TW202342603A - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
TW202342603A
TW202342603A TW112104939A TW112104939A TW202342603A TW 202342603 A TW202342603 A TW 202342603A TW 112104939 A TW112104939 A TW 112104939A TW 112104939 A TW112104939 A TW 112104939A TW 202342603 A TW202342603 A TW 202342603A
Authority
TW
Taiwan
Prior art keywords
resin composition
epoxy resin
resin
manufactured
axis
Prior art date
Application number
TW112104939A
Other languages
English (en)
Chinese (zh)
Inventor
阪內啓之
佐佐木成
Original Assignee
日商味之素股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商味之素股份有限公司 filed Critical 日商味之素股份有限公司
Publication of TW202342603A publication Critical patent/TW202342603A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW112104939A 2022-02-21 2023-02-13 樹脂組成物 TW202342603A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-024798 2022-02-21
JP2022024798 2022-02-21

Publications (1)

Publication Number Publication Date
TW202342603A true TW202342603A (zh) 2023-11-01

Family

ID=87578296

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112104939A TW202342603A (zh) 2022-02-21 2023-02-13 樹脂組成物

Country Status (3)

Country Link
JP (1) JPWO2023157542A1 (https=)
TW (1) TW202342603A (https=)
WO (1) WO2023157542A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4903989B2 (ja) * 2004-07-27 2012-03-28 株式会社アドマテックス プリント基板用組成物
JP4010420B2 (ja) * 2004-08-16 2007-11-21 電気化学工業株式会社 エポキシ樹脂用充填材及びその製造方法
JP2007262126A (ja) * 2006-03-27 2007-10-11 Toray Ind Inc フレキシブル印刷回路用接着剤組成物およびそれを用いたカバーレイフィルム、銅張り積層板、接着剤シート、リードフレーム固定テープ
JP5249903B2 (ja) * 2009-10-22 2013-07-31 味の素株式会社 樹脂組成物
JP2011168650A (ja) * 2010-02-16 2011-09-01 Daicel Chemical Industries Ltd エポキシ樹脂組成物
JP2016121294A (ja) * 2014-12-25 2016-07-07 信越化学工業株式会社 半導体封止用液状アンダーフィル材組成物及びフリップチップ型半導体装置
JP6534986B2 (ja) * 2016-11-29 2019-06-26 味の素株式会社 樹脂組成物
JP6816667B2 (ja) * 2017-07-10 2021-01-20 味の素株式会社 樹脂組成物
JP7424168B2 (ja) * 2020-03-31 2024-01-30 味の素株式会社 樹脂組成物、樹脂ペースト、硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置

Also Published As

Publication number Publication date
JPWO2023157542A1 (https=) 2023-08-24
WO2023157542A1 (ja) 2023-08-24

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