TW202340514A - Nozzle type deposition apparatus capable of minimizing the use amount of the raw material to carry out pattern deposition - Google Patents

Abstract

The present invention relates to a nozzle type deposition apparatus, and more specifically, to a nozzle type deposition apparatus in which a raw material used to deposit a pattern is provided for the pattern deposition according to requirements. The deposition is then carried out to minimize an amount of raw materials being used, which includes supplying the raw materials only to a part required for forming a pattern so that the precise pattern deposition can be carried out and spread of the raw materials can be avoided to fundamentally prevent the raw materials from depositing on other parts. The deposition apparatus further includes a heated gas which can be used to prevent clogging of a discharge pipe and a nozzle that supply the raw materials. Therefore, by supplying the raw material through the nozzle, the deposition apparatus can be constructed simply and effectively.

Description

Nozzle type deposition device

The present invention relates to a deposition device that discharges a raw material for pattern formation and irradiates laser light to deposit the material in order to form a pattern on a substrate. More specifically, it relates to a deposition device that forms fine circuit patterns for various circuit wirings on a substrate in a normal atmospheric environment, which is different from the conventional circuit patterns that are formed in a chemical vapor deposition device (Chemical Vapor Deposition; CVD). ) are formed in large-scale equipment.

Typically, thin film patterns are formed on substrates used to drive flat panel displays (including LCDs, OLEDs) containing semiconductor wafers, and the thin film patterns are typically deposited using large-scale equipment such as CVD. In particular, fine patterns of nanometer-level or micron-level units are usually produced by exposure, etching, and deposition fixation using a photomask.

In flat panel displays including LCD and OLED, components for expressing image light emission and wiring circuits for turning on/off pixels are generally deposited on the substrate. However, the substrate on which the circuit pattern is formed may have fine particles due to various reasons. of circuits have defects such as broken wires/short circuits, and a repair process for repairing these defects is essential. For the repair process, the pattern formed on the substrate needs to be cut or connected. In the process of connecting patterns, it is necessary to deposit a fine pattern. However, in the past, the metal raw material used to form the pattern was supplied to a certain area including the defect, and the area where the pattern was to be deposited was irradiated with laser light to perform deposition.

Korean Patent No. 10-0739443 discloses a conventional thin film pattern deposition device, which supplies metal raw material gas in a cavity for thin film deposition to form a local gas environment of the metal raw material, and irradiates laser light at the location where the pattern needs to be formed. Perform deposition. This thin film pattern deposition device is not formed in a large-scale cavity, but forms a gas environment of metal raw materials in certain areas of the atmosphere, thereby having the advantage of effectively performing local thin film deposition. However, it must be placed in a certain area. A gaseous environment of metal raw materials is formed. Therefore, the amount of metal raw materials used may be too much, and additional components (for example, gas curtains) are required to form a gaseous environment of metal raw materials, and as the gas of metal raw materials is formed in a certain area The environment causes metal raw materials to be deposited in unnecessary parts, thereby causing another defect in the film pattern formation process, and there are limitations in effectively depositing fine patterns, and there is also the possibility of damaging substrates that are susceptible to heat (e.g., flexible substrate) problem.

"Technical Problems to be Solved"

In order to solve the above-mentioned problems, the present invention provides a nozzle-type deposition device that deposits raw materials for pattern deposition according to the required pattern, and performs deposition to minimize the usage of raw materials, and to only form patterns when needed. The raw material is supplied to each position, thereby enabling precise pattern deposition and preventing the spread of the raw material. It can prevent the raw material from being deposited in other parts from the root. The heated gas can also prevent the clogging of the discharge pipe and nozzle that supplies the raw material, and according to the nozzle In addition, the present invention can prevent the raw materials passing through the suction nozzle from diffusing to other parts, and allows the heated gas to be concentratedly supplied to the deposition part, thereby preventing the raw materials from passing through the suction nozzle provided at the upper part. The raw material and gas are diffused in the mouth part and the suction part provided on the upper part of the base plate. "Technical Plan"

In order to achieve the above objects, the nozzle-type deposition device of the present invention is used in a deposition device for depositing patterns on a substrate, including: a laser module for irradiating laser light on the substrate to form a pattern; a first nozzle, The raw material to be deposited is ejected on the substrate to deposit the pattern; the second nozzle is formed on the outer frame of the first nozzle and injects gas heated at a predetermined temperature; the nozzle housing accommodates the first nozzle inside. The second nozzle; a heating portion housed inside the nozzle housing for heating the first nozzle and the second nozzle; and a suction nozzle portion formed on the nozzle housing for sucking in the water from the first nozzle. The raw material that is not deposited after the nozzle is injected and part of the gas injected from the second nozzle.

In addition, the first nozzle is inserted and installed inside the second nozzle, and the gas ejected from the second nozzle is ejected along the outer frame of the first nozzle.

In addition, the first nozzle is protruded by a predetermined length from the end of the second nozzle, and the second nozzle is protruded by a predetermined length from the end of the nozzle housing.

In addition, the gas ejected through the second nozzle is ejected along the outer frame of the first nozzle and to a predetermined area wider than the pattern deposited on the substrate.

In addition, the end of the suction nozzle is formed between the end of the first nozzle and the end of the second nozzle.

In addition, the nozzle housing is in a block shape formed of a metal material, and the nozzle type deposition device further includes a storage hole for receiving two of the first nozzle, the second nozzle and the heating part. above.

In addition, a heat shield member is disposed on part or all of the outer frame of the nozzle housing to prevent heat generated by the nozzle housing from being transferred to the outside.

In addition, the suction nozzle part is provided in the form of a cylinder or a plurality of nozzles surrounding the outer frame part of the heat shielding member.

In addition, the nozzle-type deposition device further includes a suction part for sucking in the remaining raw materials and gases after being used to deposit patterns among the raw materials and gases ejected/discharged from the first nozzle and the second nozzle.

In addition, the suction part is arranged in a curved shape at a position facing the first nozzle, the second nozzle, and the suction nozzle part, centered on the pattern formed on the substrate.

In addition, the first nozzle, the second nozzle and the suction nozzle part are installed obliquely on the base plate, and two or more suction flow paths are formed in the suction part, and the suction flow paths are used to suck in from all parts of the suction part. Among the raw materials and gases ejected/ejected by the first nozzle and the second nozzle, the remaining raw materials and gases after depositing patterns are used, and the suction nozzle part is used to suck in the raw materials and gases that are not sucked by the suction part. "Invention Effect"

The present invention structured as described above has the effect of supplying raw materials required for deposition in the form of a nozzle, thereby minimizing the amount of raw materials used and minimizing waste of raw materials.

In addition, by supplying the raw material through the nozzle to the location required for pattern deposition, fine patterns can be formed accurately and accurately.

In addition, the heating gas is supplied not only to the outer frame of the nozzle that supplies the raw material, but also to a certain area where the deposition is formed, thereby preventing the nozzle from being clogged and the raw material from being deposited in unnecessary locations.

In addition, the deposition device in the form of a nozzle can be used to miniaturize the structure of the deposition device, so that the operation and installation of the deposition device are convenient, and maintenance can be effectively performed.

In addition, the upper part prevents the diffusion of heated gas and raw materials through the suction nozzle part, and recovers the remaining raw materials after deposition through the suction part near the substrate, which can improve the precision of pattern deposition.

Hereinafter, the nozzle type deposition apparatus of the present invention will be described in detail with reference to the drawings.

1 is a perspective view showing a nozzle-type deposition device according to an embodiment of the present invention; FIG. 2 is an enlarged perspective view showing a first nozzle, a second nozzle and a suction nozzle portion in a nozzle-type deposition decoration according to an embodiment of the present invention; 3 is a schematic diagram showing pattern formation by a nozzle-type deposition device according to the present invention; FIG. 4 is a perspective view showing a suction portion of a nozzle-type deposition device according to an embodiment of the present invention; and FIG. 5 is a schematic diagram showing a suction portion of a nozzle-type deposition device according to an embodiment of the present invention. Schematic illustration of pattern deposition including the suction portion of a nozzle-type deposition device.

The deposition pattern, especially the process of depositing fine patterns, is formed in large-scale equipment such as CVD, and has a thin film deposition chamber device for depositing thin films in the atmosphere. Although the conventional CVD equipment has a simple structure, it requires the formation of local metal raw materials. Gas environment, and except for a small amount of metal raw materials used for pattern deposition, the remaining metal raw materials will be thrown away, so there is a serious problem of wasting metal raw materials. In addition, in order to form a local gas environment of the metal raw material, an additional structure for blocking the atmosphere is required, so there is a problem of a complicated structure.

The nozzle-type deposition device of the present invention includes: a laser module 100, which irradiates the raw material 30 of the substrate 10 that needs to be deposited to form a pattern with laser light for heating and deposition; a raw material 30 for depositing the pattern; a second nozzle 300 to prevent nozzle clogging that may occur due to the hardening of the raw material 30 moving toward the first nozzle 200, and to isolate a certain area including the deposited pattern from the outside; and It is formed on the outer frame of the first nozzle 200 and injects the heating gas 40 heated at a predetermined temperature; the nozzle housing 400 houses the first nozzle 200 and the second nozzle 300 inside; and the heating part 500 is housed inside the nozzle housing 400 for use. After heating the first nozzle 200 and the second nozzle 300; and a suction nozzle portion 700 is formed on the nozzle shell to suck in the raw materials and gases that have not been deposited after being sprayed from the first nozzle 200 and the second nozzle 300. .

The laser module 100 of the present invention supplies laser light from the first nozzle 200 to the raw material 30 ejected at the position to be deposited on the substrate 10. The laser module is used to heat and harden the raw material 30 for deposition. of components. The raw material 30 differs according to the pattern to be formed on the substrate. For example, when tungsten (W) is used, corresponding laser light needs to be irradiated. Therefore, according to the wavelength, output, pulse width, etc. of the laser light, it is necessary to select the laser module 100 that can provide suitable laser light for the material of the raw material 30 . In addition, in order to supply appropriate laser light according to the material of the raw material 30, after selecting the laser module 100, in order to irradiate the laser light to the position of the deposited pattern on the substrate 10, an optical module (not shown in the figure) may also be used. Change the path of laser light. Of course, in addition to changing the path of the laser light through the optical module, if the size of the substrate 10 is small, the substrate 10 can also be moved.

The first nozzle 200 of the present invention is a component that discharges the raw material 30 to a position on the substrate 10 where deposition is required. The raw material 30 ejected through the first nozzle 200 comes from, for example, a bubbler (not shown in the figure) used to vaporize solid metal or a component converted into a powder form, and is received through the raw material connection portion 210 at the rear end of the first nozzle 200 . The gas converted by the bubbler or the powdered raw material is delivered to the first nozzle 200 through the discharge pipe flow path. The raw material 30 discharged to the substrate through the discharge pipe flow path and the first nozzle 200 differs depending on the material, but has The property of hardening when dropped below a certain temperature. That is, in order to prevent the discharge pipe flow path and the first nozzle 200 from clogging, it is very important to maintain the temperature above a certain level. The material of the first nozzle 200 may vary depending on the raw material 30 to be discharged. However, in order to facilitate maintaining a temperature above a certain level, it is preferable to use a metal material with high thermal conductivity and high durability. Of course, in order to prevent the raw material 30 from hardening, it is better to use materials with small surface roughness. In addition, the diameter of the nozzle varies depending on the width of the pattern to be deposited, but it is advantageous to make it fine. However, the smaller the diameter of the nozzle, the hardening of a trace amount of the raw material 30 will cause clogging of the nozzle. Therefore, it is better to determine the width of the pattern and the material of the raw material 30 to be discharged.

The second nozzle 300 of the present invention is arranged on the outer frame of the first nozzle 200 and injects the heating gas 40 heated at a predetermined temperature based on the outer frame of the first nozzle 200 . The heating gas 40 is supplied through the heating gas connection portion 310 at the rear end of the nozzle housing 400 . As mentioned above, the first nozzle 200 is a member through which the vaporized or powdered raw material 30 passes. When the temperature drops below a certain temperature, the raw material 30 will harden and the nozzle will become clogged. The second nozzle 300 is a member that injects the heating gas 40 heated at a certain temperature into the outer frame of the first nozzle 200 to maintain the first nozzle 200 at a temperature higher than the temperature at which the raw material 30 does not harden in order to prevent these nozzles from being clogged. . In addition, the heated gas 40 is sprayed to a predetermined area 50 including a part of the pattern 20 deposited on the substrate 10, so that a local blocking effect can be additionally obtained. For example, as shown in FIGS. 1 and 2 , if the first nozzle 200 is inserted and installed inside the second nozzle 300 , the heating gas 40 supplied to the second nozzle 300 will heat the first nozzle 200 as a whole. Therefore, as described above, the second nozzle 200 will be heated. The nozzle 300 can fundamentally prevent the nozzle from clogging due to the hardening of the raw material 30 . Of course, the same effect can be obtained by arranging a plurality of second nozzles 300 in the outer frame of the first nozzle 200, but the effect is lower than that of inserting the first nozzle 200 inside. In addition, when the heated gas 40 (as shown in FIG. 3 ) ejected from the second nozzle 300 reaches the substrate 100 along the outer frame of the first nozzle 200, it is used to deposit the pattern and the remaining raw material 30 is hardened outside the pattern. parts, thus preventing the occurrence of defective products from the source. In addition, the gas environment in which the local raw material 30 is formed when depositing the pattern is beneficial to the blocking effect from the outside. The heating gas 40 injected through the second nozzle 300 prevents reaction with the raw material 30 and maximizes the blocking effect with the outside. It is preferable to use an inert gas. In addition, it is preferable to use argon (Ar), an inert gas with a large molecular weight, to prevent the temperature of the heating gas 40 from rapidly decreasing and to improve the blocking effect from the outside.

The nozzle housing 400 of the present invention is a member that forms the main body of the nozzle-type deposition apparatus of the present invention and accommodates the first nozzle 200 and the second nozzle 300 as well as the heating unit 500 described below. The nozzle housing 400 needs to accommodate the first nozzle 200 to the heating part 500 inside. Therefore, it is of course necessary to include tools for fixing the first nozzle 200, the second nozzle 300 and the heating part 500. After the nozzle housing 400 is made of a block and is provided with a storage hole 410 that can accommodate the first nozzle 200 , the second nozzle 300 and the heating part 500 , the heat generated by the heating part 500 can be completely transferred to the first nozzle 200 and the advantages of the second nozzle 300; in addition, no additional tools for fixing are required, and only one nozzle housing 400 can be fixed to the equipment, so it has the advantage of easy installation and maintenance. Since the heat generated by the heating part 500 is transferred to the entire body of the nozzle housing 400, it is preferable to dispose the heat shielding member 420 outside the nozzle housing 400 so that the heat cannot be transferred to the device.

The heating unit 500 of the present invention is a member that heats the first nozzle 200 and the second nozzle 300 to a temperature above a certain level. That is to say, even if the second nozzle 300 supplies the heating gas 40 heated to a certain temperature or above, since the second nozzle 300 itself has a length, and the heating gas 40 needs to maintain and reach above a certain temperature when it reaches the substrate 10, therefore, in order to maintain the heating gas A heating unit 500 is required for a temperature of 40°C. In addition, preferably, the heating part 500 is not only installed on one side, but may also be installed symmetrically with the second nozzle 300 as the center. Installing a plurality of them can maximize the heating effect, but the manufacturing cost increases. Therefore, according to the precise temperature adjustment and manufacturing cost, it is better to select according to the environment where the nozzle type deposition device of the present invention is installed.

The suction nozzle part 700 of the present invention is formed outside the nozzle housing 400 and is used to suck in the raw material that has not been deposited after being sprayed from the first nozzle 200 and a part 60 of the gas sprayed from the second nozzle 300 . The nozzle-type deposition device of the present invention has a structure without a cavity. The heated gas 40 injected through the second nozzle 300 isolates it from the outside in a certain area including the portion of the deposition pattern. However, there are undeposited raw materials and the heated gas 40 diffuses to external shortcomings. If the undeposited raw material leaves the area of the heating gas 40, its deposition on other parts of the substrate will cause a short circuit or an open circuit, thereby leading to a problem of reduced repair success rate. Therefore, disposing the end of the suction nozzle 700 between the ends of the first nozzle 200 and the second nozzle 300 can prevent the laser light irradiated by the laser module 100 from interfering with the raw materials ejected from the first nozzle 200, and at the same time, Raw materials and heating gas 40 are prevented from spreading to the outside. In order to enable the heating gas 40 to reach a certain area of the substrate 10 , while preventing the heating gas 40 from diffusing to the outside by making the injection pressure of the heating gas 40 greater than the suction force of the suction nozzle 700 , surrounding the certain area with the heating gas 40 can maximize greatly improve the efficiency of the repair process. In addition, the suction nozzle part 700 is preferably provided in a cylindrical shape, but it may be provided in a form in which a plurality of nozzles are symmetrically arranged on the outer frame of the nozzle housing 100 . When a plurality of nozzles are arranged, some nozzles may not be able to suction, but this has the advantage of adjusting the suction power of each nozzle so that the operation can be performed according to the conditions of the repair process. In addition, the inhalation part 600 described below near the substrate is mainly used to inhale the raw material and the heating gas 40, and the raw material and the heating gas 40 can be inhaled through the suction nozzle part 700 above the first nozzle 200 and the second nozzle 300. Completely prevents raw materials, etc. from leaking to the outside.

The suction part 600 of the present invention is a member that absorbs the raw material 30 remaining after depositing the pattern on the raw material 30 discharged from the first nozzle 200 and the heated gas 40 injected to the second nozzle 300, and discharges the raw material 30 to the outside. As shown in an example in FIG. 4 , preferably, the suction part 600 is arranged in a shape surrounding the outer frame part of the second nozzle 300 . In addition, in order to effectively suck in the raw material 30 and the heating gas 40, it is preferable to form a plurality of suction flow paths 610. In addition, since the deposition of the pattern 20 requires irradiation of laser light, it is preferable to install the first nozzle 200 obliquely behind the substrate to irradiate the laser perpendicularly to the substrate for precise deposition. Therefore, the suction flow path 610 is formed obliquely corresponding to the inclination of the first nozzle 200 so as to have the effect of not spreading to the outside and enabling efficient suction. In addition, as shown in FIG. 5 , after the nozzle housing 400 is installed obliquely, and the suction part 600 is installed on the opposite surface, there is an effect that the raw material 30 and the heating gas 40 can be sucked in more effectively.

10:Substrate 20: Pattern 30:Raw materials 40: Heating gas 50: Reservation area 60: Part of the gas 100:Laser module 200: first nozzle 210: Raw material receiving department 300: Second nozzle 310: Heating gas connection part 400:Nozzle housing 410: Storage hole 420:Heat shielding components 500:Heating department 600: Inhalation part 610: Suction flow path 700: Nozzle part

Figure 1 is a perspective view showing a nozzle type deposition device according to an embodiment of the present invention; 2 is an enlarged perspective view showing the first nozzle, the second nozzle and the suction nozzle part in the nozzle-type deposition decoration according to an embodiment of the present invention; 3 is a schematic diagram showing pattern formation by the nozzle-type deposition device of the present invention; Figure 4 is a perspective view showing the suction part of the nozzle type deposition device according to one embodiment of the present invention; and FIG. 5 is a schematic diagram illustrating pattern deposition formed by a suction portion of a nozzle-type deposition device according to an embodiment of the present invention.

200: first nozzle

210: Raw material receiving department

300: Second nozzle

310: Heating gas connection part

400:Nozzle housing

410: Storage hole

420:Heat shielding components

500:Heating department

700: Nozzle part

Claims (11)

A nozzle-type deposition device used in a deposition device for depositing patterns on a substrate, including: A laser module for irradiating laser light on the substrate to form a pattern; a first nozzle, used to spit out the raw material to be deposited on the substrate to deposit a pattern; a second nozzle, formed on the outer frame of the first nozzle, for injecting gas heated at a predetermined temperature; a nozzle housing that accommodates the first nozzle and the second nozzle inside; a heating part, housed inside the nozzle housing, for heating the first nozzle and the second nozzle; and A suction nozzle portion is formed on the nozzle housing for sucking in the raw material that has not been deposited after being sprayed from the first nozzle and part of the gas sprayed from the second nozzle. The nozzle type deposition device according to claim 1, wherein the first nozzle is inserted and installed inside the second nozzle, and the gas ejected from the second nozzle flows along the outer frame of the first nozzle. Squirt. The nozzle type deposition device according to claim 2, wherein the first nozzle is protrudingly provided with a predetermined length from an end of the second nozzle, and the second nozzle is protruded with a predetermined length from an end of the nozzle housing. The length is set prominently. The nozzle type deposition apparatus according to claim 2, wherein the gas ejected through the second nozzle is ejected along the outer frame portion of the first nozzle and to a wider area than the pattern deposited on the substrate. Reserve area. The nozzle type deposition apparatus according to claim 1, wherein the end of the suction nozzle is formed between the end of the first nozzle and the end of the second nozzle. The nozzle-type deposition device according to claim 1, wherein the nozzle housing is a block formed of metal material, and the nozzle-type deposition device further includes: A storage hole is used to receive at least two of the first nozzle, the second nozzle and the heating part. The nozzle type deposition apparatus according to claim 6, wherein a heat shield member is disposed on part or all of the outer frame of the nozzle housing to prevent heat generated by the nozzle housing from being transferred to the outside. The nozzle type deposition device according to claim 7, wherein the suction nozzle part is provided in the form of a cylinder or a plurality of nozzles surrounding the outer frame part of the heat shielding member. The nozzle type deposition device according to claim 1, further comprising: A suction part is used to suck in the remaining raw materials and gases after depositing the pattern among the raw materials and gases ejected/discharged from the first nozzle and the second nozzle. The nozzle-type deposition apparatus according to claim 9, wherein the suction portion is centered on a pattern formed on the substrate and is located opposite the first nozzle, the second nozzle, and the suction nozzle portion. The positions are arranged in a curved shape. The nozzle type deposition apparatus according to claim 7, wherein the first nozzle, the second nozzle and the suction nozzle part are installed on the substrate obliquely, and two or more suction flows are formed in the suction part. The suction flow path is used to suck in the remaining raw materials and gases after depositing patterns among the raw materials and gases ejected/ejected from the first nozzle and the second nozzle, and the suction nozzle part is used to suck in Raw materials and gases that are not sucked through the suction part.