TW202338283A - Immersed heat sink - Google Patents

Abstract

An immersed heat sink includes a metal housing, a welding layer, a thermal conductive layer and a porous structure. The metal housing having a heating surface and a heat dissipation surface formed behind the heating surface. The welding layer is laid on the heat dissipation surface. The thermal conductive layer is laid on the welding layer. The porous structure is laid on the thermal conductive layer. In this way, the waste heat generated by the electronic heat source can be quickly dispersed.

Description

Liquid immersed radiator

The present invention relates to the technology of a radiator, in particular to a liquid immersed radiator.

With the vigorous development and application of Internet technology, users' requirements for computer startup speed, software reading speed, and photo and video playback speed are constantly increasing. Effective time saving has become a condition for consumers to choose products. one.

With the improvement of performance and reading speed, the heat and temperature of the operation of electronic components are also increasing. High temperature will not only make most electronic components prone to rapid aging, but also make electronic components such as solid-state drives difficult to read and write. The speed is reduced, so how to maintain the operating temperature becomes the research topic of this application.

Existing heat sinks used for the aforementioned electronic components mainly include a heat conductive plate and a plurality of heat dissipation fins arranged on the heat conductive plate. Through the thermal contact between the heat conductive plate and the electronic components, air is used as the heat conduction medium to achieve the heat dissipation effect. However, the thermal conductivity of air is low, making heat transfer inefficient. Although the industry has developed liquid-immersed radiators, the amount of heat they can dissipate is limited by their structure, and they are obviously no longer able to meet current usage needs.

In view of this, the inventor has devoted himself to research and applied academic theory to solve the above-mentioned problems in order to solve the above-mentioned deficiencies in the prior art, which has become the inventor's goal of improvement.

One object of the present invention is to provide a liquid-immersed radiator that can quickly dissipate waste heat generated by electronic heat sources.

In order to achieve the above object, the present invention provides a liquid immersed radiator, which includes a metal shell, a welding layer, a thermal conductive layer and a porous structure. The metal shell has a heating surface and a surface formed on the heating surface. There is a heat dissipation surface at the back; the welding layer is laid on the heat dissipation surface; the thermal conductive layer is laid on the welding layer; and the porous structure is laid on the thermal conductive layer.

The present invention also has the following effect: through the arrangement of the thermal conductive layer, it can ensure that the pores of the porous structure will not be blocked by the welding material during the manufacturing process. By limiting the pores within a specific range, it not only has more heat dissipation surface area within the same unit area, but also allows liquid to easily flow in or out.

The detailed description and technical content of the present invention are described below with reference to the drawings. However, the attached drawings are only for reference and illustration and are not intended to limit the present invention.

Referring to FIGS. 1 to 3 , the present invention provides a liquid immersed radiator, which mainly includes a metal shell 10 , a welding layer 20 , a thermal conductive layer 30 and a porous structure 40 .

The metal shell 10 is made of copper, aluminum, magnesium or alloys thereof. It mainly includes a base plate 11 and a plurality of side plates 12 extending downward from the periphery of the base plate 11. The lower surface of the base plate 11 has a heating surface 111. , the upper surface of the substrate 11 has a heat dissipation surface 112, and the heat dissipation surface 112 is formed behind the heat receiving surface 111.

The soldering layer 20 is laid on the heat dissipation surface 112; in one embodiment, the soldering layer 20 can be a solder paste, the specific material is Sn42Bi58, the melting temperature is about 138°C, the thickness is less than 0.05 millimeters (mm), and the thermal conductivity coefficient is 19W/mk .

The thermal conductive layer 30 is laid on the welding layer 20; in one embodiment, the material of the thermal conductive layer 30 can be C1100 copper foil, with a thickness of 0.5 millimeters (mm) and a thermal conductivity coefficient greater than 390W/mk.

The porous structure 40 is laid on the thermal conductive layer 30, and the porous structure 40 can be a metal braided mesh, specifically a copper mesh, with a mesh number greater than 65 (that is, the gap is less than 0.2 mm), and the mesh number is between 120~ Between 300 is preferred. The metal braided mesh is combined with the aforementioned thermal conductive layer 30 through a diffusion bonding technology.

In one embodiment, the metal braided mesh includes a plurality of mesh units 41. Each mesh unit 41 is stacked layer by layer and assembled above the heat dissipation surface 112. The material of each braided mesh unit 41 can be C1100 copper mesh, and the wire diameter is 0.05. millimeter (mm), the thickness is 0.1 millimeter (mm), the porosity is 50%, and the thermal conductivity coefficient is greater than 390W/mk.

Please refer to Figure 3 again. The liquid immersed radiator of the present invention can be applied to an electronic component 8. The electronic component 8 mainly includes a circuit board 81 and an electronic heat source 82 arranged on the circuit board 81. When assembled, The metal shell 10 is covered on the electronic heating source 82, each side plate 12 is attached to the circuit board 81, and the top surface of the electronic heating source 82 is attached to the heating surface 111, or through a heat-conducting medium (not shown in the figure) (out) is filled between the electronic heat source 82 and the heating surface 111.

When in use, the aforementioned combined structure is placed in a liquid container (not shown). The liquid used in the liquid container is a low-boiling non-conductive liquid. When the electronic heat source 82 is operated, the waste heat generated will pass through the heating surface. 111 is directly conducted to the heat dissipation surface 112, the thermal conductive layer 30 and the porous structure 40, and the non-conductive liquid flows through the thermal conductive layer 30 and the pores 42 of each mesh unit 41, thereby quickly dissipating the aforementioned waste heat.

To sum up, the liquid immersed radiator of the present invention can indeed achieve the expected purpose of use and solve the deficiencies of conventional knowledge. Moreover, because it is extremely novel and progressive, it fully meets the requirements for an invention patent application. The application can be filed in accordance with the patent law. , please check carefully and grant the patent in this case to protect the rights of the inventor.

10:Metal shell 11:Substrate 111:Heating surface 112:Heating surface 12:Side panel 20:Welding layer 30: Thermal conductive layer 40: Porous structure 41:Network unit 42:pore 8: Electronic components 81:Circuit board 82:Electronic heating source

Figure 1 is an appearance view of the combination of the liquid immersed radiator and electronic components of the present invention.

Figure 2 is an enlarged view of a partial area of Figure 1.

Figure 3 is a cross-sectional view of the liquid immersed radiator and electronic components of the present invention.

10:Metal shell

11:Substrate

111:Heating surface

112:Heating surface

12:Side panel

20:Welding layer

30: Thermal conductive layer

40: Porous structure

41:Network unit

42:pore

8: Electronic components

81:Circuit board

82:Electronic heating source

Claims (10)

A liquid-immersed radiator, including: A metal shell having a heating surface and a heat dissipation surface formed behind the heating surface; A welding layer is laid on the heat dissipation surface; A thermal conductive layer is laid on the welding layer; and A porous structure is laid on the thermal conductive layer. The liquid immersed radiator as claimed in claim 1, wherein the porous structure is a metal braided mesh. The liquid-immersed radiator according to claim 2, wherein the mesh number of the metal braided mesh is greater than 65. The liquid immersed radiator as described in claim 3, wherein the mesh value of the metal braided mesh is between 120 and 300. The liquid immersed radiator according to claim 2, wherein the metal braided mesh is a copper mesh. The liquid immersed radiator as claimed in claim 2, wherein the metal braided mesh includes a plurality of mesh units, and each of the mesh units is stacked on each other. The liquid immersed radiator as claimed in claim 2, wherein the metal braided mesh is bonded to the heat conductive layer through diffusion welding. The liquid immersed heat sink of claim 1, wherein the soldering layer is solder paste. The liquid immersed heat sink of claim 1, wherein the heat conductive layer is a copper foil. The liquid immersed radiator according to claim 1, wherein the metal shell includes a base plate and a plurality of side plates extending downward from the periphery of the base plate, the heating surface is formed on the lower surface of the base plate, and the heat dissipation surface is formed on the upper surface of the substrate.

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