TW202341312A - Inner lead bonding apparatus and inner lead bonding method - Google Patents

Abstract

An inner lead bonding apparatus includes a stage, a bonding tool, a temperature controlling module, an image capturing module and a processor. The stage is configured to carry a flexible package tape having a plurality of packaging units. Each packaging unit has a chip bonding region and a plurality of inner leads in the chip bonding region. The plurality of inner leads has a total pitch in a direction parallel to a long side of the chip bonding region. The bonding tool is configured to receive a chip, move toward the stage and exert a force to mount the chip in the chip bonding region so that bumps of the chip are correspondingly bonded to the inner leads. The temperature controlling module is configured to adjust a temperature of the stage to a bonding temperature. The image capturing module is configured to capture an image of the chip bonding region. The processor is coupled to the image capturing module, and is configured to obtain a reference distance relevant to the total pitch according to the image and to determine if the bonding temperature is to be a predetermined temperature value or a compensated temperature after computing the reference distance and comparing.

Description

Internal pin bonding device and internal pin bonding method

The invention relates to an inner pin bonding device and an inner pin bonding method.

In the existing technology, the process of chip packaging using chip on film (COF) method uses a whole roll of flexible packaging tape including multiple packaging units, reel to reel. The transmission method sequentially places the chips on multiple packaging units. Specifically, multiple bumps are provided on the active surface of the chip, and multiple circuits are provided in each packaging unit of the flexible packaging tape. Each circuit has internal pins for each bump to be bonded to it. It is the so-called inner lead bonding (ILB) process. The current internal pin bonding is generally performed by thermal compression, so that the bumps on the chip and the internal pins generate eutectic bonding to achieve electrical connection.

8 is a schematic diagram of internal pin bonding in three different scenarios according to the internal pin bonding method of the prior art. It is worth noting that due to limitations in the circuit manufacturing process capabilities (such as circuit etching capabilities) of flexible packaging tapes, in the same flexible packaging tape, the inner pins of these packaging units of the same design are After the actual production is completed, there may be varying degrees of positional deviation, resulting in the total spacing of multiple long-side internal pins arranged along the long side of the wafer bonding area (for example, the relative length of the two outermost long-side pins of multiple long-side internal pins). distance between pins within the edge) actually makes a difference. Please refer to Figure 8. In the current manufacturing process, the bonding temperatures of the same roll of products when the inner pins are bonded are all set to the same value. However, under the same bonding temperature setting, when the total spacing L1 of the long-side inner pins 12 meets the predetermined design range (as shown in FIG. 8(a) ), each long-side inner pin 12 is bonded to the corresponding protrusion. The position of the block 22 will be at a predetermined engagement position, thereby forming a good contact point with the bump 22 . When the total spacing L2 of the long-side inner pins 12 is small (as shown in FIG. 8(b) ), the position where each long-side inner pin 12 is joined to the corresponding bump 22 will be retracted from the predetermined joining position (i.e. Pins 12 within the long side are offset toward the center of wafer 20). When the total distance L3 between the long-side inner pins 12 is larger (as shown in FIG. 8(c) ), the position where each long-side inner pin 12 is joined to the corresponding bump 22 will expand outward from the predetermined joining position (i.e. Long side inner pins 12 are offset to both sides of the wafer 20). If the offset of the pins on the long side exceeds the specification, it may cause electrical abnormalities or failure of the package structure. Under such circumstances, it is difficult for the multiple packaging units of the entire roll of flexible packaging tape to achieve consistent and stable internal pin bonding quality, making it impossible to effectively improve the manufacturing yield.

The present invention provides an inner pin bonding device and an inner pin bonding method, which can maintain consistent and stable inner pin bonding quality for multiple packaging units of a flexible packaging tape.

An internal pin bonding device of the present invention includes a carrying platform, a pressing head, a temperature control module, an image capture module and a processor. The carrying platform is used to carry the flexible packaging tape, wherein the flexible packaging tape has a plurality of packaging units. Each package unit has a chip bonding area and a plurality of inner pins located in the chip bonding area. The plurality of inner pins include a plurality of long-side inner pins arranged along two opposite long sides of the chip bonding area, and the plurality of long-side inner pins have a total spacing in a direction parallel to the two long sides. Each package The units are sequentially arranged on the carrying platform, and the carrying platform at least corresponds to the chip bonding area of the packaging unit arranged on the carrying platform. The pressing head is used to receive the wafer and is movably disposed above the carrying platform and corresponds to the packaging unit arranged on the carrying platform. The pressing head is used to move toward the carrying platform and apply pressure so that the chip is placed in the chip bonding area of the packaging unit, and the plurality of bumps on the chip are correspondingly bonded to the plurality of inner pins. The temperature control module is used to adjust the temperature of the bearing platform to the bonding temperature. The image capturing module is movably disposed above the carrying platform and is used to capture images of the chip bonding area of the packaging unit arranged on the carrying platform. The processor is coupled to the image capture module to obtain a reference distance corresponding to the total distance based on the image, and calculate the difference between the reference distance and the standard distance. Based on the difference, the joint temperature of the bearing platform is determined and the temperature compensation value is calculated. , where when the absolute value of the difference is less than or equal to the preset difference, the joining temperature is the preset temperature value; when the absolute value of the difference is greater than the preset difference, the joining temperature is the preset temperature value and the temperature compensation value and.

An internal pin bonding method of the present invention includes the following steps. The flexible packaging tape with a plurality of packaging units is transported so that each packaging unit is sequentially arranged on the carrying platform, wherein each packaging unit has a chip bonding area and a plurality of inner pins located in the chip bonding area. The plurality of inner pins include a plurality of long-side inner pins arranged along two opposite long sides of the chip bonding area, and the plurality of long-side inner pins have a total spacing in a direction parallel to the two long sides, carrying The platform at least corresponds to the wafer bonding area of the packaging unit arranged on the carrying platform. The wafer is picked up and placed on the bonding head. The wafer has multiple bumps. Capture an image of the chip bonding area of the packaging unit arranged on the carrying platform. Obtain the reference distance corresponding to the total spacing based on the image. Calculate the difference between the reference distance and the standard distance. Determine the joint temperature of the bearing platform based on the difference and calculate the temperature compensation value. When the absolute value of the difference is less than or equal to the preset difference, the joint temperature is the preset temperature value. When the absolute value of the difference is greater than the preset difference, the joint temperature is the preset temperature. When , the joint temperature is the sum of the preset temperature value and the temperature compensation value. Adjust the temperature of the load bearing platform to the joint temperature. Applying pressure to the bonding head causes the chip to be placed in the chip bonding area of the packaging unit arranged on the carrying platform, and the plurality of bumps of the chip are correspondingly bonded to the plurality of inner pins.

Based on the above, the inner pin bonding device and bonding method of the present disclosure will adjust the bonding temperature of the carrying platform according to the total spacing of the long side inner pins of the packaging unit (corresponding to the reference distance of the long side inner pins), so that The configuration can ensure that when the chip is bonded to multiple packaging units with different total distances between the long side inner pins (corresponding to the reference distance of the long side inner pins), the distance between the inner pins of each packaging unit and the bumps of the chip is The offset of the bonding position can be maintained within the allowable range, and the bonding yield of the inner pins will not be affected by the expansion or contraction of the inner pins. Therefore, the internal pin bonding device and bonding method of the present disclosure can maintain consistent and stable internal pin bonding quality for multiple packaging units of the entire roll of flexible packaging tape, thereby improving the overall manufacturing yield.

The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of each embodiment with reference to the drawings. Directional terms mentioned in the following embodiments, such as "up", "down", "front", "back", "left", "right", etc., are only for reference to the directions in the attached drawings. Accordingly, the directional terms used are illustrative and not limiting of the invention. Furthermore, in the following embodiments, the same or similar elements will be given the same or similar numbers.

FIG. 1 is a schematic diagram of an internal pin bonding device according to an embodiment of the present invention. FIG. 2 is a partial schematic diagram of an internal pin bonding device according to an embodiment of the present invention. FIG. 3 is a schematic cross-sectional view of an inner pin of a chip bonding device according to an embodiment of the present invention. Please refer to FIGS. 1 to 3 simultaneously. In some embodiments, the inner pin bonding device 100 includes a carrying platform 110 , a pressing head 120 , an image capture module 130 , a temperature control module 140 and a processor 150 . In one embodiment, the carrying platform 110 may be used to carry the flexible packaging tape 200 , wherein the flexible packaging tape 200 may have a plurality of packaging units 220 arranged adjacent to each other. Each packaging unit 220 may have a chip bonding region R1 for the chip 300 to be disposed therein. Specifically, in this embodiment, each packaging unit 220 may include a flexible base material 221 and a plurality of circuits 222 provided on the flexible base material 221, wherein each circuit 222 has an inner pin 222a, And the inner pins 222a of the lines 222 are located in the chip bonding region R1. That is to say, each package unit 220 may have a plurality of inner pins 222a located in the chip bonding region R1 for the chip 300 to be bonded thereon. Further, referring to FIG. 3 , each package unit 220 may further include a solder mask 223 that partially covers a plurality of circuits 222 and exposes the chip bonding area R1 and the inner pins 222 a. In one embodiment, the flexible base material 221 can be an electrically insulating film made of, for example, polyimide (PI), which has the flexibility to bend at will to facilitate belt-and-roll conveyance. .

Please refer to FIGS. 1 and 3 simultaneously. In one embodiment, multiple packaging units 220 of the flexible packaging tape 200 can be sequentially transported to the carrying platform 110 via the conveying device 170 . For example, the conveying device 170 may include a conveying track 172 for carrying and conveying the flexible packaging tape 200 and two tape turntables 174 and 176 respectively disposed at opposite ends of the conveying track 172 . In this way, the two ends of the flexible packaging tape 200 can be wound on the tape turntables 174 and 176 respectively. By rotating the tape turntables 174 and 176, the flexible packaging tape 200 can be driven to move along the conveyor track 172 through tension. , so that each packaging unit 220 of the flexible packaging tape 200 is sequentially arranged on the carrying platform 110 . In this embodiment, the carrying platform 110 at least corresponds to the wafer bonding area R1 of the packaging unit 220 disposed on the carrying platform 110 to provide support for the wafer bonding area R1 of the packaging unit 220 in the subsequent internal pin bonding process.

Then, the wafer 300 can be picked up from the wafer Wf, for example, using a pick and place device (such as the die suction nozzle C), and the wafer 300 can be placed on the bonding head 120 , where the wafer 300 is picked up. The method may include vacuum suction, but is not limited to this. The chip 300 has a plurality of bumps 320 respectively corresponding to the inner pins 222a. For example, the bumps 320 may include electroplated bumps whose material may include gold, copper, nickel, silver, or any combination thereof.

In some embodiments, the pressing head 120 is movably disposed above the carrying platform 110 . Specifically, the position of the pressing head 120 may correspond to the packaging unit 220 configured on the carrying platform 110 . The pressing head 120 is used to receive the wafer 300, and after receiving the wafer 300, moves toward the carrying platform 110, and applies pressure to dispose the wafer 300 in the wafer bonding area R1 of the packaging unit 220, and the plurality of bumps on the wafer 300 320 are respectively joined to the plurality of inner pins 222a of the packaging unit 220.

Generally speaking, the chip 300 is bonded to the inner pins 222a by, for example, thermal pressing. That is, the pressing head 120 is heated to a preset temperature (for example, about 460°C~480°C) and receives the wafer 300. Then, the loading platform 110 The temperature is raised to a preset bonding temperature (for example, about 110° C. to 150° C.). Finally, the pressing head 120 applies pressure toward the bearing platform 110 to bond the bumps 320 on the chip 300 with the inner pins 222 a correspondingly. In some embodiments, the temperature control module 140 can be used to adjust the temperature of the carrying platform 110 to the bonding temperature. In one embodiment, the temperature control module 140 may be built into the carrying platform 110 , for example. In addition, the temperature control module 140 may include a temperature adjustment device such as a heater. With this configuration, the temperature control module 140 can be used to heat the carrying platform 110 to a predetermined bonding temperature to perform internal pin bonding.

FIG. 4 is a schematic diagram of a chip bonding area of a packaging unit according to an embodiment of the present invention. FIG. 5 is a schematic diagram of an image captured by an image capture module of an internal pin bonding device according to an embodiment of the present invention. It should be noted that the solder mask layer in Figure 4 is presented using a perspective drawing method to more clearly present the structure below it. Please refer to FIG. 2, FIG. 4 and FIG. 5. In some embodiments, the image capture module 130 is movably disposed above the carrying platform 110 and is used to capture the chip bonding of the packaging unit 220 arranged on the carrying platform 110. Image IM of area R1. Specifically, before using the pressure bonding head 120 to place the chip 300 in the chip bonding area R1, the image capture module 130 can first move above the carrying platform 110 to capture the image of the chip bonding area R1 of the packaging unit 220. IM. The image capturing module 130 may, for example, capture images of one or more areas (eg, positioning frames A1 and A2 shown in FIG. 4 ) in the chip bonding area R1. In this embodiment, the image capturing area may be located, for example, at two corners on a diagonal line of the chip bonding area R1. In other words, the image IM captured by the image capturing module 130 may be as shown in FIG. 4 It includes positioning frames A1 and A2 located at two corners on a diagonal line of the wafer bonding area R1. Of course, this embodiment is only for illustrative purposes, and the present disclosure does not limit the location and number of regions for capturing images. In addition, the image IM captured by the image capture module 130 (such as the positioning frames A1 and A2) can be used as a reference for alignment in the internal pin bonding process.

In one embodiment, the image capture module 130 of the internal pin bonding device 100 may have a plurality of image capture devices, which may be respectively disposed at two corners on a diagonal corresponding to the chip bonding region R1 to At the same time, the images IM of the two positioning frames A1 and A2 shown in Figure 5 are captured. Of course, in other embodiments, the image capture module 130 may also have an image capture device that can move freely between the two positioning frames A1 and A2 to capture the two images shown in Figure 5 respectively. Position the images IM of frames A1 and A2. Of course, this embodiment is only for illustration, and the image capture module 130 can capture one or more images at any position in the chip bonding area R1 according to actual needs.

Specifically, in this embodiment, the chip bonding region R1 of the packaging unit 220 has two opposite long sides and two opposite short sides corresponding to the chip 300 . The plurality of inner pins 222a of the packaging unit 220 may include a plurality of long-side inner pins 222a1 adjacently arranged along two long sides and a plurality of short-side inner pins 222a2 adjacently arranged along two short sides.

In this embodiment, each positioning frame A1 and A2 in the image IM captured by the image capture module 130 may include M long-side internal pins 222a1, and one edge of each positioning frame A1 and A2 is located at the Between the M long-side inner pins 222a1 and the M+1 long-side inner pin 222a1, where M is greater than 1. In addition, each positioning frame A1, A2 may also include N short side inner pins 222a2, and the other edge of each positioning frame A1, A2 is located between the Nth short side inner pin 222a2 and the N+1th short side. between internal pins 222a2, where N is greater than 1. In other words, each positioning frame A1 and A2 may include at least two long-side inner pins 222a1 and at least two short-side inner pins 222a2. For example, as shown in Figure 5, in this embodiment, each positioning frame A1, A2 includes six long-side inner pins 222a1 and two short-side inner pins 222a2, that is, M equals 6, N equal to 2. And one edge of each positioning frame A1, A2 (ie, the edge parallel to the long side inner pin 222a1) is located between the 6th long side inner pin 222a1 and the 7th (ie, 6+1) long side inner pin. 222a1, the other edge of each positioning frame A1, A2 (that is, the edge parallel to the short side inner pin 222a2) is located between the second short side inner pin 222a2 and the third (ie, the 2+1) short side between pins 222a2 within the edge. In other words, each positioning frame A1 and A2 is limited to include only 6 long-side inner pins 222a1 and 2 short-side inner pins 222a2. It is worth mentioning that the number of the long-side inner pins 222a1 and the short-side inner pins 222a2 included in the positioning frame A1 is the same as the number of the long-side inner pins 222a1 and short-side inner pins 222a2 included in the positioning frame A2. The numbers may be the same or different, and the present invention is not limited thereto.

Please refer to Figures 1, 4 and 5 at the same time. In one embodiment, the plurality of long-side inner pins 222a1 have a total spacing L in a direction parallel to the two long sides of the chip bonding area R1, that is, at the most The distance between the two outer long side inner pins 222a1 (the two long side inner pins 222a1 selected by the box Y1 and the box Y2 in Figure 4) in a direction parallel to the two long sides. In some embodiments, the processor 150 is coupled to the image capture module 130 to obtain the reference distance Lr corresponding to the total distance L according to the image IM captured by the image capture module 130 . In one embodiment, the reference distance Lr is the distance between the center points C1 and C2 of the two positioning frames A1 and A2 in a direction parallel to the two long sides. For example, in this embodiment, the processor 150 obtains the respective centers of the two positioning frames A1 and A2 based on the images IM captured by the image capture module 130 in the positioning frames A1 and A2 (as shown in FIG. 5 ). Points C1 and C2, the processor 150 can calculate the distance between the center points C1 and C2 in the direction parallel to the long side based on this to obtain the reference distance Lr. Since each positioning frame A1 and A2 is limited to include only M long-side inner pins 222a1 and N short-side inner pins 222a2, and each positioning frame A1 and A2 is set to a fixed size, when the multiple long-side pins of the packaging unit 220 When the inner pin 222a1 expands and deviates to both sides (that is, the total distance L is larger), the positioning frames A1 and A2 captured by the image capture module 130 will also move to both sides respectively. At this time, the processing The reference distance Lr obtained by the detector 150 based on the images IM of the positioning frames A1 and A2 will also be larger. On the contrary, when the multiple long-side inner pins 222a1 of the packaging unit 220 are retracted and shifted toward the center (that is, the total distance L is smaller), the positioning frames A1 and A2 will also move toward the center respectively. At this time, the obtained reference The distance Lr will also be smaller. Of course, the method used in this embodiment to obtain the reference distance Lr corresponding to the total spacing L of the long-side inner pins 222a1 is only for illustration, and the present disclosure does not limit the method of obtaining the reference distance Lr corresponding to the total spacing L. In other embodiments, the processor 150 may also directly obtain the total distance L, and use the total distance L to perform subsequent calculations.

FIG. 6 is a schematic diagram of the relationship between the reference distance of the inner pins and the bonding temperature of the loading platform calculated for multiple packaging units by the inner pin bonding method according to an embodiment of the present invention. Please refer to FIG. 1 and FIG. 6 . The multiple black dots in FIG. 6 respectively represent the multiple reference distances Lrn of the pins 222a1 in the long sides of the multiple package units 220 calculated by the processor 150 , where n is greater than zero. Positive integers, such as n = 1, 2, 3, 4, … (and so on). The processor 150 can calculate the difference Dn between each reference distance Lrn and the standard distance Lr0 of the reference distance Lrn of the pins 222a1 in the long sides of these packaging units 220 (ie, Dn = Lrn-Lr0). Specifically, in this embodiment, the internal pin bonding device 100 may further have a storage circuit 180 , which may be used to store standard (default) size information of the packaging unit 220 and/or the chip 300 , for example, these packaging units 220 The reference distance Lrn of the pin 222a1 within the long side is the standard distance Lr0, which is the standard distance between the center points C1 and C2 of the two positioning frames A1 and A2 in the direction parallel to the long side. In this way, the processor 150 is coupled to the storage circuit 180 to read the standard distance Lr0 of the pins 222a1 in the long sides of these packaging units 220, and compare it with the calculated reference distance Lrn of each packaging unit 220, so as to Get the difference Dn between the two.

In one embodiment, when the absolute value of the difference Dn between the calculated reference distance Lrn and the standard distance Lr0 is less than or equal to the preset difference D0, it represents the reference of the pin 222a1 in the long side of the package unit 220 The difference between the distance Lrn and the standard distance Lr0 is still within the allowable range. The controller 160 coupled to the processor 150 can control the temperature control module 140 accordingly to control the joint temperature Tn of the carrying platform 110 to the preset temperature value T0. In this embodiment, the preset temperature value T0 can also be stored in the storage circuit 180 . For example, as shown in the embodiment of block P1 in FIG. 6 , the absolute value of the calculated difference D1 between the reference distance Lr1 and the standard distance Lr0 of the long-side inner pin 222a1 is less than the preset difference D0. That is, the reference distance Lr1 falls within the allowable range (that is, between the upper limit of the reference distance UL and the lower limit of the reference distance LL). Therefore, the bonding temperature T1 of the carrying platform 110 is controlled at the preset temperature value T0.

In one embodiment, when the absolute value of the difference Dn is greater than the preset difference D0, it means that the difference between the reference distance Lrn and the standard distance Lr0 of the long side pin 222a1 of the package unit 220 has exceeded the allowable range (i.e. Higher than the upper limit of the reference distance UL or lower than the lower limit of the reference distance LL). At this time, the processor 150 can calculate the temperature compensation value Tcn based on the difference Dn, and the controller 160 can control the temperature control module 140 accordingly to set the joint temperature Tn of the carrying platform 110 to the preset temperature value T0 and the temperature compensation value. The sum of the values Tcn. For example, as shown in the embodiment of block P2 in FIG. 6 , when the absolute value of the difference D2 is greater than the preset difference D0 and the difference D2 is a negative value, it means that the long side of the packaging unit 220 is within The reference distance Lr2 of the pin 222a1 is less than the standard distance Lr0, and the difference between the two exceeds the allowable range, that is, the reference distance Lr2 is lower than the allowable reference distance lower limit LL. In this case, if the bonding temperature of the bearing platform 110 is still controlled at the preset temperature value T0, it may cause the long-side inner pin 222a1 to be bonded to the corresponding bump 320 and deviate from the predetermined bonding position (ie, toward the predetermined bonding position). center offset of wafer 300). Therefore, the processor 150 will calculate a positive temperature compensation value Tc2 based on the difference D2, that is, the joint temperature T2 of the carrying platform 110 (the sum of the preset temperature value T0 and the temperature compensation value Tc2) is adjusted to be higher than Preset temperature value T0. By increasing the bonding temperature T2 of the bearing platform 110, the expansion amount of the flexible base material 221 due to thermal expansion becomes larger to compensate for the originally too small reference distance Lr2 ( Corresponds to the total spacing L) of the pins 222a1 within the long side.

On the contrary, as shown in the embodiment of block P3 in FIG. 6 , when the absolute value of the difference D3 is greater than the preset difference D0 and the difference D3 is a positive value, it means that the long side of the package unit 220 is internally leaded. The reference distance Lr3 of the foot 222a1 is greater than the standard distance Lr0, and the difference between the two exceeds the allowable range, that is, the reference distance Lr3 is higher than the allowable upper limit of the reference distance UL. In this case, if the bonding temperature of the carrying platform 110 is still controlled at the preset temperature value T0, it may cause the position of the long side inner pin 222a1 to be bonded to the corresponding bump 320 to be outwardly deviated from the predetermined bonding position (ie, toward the predetermined bonding position). The two sides of the wafer 300 are offset). Therefore, the processor 150 will calculate a negative temperature compensation value Tc3 based on the difference D3, that is, the joint temperature T3 of the carrying platform 110 (the sum of the preset temperature value T0 and the temperature compensation value Tc3) is adjusted to be lower than Preset temperature value T0. By lowering the bonding temperature T3 of the load-bearing platform 110, the amount of expansion of the flexible base material 221 due to thermal expansion is reduced to compensate for the originally excessive reference distance Lr3 ( Corresponds to the total spacing L) of the pins 222a1 within the long side.

After the processor 150 obtains the bonding temperature Tn of the bearing platform 110 according to the above method and adjusts the temperature of the bearing platform 110 to the obtained bonding temperature Tn, the controller 160 coupled to the processor 150 can control the pressing head 120 toward the bearing platform. 110 moves and applies pressure to the pressing head 120 to dispose the chip 300 in the chip bonding area R1 of the packaging unit 220, and the bumps 320 of the chip 300 are correspondingly bonded with the inner pins 222a of the packaging unit 220.

FIG. 7 is a schematic curve diagram of the reference distance of the inner pins, the joint temperature of the bearing platform, and the offset of the inner pins in three different scenarios in FIG. 6 . Specifically, FIG. 7 is a schematic diagram of three different scenarios corresponding to the embodiment of blocks P1, P2 and P3 of FIG. 6 . For example, please refer to Figure 7. The reference distance Lr1 of the long side pin 222a1 falls within the allowable range (box P1), and the reference distance Lr2 of the long side pin 222a1 is less than the allowable reference distance lower limit LL ( Box P2) and the three embodiments in which the reference distance Lr3 of the long side inner pin 222a1 is greater than the allowable upper limit of the reference distance UL (box P3) respectively control the bonding temperature T1 of the carrying platform 110 at the preset temperature value T0 , the bonding temperature T2 is adjusted to be higher than the preset temperature value T0 and the bonding temperature T3 is adjusted to be lower than the preset temperature value T0. In this case, the inner pin 222a of the three embodiments is measured after the bump 320 is bonded. The bonding position of the long-side inner pin 222a1 may have a relatively consistent offset S0, where the offset S0 may be an allowable offset range of the long-side inner pin 222a1. Therefore, the inner pin bonding device 100 and the bonding method of the present disclosure can ensure that the chip 300 has multiple packages with differences in the reference distance Lrn from the long side inner pins 222a1 (corresponding to the total spacing L of the long side inner pins 222a1). When the unit 220 is joined, the offset of the inner pins 222a (especially the long-side inner pins 222a1) after joining the bumps 320 can be maintained within the allowable range, and will not be caused by the outward expansion or inner deflection of the inner pins 222a. Shrinkage offset affects the yield of internal pin bonding, so as to maintain a more consistent and stable internal pin bonding quality.

Please refer to FIG. 6 again. When the processor 150 compensates the bonding temperature Tn of the bearing platform 110 according to the above-mentioned difference Dn (that is, the bonding temperature is adjusted to be higher or lower than the preset temperature value T0), and the pressing head 120 After the bumps 320 of the chip 300 are bonded to the inner pins 222a correspondingly, the processor 150 will adjust the bonding temperature Tn of the carrying platform 110 back to the preset temperature value T0, and then proceed to bond the inner pins of the next package unit 220. However, in some embodiments, when the bonding temperature Tn of the carrying platform 110 is adjusted to the sum of the preset temperature value T0 and the temperature compensation value Tcn for the consecutive When the compensation values Tcn are all positive values (that is, the joint temperatures are adjusted to be higher than the preset temperature value T0) or are both negative values (that is, the joint temperatures are adjusted to be lower than the preset temperature value T0), the processor 150 will The bonding temperature Tn of the X consecutive package units 220 is calculated and changed to the preset temperature value, for example, the preset temperature value is changed to the average value of the bonding temperature Tn of the X consecutive package units 220 . In one embodiment, X may be greater than or equal to 3, for example. Afterwards, the subsequent inner pin bonding of the packaging unit 220 is continued with this modified preset temperature value T0'. For example, as shown in the embodiment of block P4 in FIG. 6 , in block P4, the reference distances Lr4-1, Lr4-2, Lr4-3 of the long-side inner pins 222a1 of three consecutive packaging units 220 and The absolute values of the differences D4-1, D4-2 and D4-3 between the standard distances Lr0 are all greater than the preset difference D0 and these differences D4-1, D4-2 and D4-3 are all positive values, also That is, the reference distances Lr4-1, Lr4-2, and Lr4-3 of the long-side internal pins 222a1 of three consecutive package units 220 are all greater than the allowable upper limit of the reference distance UL. In this case, the processor 150 will perform three consecutive measurements based on these values. The difference values D4-1, D4-2, and D4-3 are used to calculate the temperature compensation values Tc4-1, Tc4-2, and Tc4-3, all of which are negative, and the temperature control module 140 will also carry the load three times in a row. The temperature of the platform 110 is adjusted to the joining temperatures T4-1, T4-2, and T4-3 that are less than the preset temperature value T0 (the sum of the preset temperature value T0 and the temperature compensation values Tc4-1, Tc4-2, and Tc4-3) . When the temperature of the bearing platform 110 is lowered to the bonding temperatures T4-1 and T4-2 for the first two times, the processor 150 will adjust the bonding temperature Tn of the bearing platform 110 back to the preset temperature value T0 after completing the inner pin bonding process. , and then the inner pin bonding of the next package unit 220 is performed. However, after the temperature of the carrying platform 110 is lowered to the bonding temperature T4-3 for the third time and the inner pin bonding process is completed, the subsequent packaging unit 220 will be determined to be the reference distance Lrn of the long side inner pin 222a1 (corresponding to The total spacing L) of the pins on the long side all changes in the same direction, that is, the reference distance Lrn of the pins 222a1 on the long side is greater than the allowable upper limit of the reference distance UL. Therefore, the processor 150 changes the original preset temperature value T0 to the joining temperatures T4-1, T4-2, and T4-3 of the three packaging units 220. The average value of T4-2 and T4-3. Afterwards, the processor 150 uses the modified preset temperature value T0' to perform subsequent internal pin bonding of the packaging unit 220.

In summary, the inner pin bonding device and bonding method of the present disclosure will adjust the bonding temperature of the carrying platform according to the total spacing of the long side inner pins of the packaging unit (corresponding to the reference distance of the long side inner pins). , such a configuration can ensure that when the chip is bonded to multiple packaging units with different total distances between the long side inner pins (corresponding to the reference distance of the long side inner pins), the inner pins of each packaging unit are connected to the convex surfaces of the chip. The offset of the bonding position of the block can be maintained within the allowable range, and the yield of the bonding of the inner pins will not be affected by the expansion or contraction of the inner pins. Therefore, the internal pin bonding device and bonding method of the present disclosure can maintain consistent and stable internal pin bonding quality for multiple packaging units of the entire roll of flexible packaging tape, thereby improving the overall manufacturing yield.

12: Long side inner pin 20:wafer 22: Bump 100:Inner pin bonding device 110: Bearing platform 120: Pressing head 130:Image capture module 140:Temperature control module 150:processor 160:Controller 170;Conveying device 172;Conveyor track 174, 176: Tape turntable 180:Storage circuit 200: Flexible packaging tape and reel 220:Packaging unit 221: Flexible substrate 222:Line 222a:Inner pin 222a1: Long side inner pin 222a2: short side inner pin 223: Solder mask 300:wafer 320: Bump A1, A2: positioning frame C: Grain suction nozzle C1, C2: center point D1, D2, D3, D4-1, D4-2, D4-3: difference D0: preset difference value L, L1, L2, L3: total spacing Lr, Lr1, Lr2, Lr3, Lr4-1, Lr4-2, Lr4-3: reference distance Lr0: standard distance IM:image P1, P2, P3, P4: box R1: Wafer bonding area S0: offset T1, T2, T3, T4-1, T4-2, T4-3: joining temperature T0, T0’: preset temperature value Tc2, Tc3, Tc4-1, Tc4-2, Tc4-3: temperature compensation value Y1, Y2: box UL: upper limit of reference distance LL: Reference distance lower limit Wf: wafer

FIG. 1 is a schematic diagram of an internal pin bonding device according to an embodiment of the present invention. FIG. 2 is a partial schematic diagram of an internal pin bonding device according to an embodiment of the present invention. FIG. 3 is a schematic cross-sectional view of an inner pin of a chip bonding device according to an embodiment of the present invention. FIG. 4 is a schematic diagram of a chip bonding area of a packaging unit according to an embodiment of the present invention. FIG. 5 is a schematic diagram of an image captured by an image capture module of an internal pin bonding device according to an embodiment of the present invention. FIG. 6 is a schematic diagram of the relationship between the reference distance of the inner pins and the bonding temperature of the loading platform calculated for multiple packaging units by the inner pin bonding method according to an embodiment of the present invention. FIG. 7 is a schematic curve diagram of the reference distance of the inner pins, the joint temperature of the bearing platform, and the offset of the inner pins in three different scenarios in FIG. 6 . 8 is a schematic diagram of internal pin bonding in three different scenarios according to the internal pin bonding method of the prior art.

D1, D2, D3, D4-1, D4-2, D4-3: difference

D0: preset difference value

Lr1, Lr2, Lr3, Lr4-1, Lr4-2, Lr4-3: reference distance

Lr0: standard distance

P1, P2, P3, P4: box

T1, T2, T3, T4-1, T4-2, T4-3: bonding temperature

T0, T0’: preset temperature value

Tc2, Tc3, Tc4-1, Tc4-2, Tc4-3: temperature compensation value

UL: upper limit of reference distance

LL: Reference distance lower limit

Claims (13)

An internal pin bonding device including: A carrying platform for carrying a flexible packaging tape, wherein the flexible packaging tape has a plurality of packaging units, each of the packaging units has a chip bonding area and a plurality of inner leads located in the chip bonding area. The plurality of inner pins include a plurality of long-side inner pins arranged along two opposite long sides of the chip bonding area, and the plurality of long-side inner pins are arranged in a direction parallel to the two long sides. With a total spacing, each of the packaging units is sequentially arranged on the carrying platform, and the carrying platform at least corresponds to the chip bonding area of the packaging unit arranged on the carrying platform; A pressing head is used to receive a wafer and is movably disposed above the carrying platform and corresponds to the packaging unit arranged on the carrying platform. The pressing head is used to move toward the carrying platform and apply a pressure to make the The chip is disposed in the chip bonding area of the packaging unit, and the plurality of bumps on the chip are correspondingly bonded with the plurality of internal pins; a temperature control module for adjusting the temperature of the bearing platform to a joint temperature; An image capture module is movably disposed above the carrying platform and used to capture an image of the chip bonding area of the packaging unit disposed on the carrying platform; and A processor coupled to the image capture module for obtaining a reference distance corresponding to the total distance based on the image, and calculating a difference between the reference distance and a standard distance, and making a judgment based on the difference. The joining temperature of the bearing platform is used to calculate a temperature compensation value. When the absolute value of the difference is less than or equal to a preset difference, the joining temperature is a preset temperature value. When the absolute value of the difference is greater than When the preset difference value is used, the joining temperature is the sum of the preset temperature value and the temperature compensation value. The inner pin bonding device as claimed in claim 1, wherein the total spacing is the distance between the outermost two long side inner pins in a direction parallel to the two long sides. The internal pin bonding device of claim 1, wherein when the absolute value of the difference is greater than the preset difference and the difference is a positive value, the temperature compensation value is a negative value, and when the difference is When the absolute value is greater than the preset difference and the difference is negative, the temperature compensation value is positive. The internal pin bonding device of claim 1, wherein the image includes two positioning frames located at two corners of a diagonal line of the wafer bonding area, and the reference distance is where the center points of the two positioning frames are at The distance in a direction parallel to the two long sides. The inner pin bonding device as described in claim 4, wherein each positioning frame includes M long-side inner pins, and an edge of each positioning frame is located between the M-th long-side inner pin and the M-th long-side inner pin. +1 between pins within this long side, where M is greater than 1. The inner pin bonding device of claim 5, wherein the wafer bonding area further has two opposite short sides and the plurality of inner pins further includes a plurality of short side inner leads arranged along the two short sides. Each positioning frame also includes N short side inner pins, and the other edge of each positioning frame is located between the Nth short side inner pin and the N+1 short side inner pin. between, where N is greater than 1. An internal pin bonding method including: A flexible packaging tape with a plurality of packaging units is transported so that each packaging unit is sequentially arranged on a carrying platform, wherein each packaging unit has a chip bonding area and a plurality of internal components located in the chip bonding area. Pins, the plurality of inner pins include a plurality of long-side inner pins arranged along two opposite long sides of the wafer bonding area, and the plurality of long-side inner pins are arranged in a direction parallel to the two long sides. There is a total spacing on the carrying platform, and the carrying platform at least corresponds to the chip bonding area of the packaging unit configured on the carrying platform; Picking up a wafer and placing it on a bonding head, the wafer has a plurality of bumps; Capture an image of the chip bonding area of the packaging unit disposed on the carrying platform; Obtain a reference distance corresponding to the total distance based on the image; Calculate a difference between the reference distance and a standard distance; Determine a joint temperature of the bearing platform based on the difference and calculate a temperature compensation value. When the absolute value of the difference is less than or equal to a preset difference, the joint temperature is a preset temperature value. When the difference When the absolute value of the value is greater than the preset difference value, the joint temperature is the sum of the preset temperature value and the temperature compensation value; adjusting the temperature of the bearing platform to the joining temperature; and Applying a pressure to the pressure bonding head causes the chip to be placed in the chip bonding area of the packaging unit disposed on the carrying platform, and the plurality of bumps of the chip are correspondingly bonded to the plurality of inner pins. The inner pin bonding method as described in claim 7, wherein the total spacing is the distance between the outermost two long side inner pins in a direction parallel to the two long sides. The inner pin bonding method as described in claim 7, wherein when the absolute value of the difference is greater than the preset difference and the difference is a positive value, the temperature compensation value is a negative value, and when the difference is When the absolute value is greater than the preset difference and the difference is negative, the temperature compensation value is positive. The internal pin bonding method as described in claim 7, wherein the image includes two positioning frames located at two corners of a diagonal line of the wafer bonding area, and the reference distance is that the center points of the two positioning frames are at The distance in a direction parallel to the two long sides. The inner pin bonding method as described in claim 10, wherein each positioning frame includes M long-side inner pins, and one edge of each positioning frame is located between the M-th long-side inner pin and the M-th long-side inner pin. +1 between pins within this long side, where M is greater than 1. The inner pin bonding method of claim 11, wherein the wafer bonding area also has two opposite short sides and the plurality of inner pins further include a plurality of short side inner pins arranged along the two short sides. Each positioning frame also includes N short side inner pins, and the other edge of each positioning frame is located between the Nth short side inner pin and the N+1 short side inner pin. between, where N is greater than 1. The internal pin bonding method as described in claim 7, wherein when the bonding temperature of the carrying platform is adjusted to the sum of the preset temperature value and the temperature compensation value for the consecutive X package units, the preset Assume that the temperature value is changed to the average value of the bonding temperatures of the X consecutive package units, where X is greater than or equal to 3.

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