second position is a position where the cover 240 is inserted from the chute 220 into the cover 240 . The grooves 220 are separated by a distance Dz and the upper end of the electronic component C inserted into the cover 240 is at a position where the chute 220 is not interfered with (a position where the chute 220 and the cover 240 can relatively move horizontally) (see ( in FIG. 10 ) A) and (B) of FIG. 10 ), the third position is a position where the chute 220 and the cover 240 are separated and stand by (see (B) of FIG. 11 ).

In addition, in order to achieve a state in which the upper end of the electronic component C does not interfere with the chute 220 in the second position, the chute 220 and the cover 240 are aligned in the vertical direction (Z direction, chute hole) through the spacing adjustment portion 260 222 in the axis Axs direction) relative to each other (distance Dz) is more than the length of the electrode formation region R in the axis Axc direction and less than the length of the electronic component C in the axis Axc direction (see (A) of FIG. 10 , FIG. 12(D)).

The electrode formation region R is a region where the electrode E is formed, and therefore is formed corresponding to a pair of two poles. Therefore, between the pair of electrode formation regions R, the + and - separated regions of the two electrodes E are required. Therefore, the electrode formation region R is a region in which gaps for achieving such polar separation remain. For example, one of the electrodes E may be formed only on the surface F at the lower end (see FIG. 1(C) ), a gap may be provided at the corner portion of the side surface that is connected to the surface F, and the other part may be the other electrode E. . That is, based on the film formation area (electrode formation area R), the distance Dz does not exceed the length of the electronic component C in the axis Axc direction. It is preferable to set the position as close as possible to the length of the electrode formation region R in the axis Axc direction in consideration of positioning errors during movement. In addition, it is preferable that the distance Dz is a distance that prevents the electronic component C accommodated in the mask hole 242 from being sucked when sucked from above.

The distance adjustment part 260 has a propeller 261 and a drive source 262. The pusher 261 has a mounting base 261a on which the receiving base 250 is mounted, and a shaft 261b that supports the mounting base 261a. The drive source 262 is a motor that raises and lowers the shaft 261b.

(mobile agency) The moving mechanism 270 moves the chute 220 and the cover 240 in the horizontal direction in such a manner that the axis Axs of the chute hole 222 deviates from the axis Axm of the cover hole 242 without the upper end of the electronic component C interfering with the chute 220 . Mechanism for relative movement (refer to Figure 10 (B) and Figure 12 (E)). The moving mechanism 270 of this embodiment is provided between the mounting base 261a and the shaft 261b, and moves the mounting base 261a to move the receiving base 250 and the cover 240 in the X direction. As the moving mechanism 270, a cylinder can be used, for example.

In order to enable such movement, a support portion 261c, a guide 261d, and a movable body 261e are further provided between the mounting table 261a and the shaft 261b (see FIGS. 8 to 11). The support part 261c is a plate-shaped member connected to the shaft 261b so as to face the mounting table 261a. The guide 261d is a rod-shaped member fixed to the support part 261c so as to extend in the X direction. The movable body 261e is a member having a recess in which the guide 261d is slidably and movably fitted. The recessed portion of the movable body 261e is fitted into the guide 261d, and the portion opposite to the recessed portion is fixed to the mounting base 261a.

The air cylinder as the moving mechanism 270 is fixed on the support part 261c at a position capable of pressing the movable body 261e. By pushing the movable body 261e with the moving mechanism 270, the movable body 261e and the mounting table 261a connected thereto move along the guide 261d. For example, the moving mechanism 270 moves a movement distance Dx that is approximately half of the horizontal length of the mask hole 242 to shift the axis Axs of the chute hole 222 from the axis Axm of the mask hole 242 .

(Transfer mechanism) The transfer mechanism 280 is a mechanism that transfers the electronic component C between the accommodating part 210 and the chute 220 . The transfer mechanism 280 is also a removal mechanism that removes electronic components C other than the electronic components C inserted into the mask hole 242 from the chute 220 . As shown in FIGS. 3(A), 3(B), 4(A), and 4(B), the transfer mechanism 280 has a pickup mechanism 281 and a guide mechanism 282.

The pickup mechanism 281 is a mechanism that picks up the electronic components C from the accommodating part 210 or the chute 220 . The pickup mechanism 281 has a moving body 283, an adsorption part 284, and an adsorption force imparting part 285. The moving body 283 moves between the receiving part 210 and the chute 220 . The movable body 283 has a shape of a corner prism on a pyramid with a widened end, and is a base member on which the adsorption part 284 and the adsorption force imparting part 285 are mounted. The moving body 283 is movably disposed between the receiving portion 210 and the chute 220 through the guide mechanism 282 .

The adsorption part 284 is a unit part for adsorbing the electronic component C in order to pick up the electronic component C. The adsorption part 284 has an adsorption plate 284a, a support plate 284b, and a support|pillar 284c. The adsorption plate 284a is a member that adsorbs the electronic components C. The adsorption plates 284a are rectangular plate-shaped bodies arranged at positions corresponding to the respective partitions 225 of the chute 220, and adsorb the electronic components C by applying magnetic force from an adsorption force imparting portion 285 to be described later. The size of the horizontal surface of the adsorption plate 284a is smaller than the area surrounded by the partition wall 223, so as to be close to the chute hole 222 of each partition 225. In addition, the position of each adsorption plate 284a also corresponds to each partition 211a of the container 211.

That is, the adsorption part 284 is provided on the movable body 283, and causes an adsorption force to act on a planarly developed area corresponding to the area in the chute 220 to which the electronic components are supplied, thereby adsorbing the electronic component C and releasing it. Adsorption force to liberate electronic parts C. The adsorption part 284 is provided in an area corresponding to the partition 225 of the chute 220 . The adsorption part 284 is not provided in the area which does not correspond to the partition 225 of the chute 220 .

The support plate 284b is a rectangular plate-shaped body to which the adsorption plate 284a is attached. The size of the support plate 284b covers the entire area of the chute hole 222 in which the chute 220 is formed. The adsorption plate 284a and the support plate 284b are formed to have a thickness that allows magnetic force. The materials of the adsorption plate 284a and the support plate 284b are not particularly limited and may be metal or non-metal such as resin. For example, stainless steel is used as the adsorption plate 284a and the support plate 284b. The pillar 284c is a pillar that fixes the support plate 284b to the moving body 283. The upper end of the pillar 284c is fixed to the bottom of the moving body 283, and the lower end is fixed to the support plate 284b. Thereby, the support plate 284b is supported in the horizontal direction at a distance from the bottom surface of the moving body 283.

The adsorption force imparting part 285 imparts adsorption force to the adsorption plate 284a. The attraction force imparting part 285 imparts magnetic force for attracting the electronic component C to the surface facing the accommodation part 210 of the adsorption plate 284a via the support plate 284b. The attraction force imparting part 285 has a magnetic member 285a, a holding plate 285b, and a contact/separation mechanism 285c. The magnetic member 285a is a permanent magnet, for example. The size of the horizontal surface of the magnetic member 285a is approximately the same as that of the adsorption plate 284a. The size of the holding plate 285b is approximately the same as that of the support plate 284b of the adsorption part 284, and is arranged between the support plate 284b, the holding plate 285b and the bottom of the moving body 283. On the holding plate 285b, the magnetic members 285a are respectively attached to positions corresponding to the adsorption plates 284a via the support plate 284b.

The contact/separation mechanism 285c causes the magnetic member 285a and the adsorption plate 284a to relatively move to adsorb and release the electronic component C. The connection/separation mechanism 285c of this embodiment is provided at the bottom of the moving body 283 and supports the magnetic member 285a so as to be able to move up and down. As the connection/separation mechanism 285c, for example, a cylinder is used. The contact/separation mechanism 285c supports the holding plate 285b in the horizontal direction, and causes the magnetic member 285a to descend and contact the support plate 284b, thereby causing the adsorption plate 284a to exert the magnetic attraction force via the support plate 284b. Furthermore, the contact/separation mechanism 285c causes the magnetic member 285a to rise and separate from the support plate 284b, thereby losing the magnetic attraction force in the adsorption plate 284a.

The guide mechanism 282 is a mechanism that moves the moving body 283 between the accommodating part 210 and the chute 220 . The guide mechanism 282 has a support part 286, an arm part 287, and a guide part 288. The support part 286 is a pair of corner column members standing on the support base 212 of the accommodating part 210. The arm portion 287 is a corner column member supported in the horizontal direction by the support portion 286 , and extends from a position above the container 211 to a position above the accommodation hole 231 b of the vibration table 231 . The guide part 288 is a two-axis moving mechanism that combines linear guide rails in the X direction and the Z direction, and is provided on the arm part 287 . The movable body 283 is supported on the guide part 288 via a slider. Thereby, the guide mechanism 282 can transfer the electronic component C adsorbed on the adsorption part 284 between the accommodating part 210 and the chute 220 .

(Transportation mechanism) As shown in FIGS. 3(A) and 3(B) , the conveyance mechanism 290 is a mechanism that conveys the mask 240 in which the electronic component C is inserted into the mask hole 242 between the supply device 2 and the film forming processing unit 3 . The conveyance mechanism 290 of this embodiment has the turntable 292 which rotates intermittently by the motor 291. A plurality of holding holes 292 a serving as through holes are formed in the turntable 292 at equal intervals. The receiving table 250 is held by the holding hole 292a.

A step is formed on the inner edge of the holding hole 292 a to hold the receiving base 250 on which the mask 240 is mounted (see FIGS. 8(A) and 8(B) ). The holding hole 292a comes just below the receiving hole 231b of the vibrating table 231 every time the rotating table 292 stops due to intermittent rotation. The pusher 261 of the interval adjustment part 260 moves the receiving base 250 on which the cover 240 is mounted between the holding hole 292a and the receiving hole 231b of the rotating base 292.

[Film Formation Processing Department] The film formation processing unit 3 is a device that forms a film using plasma on the portion of the electronic component C that is exposed from the mask hole 242 , that is, the electrode formation region R. As shown in FIG. 2 , the film forming processing unit 3 includes a chamber 31 , a conveying unit 32 , a preprocessing unit 33 , a film forming unit 34 , and a film forming unit 35 . The chamber 31 is a container whose interior can be evacuated by exhaust gas generated by the exhaust unit 311 . The exhaust part 311 has a pipe and an exhaust circuit (not shown) connected to the exhaust port. The conveyance part 32 has a rotation table 321, a drive source 322, a sealing body 323, and a propeller 324.

The rotating table 321 is a circular platform that intermittently rotates the receiving table 250 carried into the chamber 31 and moves it to various parts such as the preprocessing part 33, the film forming part 34, the film forming part 35, and the load lock part described below. The sealing body 323 is a member for sealing each part and isolating it from the chamber 31 . The sealing body 323 is mounted with the receiving base 250 and is held by holding holes provided in the rotating base 321 at equal intervals. The propeller 324 moves the sealing body 323 up and down at positions corresponding to the respective parts of the film formation processing unit 3 .

In addition, although not shown in the figure, the film formation processing unit 3 has a loading and unloading unit for loading the receiving table 250 mounted with the mask 240 into and out of the chamber 31. It is possible to carry out the loading and unloading of the receiving stage 250 with the mask 240 while maintaining the vacuum in the chamber 31. The receiving base 250 of the cover 240 is loaded into and out of the chamber 31 through a load interlock portion.

The pretreatment unit 33 performs surface treatment on the electrode formation region R with plasma. The surface treatment is, for example, an ion bombardment treatment that cleans the surface of the electrode forming region R by ions generated by plasma in a process gas. The pretreatment unit 33 has a treatment chamber 331 provided on the top side of the chamber 31 and sealed by a rising sealing body 323 to perform surface treatment on the electrode formation region R exposed from the mask 240 .

The film forming parts 34 and 35 perform a film forming process on the electrode formation region R of the electronic component C by sputtering. Sputtering is a process in which the film-forming material ejected from the targets 342 and 352 is deposited on the surface of the electrode formation region R by ions generated by plasma in the sputtering gas. The film forming parts 34 and 35 have a film forming chamber 341 provided on the top side of the chamber 31 and sealed by a rising sealing body 323 to perform a film forming process on the electrode forming region R exposed from the mask 240. Room 351.

The film forming chambers 341 and 351 are provided with targets 342 and 352 containing film forming materials. The targets 342 and 352 are members formed of a film-forming material deposited on the electronic component C by sputtering to form a film. The targets 342 and 352 are held on a backing plate (not shown) and are connected to a power source via electrodes. As the film-forming material of the base layer, for example, Ti is used, and as the seed layer of the electrode E, for example, Cu, Au, Ag, etc. are used. Among these, various materials can be applied as long as they can be formed into films by sputtering. In addition, in this embodiment, the base layer is formed in the film forming part 34 and the seed layer of the electrode E is formed in the film forming part 35 . As the material of the base layer, for example, titanium (Ti) is used, and as the material of the seed layer of the electrode E, for example, copper (Cu) is used.

Furthermore, in this embodiment, two film forming units 34 and 35 are provided to form two layers of a base layer and a seed layer. However, if a base layer is not required, only one film forming unit may be provided. Furthermore, if more layers of film formation are required, two or more film forming units may be provided.

[Control device] The control device 4 is a device that controls each part of the film forming apparatus 1 (see FIG. 2 ). The control device 4 may be composed of a computer that operates according to a prescribed program, for example. The control content of the control device 4 is programmed and executed by a processing device such as a programmable logic controller (Programmable Logic Controller, PLC) or a central processing unit (Central Processing Unit, CPU).

For example, the control device 4 controls the vibration of the vibrating table 231 by the vibrating mechanism 230, the lifting and lowering of the receiving table 250 and the cover 240 by the interval adjusting part 260, and the movement of the chute 220 by the moving mechanism 270 through the above-mentioned program. movement, input and removal of electronic components C by the transfer mechanism 280, transportation of the receiving table 250 by the transport mechanism 290, loading and unloading of the chamber 31 of the receiving table 250 by the loading and unloading unit, Plasma processing by the processing unit 33 , film formation processing by the film formation unit 35 , transportation of the receiving table 250 by the transportation unit 32 , and the like.

[action] With the film forming apparatus 1 of this embodiment described above, the process of forming a film on the electronic component C will be described with reference to the explanatory diagrams of FIGS. 8 to 13 in addition to the above-described FIGS. 1 to 7 . In addition, as a premise of the description, as shown in FIG. 4(A) , a plurality of electronic components C are put into the container 211 of the storage unit 210 in advance, and the plurality of electronic components C are stored in each partition 211 a. The number of electronic components C accommodated in each partition 211 a is greater than the number of chute holes 222 in each partition 225 in the chute 220 and the number of mask holes 242 in each partition 245 in the mask 240 . Furthermore, by grinding with a flat plate or the like, the positions of the electronic components C accommodated in each partition 211a can be averaged so that they can be evenly approached within each partition 211a.

Furthermore, as shown in (A) of FIG. 8 , the receiving base 250 on which the mask 240 is mounted is placed on the mounting base 261 a of the propeller 261 . At this time, by inserting the restricting portion 253 of the receiving platform 250 into the restricting hole 243 of the mask 240, the mask 240 and the receiving platform 250 are aligned and offset is prevented. And, as shown in FIG. 8(B) , the mounting table 261 a is raised by the pusher 261 to reach the first position where the cover 240 comes into contact with the lower surface of the chute 220 . At this time, the lower end of the chute hole 222 matches the upper end of the mask hole 242 . Furthermore, at this time, the area in which the chute hole 222 and the mask hole 242 overlap is larger than the area of the surface F in the direction orthogonal to the axis Axc of the electronic component C (see (C) of FIG. 1 ).

(supply action) First, the supply operation of the electronic component C will be described. As shown in FIG. 4(A) , the guide mechanism 282 moves the moving body 283 of the pickup mechanism 281 horizontally and is positioned above the container 211 . At this time, since the holding plate 285b is lowered by the contact/separation mechanism 285c, the magnetic member 285a comes into contact with the support plate 284b, and exerts an adsorption force by magnetic force on the adsorption plate 284a via the support plate 284b.

Next, the moving body 283 of the pickup mechanism 281 descends through the guide mechanism 282, so that each adsorption plate 284a approaches each partition 211a of the container 211. Thereby, each adsorption plate 284a attracts and holds the plurality of electronic components C by magnetic force. Then, the moving body 283 of the pickup mechanism 281 moves up via the guide mechanism 282 to pick up the electronic component C from the container 211 . Subsequently, the moving body 283 moves horizontally through the guide mechanism 282 and is positioned above the chute 220 . Furthermore, as shown in (B) of FIG. 4 , (A) of FIG. 9 , and (A) of FIG. 12 , the moving body 283 descends, and the suction plate 284 a approaches each section 225 of the chute 220 .

Subsequently, as shown in FIGS. 9(B) and 12(B) , the attachment/separation mechanism 285c holds the plate 285b upward, and the magnetic member 285a separates from the support plate 284b, thereby functioning on each adsorption plate 284a. The magnetism is released. Therefore, the electronic components C adsorbed on each adsorption plate 284 a fall to each section 225 of the chute 220 . Then, the moving body 283 moves up via the guide mechanism 282 , whereby the suction plate 284 a is evacuated from each section 225 of the chute 220 . In this way, the electronic component C is supplied to the chute 220 . Subsequently, the holding plate 285b is lowered by the contact/separation mechanism 285c, and the magnetic member 285a is brought into contact with the support plate 284b, thereby returning to the state where the magnetic force acts on each adsorption plate 284a.

Furthermore, the vibrating table 231 is vibrated by the vibrating mechanism 230, thereby vibrating the chute 220, the cover 240, and the receiving table 250. In this way, as shown in FIG. 12(C) , the electronic components C accommodated in each partition 225 of the chute 220 enter from the upper end side of the chute hole 222 one by one, and move along the axis Axc while passing through the chute hole 222 . It is guided in the vertical direction and falls into the mask hole 242 .

The electronic component C that has entered the mask hole 242 is in contact with the support portion 252 of the receiving platform 250 through its lower end, and only the electrode formation region R on the upper end side is exposed from the mask hole 242 . Among them, the electrode formation region R exposed from the mask hole 242 enters the chute hole 222 . Furthermore, the electronic component C that has entered the chute hole 222 may be mounted on the electronic component C that has entered the mask hole 242 .

Next, as shown in FIGS. 10(A) and 12(D) , the mounting base 261 a is lowered using the spacing adjustment part 260 , so that the mask 240 is separated from the lower surface of the chute 220 to the second position. The distance Dz at this time is the same as the height of the electrode formation region R exposed from the mask hole 242 . Therefore, the boundary between the electronic component C that has entered the chute hole 222 and the electronic component C that has entered the mask hole 242 becomes the same horizontal plane as the lower surface of the chute 220 , and the chute 220 can move in the horizontal direction.

And, as shown in FIG. 10(B) and FIG. 12(E) , the base 250 on which the mask 240 is placed is moved by the movement distance Dx in the X direction by the moving mechanism 270 . This movement distance Dx is approximately half the length of the mask hole 242 in the horizontal direction. In this way, by deviating the axis Axs of the chute hole 222 from the axis Axm of the mask hole 242, the electronic component C that has entered the mask hole 242 is prevented from falling, and the electronic component C that has entered the chute hole 222 is prevented from falling by the chute. The bottom surface of 220 limits the upward and downward movement of the electronic component C that has entered the mask hole 242 .

In addition, the movement distance Dx is not limited to a distance approximately half of the length of the mask hole 242 in the horizontal direction. As long as the electronic component C is prevented from falling from the chute hole 222 and the electronic component C that has entered the cover hole 242 is restricted from moving up and down, in order to prevent the electronic component C from moving between the chute hole 222 and the cover hole 242, as long as It suffices to move to a distance such that the area of the surface where the chute hole 222 and the mask hole 242 overlap is smaller than the area of the surface F in the direction orthogonal to the axis Axc of the electronic component C.

In this state, as shown in FIGS. 11(A) and 12(F) , the guide mechanism 282 is used to move the movable body 283 upward and then lower the chute 220 , thereby lowering the suction plate 284 a and approaching the chute 220 . Each partition 225 of slot 220. Thereby, each adsorption plate 284a attracts and holds the electronic component C in each partition 225 using magnetic force. At this time, the magnetic force to be attracted not only acts on the electronic component C that has entered the chute hole 222 , but also acts on the electronic component C that has entered the mask hole 242 . However, the electronic component C that has entered the mask hole 242 is not attracted because its movement is restricted as described above. Then, the moving body 283 moves up by the guide mechanism 282, and the electronic component C is picked up from the chute 220 and removed. Subsequently, the moving body 283 moves horizontally through the guide mechanism 282 and moves horizontally above the container 211 . Furthermore, the moving body 283 descends, and the adsorption plate 284a approaches each partition 211a of the container 211 (see FIG. 4(B) and FIG. 4(A) ).

Subsequently, the holding plate 285b is raised by the contact/separation mechanism 285c, and the magnetic member 285a is separated from the support plate 284b, and the magnetic force acting on each adsorption plate 284a is released. Therefore, the electronic components C adsorbed on each adsorption plate 284a fall to each partition 211a of the container 211. Furthermore, the moving body 283 moves up by the guide mechanism 282, whereby the suction plate 284a is evacuated from each section 211a of the container 211. In this way, the electronic component C is removed from the chute 220 .

Next, as shown in FIGS. 11(B) and 12(G) , the mounting base 261a of the propeller 261 is lowered, and the receiving base 250 on which the mask 240 is placed is lowered, so that the receiving base 250 is held on the rotating base 292 to maintain the third position of hole 292a. Thereby, the mask 240 with the electronic component C inserted into the mask hole 242 is supplied to the rotation table 292 together with the receiving base 250 . In addition, the moving mechanism 270 returns the base 250 on which the mask 240 is placed to the initial position.

Then, the propeller 261 moves down to evacuate from the receiving platform 250 and the rotating platform 292 . Furthermore, as the rotary table 292 rotates intermittently, the receiving table 250 held in the holding hole 292a reaches a position where the loading and unloading part can carry it in. Therefore, the loading and unloading part carries the receiving table 250 into the chamber 31 via the load interlock part and mounts it on the chamber 31 . The sealing body 323 on the rotating stage 321.

As shown in FIG. 2 , the rotary table 321 transports the receiving table 250 to the preprocessing unit 33 and raises the sealing body 323 using the propeller 324 to accommodate the receiving table 250 carrying the mask 240 in which the electronic component C is inserted. Chamber 331 and seal it. In the processing chamber 331 , the electrode formation region R of the electronic component C exposed from the mask hole 242 is subjected to surface treatment.

Furthermore, the rotary table 321 sequentially transports the receiving table 250 to the film forming part 34 and the film forming part 35. In the same manner as described above, the sealing body 323 is raised by the propeller 324 to seal, and the sealing body 323 is sealed in the film forming chamber 341 and the film forming chamber. The electrode formation region R is film-formed in 351 . In this embodiment, titanium is formed into a film in the film forming section 34 , and copper is formed into a film in the film forming section 35 .

Subsequently, the rotating table 321 carries the receiving table 250 to the loading and unloading position, and the loading and unloading part carries the receiving table 250 out of the chamber 31 via the load interlock part. The carried-out receiving base 250 is held in the holding hole 292a of the rotation base 292.

Next, the electronic component C is inverted in order to form a film on the electrode forming area R on the opposite side to the electrode forming area R where the film has been formed. The mask 240 and the receiving table 250 in which the electronic component C in which the electrode formation region R has been film-formed is inserted is transported by the rotating table 292 to a predetermined position for inversion. At the predetermined position, as shown in FIG. 13(A) , a separately prepared receiving base 250 is overlapped on the mask 240 on the receiving base 250 positioned at the predetermined position, as shown in FIG. 13(B) reverse. In addition, the restricting portion 253 of the newly overlapped receiving platform 250 enters the restricting hole 243 of the mask 240 to perform positioning and prevent deviation. Furthermore, the restriction portions 253 of the two overlapping receiving stands 250 collide with each other, thereby defining the distance between the two receiving stands 250 .

The distance between the two overlapping receiving bases 250 is set to be the same as or slightly larger than the length of the electronic component C in the axial direction. The two bearing platforms 250 are of the same shape and size. Therefore, the protruding amount of the restricting portion 253 of each receiving base 250 is the same. Moreover, the protrusion amount of the support part 252 of each receiving base 250 is the same. Therefore, twice the difference in the protrusion amount of the restricting portion 253 and the supporting portion 252 is set to be the same as or slightly larger than the length of the electronic component C in the axial direction. That is, the difference in the protrusion amount of the restricting part 253 and the supporting part 252 is set to be half of the length which is set to be the same as or slightly larger than the length of the electronic component C in the axial direction. Moreover, the thickness of the plate body 241 of the mask 240 is thicker than the difference in protrusion amount of the restriction part 253 and the support part 252, and is thinner than twice the difference in protrusion amount of the restriction part 253 and the support part 252. And it is the thickness by which the electrode formation region R of the electronic component C is exposed when it is overlapped on the support part 252 . Due to such a dimensional relationship, the restriction portion 253 of the other receiving platform 250 can be inserted into the restricting hole 243 provided in the plate body 241 of the mask 240 placed on one of the receiving platforms 250 . Furthermore, even if the two overlapping stages 250 are integrally inverted (may be turned over), the electrode formation region R with one end in contact with the other end of the electronic component C on the other stage 250 is the same as that before the inversion. The amount of exposure is the same.

The mask 240 is also inverted by this inversion, so that the mask 240 descends and comes into contact with the lower receiving base 250 . Thereby, the electrode formation region R on the opposite side to the film formation side of the electronic component C is exposed from the upper end of the mask hole 242 . Then, as shown in (C) of FIG. 13 , the upper receiving base 250 is removed. In this state, in the same manner as described above, the receiving table 250 is moved into the chamber 31 of the film formation processing unit 3, and a film formation process is performed on the exposed electrode formation region R. Thereby, the electrodes E are formed in the electrode formation regions R at both ends of the electronic component C. In addition, the stacking or disassembly of the receiving platform 250 may be performed by an operator or by a robot or the like.

[Effect] (1) The supply device 2 of this embodiment has: a chute 220 with a plurality of chute holes 222 through which electronic components C can pass one by one; and a cover 240 that overlaps the chute 220 and allows the electronic components C to pass through the chute. The hole 222 is inserted into the mask hole 242 that covers a part of the electronic components C; the accommodating part 210 accommodates a plurality of electronic components C; and the transfer mechanism 280 transfers the electronic components C between the accommodating part 210 and the chute 220. The carrier mechanism 280 has: a moving body 283 that moves between the accommodating part 210 and the chute 220; and an adsorption part 284 that is provided on the moving body 283 and corresponds to the area in the chute 220 where the electronic components C are supplied. The area expanded in a shape exerts adsorption force to adsorb the electronic component C, and the electronic component C is released by releasing the adsorption force. Furthermore, it is provided with the film formation processing part 3 which forms a film on the electronic component C supplied using this type of supply device 2.

Therefore, it is possible to provide the supply device 2 and the film forming device 1 that can uniformly supply a fixed amount of electronic components with a simple structure. Specifically, the electronic components C are adsorbed in a planarly expanded area and released in the chute 220. Therefore, each area of the chute 220 where the electronic components C are supplied can be adjusted with a simple mechanism that does not require a measuring mechanism or the like. The supply quantity per unit area is a certain amount so that the distribution within the plane is equal. This increases the probability that the electronic component C enters the mask hole 242, thereby preventing a decrease in yield. In addition, the certain quantity mentioned here does not require that the quantity of electronic components C supplied each time is exactly the same. Moreover, the term "equal" does not require that the intervals between the supplied electronic components C be completely constant and not overlap. In order to increase the probability that the electronic component C enters the mask hole 242, it is only necessary to suppress the variation in quantity and the concentration in the plane.

(2) The chute 220 is provided with a partition wall 223 including a plurality of chute holes 222 to form a partition 225 into which the electronic components C are supplied. Therefore, when the chute 220 is vibrated and the electronic components C are supplied from the chute hole 222 to the cover hole 242 , movement to other areas in the chute 220 is prevented by the partition wall 223 . This allows the electronic components C to be supplied into the chute hole 222 in the partition 225 and reliably supplied from the chute hole 222 to the corresponding cover hole 242 .

(3) The adsorption part 284 is provided in an area corresponding to the partition 225 of the chute 220 . By adsorbing and releasing the electronic components C in the area corresponding to each partition 225 of the chute 220, the electronic components C can be evenly supplied to each partition 225.

(4) The accommodating part 210 is provided with a plurality of sections 211 a to which the electronic components C are supplied, and a plurality of sections of the chute 220 are provided at positions corresponding to one-to-one correspondence with the plurality of sections of the accommodating part. Therefore, the electronic components C can be evenly supplied by adsorbing the electronic components C in advance according to each partition 211 a and moving them to the corresponding partition 225 of the chute 220 .

(5) The adsorption part 284 has an adsorption plate 284a on which the electronic component C is adsorbed, and an adsorption force imparting part 285 that imparts adsorption force to the adsorption plate 284a. The adsorption force imparting part 285 has a magnetic member 285a, and the magnetic member 285a and the adsorption part 285. The plate 284a moves relatively to the attachment/separation mechanism 285c which adsorbs and releases the electronic component C.

Therefore, by moving the magnetic member 285a relative to the adsorption plate 284a, the adsorption and release of the electronic component C within a predetermined range can be switched instantaneously, and the deviation of the adsorption position and the drop position of the electronic component C can be reduced.

The supply device 2 has a storage portion 210 that stores a plurality of electronic components C, and the transfer mechanism 280 has a guide mechanism 282 that transfers the electronic components C between the storage portion 210 and the chute 220 . Therefore, the electronic components C can be supplied and removed by a common mechanism.

[Modification] This embodiment also considers the following modifications. (1) The magnetic member 285a of the attraction force imparting portion 285 is a permanent magnet in the above-described form, but an electromagnet may also be used. In this case, there is no need to provide a mechanism for connecting/separating the magnetic member 285a, and the presence or absence of the attraction force due to the magnetic force can be switched by turning on and off the current. Furthermore, even if the magnetic member 285a is an electromagnet, it may be combined with a mechanism for connecting/separating the magnetic member 285a. In this case, the influence of the magnetic force can be reliably shielded by the mechanism for connecting/separating the magnetic members 285a, and even the small and lightweight electronic component C can be reliably released from adsorption and holding.

(2) The adsorption part may have a suction port for suctioning and holding the electronic component C using negative pressure, and a suction piping for supplying negative pressure to the suction port. In this case, the suction force imparting part is connected to the suction pipe as a negative pressure generating circuit that imparts suction force using negative pressure. Accordingly, even electronic components C of materials or shapes that are difficult to be attracted by magnetic force can be adsorbed and held by negative pressure, and can be supplied by releasing the adsorption by stopping the negative pressure. The opening area of the suction port is set to be equal to or less than the smallest surface area of the electronic component C. The suction port may be a plurality of holes formed in the adsorption plate, or the suction port may be covered with a breathable porous material. Thereby, the suction opening is made small, and the electronic component C can be suppressed from being sucked into the suction pipe.

(3) The film formation processing unit 3 is not limited to a device that performs film formation by sputtering. The electrode E may be formed by applying a conductive material to the electrode formation region R exposed from the mask hole 242 of the mask 240 , or the electrode E may be formed by immersing the electrode formation region R in the conductive material. .

(4) The number of partitions 225 of the chute 220 is at least one. That is, it may be one or multiple. There only needs to be at least one partition 245 of the mask 240 and a partition 211a of the receiving portion 210 . That is, it may be one or multiple.

(5) The receiving platform 250 may not have the support part 252 and may have a flat surface. Furthermore, the cover 240 may have only the plate body 241 without the beam portion 244 and may have a flat surface. Even if the receiving base 250 and the cover 240 are fixed, they may be formed integrally. The restricting part 253 may be a member such as the pin mentioned above, or may be a wall surrounding the cover 240 .

(6) The electrode formation region R only needs to be a region electrically connected to the internal electrode En on the outer surface of the electronic component C, and is a region of at least one end of the electronic component C. For example, the electrode formation region R may be a region at both ends or only one end of the electronic component C in the axis Axc direction. That is, the film formation processing unit 3 only needs to be capable of forming a film on at least one end of the electronic component C.

Moreover, the electrode formation region R only needs to be a part of the electronic component C. For example, it may be a box-shaped region including the surface F in the axis Axc direction of the electronic component C, or may be only the surface F in the axis Axc direction of the electronic component C. F (refer to Figure 1 (A) to Figure 1 (C)). That is, the mask hole 242 only needs to cover a part of the electronic component C, and particularly includes a form that covers part or all of the side surface (the surface along the axis Axc) of the electronic component C. When the mask hole 242 covers the entire side surface of the electronic component C, the electronic component C is held in the mask hole 242 in a state where only the surface F in the direction orthogonal to the axis Axc is exposed.

[Other embodiments] The embodiments and modifications of each part of the present invention have been described above. However, the embodiments and modifications of each part are presented as examples and are not intended to limit the scope of the invention. These novel embodiments described above can be implemented in various other forms, and various omissions, substitutions, combinations, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the scope of the invention claims.

1: Film forming device 2: Supply device 3: Film forming processing department 4:Control device 31: Chamber 32:Transportation Department 33: Preprocessing Department 34, 35: Film forming department 210: Containment Department 211:Container 211a: Partition 211b: Inclined surface 212:Support platform 212a:Feet 220:Chute 221:Plate body 222:Chute hole 223: partition wall 225:Partition 230:Vibration mechanism 231:Shaking table 231b:Containment hole 232:Abutment 240:Mask 241:Plate body 242: Mask hole 243:Restricted hole 244:Liangbu 245:Partition 250: Bearing platform 251:Plate body 252:Support part 253:Restriction Department 260: Interval adjustment part 261: Thruster 261a: Carrying platform 261b:shaft 261c: Support part 261d: guide 261e: Movable body 262:Drive source 270:Mobile mechanism 280:Transfer mechanism 281:Pick-up mechanism 282: Guidance mechanism 283:Moving body 284:Adsorption part 284a: Adsorption plate 284b: Support plate 284c: Pillar 285: Adsorption force imparting part 285a: Magnetic components 285b: retaining plate 285c: Connecting/separating mechanism 286:Pillar Department 287:Arm 288: Guidance Department 290:Transportation mechanism 291:Motor 292: Rotary table 292a: Retaining hole 311:Exhaust part 321: Rotary table 322:Drive source 323:Sealed body 324: Thruster 331:Processing room 341, 351: Film forming room 342, 352: Target Axc, Axs, Axm: axis C: Electronic parts Dx: moving distance Dz: interval E:Electrode En: internal electrode F: noodles R: electrode formation area X, Y, Z: direction

1 is a perspective view (A), a cross-sectional view (B), and a perspective view (C) showing a state in which the electronic component to be supplied in the embodiment has entered the mask hole. FIG. 2 is a simplified structural diagram showing the film forming apparatus according to the embodiment. 3 is a plan view (A) and a partially cross-sectional side view (B) showing the supply device according to the embodiment. FIG. 4 is a partial cross-sectional side view (A) showing the electronic component of FIG. 3 when being stored, and a partial cross-sectional side view (B) showing the time of supplying the electronic component. 5 is a plan view (A) and an A-A arrow cross-sectional view (B) showing the chute. 6 is a plan view (A) and a B-B arrow cross-sectional view (B) showing the mask. Fig. 7 is a plan view (A) showing the receiving platform and a C-C arrow cross-sectional view (B). 8 is a cross-sectional view showing a standby state (A) of the cover and a state (B) of the cover attached to the chute. 9 is a cross-sectional view showing a state (A) in which the suction portion is positioned on the cover and a state (B) in which the electronic components are dropped. 10 is a cross-sectional view showing a state (A) in which the mask is separated from the chute and a state (B) in which the chute is moved in the horizontal direction. 11 is a cross-sectional view illustrating a state (A) in which excess electronic components are adsorbed and a state (B) in which the pusher is lowered and the receiving base 250 is held in the holding hole. 12(A) to 12(G) are explanatory diagrams showing the supply sequence of electronic components to the mask. 13(A) to 13(C) are explanatory diagrams showing the procedure of inverting the mask.

2: Supply device

210: Containment Department

211:Container

211a: Partition

211b: Inclined surface

212:Support platform

212a:Feet

220:Chute

221:Plate body

222:Chute hole

223: partition wall

225:Partition

230:Vibration mechanism

231:Shaking table

231b:Containment hole

232:Abutment

240:Mask

242: Mask hole

250: Bearing platform

260: Interval adjustment part

261: Thruster

261a: Carrying platform

261b:shaft

261c: Support part

261d: guide

261e: Movable body

262:Drive source

270:Mobile mechanism

280:Transfer mechanism

281:Pick-up mechanism

282: Guidance mechanism

283:Moving body

284:Adsorption part

284a: Adsorption plate

284b: Support plate

284c: Pillar

285: Adsorption force imparting part

285a: Magnetic components

285b: retaining plate

285c: Connecting/separating mechanism

286:Pillar Department

287:Arm

288: Guidance Department

290:Transportation mechanism

291:Motor

292: Rotary table

292a: Retaining hole

X, Y, Z: direction

Claims (7)

A supply device has: a chute with a plurality of chute holes through which electronic parts can pass one by one; a cover that overlaps the chute and allows the electronic parts to be inserted through the chute holes to cover the a cover hole of a part of an electronic component; a receiving portion to receive a plurality of the electronic components; and a transfer mechanism to transfer the electronic components between the receiving portion and the chute, the transfer mechanism having : a moving body that moves between the accommodating part and the chute; and an adsorption part provided on the moving body that corresponds to the area in the chute where the electronic components are supplied, and is formed in a planar shape The expanded area exerts an adsorption force to adsorb the electronic components, and the electronic components are released by releasing the adsorption force; a partition wall is formed in the chute to form a partition where the electronic components are supplied. The supply device according to claim 1, wherein the adsorption part is provided in an area corresponding to the partition of the chute. The supply device according to claim 1, wherein the accommodating portion is provided with a plurality of partitions to which the electronic components are supplied, and the partitions of the chute are in one-to-one correspondence with the plurality of partitions of the accommodating portion. There are multiple locations. The supply device according to claim 1, wherein the adsorption part has: an adsorption plate on which the electronic component is adsorbed; and An adsorption force imparting unit provides an adsorption force to the adsorption plate, the adsorption force imparting unit having a magnetic member, and a device for adsorbing and releasing the electronic component by relatively moving the magnetic member and the adsorption plate. Connecting/separating mechanism. The supply device according to claim 1, further comprising an adsorption force imparting part that imparts adsorption force to the adsorption part, and the adsorption force imparting part is an electromagnet. The supply device according to claim 1, wherein the adsorption section has a suction port for suctioning and holding the electronic components using negative pressure, and a suction piping for supplying negative pressure to the suction port. A film forming apparatus includes: the supply device according to any one of claims 1 to 6; and a film forming processing unit that forms a film on the electronic component.