TWI796166B - Apparatus and method for attaching heat dissipation sheet - Google Patents

Abstract

An apparatus for attaching heat dissipation sheet includes a package tape transmitting device, a suction head and an elevating platform. The package tape transmitting device is configured to carry and transmit a package structure of the package tape to a working area. The suction head is movably disposed above the working area and configured to suck a heat dissipation sheet and press and place the heat dissipation sheet on the package structure. The suction head includes a cavity corresponding to an encapsulated chip of the package structure. When the suction head presses and places the heat dissipation sheet on the package structure, a plurality of side surfaces of the encapsulated chip are surrounded by a plurality of sidewalls of the cavity. The elevating platform is disposed at the working area and below the package tape to jack up the package tape and the suction head so that the heat dissipation sheet is attached to the package structure.

Description

Heat dissipation patch bonding equipment and heat dissipation patch bonding method

The present disclosure relates to a heat dissipation patch bonding equipment and a heat dissipation patch bonding method.

In order to improve the heat dissipation effect of the current Chip on Film (COF) structure, a method of attaching a heat dissipation patch to the surface of the COF structure is used to increase the heat dissipation area and improve the heat dissipation effect. Since the chip is the most important heat source of the thin film chip-on-chip packaging structure, attaching the heat dissipation patch to the flexible film in the chip and its surrounding area can achieve the most direct and optimal heat dissipation effect.

In the conventional technology, when attaching the heat dissipating patch on the die (hereinafter referred to as the encapsulated die) of the film-on-chip packaging structure, because the height difference between the die-encapsulated die and the flexible film is different, in order to avoid When the pick-up head presses down to attach the heat-dissipating chip to the film-on-chip packaging structure, the chip will be damaged due to pressure contact. Then use the roller with the groove in the center corresponding to the sealant wafer to roll along the long side of the sealant wafer to roll the part of the heat dissipation patch located on both sides of the long side of the sealant wafer, so that the heat dissipation patch and the film cover The crystal package structure is tightly bonded together. However, the part of the heat dissipation patch located on both sides of the short side of the encapsulated chip is not rolled by the rollers, so that the heat dissipation patch is prone to defects such as peeling or wrinkles in this area, which affects the heat dissipation efficiency and even reduces the product yield. The reliability of the package structure.

The present disclosure provides a heat dissipation patch bonding equipment and a heat dissipation patch bonding method, which can closely bond the heat dissipation patch and the packaging structure, thereby improving heat dissipation efficiency and product yield.

A heat dissipation patch laminating device disclosed in the present disclosure includes a packaging tape conveying device, a patch suction head, and a lifting platform. The packaging tape conveying device is used to carry and transport the packaging structure of the packaging tape to the working area. The patch suction head is movably arranged above the working area and is configured to suck the heat dissipation patch and press the heat dissipation patch on the packaging structure, wherein the patch suction head has a notch corresponding to the encapsulated wafer of the packaging structure, when When the chip suction head presses the heat dissipation chip on the package structure, multiple side surfaces of the encapsulated chip are surrounded by multiple side walls of the notch. The lifting platform is set in the working area and under the packaging tape to lift the packaging tape and the patch suction head upwards, so that the heat dissipation patch is attached to the packaging structure.

A bonding method of heat dissipation patches disclosed in the present disclosure includes the following steps. The packaging reel is carried by the packaging reel conveying device and the packaging structure of the packaging reel is delivered to the working area. Use the patch suction head to suck up the heat dissipation patch and move it to the top of the working area, wherein the patch suction head has a notch. Move the patch suction head that absorbs the heat dissipation patch towards the direction of the working area to the patch suction head to press the heat dissipation patch on the package structure, wherein when the patch suction head presses the heat dissipation patch on the package structure, Multiple side surfaces of the encapsulated chip of the packaging structure are surrounded by multiple sidewalls of the recess. Use the lifting platform to lift the packaging tape and the chip suction head so that the heat dissipation chip can be attached to the package structure.

Based on the above, the patch suction head of the heat dissipation patch bonding equipment of the present disclosure has a notch corresponding to the encapsulated wafer of the package structure. When the patch suction head presses the heat dissipation patch on the package structure, The multiple side surfaces are respectively surrounded by multiple sidewalls of the notch, so that the notch and the packaging structure jointly form a closed space for accommodating the encapsulated chip. In this way, through the design of the notch corresponding to the encapsulated wafer on the patch suction head, and the multiple side surfaces of the encapsulated wafer are surrounded by the multiple side walls of the notch, the surface of the patch suction head can place the heat dissipation patch on the surface of the chip. The part around the encapsulated chip is fully pressed on the package structure, so that it completely covers the encapsulated chip, so as to prevent or reduce the peeling of the heat sink and the package structure due to poor bonding, resulting in peeling off of the heat sink or wrinkles, etc. Problem, therefore, the heat dissipation patch bonding equipment and bonding method disclosed in this disclosure can effectively improve the heat dissipation efficiency and reliability of the packaging structure.

In addition, in the heat dissipation chip attachment method of the present disclosure, the chip suction head is moved down to place the heat dissipation chip on the packaging structure with light pressure initially. Then, the lifting platform moves upwards to lift the packaging tape and the pick-up head, and the force of the pick-up head and the lifting platform in the opposite direction clamps each other, so that the heat dissipation patch can be tightly attached to the package Structurally, it omits the step of rolling the heat-dissipating patch in the traditional manufacturing process to closely attach the heat-dissipating patch to the package structure, thereby simplifying the heat-dissipating patch bonding process.

The aforementioned and other technical contents, features and effects of the present disclosure will be clearly presented in the following detailed descriptions of the embodiments with reference to the drawings. The directional terms mentioned in the following embodiments, such as "upper", "lower", "front", "rear", "left", "right", etc., are only referring to the directions of the attached drawings. Accordingly, the directional terms used are for illustration, not for limitation of the present disclosure. Also, in the following embodiments, the same or similar components will be given the same or similar symbols.

FIG. 1 is a partial schematic diagram of a thermal patch bonding equipment according to an embodiment of the present disclosure. FIG. 2 is a schematic diagram of a packaging tape conveying device of a heat dissipation chip bonding equipment carrying and conveying a packaging tape according to an embodiment of the present disclosure. Please refer to FIG. 1 and FIG. 2 at the same time. In some embodiments, the heat dissipation patch bonding equipment 100 may include a packaging tape conveyor 110 , a patch suction head 130 and a lifting platform 120 . In this embodiment, the packaging tape conveying device 110 may include a conveying track for carrying and conveying the packaging tape 201 , which may be composed of a first rail frame 111 and a second rail frame 113 . In this embodiment, the first rail frame 111 and the second rail frame 113 can be respectively located on opposite sides of the packaging tape 201 to jointly carry the packaging tape 201 . In this embodiment, the packaging and tape conveying device 110 further includes two tape and tape carousels 114, 116, which are respectively arranged at opposite ends of the conveying track defined by the first rail frame 111 and the second rail frame 113, and the packaging tape The two ends of the tape 201 can be wound on the take-up turntables 114 and 116 respectively, and by rotating the take-up turntables 114 and 116, the packaging tape 201 can be driven to move along the conveying track through the tension, and the packaging tape 201 can move more Each packaging structure 200 is sequentially delivered to a working area 112 in the conveying track. In this embodiment, the packaging structure 200 can be a chip-on-film packaging structure, and the packaging tape 201 can include a film substrate 210, a plurality of packaging units 211 defined on the film substrate 210, and respectively arranged on these packaging units 211 A plurality of encapsulated wafers 220 in. These encapsulation units 211 are spaced apart and arranged in sequence on the film substrate 210 , and each encapsulation unit 211 has a patterned metal layer (not shown) formed on the film substrate 210 inside. In more detail, in this embodiment, each packaging structure 200 is each packaging unit 211 provided with a molded chip 220 . In other words, the packaging structure 200 includes a film substrate 210 , a patterned metal layer, and an encapsulated chip 220 electrically connected to the patterned metal layer. In addition, in this embodiment, the packaging tape 201 is transported with the molded wafer 220 facing upwards.

In one embodiment, the heat dissipation patch bonding equipment 100 may further include a heat dissipation patch conveying device 150 , which may be disposed adjacent to the working area 112 of the package tape and tape conveying device 110 . So configured, the patch suction head 130 is movably arranged above the working area 112, and is configured to suck the heat dissipation patch 300 on the heat dissipation patch delivery device 150, and press the heat dissipation patch 300 on the working area 112 on the encapsulation structure 200 within. Specifically, when the packaging structure 200 on the packaging tape 201 is transported to the working area 112 by the packaging tape conveying device 110, the patch suction head 130 can move back and forth between the heat dissipation chip conveying device 150 and the working area 112, In order to press the heat dissipation patch 300 on the package structure 200 located in the working area 112 . For example, the patch suction head 130 can be pivoted on multiple axial movement mechanisms (such as X-axis movement mechanism, Y-axis movement mechanism, and Z-axis movement mechanism) by a rotation mechanism (such as a rotation motor) 160, so that The sheet suction head 130 can slide along multiple axial directions (for example, the X-axis direction, the Y-axis direction, and the Z-axis direction). Moreover, the rotating mechanism 160 can be used to rotate the patch suction head 130 and the rotating mechanism 160 can rotate around the Z-axis direction of the Z-axis moving mechanism, and then rotate the heat-dissipating patch 300 on the heat-dissipating patch conveying device 150 For the package structure 200 located in the working area 112 .

In one embodiment, the lifting platform 120 can be set in the working area 112 and under the packaging tape 201, so as to lift the packaging tape 201 and the chip suction head 130 upwards, so that the heat dissipation chip 300 can be attached to the package. Structure 200. In this embodiment, the lifting platform 120 can move along the Z-axis direction, for example. In other words, when the chip suction head 130 presses the heat dissipation chip 300 on the package structure 200 located in the working area 112 , the lifting platform 120 can take the packaging tape 201 located in the working area 112 and the chip suction head 130 Together, they are lifted along the Z-axis direction, so that the chip suction head 130 can obtain a resisting force in the opposite direction, so that the heat dissipation chip 300 can be more tightly attached to the package structure 200 .

FIG. 3 is a schematic cross-sectional view of a package tape conveying device carrying a package tape of a heat dissipation chip bonding equipment according to an embodiment of the present disclosure. Please refer to FIG. 2 and FIG. 3 at the same time. In this embodiment, the first rail frame 111 and the second rail frame 113 can respectively have an L-shaped cross-sectional shape, and the opposite sides of the packaging tape 201 can be shown in FIG. 3 respectively. The ground rests on the L-shaped platform portions of the first rail frame 111 and the second rail frame 113 . In one embodiment, the opposite sides of the packaging tape 201 are transmission areas, and the transmission area may include a plurality of transmission holes 212 arranged in succession at a fixed interval, and the packaging tape 201 is supported by the transmission area on the first The platforms of the first rail frame 111 and the second rail frame 113 are used to reduce the friction area between the packaging tape 201 and the first rail frame 111 and the second rail frame 113 , thereby reducing the probability of static electricity and metal particles. In addition, please refer to FIG. 3 , in the present embodiment, the encapsulated wafer 220 is an encapsulated wafer structure, which may include a wafer 221 and an encapsulant 222 . The encapsulant 222 is filled between the chip 221 and the film substrate 210 and covers the sidewall of the chip 221, so as to protect the chip 221 and the electrical contact between the chip 221 and the film substrate 210, and prevent moisture or foreign matter from entering the bonding of the chip 221 inside the area. In this embodiment, the material of the encapsulant 222 may be, for example, underfill, and the method of forming the encapsulant 222 may be, for example, dispensing.

FIG. 4 is a schematic bottom view of a patch suction head of a thermal patch bonding device according to an embodiment of the present disclosure. FIG. 5 is a schematic top view of a package structure with heat dissipation pads attached according to an embodiment of the present disclosure. Please refer to FIG. 4 and FIG. 5 at the same time, wherein FIG. 5 shows one of the packaging structures 200 on the packaging tape 201 as an example. In this embodiment, the pick-up head 130 may include a notch 132 corresponding to the encapsulated wafer 220 of the package structure 200 , and the notch 132 is formed on the surface 131 of the pick-up head 130 facing the package structure 200 . In addition, in this embodiment, the patch suction head 130 can be a vacuum suction pressing head. In more detail, the surface 131 of the patch suction head 130 can have a plurality of vacuum holes 138, so as to use vacuum suction to make the heat dissipation paste The sheet 300 is firmly adsorbed on the surface 131 of the patch suction head 130 . In this embodiment, the package structure 200 may further include a solder resist layer 230 , and the solder resist layer 230 partially covers the patterned circuit layer and exposes a region where the chip 221 is disposed. As shown in FIG. 5 , when the heat dissipation chip 300 is attached to the package structure 200 , the heat dissipation chip 300 is attached to the encapsulated chip 220 and the solder resist layer 230 around the encapsulated chip 220 .

FIG. 6 to FIG. 8 are schematic flowcharts of a method for attaching a heat dissipation patch using a heat dissipation patch bonding equipment according to an embodiment of the present disclosure. Please refer to FIG. 1 and FIG. 6 first. During the process of attaching the heat dissipation patch 300 to the surface of the package structure 200 with the encapsulated wafer 220, the package tape conveying device 110 will transport the package structure 200 to be operated to the working area. 112. At this time, the patch suction head 130 can move back and forth between the heat dissipation patch conveying device 150 and the working area 112 as shown in FIG. 1 to absorb the heat dissipation patch 300 on the heat dissipation patch conveying device 150 And move to the top of the working area 112 , and calculate the attachment position through the image capture device and the information processing device, so as to align the heat dissipation patch 300 on the package structure 200 .

Please refer to Fig. 4, Fig. 5 and Fig. 7 at the same time, and then, move the patch suction head 130 that sucks the heat dissipation patch 300 toward the direction of the working area 112 (that is, the first direction D1) until the patch suction head 130 takes the heat dissipation patch The sheet 300 is pressed onto the encapsulation structure 200 . When the chip suction head 130 presses the heat dissipation chip 300 on the package structure 200, the multiple side surfaces 223 (for example, four side surfaces 223) of the encapsulated wafer 220 are respectively pressed by the multiple side walls 134 (for example, the four side surfaces 223) of the notch 132 surrounded by four side walls 134). More specifically, the multiple side surfaces 223 of the encapsulated chip 220 are formed by the encapsulant 222 covering the sidewall of the chip 221 . Furthermore, as shown in FIGS. 5 and 7 , the shortest distance between each side wall 134 of the notch 132 and the corresponding side surface 223 of the encapsulated wafer 220 is greater than zero, that is, each side wall 134 of the notch 132 does not It contacts the corresponding side surface 223 of the encapsulated wafer 220 . For example, in this embodiment, the encapsulated wafer 220 has four side surfaces 223 , and the recess 132 has four corresponding sidewalls 134 . The shortest distances d1, d2, d3, d4 between the four sidewalls 134 of the notch 132 and the corresponding four side surfaces 223 of the encapsulated wafer 220 are all greater than zero, wherein the shortest distances d1, d2, d3, d4 All can be equal or all can be unequal, and can also be equal in pairs, for example, the shortest distance d1 is equal to the shortest distance d3, and the shortest distance d2 is equal to the shortest distance d4, which is not limited by the present invention. With such a configuration, when the chip pick-up head 130 presses the heat dissipation chip 300 on the package structure 200 , the notch 132 and the package tape 201 together form a closed space S1 for accommodating the encapsulated chip 220 . Further, when the chip pick-up head 130 presses the heat dissipation chip 300 on the package structure 200 , the heat dissipation chip 300 conforms to the notch 132 to form an accommodating space S2 to cover the encapsulated chip 220 . Other areas of the heat dissipation chip 300 other than the corresponding notches 132 can be pressed against the surface 131 of the chip suction head 130 , and are pressed flatly on the package structure 200 . In other words, the parts of the heat dissipation chip 300 beside the four side surfaces 223 of the encapsulated chip 220 can be pressed against by the surface 131 of the chip suction head 130 . Therefore, through the design of the notch 132 corresponding to the encapsulated wafer 220 on the patch suction head 130, and the four side surfaces 223 of the encapsulated wafer 220 are surrounded by the four side walls 134 of the notch 132, the chip pickup head The surface 131 of 130 can fully press the part of the heat dissipation patch 300 located around the encapsulated wafer 220 on the package structure 200, so that it can completely cover the encapsulated wafer 220, preventing the heat dissipation patch 300 from being bonded to the package structure 200. Defects may lead to problems such as peeling or wrinkling of the heat dissipation patch 300 , so as to effectively improve the heat dissipation efficiency and reliability of the package structure 200 .

Please refer to FIG. 7 and FIG. 8 at the same time. When the chip suction head 130 moves along the first direction D1 to press the heat dissipation chip 300 on the packaging structure 200, the chip suction head 130 presses the packaging tape 201 downwards to The first height is h1, and the heat dissipation patch 300 is placed on the package structure 200 with light pressure. Next, the lifting platform 120 lifts the packaging tape 201 and the chip suction head 130 along the second direction D2, so that the heat dissipation chip 300 is closely attached to the package structure 200 . At this time, the patch suction head 130 is located at a second height h2 higher than the first height h1. That is to say, the patch suction head 130 first moves down until the heat dissipation patch 300 is placed on the packaging structure 200 with light pressure, at this time, the chip suction head 130 and the packaging structure 200 move down to the first height h1. Then, the lifting platform 120 moves upwards to push against and lift the packaging tape 201 and the patch suction head 130 to the second height h2, by the downward pressure of the patch suction head 130 and the upward force of the lifting platform 120 The abutting forces clamp each other, so that the heat dissipation patch 300 can be closely attached to the package structure 200 . In the present invention, the lifting platform 120 is used to provide the force of pushing up and causing a close fit. Since the lifting platform 120 has a large flat surface, the force can be more uniform. Therefore, the heat dissipation patch 300 and the packaging structure 200 can be improved. Fit quality.

It is worth mentioning that in order to meet the bending requirements of the film-on-chip packaging structure in subsequent applications and maintain its flexibility, a flexible thin heat dissipation patch is generally used, and its structure usually includes a heat dissipation layer, An insulating protective layer attached to one surface of the heat dissipation layer and a bottom adhesive layer formed on the other surface of the heat dissipation layer. The material of the insulating protection layer may be flexible material such as polyimide (PI), which is used to protect the heat dissipation layer, so as to prevent the heat dissipation layer from being scratched and damaged. The material of the heat dissipation layer may include metal foil or graphite film, and the metal foil is, for example, aluminum foil or copper foil. The insulating protection layer can be adhered to the surface of the heat dissipation layer through the adhesive layer. When the patch suction head 130 presses down on the heat dissipation patch 300, the side wall 134 of the notch 132 will generate shear stress on the heat dissipation patch 300, and the side wall 134 that is too vertical will generate a large instantaneous stress on the heat dissipation patch 300. This may result in partial peeling of the heat dissipation patch 300 or delamination between the insulating protection layer and the heat dissipation layer of the heat dissipation patch 300 . 9 is a schematic cross-sectional view of a patch suction head of a thermal patch bonding device according to an embodiment of the present disclosure. In this embodiment, the top surface 136a of the notch 132a of the patch suction head 130a and the plurality of sidewalls 134a form an obtuse angle θ1, wherein the obtuse angle θ1 is approximately between 100 degrees and 120 degrees. In other words, in such a configuration, the side wall 134a of the notch 132a is an inclined plane rather than a vertical plane, so that the heat dissipation chip 300 pressed by the chip suction head 130a can also be moved along the slope side wall 134a of the chip suction head 130a. Extending from the top surface of the encapsulated wafer 220 to the film substrate 210 with a relatively gentle slope, it can reduce the stress concentration problem when the patch suction head 130a is pressed, thereby avoiding the partial peeling of the heat dissipation patch 300 or the heat dissipation patch The problem of delamination occurred between the insulating protective layer and the heat dissipation layer of 300.

To sum up, the patch suction head of the heat dissipation patch bonding equipment disclosed in this disclosure has a notch corresponding to the sealing wafer of the packaging structure. When the patch suction head presses the heat dissipation patch on the packaging structure, the sealing Multiple side surfaces of the chip are respectively surrounded by multiple sidewalls of the notch, so that the notch and the packaging structure jointly form a closed space for accommodating the encapsulated chip. In this way, through the design of the notch corresponding to the encapsulated wafer on the patch suction head, and the multiple side surfaces of the encapsulated wafer are surrounded by the multiple side walls of the notch, the surface of the patch suction head can place the heat dissipation patch on the surface of the chip. The part around the encapsulated chip is fully pressed on the package structure, so that it completely covers the encapsulated chip, so as to prevent or reduce the peeling of the heat sink and the package structure due to poor bonding, resulting in peeling off of the heat sink or wrinkles, etc. Problem, therefore, the heat dissipation patch bonding equipment and bonding method disclosed in this disclosure can effectively improve the heat dissipation efficiency and reliability of the packaging structure.

In addition, in the heat dissipation chip attachment method of the present disclosure, the chip suction head is moved down to place the heat dissipation chip on the packaging structure with light pressure initially. Then, the lifting platform moves upwards to lift the packaging tape and the pick-up head, and the force of the pick-up head and the lifting platform in the opposite direction clamps each other, so that the heat dissipation patch can be tightly attached to the package Structurally, it omits the step of rolling the heat-dissipating patch in the traditional manufacturing process to closely attach the heat-dissipating patch to the package structure, thereby simplifying the heat-dissipating patch bonding process.

100: Thermal patch bonding equipment 110: Encapsulation Tape Conveyor 111: The first rail frame 112: work area 113: Second rail frame 114, 116: take-up turntable 120: lifting platform 130, 130a: patch suction head 131: surface 132, 132a: notch 134a: side wall 136a: top surface 150: Heat dissipation patch conveying device 160: rotating mechanism 200: package structure 201: Encapsulation Tape 210: film substrate 211: Encapsulation unit 212: transmission hole 220: encapsulated wafer 221: chip 222: Encapsulating colloid 223: side surface 230: solder mask 300: heat dissipation patch D1: the first direction D2: Second direction d1, d2, d3, d4: the shortest distance h1: first height h2: second height S1: closed space S2: storage space θ1: obtuse angle

FIG. 1 is a partial schematic diagram of a thermal patch bonding equipment according to an embodiment of the present disclosure. FIG. 2 is a schematic diagram of a packaging tape conveying device of a heat dissipation chip bonding equipment carrying and conveying a packaging tape according to an embodiment of the present disclosure. FIG. 3 is a schematic cross-sectional view of a package tape conveying device carrying a package tape of a heat dissipation chip bonding equipment according to an embodiment of the present disclosure. FIG. 4 is a schematic bottom view of a patch suction head of a thermal patch bonding device according to an embodiment of the present disclosure. FIG. 5 is a schematic top view of a package structure with heat dissipation pads attached according to an embodiment of the present disclosure. FIG. 6 to FIG. 8 are schematic flowcharts of a method for attaching a heat dissipation patch using a heat dissipation patch bonding equipment according to an embodiment of the present disclosure. 9 is a schematic cross-sectional view of a patch suction head of a thermal patch bonding device according to an embodiment of the present disclosure.

100: Thermal patch bonding equipment

120: lifting platform

130: Patch suction head

132: notch

200: package structure

201: Encapsulation Tape

210: film substrate

220: encapsulated wafer

300: heat dissipation patch

D1: the first direction

h1: first height

S1: closed space

S2: storage space

Claims (9)

A heat-dissipating patch bonding equipment, comprising: a packaging tape conveying device, used to carry and transport a packaging structure of a packaging tape to a work area; a patch suction head, which is movably arranged above the work area And configured to pick up a heat dissipation patch and press the heat dissipation patch on the package structure, wherein the patch suction head has a notch corresponding to the encapsulation wafer of the package structure, when the patch suction head When the heat dissipation chip is pressed on the package structure, the multiple side surfaces of the encapsulated chip are surrounded by the multiple side walls of the recess, wherein a top surface of the recess and the multiple side walls respectively sandwich a an obtuse angle; and a lifting platform, which is arranged in the working area and under the packaging tape to lift the packaging tape and the patch suction head upwards, so that the heat dissipation patch is attached to the packaging structure. The heat dissipation patch bonding equipment as claimed in claim 1, wherein the shortest distance between each of the side walls of the notch and the corresponding side surface of the molded wafer is greater than zero. The heat dissipation patch bonding equipment as claimed in claim 1, wherein when the patch suction head presses the heat dissipation patch on the package structure, the notch and the package tape together form a closed space to accommodate The encapsulated wafer. The heat dissipation patch bonding equipment as described in claim 1, wherein when the patch suction head presses the heat dissipation patch on the package structure, the heat dissipation patch conforms to the notch to form an accommodating space covering The encapsulated wafer. The thermal patch bonding equipment as claimed in claim 1, wherein the obtuse angle is substantially between 100° and 120°. A heat dissipation patch bonding method, comprising: carrying a packaging tape with a packaging tape conveying device and transporting a packaging structure of the packaging tape to a work area; using a patch suction head to absorb a heat dissipation patch and Move to the top of the work area, wherein the patch suction head has a notch; move the patch suction head that absorbs the heat dissipation patch toward the direction of the work area until the patch suction head presses the heat dissipation patch Placed on the packaging structure, wherein when the patch suction head presses the heat dissipation chip on the packaging structure, the patch suction head is located at a first height, and the number of encapsulated wafers of the packaging structure A side surface is surrounded by a plurality of side walls of the notch; and a lifting platform is used to lift the packaging tape and the patch suction head, so that the heat dissipation patch is attached to the package structure, when the heat dissipation patch When attached to the packaging structure, the pick-up head is located at a second height higher than the first height. The heat dissipation patch bonding method as claimed in claim 6, wherein the shortest distance between each side wall of the notch and the corresponding side surface of the molded chip is greater than zero. The heat dissipation patch bonding method as described in claim 6, wherein when the patch suction head presses the heat dissipation patch on the package structure, the notch and the package tape together form a closed space to accommodate The encapsulated wafer. The heat dissipation patch attachment method as described in claim 6, wherein when the patch suction head presses the heat dissipation patch on the package structure, the heat dissipation patch conforms to the notch to form an accommodating space covering The encapsulated wafer.

Images